KR100747050B1 - 3-dimensional measuring device - Google Patents

Abstract

When measuring the three-dimensional shape of an object, the three-dimensional measuring apparatus which can measure more accurately by setting a height reference suitably in the said object is provided.

The plurality of light patterns are irradiated to the printed circuit board 1 having the cream solder printed thereon by the illumination device 10. Light irradiated from the illuminating device 10 is an ultraviolet ray and is reflected on the surface of a cream solder, a resist film, etc. of the printed circuit board 1. The ultraviolet light of the reflected light is imaged by the CCD camera 11, thereby obtaining image data. This image data is processed by the control apparatus 12, and the height, quantity, etc. of the cream solder are calculated based on the height of the surface of the resist film, and the quality of the printing of the cream solder is determined.

Description

3-D Measuring Device {3-DIMENSIONAL MEASURING DEVICE}

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram which shows typically the structure of a printing state inspection apparatus.

2 is a partial cross-sectional view of a printed board.

3 is a schematic configuration diagram schematically showing the configuration of a printing state inspection apparatus in more detail.

4 is a schematic diagram for explaining reflection of light irradiated from an illuminating device on a printed board.

FIG. 5 is a schematic diagram for explaining reflection of irradiated light when irradiating infrared rays or red light as another embodiment; FIG.

<Explanation of symbols for the main parts of the drawings>

1: Printed board as a board

2: base substrate

4: cream solder as a measurement object

5: resist film as film

8: Printing state inspection device equipped with three-dimensional measuring device

10: lighting device as a lighting means

11: CCD camera as imaging means

12: control device constituting the calculation means

The present invention relates to a three-dimensional measuring device for measuring a three-dimensional shape or the like of a measurement object.

Generally, a printed circuit board is provided with the electrode pattern on the base substrate which consists of glass epoxy resin, and the surface is protected by the resist film. When the electronic component is mounted on the printed board, first, a cream solder is printed at a predetermined position that is not protected by the resist film on the electrode pattern. Next, the electronic component is temporarily fixed on the printed circuit board based on the viscosity of the cream solder. Thereafter, the printed board is guided to a reflow furnace, and soldering is performed by passing through a predetermined reflow process. These days, it is necessary to inspect the printing state of the cream solder in all stages guided to the reflow furnace, and a three-dimensional measuring apparatus may be used at such an inspection.

In recent years, various so-called non-contact three-dimensional measuring devices using light have been proposed in various ways. For example, in the three-dimensional measuring apparatus using the phase shift method, a measurement object (in this case, a printed circuit board) having a light pattern having a stripe-shaped distribution using visible light as a light source by means of irradiation. Investigate. And the three-dimensional shape, especially height of a cream solder is measured by analyzing the phase difference of the stripe of the said optical pattern from the image which imaged the to-be-measured object by a CCD camera (for example, a patent document) 1).

Patent Document 1 : Japanese Patent Application Laid-Open No. 5-280945

By the way, the resist film of a printed board is unstable in the transmission characteristic with respect to visible light. That is, the resist film may or may not transmit visible light irradiated by the irradiation means. Visible light is reflected by the base substrate or the like when it is transmitted through the resist film, and is reflected by the surface of the resist film when it is not transmitted by the resist film. In such a case, it is difficult to determine whether the reflecting surface is a resist film or a base substrate in the resist film area in the image obtained by the CCD camera, and there is a fear that measurement of the height of the resist film area becomes difficult. In order to measure the height of the cram solder printed on the board | substrate with a high precision, it is preferable to adopt a height reference | standard within the board | substrate. However, since the resist film region cannot be appropriately used as the height reference plane, there is a fear that it is undesirable that the height reference cannot be adopted in the substrate.

Then, this invention was made | formed in order to solve the said problem, The objective is the three-dimensional which can be measured more correctly by setting a height reference in the said object suitably, etc. when measuring the three-dimensional shape of an object. It is providing a measuring device.

In the following, items are classified and described for each of the means suitable for solving the above-mentioned purpose and the like. Moreover, a specific effect and the like are added to the corresponding means as necessary.

Sudan 1

Irradiating means capable of irradiating at least one of blue light and ultraviolet rays to the measurement object on the substrate; imaging means capable of imaging at least the wavelength irradiated by the irradiation means among reflected light from the measurement object irradiated with the light; And calculating means for calculating at least the height of the measurement object based on image data picked up by the imaging means.

According to the means 1, blue light or ultraviolet rays are irradiated to the measurement object on the substrate by the irradiation means. Such relatively short wavelength light has a property which is easy to reflect on the surface of an object. For visible light having a wavelength longer than that of the irradiated light, the transmission characteristic is unstable, and there is a case where the transmission characteristic is not transmitted or transmitted. In this sense, in means 1, even if the transmission characteristic of the measurement object is unstable, it is possible to more reliably reflect the surface of the measurement object. For this reason, the imaging means can grasp | ascertain the surface of a to-be-measured object as an image. And calculation is performed based on image data by arithmetic means, and the height which is a position of the surface of a to-be-measured object can be calculated more accurately. In addition, the board | substrate in each means is a meaning containing a printed board, a wafer board | substrate, a mounting board | substrate, etc ..

