KR100733245B1 - Printed circuit board with embeded chip components and manufacturing method thereof - Google Patents

Abstract

A printed circuit board having embedded chip components and a manufacturing method thereof are provided to improve freedom of a design by freely using the mount area of a bottom surface. A printed circuit board having embedded chip components includes a first insulation layer(101), a second insulation layer(201), a third insulation layer(301), a first circuit layer(105), and a second circuit layer(305). The first insulation layer(101) has a penetrating unit or a groove unit. The first circuit layer(105) is formed at both sides of the first insulation layer(101) except for the penetrating unit or the groove unit. The second insulation layer(201) is inserted into the penetrating unit or the groove unit of the first insulation layer(101), and one surface of a chip component(204) having component terminals(205) at both sides is buried in the second insulation layer(201) with being exposed. The third insulation layer(301) is laminated on the first circuit layer(105) and the first insulation layer(201) inserted into the second insulation layer(201). The second circuit layer(305) includes a connection member to electrically connect the terminal(205) of the chip component(204).

Description

Printed circuit board with embedded chip components and manufacturing method thereof

1A to 1P are schematic cross-sectional views illustrating a process flow of manufacturing a printed circuit board having embedded components according to the related art.

2A to 2J are cross-sectional views schematically illustrating a process flow of manufacturing a printed circuit board having embedded chip components according to an exemplary embodiment of the present invention.

3A to 3K are schematic cross-sectional views illustrating a process flow of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention.

4A to 4I are schematic cross-sectional views illustrating a process flow of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention.

5A to 5I are schematic cross-sectional views illustrating a process flow of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention.

6A through 6K are cross-sectional views schematically illustrating a process flow of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention.

※ Explanation of code about main part of drawing ※

101, 201, 301, 111, 211, 311, 121, 221, 321, 131, 231, 331, 141, 341: insulating layer

102, 202, 112, 212, 122, 222, 132, 232, 142: conductive metal layer

103, 203, 113, 213, 123, 223, 233, 143: penetration

133: groove

104, 303, 114, 313, 124, 134, 144, 343: through hole

105, 305, 115, 218, 219, 315, 125, 228, 229, 135, 238, 239, 145, 345: circuit layer

204, 214, 224, 234, 242: chip components

205, 215, 225, 235, 243: Component terminal

206, 216, 226, 236, 244: insulating material

207, 217, 227, 237, and 245 cutting lines

230, 240: adhesive member

241 support member

302, 304, 312, 314, 342, 344: via hole

The present invention relates to a printed circuit board having a built-in chip component and a method of manufacturing the same. More specifically, the present invention is a built-in chip having the advantages of both the electrical characteristics and the space utilization characteristics of the chip component embedding method by separating and fabricating the substrate to be the actual product and the substrate containing the component and then integrated to manufacture the final product A printed circuit board having a component and a method of manufacturing the same.

Flip chip technology, either ball grid array (BGA) or pin grid array (PGA), is a well known technique for coupling ICs to substrates. For example, in the manufacture of Flip Chip BGA (FCBGA) packages, the electrically conductive terminals or lands of the IC components are soldered directly to the corresponding lands of the die bond region on the surface of the substrate using reflowable solder bumps or balls. . At this time, the electronic component or components are functionally connected to other elements of the electronic system through a layer of electrically conductive paths including the substrate traces, and the substrate traces generally carry signals transmitted between electronic components such as the IC of the system. . In the case of FCBGA, the IC at the top of the substrate and the capacitor at the bottom may be surface-mounted respectively. In this case, the path of the circuit connecting the IC and the capacitor, that is, the length of the connection circuit, is increased by the thickness of the substrate. Increased values adversely affect electrical performance. In addition, since a certain area of the lower surface can only be used for chip mounting, for example, a user who wants a ball array on all the lower surfaces can not satisfy the requirements.

As a solution to this problem, the chip component embedding technology, which reduces the circuit path by inserting chip components into the FCBGA substrate, has not been applied to a board containing a large number of components due to reliability and the like. This is because, even when the yield per chip is high, even if any one of the commercialized units is defective, the product itself becomes a defective product, and the yield per unit containing a large amount of chips is significantly reduced. For example, even if the individual yield of the chip is 99%, in the case of a unit in which 100 chips are mounted, there is a case where a total failure occurs due to one chip failure. Defect detection is also carried out after the completion of the substrate in the substrate process, it can be said that the cost of loss due to a single bad chip is very large.

For example, Korean Patent Laid-Open Publication No. 2004-73606 as a conventional embedded technology discloses a method of inserting a part into a base and forming a contact. Hereinafter, this will be described with reference to FIGS. 1A to 1P.

