KR100725075B1 - 볼 그리드 어레이 솔더 합금 스피어를 보호 코팅하는 방법 - Google Patents

볼 그리드 어레이 솔더 합금 스피어를 보호 코팅하는 방법 Download PDF

Info

Publication number
KR100725075B1
KR100725075B1 KR1020017015481A KR20017015481A KR100725075B1 KR 100725075 B1 KR100725075 B1 KR 100725075B1 KR 1020017015481 A KR1020017015481 A KR 1020017015481A KR 20017015481 A KR20017015481 A KR 20017015481A KR 100725075 B1 KR100725075 B1 KR 100725075B1
Authority
KR
South Korea
Prior art keywords
chamber
solder
present
concentration
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020017015481A
Other languages
English (en)
Korean (ko)
Other versions
KR20020008211A (ko
Inventor
미노규제라드알
Original Assignee
알파 메탈즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/584,674 external-priority patent/US6506448B1/en
Application filed by 알파 메탈즈, 인크. filed Critical 알파 메탈즈, 인크.
Publication of KR20020008211A publication Critical patent/KR20020008211A/ko
Application granted granted Critical
Publication of KR100725075B1 publication Critical patent/KR100725075B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020017015481A 1999-06-01 2000-06-01 볼 그리드 어레이 솔더 합금 스피어를 보호 코팅하는 방법 Expired - Fee Related KR100725075B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13703199P 1999-06-01 1999-06-01
US60/137,031 1999-06-01
US09/584,674 US6506448B1 (en) 1999-06-01 2000-05-31 Method of protective coating BGA solder alloy spheres
US09/584,674 2000-05-31

Publications (2)

Publication Number Publication Date
KR20020008211A KR20020008211A (ko) 2002-01-29
KR100725075B1 true KR100725075B1 (ko) 2007-06-08

Family

ID=26834838

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017015481A Expired - Fee Related KR100725075B1 (ko) 1999-06-01 2000-06-01 볼 그리드 어레이 솔더 합금 스피어를 보호 코팅하는 방법

Country Status (4)

Country Link
EP (1) EP1232524A1 (enExample)
JP (1) JP2004500700A (enExample)
KR (1) KR100725075B1 (enExample)
AU (1) AU5315600A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0556864A1 (en) * 1992-02-21 1993-08-25 London Chemical Company, Inc. Solder powder coated with parylene
WO1997001414A1 (en) * 1995-06-29 1997-01-16 Fry's Metals Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0556864A1 (en) * 1992-02-21 1993-08-25 London Chemical Company, Inc. Solder powder coated with parylene
WO1997001414A1 (en) * 1995-06-29 1997-01-16 Fry's Metals Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors

Also Published As

Publication number Publication date
AU5315600A (en) 2000-12-18
JP2004500700A (ja) 2004-01-08
EP1232524A1 (en) 2002-08-21
KR20020008211A (ko) 2002-01-29

Similar Documents

Publication Publication Date Title
US6468363B2 (en) Composition for increasing activity of a no-clean flux
US6307160B1 (en) High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method
US5075965A (en) Low temperature controlled collapse chip attach process
US6506448B1 (en) Method of protective coating BGA solder alloy spheres
US5615827A (en) Flux composition and corresponding soldering method
US5261593A (en) Direct application of unpackaged integrated circuit to flexible printed circuit
US5874043A (en) Lead-free, high tin ternary solder alloy of tin, silver, and indium
KR100737498B1 (ko) 반도체 소자의 실장 방법 및 실장 구조
US7425299B2 (en) Lead-free solder balls and method for the production thereof
KR100322823B1 (ko) 전자회로장치의제조방법
JP6150881B2 (ja) はんだ付け装置及びはんだ付け方法
TW200522229A (en) Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
US20010042778A1 (en) Flux cleaning method and method of manufacturing semiconductor device
US6227434B1 (en) Reworking of a ball grid array module
KR100725075B1 (ko) 볼 그리드 어레이 솔더 합금 스피어를 보호 코팅하는 방법
US7037819B2 (en) Method of making a circuitized substrate
JP3124224B2 (ja) はんだバンプ形成方法
US7560373B1 (en) Low temperature solder metallurgy and process for packaging applications and structures formed thereby
JP2001168513A (ja) 非鉛系はんだ材料被覆基板の製造方法
JP3468876B2 (ja) プリント配線板およびその製造方法
WO1997050001A1 (en) A method of testing and fitting electronic surface-mounted components
Viswanadham et al. Corrosion and related phenomena in portable electronic assemblies
JPH02248013A (ja) チップ電子部品

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20120518

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130516

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20140530

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20140530

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000