KR100730453B1 - Vacuum drying apparatus and method - Google Patents

Abstract

It is an object of the present invention to provide a pressure reduction drying apparatus and a pressure reduction drying method capable of rapidly drying a thin film formed on a main surface of a substrate without generating bumps, and the support pins 21 are supported. The support pins 21 are supported by the support plate 22 after exhausting with a small amount of exhaust gas while being raised together with the 22 and the distance between the main surface of the substrate W and the upper surface 14 of the chamber 10 is reduced. The air is discharged with a large amount of exhaust gas in a state in which the distance between the main surface of the substrate W and the upper surface 14 of the chamber 10 is increased along with the downward movement.

Description

Pressure reduction drying device and pressure reduction drying method {VACUUM DRYING APPARATUS AND METHOD}

1 is a schematic diagram of a vacuum drying apparatus according to a first embodiment of the present invention.

2 is a schematic view of a vacuum drying apparatus according to the first embodiment of the present invention.

3 is a schematic view of a reduced pressure drying apparatus according to the first embodiment of the present invention.

It is a flowchart which shows the drying operation by the pressure reduction drying apparatus which concerns on 1st Embodiment of this invention.

5 is a flowchart showing a drying operation by the vacuum drying apparatus according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram showing a change in the degree of vacuum in the chamber 10 during a reduced pressure drying operation.

7 is a schematic diagram of a vacuum drying apparatus according to a second embodiment of the present invention.

It is a flowchart which shows the drying operation by the pressure reduction drying apparatus which concerns on 2nd Embodiment of this invention.

It is a flowchart which shows the drying operation by the pressure reduction drying apparatus which concerns on 2nd Embodiment of this invention.

It is a schematic diagram of the pressure reduction drying apparatus which concerns on 3rd Embodiment of this invention.

It is a flowchart which shows the drying operation by the pressure reduction drying apparatus which concerns on 3rd Embodiment of this invention.

It is a flowchart which shows the drying operation by the pressure reduction drying apparatus which concerns on 3rd Embodiment of this invention.

<Explanation of symbols for the main parts of the drawings>

10 chamber 11 cover part

12 packing 13 base

14: upper surface 15: recessed portion

21: support pin 22: support plate

31: exhaust port 32: pipeline

33: damper 34: vacuum pump

41 plate member 43: air cylinder

W: Substrate

The present invention relates to a vacuum drying apparatus and a vacuum drying method.

For example, Japanese Patent Application Laid-Open No. 7-283108 discloses a reduced pressure drying device for vacuum drying a thin film such as a photoresist applied to a substrate such as a glass substrate for a semiconductor wafer, a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus. Is disclosed. In the vacuum drying apparatus described in Japanese Patent Application Laid-Open No. 7-283108, by depressurizing the inside of a chamber into which a substrate is loaded by a vacuum pump, the evaporation of the solvent, which is the center of the resist liquid component, is promoted, and the photoresist is quickly carried out. It is supposed to dry. When the photoresist is dried using such a vacuum drying apparatus, the influence of external factors such as wind and heat can be prevented, and the photoresist can be dried without spots.

When using such a vacuum drying apparatus, the phenomenon called a dolby may arise immediately after starting a vacuum drying process. This is a phenomenon caused by sudden boiling of the solvent component in the photoresist applied on the substrate surface. When such a dolby generate | occur | produces, the phenomenon which a small bubble forms on the surface of photoresist called defoaming arises, and the use of the board | substrate becomes impossible.

For this reason, in the initial stage of a pressure reduction drying process, it is necessary to exhaust | exhaust at low speed in a chamber, and to prevent generation | occurrence | production of defoaming. Therefore, there is a problem that it takes a long time until drying the photoresist.

This invention is made | formed in order to solve the said subject, Comprising: It aims at providing the pressure reduction drying apparatus and the pressure reduction drying method which can dry the thin film formed in the main surface of a board | substrate quickly without a dolby generating.

According to an aspect of the present invention, there is provided a pressure reduction drying apparatus for drying a thin film formed on a main surface of a substrate under reduced pressure, comprising: a chamber covering the substrate, a support member for supporting the substrate horizontally upward, and the support; Lifting means for raising and lowering the member, an exhaust port formed at a position not facing the main surface of the substrate supported by the support means in the chamber, an exhaust means for exhausting through the exhaust port, and an exhaust amount from the exhaust means With a displacement control means for controlling in two stages, the support member supporting the substrate is lifted by the lifting means, and in a state where the distance between the main surface of the substrate and the upper surface of the chamber is reduced, After exhausting, the support member which supported the board | substrate was lowered by elevating means, and in the state which enlarged the distance of the main surface of a board | substrate and the upper surface of a chamber, Characterized in that performing the exhaust gas in a large amount of displacement by the control means.