First, a resin substrate 1 for a printed circuit board having a conductive metal layer 2, for example, a copper layer laminated on both surfaces thereof is prepared (see FIG. 1A), and then a through hole 3 is formed for electrical connection. 1b). Next, the metal layer 4 is grown on the substrate 1 on which the through hole 3 is formed (for example, by plating) (see FIG. 1C), and patterned to form the metal layer 4 of the unnecessary portion 5. Is removed and the circuit layer 4 is formed (see FIG. 1D).

Subsequently, the penetrating portion 6 is machined to a portion where the IC chip is to be inserted, extending from the first surface 1a to the second surface 1b over the entire substrate 1 (see FIG. 1E), and supporting tape or the like. The member 7 is attached to the second surface 1b side of the substrate 1 (see FIG. 1F). Next, the IC chip 8 is inserted into the penetrating portion 6 and attached to the tape 7 (FIG. 1G) to align the IC chip 8 by filling the penetrating portion 6 with the filler 9. It is attached to (1) (refer FIG. 1H).

Subsequently, the tape 7 is removed (see FIG. 1I), and the insulating layer 10 and the metal layer 11 are laminated on the substrate 1, respectively (see FIG. 1J), and then blind via holes for interlayer electrical connection. 12 is processed and formed (refer FIG. 1K). Next, the conductive layer 13 is formed in the blind via hole 12 and on the substrate surface (see FIG. 1L), and then patterned to form the conductive pattern 13 (see FIG. 1M).

Finally, after forming the solder resist layer 14 as the outermost layer and exposing the connection region through a conventional solder opening process (see FIGS. 1N and 1O), for example, conventional Ni / Au plating or OSP is applied. To prepare a contact pad 15.

However, in the case of using such a built-in method according to the prior art, there is a problem that the yield is very low due to the characteristics of the embedded substrate, which is not possible to simply replace defective parts, unlike surface mounting. Therefore, in order to overcome this tendency, there is a need for a new concept implementation method capable of improving yield while improving performance.

Accordingly, the present invention has found that the above problems can be solved by separating and manufacturing a substrate and a substrate incorporating parts to be a real product, and then manufacturing the final product by integrating the same.

Accordingly, an object of the present invention is to provide a printed circuit board having an embedded chip component having both the advantages of the electrical characteristics and the space utilization characteristics of the chip component embedding method and a method of manufacturing the same.

Another object of the present invention is to provide a printed circuit board having a built-in chip component capable of reducing costs by maximizing product yield and reliability, and a method of manufacturing the same.

It is still another object of the present invention to reduce unit defects in the whole process in terms of products, and to improve yield and substrate reliability since the warpage of the board up to the component mounting process and other potential process defects do not affect the final product. There is provided a printed circuit board having a built-in chip component and a method of manufacturing the same.

It is still another object of the present invention to provide a printed circuit board having a built-in chip component capable of freely using a mounting area of a lower surface in terms of design and improving a design degree of freedom, and a method of manufacturing the same.

It is still another object of the present invention to provide a printed circuit board having a built-in chip component capable of improving electrical characteristics by reducing a circuit path when applied as a substrate for FCBGA and thereby reducing impedance, and a method of manufacturing the same.

A printed circuit board having an embedded chip component according to the present invention for achieving the above and other objects is:

(a) a first insulating layer having a through portion or a groove portion;

(b) a first circuit layer formed on both sides of the first insulating layer except for the through part or the groove part;

(c) a second insulating layer inserted into a through portion or a groove portion of the first insulating layer and having one surface of a chip component having component terminals attached to both sides thereof exposed;

(d) a first insulating layer having the second insulating layer inserted therein and a third insulating layer stacked on the first circuit layer; And

(e) a second circuit layer formed on the third insulating layer and including a connection member for electrically connecting the terminal of the chip component and the first circuit layer;

Characterized in that it comprises a.

Here, the first insulating layer and the third insulating layer may be the same or different from each other thermosetting resin or thermoplastic resin, the second insulating layer is a thermosetting resin or thermoplastic resin impregnated with a thermosetting resin, a thermoplastic resin, a ceramic filler, and Combinations thereof. In addition, the second insulating layer preferably has a higher thermal conductivity than the first insulating layer and the third insulating layer.

On the other hand, the second insulating layer preferably has a shape corresponding to the through portion or the groove portion of the first insulating layer. In addition, it is preferable that both side surfaces of the through portion or the groove portion of the first insulating layer and both side surfaces of the second insulating layer have the same slope. More preferably, both side surfaces or one side surface of the through portion or the groove portion of the first insulating layer and the side surface of the second insulating layer corresponding thereto have an oblique slope. Preferably, the through part or the groove part of the first insulating layer has different widths on the upper and lower surfaces so that the second insulating layer inserted therein is fixed over the inclined surface.