Sudan 2

Irradiation means capable of irradiating at least one of blue light and ultraviolet rays to the substrate provided with the base substrate and the surface of the base substrate and having a planar film and a measurement object, and reflected light from the substrate irradiated with the light Among the calculations, at least the height of the measured object is calculated based on the height of the plane formed by the film based on the imaging means capable of imaging the wavelength irradiated by the irradiation means and the image data captured by the imaging means. A three-dimensional measuring device comprising a means.

According to the means 2, blue light or ultraviolet rays are irradiated to the substrate by the irradiation means. Such relatively short wavelength light has the property of being easy to reflect on the surface of an object. For example, when the irradiation means irradiates visible light having a wavelength longer than the above light, the coating film covering the substrate may exhibit unstable transmission characteristics such as to transmit or not to irradiate visible light. In this case, it is difficult to determine the reflection position of the light, and there is a fear that the height reference cannot be set in the coating area. In this respect, in the means 2, even if the film has an unstable transmissive property, surface reflection can be more reliably performed. For this reason, the imaging surface can grasp | ascertain the surface of a film and the surface of a to-be-measured object as an image. And calculation is performed based on image data by a calculation means, and the height which is a position of the surface of a to-be-measured object can be computed based on the height of the surface of a film. Therefore, since the height reference can be appropriately set in the substrate on which the measurement object is installed, the height of the measurement object can be measured more accurately. In addition, the film can be measured simultaneously with the measurement of the measurement object. For this reason, it is not necessary to measure the height of a film | membrane and another height reference | standard by another means, and the complexity of an apparatus can be suppressed.

Sudan 3

Irradiating means capable of irradiating only ultraviolet rays to the base substrate, the substrate covering the surface of the base substrate and forming a plane, and the measurement object can image only ultraviolet rays among the irradiation means capable of irradiating only the ultraviolet rays and the reflected light from the substrate irradiated with the light And an arithmetic means for calculating at least the height of the object to be measured based on the height of the plane formed by the film on the basis of the image capturing means and the image data picked up by the image capturing means.

According to the means 3, ultraviolet rays are irradiated to the substrate by the irradiation means. Such relatively short wavelength light has a property which is easy to reflect on the surface of an object. For example, when the irradiation means irradiates visible light having a wavelength longer than that of the ultraviolet light, the coating film covering the substrate may exhibit unstable transmission characteristics such as to transmit or not to irradiate visible light. In this case, it is difficult to determine the reflection position of the light, and there is a fear that the height reference cannot be set in the coating area. In this respect, in means 3, even if the film is unstable in the transmissive property, surface reflection can be more reliably performed. For this reason, the imaging surface can grasp | ascertain the surface of a film and the surface of a to-be-measured object as an image. And calculation is performed based on the said image data by a calculating means, and the height which is a position of the surface of a to-be-measured object can be calculated based on the height of the surface of a film. Therefore, since a height reference can be set in the board | substrate with which the to-be-measured object was installed, the height of a to-be-measured object can be measured more correctly. Moreover, a film can also be measured simultaneously with the measurement of a to-be-measured object. For this reason, it is not necessary to measure the height of a film | membrane or another height reference | standard by separate means, and the complexity of an apparatus can be suppressed. Moreover, since the imaging means can image only ultraviolet rays, even when visible light from a lighting device such as an indoor lighting device touches the substrate, appropriate image data can be obtained without being affected by the visible light. In addition, when the visible light is irradiated, the amount of light reflected by the color of the film decreases, and image data obtained by imaging is not available, or the wavelength of the visible light needs to be changed according to the color of the film. There is a risk that something will happen. In this regard, in the means 3, since the surface reflection can be performed irrespective of the color of the film, the concern can be eliminated. In addition, it is good also as "irradiation means which can irradiate the light containing an ultraviolet ray" instead of "irradiation means which can irradiate only an ultraviolet ray." Also in this case, ultraviolet rays of the irradiated light are reflected on the surface of the film, and only the ultraviolet rays are picked up by the imaging means. For this reason, the surface of a film can be grasped | ascertained as an image.

Sudan 4

The substrate is a printed board, and the calculating means calculates at least the height of the cream solder as the measurement object based on the height of the surface of the resist film as the coating, and based on the height of the cream solder in the printing state. A three-dimensional measuring device according to the means 2 or 3, wherein judging means for judging quality is provided.

According to the means 4, the height of the cream solder is calculated on the basis of the surface of the resist film of the printed circuit board, and the acceptance determination is performed based on the calculated height. For this reason, the above-mentioned effect is achieved when measuring the cream solder, and moreover, it is possible to make the quality determination more accurately.

Sudan 5

The substrate is a wafer substrate, and the calculating means calculates at least the height of the solder bumps as the measurement object based on the height of the surface of the oxide film as the coating, and based on the height of the solder bumps, A three-dimensional measuring apparatus according to the means 2 or 3, wherein a judging means for judging is provided.

According to the means 5, the height of the solder bumps is calculated on the basis of the surface of the oxide film of the wafer substrate, and acceptance determination is performed based on the calculated height. For this reason, the said effect is achieved at the time of measuring a solder bump, and also it can carry out a judgment more correctly.