In the invention according to claim 2, in the invention according to claim 1, the exhaust port is formed on the bottom of the chamber.

Invention of Claim 3 WHEREIN: The pressure reduction drying apparatus which pressure-drys the thin film formed in the main surface of the board | substrate, WHEREIN: The chamber which covers the periphery of a board | substrate, the support member which horizontally supports the board | substrate with its main surface facing upwards, and a support member A plate-shaped member provided at a position opposed to the main surface of the substrate supported by the substrate, elevating means for elevating the plate-shaped member, an exhaust port formed on the side opposite to the substrate with respect to the plate-shaped member, and an exhaust gas exhausting through the exhaust port. Means and an exhaust amount control means for controlling the exhaust amount by the exhaust means in at least two stages, and the elevating means lowers the plate-like member so as to reduce the distance between the main surface of the substrate and the plate-shaped member. After exhausting by a small amount of exhaust gas by the means, the plate-shaped member is raised by the elevating means, and the distance between the main surface of the substrate and the plate-shaped member is increased. In one state, the exhaust gas is exhausted by a large amount of exhaust gas by means of exhaust control means.

According to an aspect of the present invention, there is provided a pressure reduction drying apparatus for vacuum-drying a thin film formed on a main surface of a substrate, comprising: a chamber covering a substrate, a support member for horizontally supporting a substrate whose main surface is upward, and a chamber. An exhaust port formed at a position not opposed to the main surface of the substrate supported by the support means in the air, an exhaust means for exhausting air through the exhaust port, and an exhaust amount control means for controlling the exhaust amount by the exhaust means in at least two stages; At a position opposed to the main surface of the substrate supported by the supporting member in the chamber, the shape of which is farthest from the main surface of the substrate in the central portion of the main surface of the substrate and closes to the main surface of the substrate as the end surface of the substrate approaches the edge of the main surface. Is formed, the exhaust gas is exhausted by a small amount of exhaust by the exhaust control means, and then exhausted by a large amount of exhaust That performs characterized.

In the invention according to claim 5, in the invention according to claim 4, the exhaust port is formed on the bottom of the chamber.

According to the sixth aspect of the present invention, there is provided a pressure reduction drying method in which a thin film formed on a main surface of a substrate is dried under reduced pressure, the carrying-in step of loading the substrate into a chamber and placing the substrate on a support member, and a distance between the main surface of the substrate and the upper surface of the chamber. In the small state, the first drying step of exhausting the exhaust gas with a small amount of exhaust gas at an exhaust port formed at a position not facing the main surface of the substrate supported by the supporting means in the chamber, and between the main surface of the substrate and the upper surface of the chamber It is characterized by including the 2nd drying process which exhausts by a large amount of exhaust amount in an exhaust port in the state which enlarged the distance.

According to the invention described in claim 7, the pressure-sensitive drying method for drying the thin film formed on the main surface of the substrate under reduced pressure, wherein the substrate is loaded into the chamber, and the substrate is supported by the substrate while the main surface of the substrate faces the plate-shaped member provided in the chamber. A first drying step of carrying out a step of carrying out the step of carrying out a step of exhausting the plate-shaped member from the exhaust port formed on the side opposite to the substrate with respect to the plate-shaped member in a state where the distance between the main surface of the substrate and the plate-shaped member is reduced; It is characterized by including the 2nd drying process which exhausts by a large amount of exhaust amount at an exhaust port in the state which enlarged the distance of a principal surface and a plate-shaped member, It is characterized by the above-mentioned.

According to the invention of claim 8, in the reduced pressure drying method for drying the thin film formed on the main surface of the substrate under reduced pressure, the main surface of the substrate is located farthest away from the main surface of the substrate in the central portion of the main surface of the substrate and close to the edge of the main surface of the substrate. A small amount of the carrying-in step of bringing a substrate into a chamber having an upper surface with a concave portion having a shape close to the upper surface thereof, and placing it on a support member, and an exhaust port formed at a position not facing the main surface of the substrate supported by the supporting means in the chamber. And a second drying step of evacuating with a large exhaust amount at an exhaust port and a second drying step of evacuating with a large amount of exhaust at an exhaust port.