According to an embodiment of the present invention, a circuit layer may be further formed on one or both surfaces of the second insulating layer including the exposed surface of the chip component. Preferably, the circuit layer formed on one surface of the second insulating layer including the exposed surface of the chip component and the first circuit layer formed on one surface of the first insulating layer corresponding thereto are on a plane having the same height.

According to another embodiment of the present invention, an adhesive member may be further formed between at least one of the contact surfaces between the second insulating layer and the through portion or the groove portion of the first insulating layer, wherein the adhesive member is preferably Preferably an adhesive tape or insulating resin.

The connecting member is preferably formed by a via hole.

In addition, the chip component may be an active device or a passive device.

A printed circuit board having embedded chip components according to the present invention is:

(a) processing the through portion or the groove portion in the first insulating layer;

(b) forming a first circuit layer on both sides of the first insulating layer except for the through part or the groove part;

(c) providing a second insulating layer in which one surface of the chip component having component terminals attached to both sides thereof is exposed;

(d) cutting the second insulating layer having the chip component embedded therein into a size that can be inserted into a through portion or a groove portion of the first insulating layer;

(e) inserting the cut second insulating layer into a through portion or a groove portion of the first insulating layer;

(f) stacking a third insulating layer on the first insulating layer and the first circuit layer into which the second insulating layer is inserted; And

(g) forming a second circuit layer on the third insulating layer, the second circuit layer including a connecting member for electrically connecting the terminal of the chip component and the first circuit layer;

Characterized in that it comprises a.

According to one embodiment of the invention, step (c) is:

Providing a second insulating layer;

Processing a through hole in an array type in the second insulating layer to secure a chip component buried space; And

Burying a chip component having component terminals attached to both sides by using a component mounting method in the through hole of the second insulating layer, and embedding one surface of the chip component to expose the surface;

It may be performed including.

According to one embodiment of the invention, step (c) is:

Providing a support member;

Surface-mounting a chip component having component terminals attached to both sides on the support member;

Embedding the chip component in the second insulating layer by encapsulating the surface mounted chip component using an insulating material; And

Removing the support member to expose one surface of the chip component;

It may be performed including.

According to another embodiment of the present invention, the step (c) is:

Providing a second insulating layer having a conductive metal layer laminated on both surfaces thereof;

Processing through holes in an array type in the conductive metal layer and the second insulating layer to secure a space where a chip component is to be inserted;

Burying a chip component having component terminals attached to both sides by using a component mounting method in the through hole of the second insulating layer, and embedding one surface of the chip component to expose the surface; And

Forming a circuit layer on one or both surfaces of the second insulating layer including an exposed surface of the chip component;

It may be performed including.

Optionally, forming an adhesive member between at least one of the contact surfaces between the second insulating layer and the through portion or the groove portion of the first insulating layer may be further performed.

According to one embodiment of the present invention, the adhesive member forming step may be performed by attaching an uncured insulating resin to at least one of the contact surfaces. According to another embodiment of the present invention, the forming of the adhesive member may be performed by attaching an adhesive tape to at least one of the contact surfaces. According to another embodiment of the present invention, the forming of the adhesive member may be performed by filling an insulating resin between the contact surfaces.

On the other hand, step (g) is:

Forming a via hole in the third insulating layer to electrically connect the terminal and the first circuit layer of the chip component with a second circuit layer;

Forming a conductive metal layer on the third insulating layer including the via hole; And

Patterning the conductive metal layer to form a second circuit layer;

It is preferable to be decomposed including.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

As described above, the present invention is a method of separately manufacturing a substrate containing a substrate and a component to be a real product, and more specifically, by inserting the component in an array form on a separate substrate and then cutting it into a unit to inspect only good quality It is separated and reinserted into the main board to be the actual product. By dividing the embedded parts into arbitrary units and applying the method of inserting only the parts confirmed to be good again as a part of the main board, it takes all the advantages of the built-in method and advances them in a separate board to be inserted into the inner layer. Part failure detection has the advantage of reducing costs by reducing unit failure during the entire process.

Hereinafter, a method of manufacturing a printed circuit board having embedded chip components according to the present invention will be described in more detail with reference to preferred embodiments shown in FIGS. 2 to 6, but the scope of the present invention is not limited thereto.

Referring to FIGS. 2A to 2J, a method of manufacturing a printed circuit board having embedded chip components according to an exemplary embodiment of the present invention will be described below.