Sudan 6

The calculating means uses a plurality of image data in one height calculation, and the irradiation means irradiates light of the same wavelength every time the imaging for obtaining the plurality of image data is performed. The three-dimensional measuring apparatus in any one of them.

According to the means 6, the light irradiated by the irradiating means uses light having the same wavelength without changing the wavelength of the light each time the image is taken. For this reason, even if the imaging means has a lens, the refraction of light does not change. Therefore, it is possible to suppress undesirable points such as deviations in the image obtained by the wavelength of illumination. As a result, the calculation accuracy of the height of the measured object can be improved.

Sudan 7

The said irradiation means irradiates light of the wavelength of 250 nm or more and 430 nm or less, The three-dimensional measuring apparatus in any one of means 1 to 6 characterized by the above-mentioned.

According to the means 7, light having a wavelength of 250 nm or more and 430 nm or less is irradiated by the irradiation means. For this reason, surface reflection can be made more reliably also about the instability of a transmission characteristic. Therefore, the surface of the film | membrane, the said measured object, etc. can be grasped | ascertained as an image by an imaging means. Instead of "250 nm or more and 430 nm or less", "300 nm or more and 380 nm or less" or "300 nm or more and 350 nm or less" may be used. In this case, even if the transmission characteristic is unstable, the surface can be reflected more reliably. Furthermore, instead of "light having a wavelength of 250 nm or more and 430 nm or less", "light having a peak of a wavelength within a range of 250 nm or more and 430 nm or less", "300 nm or more and a range of 380 nm or less A similar effect can be obtained even when the light having a peak of a wavelength in the light "or" the light having a peak of a wavelength in the range of 300 nm or more and 350 nm or less "is obtained.

Sudan 8

The said irradiation means irradiates the light of the wavelength range within 60 nm, The three-dimensional measuring apparatus in any one of means 1 thru | or 7 characterized by the above-mentioned.

According to the means 8, the wavelength range of light irradiated by the irradiating means is relatively narrowly set within 60 nm. In general, the refraction of light at the time of passing through the lens depends on the wavelength, and when the wavelength range is wide, there is a fear of causing chromatic aberration. In view of this, even in the case where the lighting device or the imaging means has a lens, the wavelength range is narrow, and chromatic aberration generated during irradiation or imaging can be suppressed. In other words, sharp image data can be obtained without blurring of irradiated light or blurring of the captured image data. Therefore, the calculation accuracy of the height of the measured object based on the image data can be improved. In addition, it is good also as "30 nm or less" instead of "60 nm or less." In this case, chromatic aberration can be further suppressed, and as a result, further improvement of the calculation precision of the height of the measured object based on image data can be aimed at.

Sudan 9

Irradiating means capable of irradiating at least one of red light and infrared ray to the measurement object on the substrate; imaging means capable of imaging at least the wavelength irradiated by the irradiation means among reflected light from the measurement object irradiated with the light; And calculating means for calculating at least the height of the measurement object based on image data picked up by the imaging means.

According to the means 9, red light or infrared rays are irradiated to the measurement object on the substrate by the irradiation means. Light having such a relatively long wavelength has a property of easily transmitting an object. For visible light having a wavelength shorter than that of the irradiated light, there is also a case where the transmission characteristic is unstable and not transmitted or transmitted. For example, even when the transmission property of the measurement object is stable and the visible light can be surface-reflected, the transmission property of other than the measurement object on the substrate may be unstable. In this regard, in the means 9, since the irradiation light is red light or infrared light, the irradiation light can be transmitted while the transmission characteristic is unstable. For this reason, only the surface of the thing (surface to be measured) etc. which can be surely reflected by the imaging means can be grasped | ascertained more reliably. And calculation is performed based on image data by arithmetic means, and the height which is a position of the surface of a to-be-measured object can be calculated more accurately. In addition, the board | substrate in each means is a meaning containing a printed board, a wafer board | substrate, a mounting board | substrate, etc ..

Sudan 1O

Irradiating means capable of irradiating only at least one of red light and infrared rays to a substrate having a base substrate, an electrode pattern formed on the base substrate, a film covering the surfaces of the base substrate and the electrode pattern, and a measurement object; Based on the imaging means which can image the wavelength irradiated by the said irradiation means at least among the reflected light from the said light irradiation substrate, and the image data image | photographed by the said imaging means, based on the said electrode pattern or a base substrate, And a calculating means for calculating at least the height of the object to be measured.

According to the means 10, red light or infrared rays are irradiated to the substrate by the irradiation means. Light having such a relatively long wavelength has a property of easily transmitting an object. For example, when the visible means irradiates visible light having a shorter wavelength than the above-mentioned light, the film covering the substrate may exhibit unstable transmissive characteristics such as not transmitting or not transmitting the irradiated visible light. In this case, it is difficult to determine the reflection position of the light, and there is a fear that the height reference cannot be set in the coating area. In this sense, since the irradiated light is red light or infrared light in the means 10, the irradiated light can be transmitted more reliably to the film having unstable transmission properties, and the light can be reflected by the electrode pattern under the film or the base substrate. For this reason, not only an object to be measured but an electrode pattern and a base substrate can be grasped | ascertained by an imaging means as an image. And calculation is performed based on image data by a calculation means, and can calculate the height which is a position of the surface of a to-be-measured object based on an electrode pattern or a base substrate as a height reference | standard. Therefore, since the height reference can be appropriately set in the substrate on which the measurement object is installed, the height of the measurement object can be measured more accurately.