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing. 1 to 3 are schematic views of a reduced pressure drying apparatus according to the first embodiment of the present invention.

The pressure reduction drying apparatus includes a support plate 22 in which a lid portion 11, a packing 12, a chamber 10 formed of a base 13, and a support pin 21 for supporting a substrate W are placed upright. Equipped with. The substrate W is supported by the support pins 21 in the chamber 10 in a horizontal posture whose main surface is upward.

The exhaust port 31 is formed in the base 13 in the chamber 10. This exhaust port 31 is connected to the vacuum pump 34 by the conduit 32. A damper 33 is provided between the exhaust port 31 and the vacuum pump 34 to control the amount of exhaust gas from the exhaust port 31 in two stages. In addition, an exhaust fan or the like may be used instead of the vacuum pump 34. In addition, a flow rate variable valve or the like may be used instead of the damper 33.

In addition, the support plate 22 is connected to the lifting mechanism 25 via the support bar 24. The support pins 21 together with the support plate 22, the position of the board | substrate W which exchanges the board | substrate W with the conveyance arm which is not shown in figure by the action of the lifting mechanism 25. It is possible to move up and down between the three height positions of the 1st, 2nd drying position from which height differs, respectively.

Next, the drying operation | movement which dries the thin film formed in the main surface of the board | substrate by this reduced pressure drying apparatus is demonstrated. 4 and 5 are flowcharts showing a drying operation by the vacuum drying apparatus according to the first embodiment of the present invention.

When drying the thin film formed in the main surface of the board | substrate W, the lid part 11 in the chamber 10 is first raised by the lifting mechanism not shown, as shown in FIG. 10) is opened (step S11). Next, the conveyance arm (not shown) which supported the board | substrate W enters the chamber 10 (step S12).

Next, by the drive of the elevating mechanism 25, the support pin 21 raises to the delivery position of the board | substrate W shown in FIG. 1 with the support plate 22 (step S13). Thereby, the board | substrate W supported by the conveyance arm is supported by the support pin 21. And the conveyance arm is withdrawn in the chamber 10 (step S14).

Next, by the drive of the lifting mechanism 25, the support pin 21 is lowered together with the support plate 22 to the first drying position shown in FIG. 2 (step S15). As shown in FIG. 2, the lid portion 11 in the chamber 10 is lowered by a lifting mechanism (not shown) to close the chamber 10 (step S16). In this state, the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 becomes small.

In this state, by the action of the vacuum pump 34 and the damper 33, the exhaust gas is exhausted with a small amount of exhaust gas (step S17). At this time, in this pressure reduction drying apparatus, the exhaust port 31 is formed in the bottom part of the chamber 10. For this reason, when evacuating from this exhaust port 31, the air flow from the center toward the edge of the edge arises in the main surface of the board | substrate W. As shown to FIG.

In addition, instead of forming this exhaust port 31 in the bottom part of the chamber 10, the other side which does not oppose the main surface of the board | substrate W supported by the support pin 21, such as the side surface of the chamber 10, and the like. You may form in a position. In this embodiment, the exhaust port 31 is disposed below the support plate 22. For this reason, if the support plate 22 approaches the exhaust port 31 excessively, it will interfere with the exhaust operation from the exhaust port 31. When it is necessary to bring the support plate 22 and the exhaust port 31 close in order to reduce the size of the apparatus, the exhaust port 31 may be formed outside the support plate 22 in a plan view.

In the state shown in FIG. 2, the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 is set small. This is because when this distance is enlarged, a phenomenon called dolby occurs due to an active drying operation immediately after starting the reduced pressure drying process. When the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 is set small, such active drying operation | movement can be prevented and generation | occurrence | production of defoaming by a dolby is produced. Can be prevented.

At this time, the distance between the main surface of the substrate W and the upper surface 14 of the lid portion 11 in the chamber 10 is preferably 15 mm or less, particularly preferably 2 mm to 10 mm. Do.

Thus, after setting the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 small, and performing a reduced pressure drying with a small amount of exhaust gas, the board | substrate ( Due to the slow air flow from the center on the main surface of W) toward the short edge, it is possible to perform appropriate reduced-pressure drying in the state in which defoaming by dolby is prevented. However, sufficient drying cannot be performed with respect to the thin film part of the main surface center part of the board | substrate W. FIG.