First, a first insulating layer 101 in which a conductive metal layer 102, for example, a copper layer is laminated on both surfaces is prepared (see FIG. 2A). Here, for example, through-holes 103 for securing a space into which the second insulating layer in which the chip parts are embedded are inserted and through-holes 104 for interlayer electrical conduction are formed by a known method such as mechanical drilling. (See FIG. 2B). At this time, the through part 103 is formed at an oblique slope so that the upper and lower surfaces have different widths so that the second insulating layer does not fall out after insertion. Next, the first circuit layer 105 is formed on both surfaces of the first insulating layer 101 except for the through part 103 through a patterning process of a conventional metal layer 102 to facilitate via connection (FIG. 2C). Reference).

Meanwhile, after separately preparing the second insulating layer 201 having the conductive metal layer 202 laminated on both surfaces (see FIG. 2D), the through parts 203 are densely formed in an array type through a known method such as mechanical drilling. Secure space for embedding chip components (see FIG. 2E). Subsequently, the chip component 204 having the component terminals 205 attached to both sides is buried in the second insulating layer 201 using the insulating material 206 through the normal component mounting method. Buried so that one surface is exposed (see FIG. 2F). In this embedding method, for example, one side of the substrate on which the through portion 203 is formed is taped, the chip component 204 is mounted and the insulating material 206 is filled, and then the tape is removed. One surface of 204 may be embedded to expose.

In this case, both the conventional passive element and / or the active element may be used as the chip component 204, and examples thereof include a resistor, a capacitor, and an IC. In addition, the insulating material 206 is not particularly limited as long as it is used in a component mounting method such as a filling ink and an insulating paste.

Next, the second component layer 201 having the chip component 204 embedded therein is routed obliquely by the unit along the cutting line 207 in the through part 103 formed in the first insulating layer 101. 204 is inserted upwards (see FIG. 2G).

Subsequently, the insulating layer 301 used as a normal resin substrate such as Ajinomoto Build UP Film (ABF) is formed into the first insulating layer 101 and the first circuit layer 105 into which the second insulating layer 201 is inserted. The gap space between the first insulating layer 101 and the second insulating layer 201 is filled and fixed (see FIG. 2H).

Next, a through hole 303 and a blind via hole 302 for interlayer conduction are formed through laser processing and / or mechanical drill processing (see FIG. 2I).

Finally, the second circuit layer 305 is formed on the third insulating layer 301 through a conventional circuit layer forming method such as a semi-additive process (SAP) (see FIG. 2J). Through this process, the terminal 205 and the first circuit layer 105 of the chip component 204 are electrically connected to the second circuit layer 305 by a connection member such as the blind via hole 304.

It will be apparent to those skilled in the art that the substrate thus manufactured may be further subjected to an optional process depending on the purpose of the application. For example, when using this as an FCBGA substrate, the final product may be completed by performing a conventional solder resist coating and solder resist open process known in the art.

As another embodiment of the present invention can be changed or added as follows.

Referring to FIGS. 3A to 3K, a method of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention will be described below.

First, a first insulating layer 111 having a conductive metal layer 112 laminated on both surfaces thereof is prepared (see FIG. 3A). Here, for example, through-holes 114 for securing a space for inserting the second insulating layer having chip parts embedded therein through a known method such as mechanical drilling, and through-holes 114 for interlayer electrical conduction are formed. (See FIG. 3B). In this case, the through part 113 is formed to have different widths at upper and lower surfaces with an oblique inclination so that the second insulating layer does not fall out after insertion. Subsequently, via connections are formed on the both surfaces of the first insulating layer 111 except for the through part 113 through the normal metal layer 112 patterning process, thereby making via connection easier (FIG. 3C). Reference).

Meanwhile, after separately preparing the second insulating layer 211 having the conductive metal layer 212 laminated on both surfaces (see FIG. 3D), the through parts 213 are densely formed in an array type through a known method such as mechanical drilling. Secure space for chip component embedding (see FIG. 3E). Subsequently, the chip component 214 having the component terminal 215 attached to both sides is buried in the second insulating layer 211 by using the insulating material 216 through a conventional component mounting method. Buried so that one surface is exposed (see FIG. 3F). In this embedding method, for example, one side of the substrate on which the through portion 213 is formed is taped, the chip component 214 is mounted and the insulating material 216 is filled, and then the tape is removed. One surface of 214 may be embedded to expose.

In this case, the insulating material 216 is not particularly limited as long as it is used in a component mounting method such as a filling ink and an insulating paste.