Sudan 11

Irradiation means capable of irradiating only infrared rays to a substrate provided with a base substrate, an electrode pattern formed on the base substrate, a film covering the surfaces of the base substrate and the electrode pattern, and a measurement object, and a substrate irradiated with the light Image pickup means capable of picking up only infrared rays, and calculation means for calculating at least the height of the measured object based on the height of the electrode pattern or the base substrate based on the image data picked up by the image pickup means. Three-dimensional measuring device characterized in that.

According to the means 11, infrared rays are irradiated onto the substrate by the irradiation means. Light having such a relatively long wavelength has a property of easily transmitting the surface of an object. For example, when irradiating visible light with a wavelength shorter than the said infrared rays by an irradiation means, the film which coat | covers a board | substrate may exhibit unstable transmissive property which transmits or does not transmit irradiated visible light. In this case, it is difficult to determine the reflection position of the light, and there is a fear that the height reference cannot be set in the coating area. In this regard, in the means 11, since the irradiation light is red light or infrared light, the irradiation light can be transmitted more reliably to the film having unstable transmission properties, and can be reflected by the electrode pattern and the base substrate under the film. For this reason, not only an object to be measured but an electrode pattern and a base substrate can be grasped | ascertained by an imaging means as an image. And calculation is performed based on image data by a calculation means, and can calculate the height which is a position of the surface of a to-be-measured object based on an electrode pattern and a base substrate as a height reference | standard. Therefore, since the height reference can be appropriately set in the substrate on which the measurement object is installed, the height of the measurement object can be measured more accurately. Furthermore, since the imaging means can image only infrared rays, even when visible light from a lighting device such as an indoor lighting device touches the substrate, appropriate image data can be obtained without being affected by the visible light. In addition, when the visible light is irradiated, the amount of light reflected by the color of the film decreases, and image data obtained by imaging cannot be used, or the wavelength of the visible light needs to be changed according to the color of the film. There is a risk of causing it. In view of this, the means 11 can irradiate the light irrespective of the color of the film and reflect it on the electrode pattern under the film or the base substrate. In addition, it is good also as "irradiation means which can irradiate the light containing infrared rays" instead of "irradiation means which can irradiate only infrared rays." Even in this case, infrared rays of the irradiated light pass through the surface of the coating film and are reflected by the electrode pattern or the base substrate, and only the infrared rays are picked up by the imaging means. For this reason, the electrode pattern and base substrate which become a height reference | standard can be grasped | ascertained as an image, without a film becoming an image.

Sudan 12.

The substrate is a printed substrate, and the calculating means calculates at least the height of the cream solder as the measurement object based on the height of the electrode pattern under the resist film or the base substrate as the coating, based on the height of the cream solder. And a judging means for judging the quality of the printing state. A three-dimensional measuring apparatus according to the means 10 or the means 11.

According to the means 12, the height of the cream solder is calculated on the basis of the electrode pattern under the resist film of the printed board or the base substrate, and the quality determination is performed based on the calculated height. Therefore, when measuring a cream solder, the said effect is achieved, and also it can carry out a judgment more correctly.

Sudan 13.

The substrate is a wafer substrate, and the calculating means calculates at least the height of the solder bumps as the measurement object based on the wafer surface under the oxide film as the coating film, and the shape of the shape is based on the height of the solder bumps. 3. A three-dimensional measuring apparatus according to the means 10 or 11, wherein judging means for judging is provided.

According to the means 13, the height of the solder bumps is calculated on the basis of the wafer surface under the oxide film of the wafer substrate, and the acceptance judgment is performed based on the calculated height. Therefore, when measuring a solder bump, the said effect is achieved, and also it can carry out a judgment of more correctly.

Sudan 14.

The calculating means uses a plurality of image data in one height calculation, and the irradiation means irradiates light of the same wavelength every time the imaging for obtaining the plurality of image data is performed. The three-dimensional measuring apparatus in any one of them.

According to the means 14, the light irradiated by the irradiating means uses light having the same wavelength without changing the wavelength of the light each time the image is taken. For this reason, even if the imaging means has a lens, the refraction of light does not change. Therefore, it is possible to suppress the undesirable point that a deviation occurs in the image obtained by the wavelength of illumination. As a result, the calculation accuracy of the height of the measured object can be improved.

Sudan 15.

Said irradiation means irradiates light of wavelength 680 nm or more and 1500 nm or less, The three-dimensional measuring apparatus in any one of means 9-14.