When a predetermined time elapses after starting the above-described first drying step (step S18), the vacuum pump 34 and the damper 33 act to exhaust the gas in a large amount of exhaust gas (step S19). At this time, a relatively large air flow is generated in the main surface of the substrate W from the center toward the short edge. And the support pin 21 descends to the 2nd drying position shown in FIG. 3 with the support plate 22 by the drive of the lifting mechanism 25 (step S20).

Thus, after setting the distance of the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 large, and performing pressure reduction drying with a large amount of exhaust volume, the board | substrate W Drying is performed quickly over the whole main surface of the (). However, since the thin film is somewhat dried in the above-described first drying step, defoaming by Dolby does not occur.

At this time, it is preferable that the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 shall be 20 mm or more and 50 mm or less. Since this distance is limited by the volume in the chamber 10, ie, the amount of the atmosphere to be evacuated, it is not preferable to set the distance to be larger than 50 mm.

In the above-mentioned 2nd drying process, when the vacuum degree in the chamber 10 reaches the preset value by the sensor (not shown) (step S21), nitrogen gas is purged in a chamber (step S22). And when the inside of the chamber 10 becomes atmospheric pressure, the cover part 11 in the chamber 10 is raised by the lifting mechanism which is not shown in figure, and the chamber 10 is opened (step S23). Next, by the drive of the elevating mechanism 25, the support pin 21 raises to the delivery position of the board | substrate W shown in FIG. 1 with the support plate 22 (step S24).

In this state, the conveyance arm which is not shown in figure enters the chamber 10 (step S25). And the support pin 21 descends to the 1st dry position shown in FIG. 2 with the support plate 22 by the drive of the lifting mechanism 25 (step S26). Thereby, the board | substrate W supported by the support pin 21 is supported by the conveyance arm. And the conveyance arm which supported the board | substrate W exits in the chamber 10 (step S27).

FIG. 6 is an explanatory diagram showing a change in the degree of vacuum in the chamber 10 during the above-described vacuum drying operation.

In this figure, the horizontal axis represents time (seconds), and the vertical axis represents the vacuum degree (Torr) in logarithms. Region A represents the first drying process described above, region B represents the second drying process, and region C represents the purge process using nitrogen gas. In addition, the code P represents atmospheric pressure.

As described above, according to the pressure reduction drying apparatus in the first embodiment of the present invention, the exhaust gas is discharged with a small amount of exhaust gas in a state in which the distance between the main surface of the substrate W and the upper surface 14 of the chamber 10 is reduced. After the exhaust gas is exhausted with a large amount of exhaust gas in a state where the distance between the main surface of the substrate W and the upper surface 14 of the chamber 10 is increased, a thin film formed on the main surface of the substrate W is generated without a dolby. It becomes possible to dry quickly.

Next, another embodiment of the present invention will be described. 7 is a schematic diagram of a vacuum drying apparatus according to a second embodiment of the present invention.

In the pressure reduction drying apparatus which concerns on 1st Embodiment mentioned above, the board | substrate W is raised and lowered, and the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 is shown. The exhaust port 35 is formed at the bottom of the chamber 10. On the other hand, in this 2nd Embodiment, the distance of the principal surface of the board | substrate W and the plate-shaped member 41 is changed by elevating the plate-shaped member 41 arrange | positioned in the chamber 10, and the exhaust port ( 31 is formed on the upper surface 14 of the chamber 10. In other structure, it is the same as that of 1st Embodiment mentioned above.

In this 2nd Embodiment, the plate-shaped member 41 is connected to the cylinder rod 42 of a pair of air cylinder 43, and is a structure which raises and lowers by the drive of a pair of air cylinder 43. FIG. It is. In addition, also in this 2nd Embodiment, when exhausting from the exhaust port 35 formed in the upper surface 14 of the chamber 10, the air flow which goes to the short edge from the center in the main surface of the board | substrate W Occurs.

Next, a drying operation for drying the thin film formed on the main surface of the substrate by the reduced pressure drying apparatus according to the second embodiment will be described. 8 and 9 are flowcharts illustrating a drying operation by the vacuum drying apparatus according to the second embodiment of the present invention. In addition, description is simplified about the part same as 1st Embodiment mentioned above.