Next, circuit layers 218 and 219 are formed on both surfaces of the second insulating layer 211 including the exposed surface of the chip component 214 (see FIG. 3G). For example, the circuit layer forming process may be performed by forming a plating layer 219 on both sides of a substrate by a common copper plating process, and then patterning the circuit layers 218 and 219 by a conventional exposure, development, and etching process. Can be performed.

Subsequently, the second insulating layer 211 in which the chip component 214 is embedded is routed obliquely by the unit along the cutting line 217 in the penetrating portion 113 formed in the first insulating layer 111. 214) facing up (see Figure 3H).

Next, an insulating layer 311 used as a normal resin substrate such as ABF is laminated on the first insulating layer 111 and the first circuit layer 115 into which the second insulating layer 211 is inserted. The gap space between the first insulating layer 111 and the second insulating layer 211 is filled and fixed (see FIG. 3I).

Subsequently, a through hole 313 and a blind via hole 312 for interlayer conduction are formed through laser processing and / or mechanical drill processing (see FIG. 3J).

Finally, the second circuit layer 315 is formed on the third insulating layer 311 through a conventional circuit layer forming method such as SAP (see FIG. 3K). Through this process, the terminal 215 and the circuit layers 115 and 218 of the chip component 214 are electrically connected to the second circuit layer 315 by a connection member such as the blind via hole 314.

It will be apparent to those skilled in the art that the substrate thus manufactured may be further subjected to an optional process depending on the purpose of the application. For example, when using this as an FCBGA substrate, the final product may be completed by performing a conventional solder resist coating and solder resist open process known in the art.

4A to 4I, a method of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention will be described below.

First, a first insulating layer 121 in which conductive metal layers 122 are stacked on both surfaces is prepared (see FIG. 4A). Here, for example, through-holes 124 for securing a space for inserting the second insulating layer in which the chip parts are embedded and through-holes 124 for interlayer electrical conduction are formed by a known method such as mechanical drilling. (See FIG. 4B). Subsequently, the via circuit 124 is formed on both surfaces of the first insulating layer 121 except for the through part 123 through a patterning process of the conventional metal layer 122 to facilitate via connection (FIG. 4C). Reference).

Meanwhile, after separately preparing the second insulating layer 221 having the conductive metal layer 222 laminated on both surfaces (see FIG. 4D), the through parts 223 are densely formed in an array type through a known method such as mechanical drilling. Secure space for embedding chip components (see FIG. 4E). Subsequently, the chip component 224 having the component terminal 225 attached to both sides is buried in the second insulating layer 221 by using the insulating material 226 through a conventional component mounting method. Buried so that one surface is exposed (see FIG. 4F). In this embedding method, for example, one side of the substrate on which the through part 223 is formed is taped, the chip component 224 is mounted and the insulating material 226 is filled, and then the tape is removed. One surface of 224 may be embedded to expose.

Next, circuit layers 228 and 229 are formed on both surfaces of the second insulating layer 221 including the exposed surface of the chip component 224 (see FIG. 4G). For example, the circuit layer forming process may be performed by forming a plating layer 229 on both surfaces of a substrate by a common copper plating process, and then patterning the circuit layers 228 and 229 by a conventional exposure, development, and etching process. Can be performed.

Subsequently, the second insulating layer 221 having the chip component 224 embedded therein is routed for each unit along the cutting line 227 to form the chip component 224 in the through part 123 formed in the first insulating layer 121. ) Face up (see FIG. 4H). At this time, the adhesive member 230 is attached to each other between both side surfaces of the penetrating portion 123 of the first insulating layer 121 and the cut portions 227 of the second insulating layer 221 to fill and fill the gap space to fix the adhesive. do. The adhesive member 230 may include a conventional uncured insulating resin or an adhesive tape, but is not particularly limited thereto.

Next, an insulating layer 321 used as a normal resin substrate such as ABF is laminated on the first insulating layer 121 and the first circuit layer 125 into which the second insulating layer 221 is inserted ( 4i).

The process is as described above in Figures 3J and 3K.

5A to 5I, a method of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention will be described below.

First, a first insulating layer 131 having a conductive metal layer 132 laminated on both surfaces thereof is prepared (see FIG. 5A). For example, through-holes 133 for securing the space for insertion of the second insulating layer in which the chip parts are embedded and through-holes 134 for interlayer electrical conduction are formed by a known method such as mechanical drilling. Form (see FIG. 5B). Subsequently, vias are formed on the both surfaces of the first insulating layer 131 except for the groove 133 through the normal metal layer 132 patterning process to make via connection easier (see FIG. 5C). ).

