KR100763279B1 - 세라믹 히터 - Google Patents
세라믹 히터 Download PDFInfo
- Publication number
- KR100763279B1 KR100763279B1 KR1020060038584A KR20060038584A KR100763279B1 KR 100763279 B1 KR100763279 B1 KR 100763279B1 KR 1020060038584 A KR1020060038584 A KR 1020060038584A KR 20060038584 A KR20060038584 A KR 20060038584A KR 100763279 B1 KR100763279 B1 KR 100763279B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- ceramic heater
- heater
- heating plate
- heat
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims abstract description 130
- 238000010438 heat treatment Methods 0.000 claims abstract description 111
- 239000012212 insulator Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 12
- 229910001120 nichrome Inorganic materials 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
Claims (9)
- 삭제
- 삭제
- 열을 발열하도록 세라믹으로 이루어진 세라믹 발열판과, 상기 세라믹 발열판의 하부에 접합되어 세라믹 발열판으로 열을 전달하도록 상기 열이 발생되는 발열부를 포함하는 세라믹 히터에 있어서,상기 발열부는,세라믹 발열체의 하부면에 접합되어 전기적 절연상태에서 열을 전달하도록 하는 한 쌍의 절연체와, 상기 한 쌍의 절연체 사이에 결합되어 외부로부터 인가되는 전원에 의해 열이 발생되도록 하는 복수개의 저항 발열체를 포함하는 것을 특징으로 하는 세라믹 히터.
- 제 3 항에 있어서,한 쌍의 절연체는 폴리이미드 수지 필름(Polyimide Film)인 것을 특징으로 하는 세라믹 히터.
- 제 3 항에 있어서,각 저항 발열체의 양단부에는 외부로부터 전원이 인가되도록 상기 각 저항 발열체와 결합되는 단자부가 각각 형성됨을 특징으로 하는 세라믹 히터.
- 제 3 항에 있어서,각 저항 발열체는 세라믹 히터를 중심으로 하여 동심원 형태로 분할 형성됨을 특징으로 하는 세라믹 히터.
- 제 3 항에 있어서,각 저항 발열체는 니크롬합금(NiCr: Nichrome)인 것을 특징으로 하는 세라믹 히터.
- 제 3 항에 있어서,세라믹 히터의 하부에는 상기 세라믹 히터의 각 구간별 온도를 측정하도록 하는 복수개의 센서가 각각 부착됨을 특징으로 하는 세라믹 히터.
- 제 3 항에 있어서,세라믹 발열판과 각 절연체에는 상기 세라믹 히터의 상면에서 웨이퍼를 장착 및 탈착하는 이송장치의 핀이 삽탈되도록 복수개의 이송홀이 각각 형성됨을 특징으로 하는 세라믹 히터.
Priority Applications (1)
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KR1020060038584A KR100763279B1 (ko) | 2006-04-28 | 2006-04-28 | 세라믹 히터 |
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KR1020060038584A KR100763279B1 (ko) | 2006-04-28 | 2006-04-28 | 세라믹 히터 |
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KR100763279B1 true KR100763279B1 (ko) | 2007-10-08 |
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KR1020060038584A KR100763279B1 (ko) | 2006-04-28 | 2006-04-28 | 세라믹 히터 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101116799B1 (ko) * | 2010-03-19 | 2012-03-13 | 조항선 | 저항 패턴을 갖는 전기 발열체 및 그 제조방법 |
KR101340424B1 (ko) * | 2012-02-27 | 2013-12-10 | (주)주영 | 고온용 AlN 세라믹 핫플레이트 |
KR20160038233A (ko) * | 2014-09-30 | 2016-04-07 | 주식회사 엘엠테크놀로지 | 고온 베이킹 장치용 히팅 플레이트 |
KR101619094B1 (ko) | 2014-09-30 | 2016-05-12 | 주식회사 엘엠테크놀로지 | 고온 베이킹 장치용 기판히터 |
CN112038256A (zh) * | 2019-06-04 | 2020-12-04 | 上海微电子装备(集团)股份有限公司 | 加热装置和键合装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030072324A (ko) * | 2001-07-09 | 2003-09-13 | 이비덴 가부시키가이샤 | 세라믹 히터 및 세라믹 접합체 |
KR20040068154A (ko) * | 2001-11-30 | 2004-07-30 | 이비덴 가부시키가이샤 | 세라믹 히터 |
-
2006
- 2006-04-28 KR KR1020060038584A patent/KR100763279B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030072324A (ko) * | 2001-07-09 | 2003-09-13 | 이비덴 가부시키가이샤 | 세라믹 히터 및 세라믹 접합체 |
KR20040068154A (ko) * | 2001-11-30 | 2004-07-30 | 이비덴 가부시키가이샤 | 세라믹 히터 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101116799B1 (ko) * | 2010-03-19 | 2012-03-13 | 조항선 | 저항 패턴을 갖는 전기 발열체 및 그 제조방법 |
KR101340424B1 (ko) * | 2012-02-27 | 2013-12-10 | (주)주영 | 고온용 AlN 세라믹 핫플레이트 |
KR20160038233A (ko) * | 2014-09-30 | 2016-04-07 | 주식회사 엘엠테크놀로지 | 고온 베이킹 장치용 히팅 플레이트 |
KR101619094B1 (ko) | 2014-09-30 | 2016-05-12 | 주식회사 엘엠테크놀로지 | 고온 베이킹 장치용 기판히터 |
KR101638569B1 (ko) * | 2014-09-30 | 2016-07-11 | 주식회사 엘엠테크놀로지 | 고온 베이킹 장치용 히팅 플레이트 |
CN112038256A (zh) * | 2019-06-04 | 2020-12-04 | 上海微电子装备(集团)股份有限公司 | 加热装置和键合装置 |
CN112038256B (zh) * | 2019-06-04 | 2023-06-09 | 上海微电子装备(集团)股份有限公司 | 加热装置和键合装置 |
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