KR100735868B1 - 패럴린 코팅 전처리용 플라즈마 발생장치 - Google Patents
패럴린 코팅 전처리용 플라즈마 발생장치 Download PDFInfo
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- KR100735868B1 KR100735868B1 KR1020050071465A KR20050071465A KR100735868B1 KR 100735868 B1 KR100735868 B1 KR 100735868B1 KR 1020050071465 A KR1020050071465 A KR 1020050071465A KR 20050071465 A KR20050071465 A KR 20050071465A KR 100735868 B1 KR100735868 B1 KR 100735868B1
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- South Korea
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- vacuum chamber
- base material
- positive electrode
- negative electrode
- vacuum
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32825—Working under atmospheric pressure or higher
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
Abstract
Description
Claims (5)
- 삭제
- 삭제
- 삭제
- 도어가 구비된 진공챔버 내에 간격을 두고 상하 교대로 설치되며 고주파가 인가되는 음전극 및 양전극과;상기 음전극 및 양전극의 사이에 설치되고 플라스틱, PCB, 종이, 고무 중에서 선택된 모재를 수납할 수 있도록 다수의 슬릿이 형성되는 모재수납판과;상기 진공챔버 내로 연장된 가스분사구를 통해 반응가스를 공급하는 가스탱크; 및상기 진공챔버의 일측벽에 구비된 배출관을 통해 진공챔버 내의 압력을 조절하는 진공펌프;로 구성되는 패럴린 코팅 전처리용 플라즈마 발생장치에 있어서,상기 진공챔버에 구비되면서 진공펌프와 연통되는 배출관은 진공챔버의 일측벽 중앙부와 이 중앙부에 대칭되도록 주변부에 여러 개로 형성되고;상기 진공챔버에 구비된 가스분사구는 음전극과 양전극의 사이로 길게 연장되어 분사노즐이 진공챔버의 중앙에 위치하는 것을 특징으로 하는 패럴린 코팅 전처리용 플라즈마 발생장치.
- 제 4항에 있어서,상기 진공챔버 내의 압력을 조절하는 진공펌프에는 사용되는 오일을 필터링하는 오일클리너가 구비되는 것을 특징으로 하는 패럴린 코팅 전처리용 플라즈마 발생장치.
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KR1020050071465A KR100735868B1 (ko) | 2005-08-04 | 2005-08-04 | 패럴린 코팅 전처리용 플라즈마 발생장치 |
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KR1020050071465A KR100735868B1 (ko) | 2005-08-04 | 2005-08-04 | 패럴린 코팅 전처리용 플라즈마 발생장치 |
Publications (2)
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KR20070016640A KR20070016640A (ko) | 2007-02-08 |
KR100735868B1 true KR100735868B1 (ko) | 2007-07-06 |
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KR1020050071465A KR100735868B1 (ko) | 2005-08-04 | 2005-08-04 | 패럴린 코팅 전처리용 플라즈마 발생장치 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102290337B1 (ko) * | 2018-06-29 | 2021-08-17 | 한국세라믹기술원 | 가스센서용 전극 제조방법 및 가스센서 |
CN112820614A (zh) * | 2020-12-31 | 2021-05-18 | 深圳泰德半导体装备有限公司 | 等离子清洗设备 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010049903A (ko) * | 1999-07-27 | 2001-06-15 | 이마이 기요스케 | 플라즈마 생성용 전극, 그 전극을 사용하는 플라즈마 처리장치, 및 그 장치로 플라즈마 처리하는 방법 |
KR20020004935A (ko) * | 1999-09-09 | 2002-01-16 | 니시히라 순지 | 내부 전극 방식의 플라즈마 처리 장치 및 플라즈마 처리방법 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20010049903A (ko) * | 1999-07-27 | 2001-06-15 | 이마이 기요스케 | 플라즈마 생성용 전극, 그 전극을 사용하는 플라즈마 처리장치, 및 그 장치로 플라즈마 처리하는 방법 |
KR20020004935A (ko) * | 1999-09-09 | 2002-01-16 | 니시히라 순지 | 내부 전극 방식의 플라즈마 처리 장치 및 플라즈마 처리방법 |
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