Meanwhile, after separately preparing the second insulating layer 231 having the conductive metal layer 232 laminated on both surfaces (see FIG. 5D), the through part 233 is densely formed in an array type through a known method such as mechanical drilling. Secure space for chip component embedding (see FIG. 5E). Subsequently, the chip component 234 having the component terminals 235 attached to both sides is buried in the second insulating layer 231 using the insulating material 236 through a conventional component mounting method. Buried so that one surface is exposed (see FIG. 5F). In this embedding method, for example, one side of the substrate on which the through part 233 is formed is taped, the chip component 234 is mounted and the insulating material 236 is filled, and then the tape is removed. One surface of 234 may be embedded to expose.

Next, circuit layers 238 and 239 are formed on both surfaces of the second insulating layer 231 including the exposed surface of the chip component 234 (see FIG. 5G). For example, the plating layers 239 are formed on both surfaces of the substrate by a common copper plating process, and then patterned through conventional exposure, development, and etching processes to form circuit layers 238 and 239.

Subsequently, the second component layer 231 having the chip component 234 embedded therein is routed for each unit along the cutting line 237 to form the chip component 234 in the groove 133 formed in the first insulating layer 131. Insert it face up (see Figure 5H). In this case, the insulating resin 240 is filled between the groove 133 of the first insulating layer 131 and the contact surface of the second insulating layer 231 to fill and fill the gap space.

Next, an insulating layer 331 used as a normal resin substrate such as ABF is laminated on the first insulating layer 131 and the first circuit layer 135 into which the second insulating layer 231 is inserted ( 5i).

The process is as described above in Figures 3J and 3K.

6A to 6K, a method of manufacturing a printed circuit board having embedded chip components according to another exemplary embodiment of the present invention will be described below.

First, a first insulating layer 141 having a conductive metal layer 142 laminated on both surfaces thereof is prepared (see FIG. 6A). Here, for example, through-holes 143 and the through-holes 144 for interlayer electrical conduction are formed through a known method such as mechanical drilling. (See FIG. 6B). Subsequently, the via circuit 145 is formed on both surfaces of the first insulating layer 141 except for the through part 143 through the normal metal layer 142 patterning process to facilitate via connection (FIG. 6C). Reference).

Meanwhile, the chip component 242 having the component terminals 243 attached to both sides thereof is surface-mounted on the separately prepared supporting member 241, and then the chip component 242 is embedded by encapsulation using the insulating material 244. A second insulating layer 244 is fabricated (see FIGS. 6D-6F). At this time, the support member 241 may include an adhesive tape or an insulating resin, but is not particularly limited to those known in the art. Next, the support member 241 is removed to expose one surface of the chip component 242 (see FIG. 6G).

Subsequently, the second insulating layer 244 having the chip component 242 embedded therein is routed for each unit along the cutting line 245 to form the chip component 242 in the through part 143 formed in the first insulating layer 141. ) Face up (see FIG. 6H).

Next, an insulating layer 341 used as a normal resin substrate such as ABF is laminated on the first insulating layer 141 and the first circuit layer 145 into which the second insulating layer 244 is inserted. The gap space between the first insulating layer 141 and the second insulating layer 244 is filled and fixed (see FIG. 6I).

Subsequently, a through hole 343 and a blind via hole 342 for interlayer conduction are formed through laser processing and / or mechanical drill processing (see FIG. 6J).

Finally, the second circuit layer 345 is formed on the third insulating layer 341 through a conventional circuit layer forming method such as SAP (see FIG. 6K). Through this process, the terminal 243 and the first circuit layer 145 of the chip component 242 are electrically connected to the second circuit layer 345 by a connection member such as the blind via hole 344.

It will be apparent to those skilled in the art that the substrate thus manufactured may be further subjected to an optional process depending on the purpose of the application. For example, when using this as an FCBGA substrate, the final product may be completed by performing a conventional solder resist coating and solder resist open process known in the art.

As described above, the existing surface mounting method has a disadvantage of limited design freedom and poor electrical characteristics.In order to improve this, even if a method of embedding parts is applied, it is impossible to repair a chip due to the characteristics of an embedded substrate. There was a drawback to throwing away the entire unit, even if bad. Thus, the present invention is a method of manufacturing a separate substrate and the substrate containing the parts to be a real product, more specifically, by embedding the components in an array form on a separate substrate and then cut into units to separate the good only by inspection, It provides a way to reinsert the main board into a real product. In this way, by dividing the parts to be built into arbitrary units and then inserting the parts confirmed to be good again as a part of the main board by applying a method of inserting the inside of the inner layer while taking all the advantages of the built-in method Detecting component failures in advance reduces costs by reducing unit failures during the entire process.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and a printed circuit board having a built-in chip component according to the present invention and a manufacturing method thereof are not limited thereto. It is apparent that modifications and improvements are possible by those skilled in the art within the technical idea.