According to the means 15, light of a wavelength of 680 nm or more and 1500 nm or less is irradiated by the irradiation means. For this reason, surface reflection can be made more reliably even if the transmission characteristic is unstable. Therefore, the surface of the film | membrane, the said measured object, etc. can be grasped | ascertained as an image by an imaging means. Instead of "680 nm or more and 1500 nm or less", "680 nm or more and 1000 nm or less" or "1000 nm or more and 1500 nm or less" may also be referred to as "780 nm or more and 900 nm or less." Or 1100 nm or more and 1400 nm or less. In addition, instead of "light of the wavelength of 680 nm or more and 1500 nm or less", "light which has a peak of a wavelength in the range of 680 nm or more and 1500 nm or less", "in the range of 680 nm or more and 1000 nm or less Light having a peak of a wavelength ”or“ light having a peak of a wavelength within a range of 1000 nm or more and 1500 nm or less ”may be referred to as“ light having a peak of a wavelength within a range of 780 nm or more and 900 nm or less. Or "light having a peak of a wavelength within the range of 1100 nm or more and 1400 nm or less".

Sudan 16

The said irradiation means irradiates the light of the wavelength range within 60 nm, The three-dimensional measuring apparatus in any one of means 9 thru | or 15 characterized by the above-mentioned.

According to the means 16, the wavelength range of the light irradiated by the irradiating means is relatively narrowly set within 60 nm. In general, the refraction of light when passing through a lens depends on the wavelength, and there is a fear that chromatic aberration occurs when the wavelength range is wide. In this regard, in the means 16, even when the illuminating device or the imaging means has a lens, the wavelength range is narrow, and chromatic aberration generated during irradiation or imaging can be suppressed. In other words, sharp image data can be obtained without blurring of irradiated light or blurring of the captured image data. Therefore, the calculation accuracy of the height of the measured object based on the image data can be improved. In addition, it is good also as "30 nm or less" instead of "60 nm or less." In this case, chromatic aberration can be further suppressed, and as a result, the calculation accuracy of the height of the measured object based on the image data can be further improved.

(Example)

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment is described, referring drawings. As shown in FIG. 2, the printed circuit board 1 as a board | substrate forms a flat plate shape (it has a flat surface), and the electrode pattern 3 which consists of copper foil on the base board | substrate 2 which consists of glass epoxy etc. Is installed. Furthermore, a cream solder 4 as a measurement object is printed on the electrode pattern 3. In addition, the printed circuit board 1 is coated with the translucent resist film 5 as a film so that the cream solder 4 may not be loaded other than the predetermined wiring portion of the electrode pattern 3. Moreover, the surface of the resist film 5 has comprised the plane of substantially constant height.

FIG. 1: is a schematic block diagram which shows typically the printing state inspection apparatus 8 provided with the three-dimensional measuring apparatus in this embodiment. As shown in the figure, the printing state inspection apparatus 8 includes a table 9 for mounting the printed board 1 and predetermined light from an oblique upper side with respect to the surface of the printed board 1. The illumination device 10 constituting the irradiation means for irradiating the component pattern, the CCD camera 11 constituting the imaging means for imaging the irradiated portion on the printed board 1, and the printing state inspection apparatus ( The control apparatus 12 for performing various control, image processing, and arithmetic process in 8) is provided.

The table 9 is provided with motors 15 and 16, and the prints placed on the table 9 by driving the motors 15 and 16 by the control device 12 are controlled. The board | substrate 1 is made to slide in arbitrary directions (X-axis direction and Y-axis direction).

As shown in FIG. 3, the illumination device 10 includes a light source 17, a condenser lens 18 for collecting light from the light source 17, an irradiation lens 19, and both lenses 18. ) And liquid crystal optical shutter 21 disposed between 19. The light from the light source 17 is irradiated onto the printed circuit board 1 via the liquid crystal optical shutter 21, and in particular, the light pattern of a stripe shape in which illuminance changes to a sine wave shape is irradiated to the printed circuit board 1. . In the liquid crystal optical shutter 21, the phase of the light pattern is changed by a predetermined pitch.

In addition, the wavelength is set so that the light irradiated from the light source 17 is reflected not only on the surface of the cream solder 4 but also on the surface of the resist film 5 as shown in FIG. 4. However, in this embodiment, the light source 17 irradiates an ultraviolet-ray, for example, LED, a UV lamp, etc. are used. Since light of a relatively short wavelength, such as ultraviolet rays, is easily reflected on the surface, it is possible to more certainly reflect on the surface of a semi-transparent material such as the resist film 5. In addition, the condenser lens 18 and the irradiation lens 19 can transmit light having the wavelength, and the CCD camera 11 is capable of imaging only ultraviolet rays.

In particular, the wavelength range of the light to be irradiated is set relatively narrow. In general, the refraction of light when passing through a lens depends on the wavelength, and there is a fear that chromatic aberration occurs when the wavelength range is wide. From this point of view, by narrowing the wavelength range, the chromatic aberration generated at the time of irradiation or imaging can be suppressed, and a sharp image can be obtained.

Here, the inspection procedure in the print state inspection apparatus 8 will be described. First, when the printed board 1 is placed on the table 9, the control device 12 drives and controls the motors 15 and 16 to move to a predetermined position, and moves the printed board 1 to the initial position. Move it. This initial position is one position in which the surface of the printed circuit board 1 was divided | divided previously, for example with the magnitude | size of the visual field of the CCD camera 11 as a unit.