Initially, the lid part 11 in the chamber 10 is raised by the lifting mechanism not shown, and the chamber 10 is opened (step S31). Next, the conveyance arm (not shown) which supported the board | substrate W enters the chamber 10 (step S32).

Next, by the drive of the elevating mechanism 25, the support pin 21 raises to the water-receiving position of the board | substrate W with the support plate 22 (step S33). Thereby, the board | substrate W supported by the conveyance arm is supported by the support pin 21. Then, the conveying arm exits in the chamber 10 (step S34).

Next, by the drive of the elevating mechanism 25, the support pin 21 descends to the dry position shown in FIG. 7 with the support plate 22 (step S35). As shown in FIG. 7, the lid part 11 in the chamber 10 is lowered by the lifting mechanism not shown, and the chamber 10 is abolished (step S36). In this state, the distance between the main surface of the substrate W and the plate member 41 becomes small.

In this state, by the action of the vacuum pump 34 and the damper 33, the exhaust gas is exhausted with a small amount of exhaust gas (step S37). At this time, in this pressure reduction drying apparatus, the exhaust port 35 is formed in the upper surface 14 of the chamber 10. For this reason, when evacuating from this exhaust port 35, the air flow toward the short edge from the center in the main surface of the board | substrate W generate | occur | produces.

In the state shown in FIG. 7, the distance between the main surface of the board | substrate W and the plate-shaped member 41 is set small. For this reason, like the case of 1st Embodiment, generation | occurrence | production of defoaming by a dolby can be prevented.

Thus, when setting the distance of the main surface of the board | substrate W and the plate-shaped member 41 small, and performing pressure reduction drying with a small amount of discharge | emission, from the center to the short edge in the main surface of the board | substrate W By the slow air flow, it becomes possible to perform appropriate reduced-pressure drying in the state which prevented defoaming by Dolby. However, sufficient drying cannot be performed with respect to the thin film part of the main surface center part of the board | substrate W. FIG.

When a predetermined time elapses after starting the above-described first drying process (step S38), the vacuum pump 34 and the damper 33 act to exhaust the gas in a large amount of exhaust gas (step S39). At this time, a relatively large air flow is generated from the main surface of the substrate W toward the short edge from the center thereof. And the plate-shaped member 41 raises by the drive of a pair of air cylinder 43 (step S40).

Thus, when setting the distance of the main surface of the board | substrate W and the plate-shaped member 41 large, and drying under reduced pressure by a large amount of exhaust volume, it is the same as the case of 1st Embodiment, Drying is performed quickly over the entire main surface. However, since the thin film is dried to some extent in the above-described first drying step, defoaming due to Dolby does not occur.

In the above-mentioned 2nd drying process, when the vacuum degree in the chamber 10 reaches the preset value by the sensor (not shown) (step S41), nitrogen gas is purged in a chamber (step S42). And when the inside of the chamber 10 becomes atmospheric pressure, the cover part 11 in the chamber 10 is raised by the lifting mechanism which is not shown in figure, and the chamber 10 is opened (step S43). Next, by the drive of the elevating mechanism 25, the support pin 21 raises to the delivery position of the board | substrate W with the support plate 22 (step S44).

In this state, the conveyance arm which is not shown in figure enters the chamber 10 (step S45). Then, by the driving of the elevating mechanism 25, the support pin 21 is lowered to the dry position together with the support plate 22 (step S46). Thereby, the board | substrate W supported by the support pin 21 is supported by the conveyance arm. And the conveyance arm which supported the board | substrate W exits in the chamber 10 (step S47).

As described above, according to the vacuum drying apparatus according to the second embodiment of the present invention, after exhausting with a small amount of exhaust gas in a state in which the distance between the main surface of the substrate W and the plate-shaped member 41 is reduced, the substrate is subjected to exhaust gas. Since the exhaust gas is exhausted with a large amount of exhaust gas in a state where the distance between the main surface of (W) and the plate-shaped member 41 is increased, similarly to the case of the first embodiment, a thin film formed on the main surface of the substrate W without generating a dolby It is possible to dry quickly.

In addition, the distance between the main surface of the board | substrate W in this 2nd Embodiment, and the plate-shaped member 41 is a cover in the main surface of the board | substrate W in 1st Embodiment mentioned above, and the chamber 10. As shown in FIG. The distance from the upper surface 14 of the unit 11 can be set to be the same.