First, by dividing the internal parts into arbitrary units and inserting the parts that are found to be good again into the second part of the main board to reduce costs by reducing unit defects that have been performed in the whole process in terms of products. Can be.

Second, if the built-in parts are divided into arbitrary units, and then the part that is confirmed to be good is inserted into the part of the main board secondly, the process yield and the overhead costs are increased by increasing the substrate process yield compared to the conventional one. Can reduce the cost.

Third, if the internal parts are divided into arbitrary units, and then the part that is confirmed to be good is inserted into the second part of the main board again, if the raw material price of the product desired by the customer in terms of raw materials is large, the final product board The cost reduction is great because there are fewer defects.

Fourth, if the internal parts are divided into arbitrary units, and then the part that is confirmed to be good is inserted into the second part of the main board again, the warpage of the board and other potential process defects until the component mounting process are finally achieved. It does not affect the product, improving yield and board reliability.

Fifth, if the built-in parts are divided into arbitrary units and then the part that is confirmed to be good is inserted into the part of the main board again, the mounting area of the lower surface can be freely used in terms of design. Is improved.

Sixth, if the built-in parts are divided into arbitrary units, and then the parts that are found to be good are inserted into the second part of the main board again, the design flexibility in terms of customer response is improved due to the improved design freedom. Is improved.

Seventh, if the built-in parts are divided into arbitrary units, and then a part that is confirmed to be good is inserted into the part of the main board again, the FCBGA reduces the circuit path and thereby reduces the impedance, thereby reducing the electrical characteristics. Is improved.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

Claims (34)