And the control apparatus 12 drive-controls the lighting apparatus 10, and starts irradiation of a light pattern. The irradiated light is reflected on the surface of the printed board 1 such as the cream solder 4 or the resist film 5, and the reflected light is captured by the CCD camera 11. At this time, the phases of the light patterns are shifted by a quarter pitch, for example, to control the switching of the four types of light patterns sequentially. In addition, while the irradiation of each light pattern is performed in this way, the control device 12 drives and controls the CCD camera 11, and captures an inspection area portion for each of these light patterns, and respectively displays four screens of image data. Get

By the way, the control apparatus 12 is equipped with the image memory, and stores image data one by one. Based on the stored image data, the control apparatus 12 performs various image processing. While such image processing is being performed, the control apparatus 12 drives and controls the motors 15 and 16 to move the table 9 to the next inspection area. The control apparatus 12 also stores the image data here in the image memory. On the other hand, when the image processing in the image memory is finished once, since the next image data is already stored in the image memory, the control device 12 can quickly perform the next image processing. That is, the inspection performs the movement and image input from one side to the next inspection area (m + 1st), and the other side performs the mth image processing and comparison determination. Thereafter, the same parallel processing is repeatedly performed alternately until the inspection in all the inspection areas is completed. Thus, in the printing state inspection apparatus 8 of this embodiment, the cream solder on the printed circuit board 1 is performed by performing image processing sequentially, moving the inspection area by control of the control apparatus 12. The printing state of 4) can be inspected at high speed and reliably.

Next, the image processing and arithmetic processing which the control apparatus 12 performs, and the comparison determination process are demonstrated. The control apparatus 12 calculates the height in an inspection area using the obtained 4-screen image data. With respect to the light pattern projected on the inspection area, a phase difference based on the height difference occurs. The control device 12 uses the image data of each light pattern to calculate the height of the reflection surface based on the principle of the phase shift method (stripe scanning method). The height data thus obtained is calculated in the pixel unit of the imaging screen and stored in the memory of the control device 12.

The height of the printed cream solder 4 with respect to the printed circuit board 1 is computed based on the height of the printer substrate 1 based on the height of the area | region of the resist film 5 which comprises a plane among the obtained height data. In addition, by integrating the height of the cream solder 4, the amount of the printed cream solder 4 is calculated. And the data, such as the height and quantity of the cream solder 4 calculated | required in this way, is compared with the reference data memorize | stored previously, and the cream solder in the inspection area depends on whether this comparison result exists in an allowable range. Pass or fail of the printing state of (4) is determined.

As described above in detail, according to the present embodiment, by irradiating ultraviolet rays with the illumination device 10, even the translucent resist film 5 can reliably reflect light on its surface. For this reason, the surface of the resist film 5 in the printed circuit board 1 with which the cream solder 4 to which the printing state was to be determined can be detected, and the surface can be used as a reference height. As a result, the height of the cream solder 4 can be calculated more accurately than in the case of adopting the height standard other than the same printed board 1.

In addition, the height of the resist film 5 can be measured simultaneously with the height measurement of the cream solder 4. For this reason, it is not necessary to measure the height of a resist film and a separate height reference by other means, and the complexity of an apparatus can be suppressed.

Moreover, the printing state inspection apparatus 8 is generally installed indoors with the indoor lighting device. Generally, in this indoor lighting device, the radiation energy of visible light is large, and the radiation energy of the light of short wavelength employ | adopted by this embodiment is sufficiently small compared with visible light. For this reason, even if the light from the indoor lighting device is irradiated to the printed board 1, undesirable occurrences such as the inability to process an image captured by the CCD camera 11 are unlikely to occur.

Furthermore, when the visible light is irradiated, the amount of light reflected by the color of the resist film 5 decreases, and image data obtained by imaging is not available, or the wavelength of the visible light depending on the color of the resist film 5. There is a fear that undesirable things, such as need to change or need to be changed. From this point of view, since the surface reflection can be performed irrespective of the color of the resist film 5, the above concerns can be eliminated.

In addition, the wavelength range of the light irradiated from the illuminating device 10 is set relatively narrow as mentioned above. Therefore, chromatic aberration hardly occurs, and sharp image data can be obtained without blurring of light patterns or blurring of captured image data. Therefore, the calculation precision of height, quantity, etc. of the cream solder 4 based on this image data can be improved.

In addition, the light of the same wavelength is used for a light pattern, without changing the wavelength of light for every light pattern. That is, even if the light pattern is changed, the refraction of the light when passing through the lens does not change. For this reason, it is possible to suppress undesirable points such as deviations in the image obtained by the wavelength of illumination. As a result, calculation accuracy, such as height and quantity of the cream solder 4 based on image data, can be improved.

In embodiment described above, it is also possible to change a part of structure suitably as follows, for example. Of course, other modifications not exemplified below are naturally possible.