Next, another embodiment of the present invention will be described. It is a schematic diagram of the pressure reduction drying apparatus which concerns on 3rd Embodiment of this invention.

In the pressure reduction drying apparatus which concerns on 1st Embodiment mentioned above, the distance of the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 is increased by elevating the board | substrate W. As shown in FIG. In the third embodiment, instead of changing the distance between the main surface of the substrate W and the upper surface 14 of the lid portion 11 in the chamber 10, the lid of the chamber 10 is changed. At the position opposite to the main surface of the substrate W supported by the supporting pins 21 in the unit 11, the substrate W is farthest from the main surface of the substrate W in the central portion of the main surface of the substrate W. The recessed part 15 of the shape which approximates the main surface of the board | substrate W is formed in proximity to the edge of the main surface end of W). About other structure, it is the same as that of 1st Embodiment mentioned above.

Next, the drying operation which dries the thin film formed in the main surface of the board | substrate by the pressure reduction drying apparatus which concerns on 3rd Embodiment is demonstrated. 11 and 12 are flowcharts illustrating a drying operation by the vacuum drying apparatus according to the third embodiment of the present invention. In addition, description is simplified about the part same as 1st Embodiment mentioned above.

Initially, the lid part 11 in the chamber 10 is raised by the lifting mechanism not shown, and the chamber 10 is opened (step S51). Next, a conveyance arm (not shown) supporting the substrate W enters the chamber 10 (step S52).

Next, by the drive of the elevating mechanism 25, the support pin 21 raises to the delivery position of the board | substrate W with the support plate 22 (step S53). Thereby, the board | substrate W supported by the conveyance arm is supported by the support pin 21. And the conveyance arm is withdrawn in the chamber 10 (step S54).

Next, by the drive of the lifting mechanism 25, the support pin 21 is lowered to the dry position together with the support plate 22 (step S55). And the lid part 11 in the chamber 10 is lowered by the lifting mechanism not shown, and the chamber 10 is closed (step S56).

In this state, by the action of the vacuum pump 34 and the damper 33, the exhaust gas is exhausted in a small amount of exhaust gas (step S57). At this time, in this pressure reduction drying apparatus, the exhaust port 31 is formed in the bottom part of the chamber 10. For this reason, when the gas is exhausted from the exhaust port 31, air flows toward the short edge from the center of the main surface of the substrate W.

In this state, the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 is set comparatively small. This is because when the distance is large, a phenomenon called dolby occurs due to an active drying operation immediately after starting the reduced pressure drying process. When the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 is set small, such active drying operation | movement can be prevented and generation | occurrence | production of defoaming by a dolby is produced. Can be prevented.

Thus, after setting the distance between the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 small, when depressurizing drying with a small amount of exhaust gas, the board | substrate W Due to the slow air flow from the center on the main surface to the short edge, appropriate decompression drying can be performed in a state in which defoaming by Dolby is prevented. And in this embodiment, the main surface center part of the board | substrate W is located in the position which opposes the main surface of the board | substrate W supported by the support pin 21 in the cover part 11 of the chamber 10. As shown in FIG. Therefore, the recessed part 15 of the shape which is farthest from the main surface of the board | substrate W, and comes close to the main surface end edge of the board | substrate W is formed. Therefore, drying is accelerated also about the thin film part of the main surface center part of the board | substrate W. FIG.

When a predetermined time elapses after starting the above-described first drying step (step S58), the vacuum pump 34 and the damper 33 act to exhaust the gas in a large amount of exhaust gas (step S59). At this time, a relatively large air flow is generated in the main surface of the substrate W from the center to the short edge.

Thus, after setting the distance of the main surface of the board | substrate W and the upper surface 14 of the cover part 11 in the chamber 10 large, and performing pressure reduction drying with a large amount of exhaust volume, the board | substrate W Drying is performed quickly over the whole main surface of the (). In particular, in the present embodiment, rapid drying is performed even in the vicinity of the center of the substrate W, which is normally difficult to promote drying due to the action of the recessed portion 15 formed in the lid portion 11 of the chamber 10. . At this time, since the thin film is dried to some extent in the above-described first drying step, defoaming by Dolby does not occur.

In addition, the distance between the main surface of the board | substrate W in this 3rd Embodiment, and the upper surface 14 of the cover part 11 in the chamber 10 is the center part of the board | substrate W which takes the largest value. It is preferable to set it as 10 mm-20 mm, and it is preferable to set it as 2 mm-10 mm in the vicinity of the short edge of the board | substrate W which takes the smallest value.