(a) a first insulating layer having a through portion or a groove portion; (b) a first circuit layer formed on both sides of the first insulating layer except for the through part or the groove part; (c) a second insulating layer inserted into a through portion or a groove portion of the first insulating layer and having one surface of a chip component having component terminals attached to both sides thereof exposed; (d) a first insulating layer having the second insulating layer inserted therein and a third insulating layer stacked on the first circuit layer; And (e) a second circuit layer formed on the third insulating layer and including a connection member for electrically connecting the terminal of the chip component and the first circuit layer; Printed circuit board having a built-in chip component, characterized in that it comprises a. The printed circuit board of claim 1, wherein the first insulation layer and the third insulation layer are thermosetting resins or thermoplastic resins. The printed circuit having the embedded chip component according to claim 1, wherein the second insulating layer is selected from the group consisting of a thermosetting resin, a thermoplastic resin, a thermosetting resin or a thermoplastic resin impregnated with a ceramic filler, and a combination thereof. Board. The printed circuit board of claim 1, wherein the second insulating layer has a higher thermal conductivity than the first insulating layer and the third insulating layer. The printed circuit board of claim 1, wherein the second insulating layer has a shape corresponding to a through portion or a groove portion of the first insulating layer. The printed circuit board of claim 1, wherein both sides of the through or groove portion of the first insulating layer and both sides of the second insulating layer have the same slope. The printing with embedded chip parts according to claim 1, wherein both sides or one side of the through portion or the groove portion of the first insulating layer and the side surface of the second insulating layer corresponding thereto have an oblique slope. Circuit board. 2. The printed circuit of claim 1, wherein the through portion or the groove portion of the first insulating layer has different widths at upper and lower surfaces so that the second insulating layer inserted therein is fixed over the inclined surface. Board. The printed circuit board of claim 1, wherein a circuit layer is further formed on one or both surfaces of the second insulating layer including the exposed surface of the chip component. The semiconductor device of claim 9, wherein the circuit layer formed on one surface of the second insulating layer including the exposed surface of the chip component and the first circuit layer formed on one surface of the first insulating layer corresponding thereto are present on a plane having the same height. Printed circuit board having a built-in chip component, characterized in that. The printed circuit having the embedded chip component according to claim 1, wherein an adhesive member is further formed between at least one of contact surfaces between the second insulating layer and the through portion or the groove portion of the first insulating layer. Board. 12. The printed circuit board of claim 11, wherein the adhesive member is an adhesive tape or an insulating resin. The printed circuit board of claim 1, wherein the connection member is formed by a via hole. The printed circuit board of claim 1, wherein the chip component is an active element or a passive element. (a) processing the through portion or the groove portion in the first insulating layer; (b) forming a first circuit layer on both sides of the first insulating layer except for the through part or the groove part; (c) providing a second insulating layer in which one surface of the chip component having component terminals attached to both sides thereof is exposed; (d) cutting the second insulating layer having the chip component embedded therein into a size that can be inserted into a through portion or a groove portion of the first insulating layer; (e) inserting the cut second insulating layer into a through portion or a groove portion of the first insulating layer; (f) stacking a third insulating layer on the first insulating layer and the first circuit layer into which the second insulating layer is inserted; And (g) forming a second circuit layer on the third insulating layer, the second circuit layer including a connecting member for electrically connecting the terminal of the chip component and the first circuit layer; Method of manufacturing a printed circuit board having a built-in chip component comprising a. 16. The method of claim 15, wherein the first insulating layer and the third insulating layer are the same or different from each other in thermosetting resin or thermoplastic resin. The printing with embedded chip parts according to claim 15, wherein the second insulating layer is selected from the group consisting of a thermosetting resin, a thermoplastic resin, a thermosetting resin or a thermoplastic resin impregnated with a ceramic filler, and a combination thereof. Method of manufacturing a circuit board. 16. The method of claim 15, wherein the second insulating layer has a higher thermal conductivity than the first insulating layer and the third insulating layer. 16. The method of claim 15, wherein the second insulating layer is cut to have a shape corresponding to a through portion or a groove portion of the first insulating layer. 16. The method of claim 15, wherein both sides of the through or groove portion of the first insulating layer and both sides of the second insulating layer are processed to have the same slope, respectively. . 16. The embedded chip component of claim 15, wherein both sides or one side surface of the through portion or the groove portion of the first insulating layer and the side surface of the second insulating layer corresponding thereto are processed to have an oblique slope. Method of manufacturing a printed circuit board having a. 16. The embedded chip component of claim 15, wherein the penetrating portion or the groove portion of the first insulating layer is processed so that the upper and lower surfaces thereof have different widths so that the second insulating layer inserted therein is fixed over the inclined surface. Method of manufacturing a printed circuit board. 16. The method of claim 15, further comprising forming a circuit layer on one or both surfaces of the second insulating layer including the chip component exposed surface. 24. The semiconductor device of claim 23, wherein the circuit layer formed on one surface of the second insulating layer including the exposed surface of the chip component and the first circuit layer formed on one surface of the first insulating layer corresponding thereto are present on a plane having the same height. Method of manufacturing a printed circuit board having a built-in chip component, characterized in that. The method of claim 15, wherein step (c) comprises: Providing a second insulating layer; Processing a through hole in an array type in the second insulating layer to secure a chip component buried space; And Burying a chip component having component terminals attached to both sides by using a component mounting method in the through hole of the second insulating layer, and embedding one surface of the chip component to expose the surface; Method of manufacturing a printed circuit board having a built-in chip component comprising a. The method of claim 15, wherein step (c) comprises: Providing a support member; Surface-mounting a chip component having component terminals attached to both sides on the support member; Embedding the chip component in the second insulating layer by encapsulating the surface mounted chip component using an insulating material; And Removing the support member to expose one surface of the chip component; Method of manufacturing a printed circuit board having a built-in chip component comprising a. 27. The method of manufacturing a printed circuit board having embedded chip components according to claim 26, wherein the support member is an adhesive tape or an insulating resin. The method of claim 15 or 23, wherein step (c) comprises: Providing a second insulating layer having a conductive metal layer laminated on both surfaces thereof; Processing through holes in an array type in the conductive metal layer and the second insulating layer to secure a space where a chip component is to be inserted; Burying a chip component having component terminals attached to both sides by using a component mounting method in the through hole of the second insulating layer, and embedding one surface of the chip component to expose the surface; And Forming a circuit layer on one or both surfaces of the second insulating layer including an exposed surface of the chip component; Method of manufacturing a printed circuit board having a built-in chip component comprising a. 16. The embedded chip of claim 15, further comprising forming an adhesive member between at least one of the contact surfaces between the second insulating layer and the through portion or the groove portion of the first insulating layer. A method of manufacturing a printed circuit board having a component. 30. The method of claim 29, wherein the forming of the adhesive member is performed by attaching an uncured insulating resin to at least one of the contact surfaces. 30. The method of claim 29, wherein the forming of the adhesive member is performed by attaching an adhesive tape to at least one of the contact surfaces. 30. The method of claim 29, wherein the forming of the adhesive member is performed by filling an insulating resin between the contact surfaces. The method of claim 15, wherein step (g) comprises: Forming a via hole in the third insulating layer to electrically connect the terminal and the first circuit layer of the chip component with a second circuit layer; Forming a conductive metal layer on the third insulating layer including the via hole; And Patterning the conductive metal layer to form a second circuit layer; Method of manufacturing a printed circuit board having a built-in chip component comprising a. 16. The method of claim 15, wherein the chip component is an active element or a passive element.

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