(a) Although the ultraviolet light is irradiated from the illuminating device 10 in the above embodiment, blue light may be used as long as it can be reflected on the surface of the resist film 5. In this case, the CCD camera needs to be capable of picking up blue light. Moreover, the light irradiated by the illuminating device 10 is 250 nm or more and the wavelength of 430 nm or less is preferable. More preferably, it is a wavelength of 300 nm or more and 380 nm or less, More preferably, it is a wavelength of 30 nm or more and 350 nm or less. Instead of the wavelength of 250 nm or more and 430 nm or less, light having a peak of a wavelength within a range of 250 nm or more and 430 nm or less, and a light having a peak of the wavelength within a range of 300 nm or more and 380 nm or less. Similar effects can be obtained even when the light has a peak of a wavelength within a range of 300 nm or more and 350 nm or less.

(b) Although ultraviolet light is to be irradiated from the light source 12, it is only necessary that the wavelength of the light reaching the printed circuit board 1 is a predetermined wavelength, and the wavelength of the light from the light source 12 is not necessarily the predetermined wavelength. good. For example, as a light source irradiates light with a wide wavelength range including a predetermined wavelength, only a predetermined wavelength between the lighting apparatus 10 and the printed circuit board 1 or in the lighting apparatus 10 (predetermined) It is also possible to provide a filter capable of transmitting only a wavelength in a narrow wavelength range of?).

(c) Although the said embodiment does not specifically mention numerically about the wavelength range of light, Preferably it is within 60 nm, More preferably, it is within 30 nm.

(d) Although the light irradiated to the printed circuit board 1 is an ultraviolet-ray in the said embodiment, it does not interfere even if it irradiates the light of a different wavelength in addition to an ultraviolet-ray, and only the ultraviolet-ray is imaged. In this case, of course, the CCD camera 11 may be capable of imaging only ultraviolet rays, or may be provided with a filter that can transmit only ultraviolet rays between the CCD camera and the printed circuit board 1.

(e) In the above embodiment, the number of times of imaging is performed four times, but may be three times or five or more times.

(f) In the above embodiment, the embodiment is specified in the case of measuring the height or the like of the cream solder 4 formed on the printed circuit board 1, but the present invention can also be applied to an inspection apparatus such as a wafer substrate or a mounting substrate. For example, in the case of a wafer substrate, the height, shape, volume, and the like of the solder bumps can be calculated using the surface of the oxide film as the reference height.

(g) In the above embodiment, the phase shift method is adopted as the three-dimensional measurement method, but in addition, the optical cutting method, the moire method, the in-focus method, the confocal method, and the space Various three-dimensional measurement methods, such as a coding method and a grid pattern projection method, can also be employ | adopted.

(h) Instead of the illuminating device 10 of the above embodiment, light having a wavelength that passes through the resist film 5 and reflects from the surface of the cream solder 4, the electrode pattern 3, or the like is printed on the substrate 1. ), And the light of the wavelength may be imaged. That is, the irradiated light may be infrared or red light instead of the ultraviolet light of the above embodiment, and the infrared or red light may be imaged. Since light of relatively long wavelengths, such as infrared rays and red light, is relatively easy to transmit through an object, it becomes possible to transmit about translucent things like the resist film 5.

In this manner, as shown in FIG. 5, the infrared rays are reflected on the surface of the cream solder 4, and simultaneously pass through the translucent resist film 5 and are reflected by the electrode pattern 3 and the like. For this reason, the height of the cream solder 4 can be calculated based on the height of the electrode pattern 3, for example. In addition, when reflected light is obtained also about the base substrate 2, it is also possible to make the base substrate 2 a height reference.

In this case, the light to irradiate is 680 nm or more, and the wavelength of 1500 nm or less is preferable. The wavelength may be 680 nm or more and a wavelength of 1000 nm or less, or a wavelength of 1000 nm or more or 150 nm or less, and a wavelength of 780 nm or more and 900 nm or less, or 1100 nm or more and 1400 nm or less. You may make it. Moreover, instead of the wavelength of 680 nm or more and 1500 nm or less, the light which has a peak of a wavelength in the range of 680 nm or more and 1500 nm or less, the light which has a peak of the wavelength in the range of 680 nm or more and 1000 nm or less, Light having a peak of wavelength within a range of 1000 nm or more and 1500 nm or less, light having a peak of wavelength within a range of 780 nm or more or 900 nm or a peak of a wavelength within a range of 1100 nm or more and 1400 nm or less Even with light having the same effect, the same effect can be obtained.

In addition, of course, it is also possible to carry out by changing suitably as said (b), (c), (e), (f), (g).