In the above-mentioned 2nd drying process, when the vacuum degree in the chamber 10 reaches the preset value by the sensor (not shown) (step S60), nitrogen gas is purged in a chamber (step S61). And when the inside of the chamber 10 becomes atmospheric pressure, the cover part 11 in the chamber 10 is raised by the lifting mechanism which is not shown in figure, and the chamber 10 is opened (step S62). Next, by the drive of the elevating mechanism 25, the support pin 21 raises to the water-receiving position of the board | substrate W with the support plate 22 (step S63).

In this state, a conveyance arm (not shown) enters the chamber 10 (step 64). Then, by the driving of the elevating mechanism 25, the support pin 21 descends to the dry position together with the support plate 22 (step S65). Thereby, the board | substrate W supported by the support pin 21 is supported by the conveyance arm. And the conveyance arm which supported the board | substrate W exits in the chamber 10 (step S66).

As mentioned above, according to the pressure reduction drying apparatus in 3rd Embodiment of this invention, the board | substrate W does not produce a dolby by the action of the recessed part 15 formed in the cover part 11 of the chamber 10. As shown in FIG. It is possible to quickly dry the thin film formed on the main surface of the substrate.

According to the invention described in claims 1 to 8, it is possible to quickly dry a thin film formed on the main surface of the substrate without generating a dolby.

Claims (8)

In the pressure reduction drying apparatus which vacuum-drys the thin film formed in the main surface of the board | substrate, A chamber covering the periphery of the substrate, A supporting member for horizontally supporting the substrate whose main surface is upward; Elevating means for elevating the supporting member; An exhaust port formed at a position not facing the main surface of the substrate supported by the support means in the chamber; Exhaust means for exhausting through the exhaust port; And an exhaust amount control means for controlling the exhaust amount by the exhaust means in at least two stages, After the support member which supported the board | substrate was raised by the said raising / lowering means, and the distance between the main surface of a board | substrate and the upper surface of the said chamber was made small, exhausting was performed by the said exhaust control means with a small amount of exhaust amount, And the exhaust member is exhausted by a large amount of exhaust gas by the exhaust control means while lowering the support member supporting the substrate to increase the distance between the main surface of the substrate and the upper surface of the chamber. The method of claim 1, The exhaust port is a reduced pressure drying device formed on the bottom of the chamber. delete In the pressure reduction drying apparatus which vacuum-drys the thin film formed in the main surface of the board | substrate, A chamber covering the periphery of the substrate, A supporting member for horizontally supporting the substrate whose main surface is upward; An exhaust port formed at a position not facing the main surface of the substrate supported by the support means in the chamber; Exhaust means for exhausting through the exhaust port; A displacement control means for controlling the displacement by the exhaust means in at least two stages, wherein the substrate is disposed at a central portion of the principal surface of the substrate at a position opposite the main surface of the substrate supported by the support member in the chamber; A concave portion that is farthest from the main surface portion and closes to the main surface end edge of the substrate is formed, And exhausting the gas in a small amount of exhaust gas by the exhaust control means, and exhausting the gas in a large amount of exhaust gas. The method of claim 4, wherein The exhaust port is a reduced pressure drying device formed on the bottom of the chamber. In the vacuum drying method of vacuum drying the thin film formed on the main surface of the substrate, An import process for carrying the substrate into the chamber and placing it on the support member; A first exhausting exhaust gas with a small amount of exhaust gas from an exhaust port formed at a position not facing the main surface of the substrate supported by the support means in the chamber in a state where the distance between the main surface of the substrate and the upper surface of the chamber is reduced; Drying process, And a second drying step of evacuating a large amount of exhaust gas from the exhaust port in a state where the distance between the main surface of the substrate and the upper surface of the chamber is increased. delete In the vacuum drying method of vacuum drying the thin film formed on the main surface of the substrate, The substrate is loaded on the support member in a chamber having an upper surface formed with a concave portion that is farthest from the main surface of the substrate and closest to the edge of the main surface of the substrate in the central portion of the main surface of the substrate. Import process, A first drying step of performing exhausting with a small amount of exhaust gas at an exhaust port formed at a position not facing the main surface of the substrate supported by the supporting means in the chamber; And a second drying step of evacuating a large amount of exhaust gas at the exhaust port.

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