 As mentioned above, this invention can provide the three-dimensional measuring apparatus which can measure more accurately by setting a height reference in the said object suitably, etc., when measuring the three-dimensional shape of an object. Has

Claims (20)

delete Irradiating means capable of irradiating at least one of blue light and ultraviolet rays to the base substrate, the substrate covering the surface of the base substrate, and having a film and a measurement object forming a plane; Imaging means capable of imaging at least the wavelength irradiated by the irradiation means among the reflected light from the substrate to which the light is irradiated; And a calculation means for calculating at least the height of the object to be measured, based on the height of the plane formed by the film, based on the image data picked up by the image pickup means. Irradiation means which irradiates only a ultraviolet-ray with respect to the base board | substrate, the board | substrate which coat | covers the surface of the base board | substrate, and is equipped with the film | membrane and the to-be-measured object which are planar, Imaging means which can image only an ultraviolet-ray among the reflected light from the board | substrate with which the said light was irradiated, And a calculation means for calculating at least the height of the object to be measured, based on the height of the plane formed by the film, based on the image data picked up by the image pickup means. The method of claim 2, The substrate is a printed substrate, The calculating means calculates at least the height of a cream solder as the measurement object based on the height of the surface of the resist film as the coating film, Based on the height of this cream solder, the determination means which determines the quality of the printing state was provided, The three-dimensional measuring apparatus characterized by the above-mentioned. The method of claim 3, wherein The substrate is a printed substrate, The calculating means calculates at least the height of the cream solder as the measurement object based on the height of the surface of the resist film as the coating film, Based on the height of this cream solder, the determination means which determines the quality of the printing state was provided, The three-dimensional measuring apparatus characterized by the above-mentioned. The method of claim 2, The substrate is a wafer substrate, The calculating means calculates at least the height of the solder bumps as the measurement object based on the height of the surface of the oxide film as the coating film, Based on the height of the solder bumps, a three-dimensional measurement device characterized in that the determination means for determining the quality of the shape is provided. The method of claim 3, wherein The substrate is a wafer substrate, The calculating means calculates at least the height of the solder bumps as the measurement object based on the height of the surface of the oxide film as the coating film, Based on the height of the solder bumps, a three-dimensional measurement device characterized in that the determination means for determining the quality of the shape is provided. The method according to any one of claims 2 to 7, The calculating means uses a plurality of image data in one height calculation. The said irradiation means irradiates the light of the same wavelength for every imaging for obtaining the said some image data, The three-dimensional measuring apparatus characterized by the above-mentioned. The method according to any one of claims 2 to 7, The said irradiation means irradiates the light of wavelength 250nm or more and 430nm or less, The three-dimensional measuring apparatus characterized by the above-mentioned. The method according to any one of claims 2 to 7, The said irradiation means irradiates the light of the wavelength range exceeding 0 nm and 60 nm or less, The three-dimensional measuring apparatus characterized by the above-mentioned. Irradiating means capable of irradiating at least one of red light and infrared ray to the measurement object on the substrate; imaging means capable of imaging at least the wavelength irradiated by the irradiation means among reflected light from the measurement object irradiated with the light; And calculating means for calculating at least the height of the measurement object based on image data picked up by the imaging means. Irradiating means capable of irradiating only at least one of red light and infrared rays to a substrate having a base substrate, an electrode pattern formed on the base substrate, a film covering the surfaces of the base substrate and the electrode pattern, and a measurement object; Based on the image pickup means which can image the wavelength irradiated by the said irradiation means at least among the reflected light from the board | substrate with which the said light was irradiated, and the image data image | photographed by the said image pickup means, and based on the said electrode pattern or a base substrate as a height reference | standard And calculating means for calculating at least the height of the object to be measured. Irradiation means capable of irradiating only infrared rays with a base substrate, an electrode pattern formed on the base substrate, a film covering the surfaces of the base substrate and the electrode pattern, and a measurement object; Image pickup means capable of picking up only infrared rays, and calculation means for calculating at least the height of the measured object based on the height of the electrode pattern or the base substrate based on the image data picked up by the image pickup means. Three-dimensional measuring device characterized in that. The method of claim 12, The substrate is a printed board, and the calculating means calculates at least the height of the cream solder as the measurement object based on the height of the electrode pattern under the resist film or the base substrate as the coating, and the height of the cream solder. On the basis of this, determination means for determining whether or not the print state is provided is provided. The method of claim 13, The substrate is a printed board, and the calculating means calculates at least the height of the cream solder as the measurement object based on the height of the electrode parton or the base substrate under the resist film as the coating film, based on the height of the cream solder. And a judging means for judging the quality of the printing state is provided. The method of claim 12, The substrate is a wafer substrate, and the calculating means calculates at least the height of the solder bumps as the measurement object based on the wafer surface under the oxide film as the coating film, and the shape of the shape is based on the height of the solder bumps. 3. A three-dimensional measuring apparatus characterized by comprising determining means for determining the quality. The method of claim 13, The substrate is a wafer substrate, and the calculating means calculates at least the height of the solder bumps as the measurement object based on the wafer surface under the oxide film as the coating film, and the shape of the shape is based on the height of the solder bumps. 3. A three-dimensional measuring apparatus characterized by comprising determining means for determining the quality. The method according to any one of claims 11 to 17, And said calculating means uses a plurality of image data in one height calculation, and said irradiating means irradiates light of the same wavelength every imaging for obtaining said plurality of image data. The method according to any one of claims 11 to 17, The said irradiation means irradiates the light of wavelength 680 nm or more and 1500 nm or less, The three-dimensional measuring apparatus characterized by the above-mentioned. The method according to any one of claims 11 to 17, The said irradiation means irradiates the light of the wavelength range exceeding 0 nm and 60 nm or less, The three-dimensional measuring apparatus characterized by the above-mentioned.

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