AU5315600A - Method of protective coating bga solder alloy spheres - Google Patents

Method of protective coating bga solder alloy spheres

Info

Publication number
AU5315600A
AU5315600A AU53156/00A AU5315600A AU5315600A AU 5315600 A AU5315600 A AU 5315600A AU 53156/00 A AU53156/00 A AU 53156/00A AU 5315600 A AU5315600 A AU 5315600A AU 5315600 A AU5315600 A AU 5315600A
Authority
AU
Australia
Prior art keywords
protective coating
solder alloy
bga solder
alloy spheres
spheres
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU53156/00A
Other languages
English (en)
Inventor
Gerard R. Minogue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Alpha Metals Ltd
Alpha Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/584,674 external-priority patent/US6506448B1/en
Application filed by Alpha Metals Ltd, Alpha Metals Inc filed Critical Alpha Metals Ltd
Publication of AU5315600A publication Critical patent/AU5315600A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
AU53156/00A 1999-06-01 2000-06-01 Method of protective coating bga solder alloy spheres Abandoned AU5315600A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US13703199P 1999-06-01 1999-06-01
US60137031 1999-06-01
US09/584,674 US6506448B1 (en) 1999-06-01 2000-05-31 Method of protective coating BGA solder alloy spheres
US09584674 2000-05-31
PCT/US2000/015220 WO2000074132A1 (en) 1999-06-01 2000-06-01 Method of protective coating bga solder alloy spheres

Publications (1)

Publication Number Publication Date
AU5315600A true AU5315600A (en) 2000-12-18

Family

ID=26834838

Family Applications (1)

Application Number Title Priority Date Filing Date
AU53156/00A Abandoned AU5315600A (en) 1999-06-01 2000-06-01 Method of protective coating bga solder alloy spheres

Country Status (4)

Country Link
EP (1) EP1232524A1 (enExample)
JP (1) JP2004500700A (enExample)
KR (1) KR100725075B1 (enExample)
AU (1) AU5315600A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272007A (en) * 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors

Also Published As

Publication number Publication date
KR100725075B1 (ko) 2007-06-08
JP2004500700A (ja) 2004-01-08
EP1232524A1 (en) 2002-08-21
KR20020008211A (ko) 2002-01-29

Similar Documents

Publication Publication Date Title
KR20010012869A (ko) 무연땜납합금
AU9385798A (en) Process of using an active solder alloy
AU2998299A (en) Improved protective coatings for metals and other surfaces
AU2003237370A1 (en) Corrosion-responsive coating formulations for protection of metal surfaces
AU2409800A (en) Protective coating and methods for making same
AU1625501A (en) Direct bga attachment without solder reflow
IL145465A (en) Coated hard alloy
AU2059301A (en) Coated metal substrates and methods for preparing and inhibiting corrosion of the same
GB2319039B (en) Solder alloy
GB0008506D0 (en) Method of manufacturing formed pieces of type 2024 aluminium alloy
AU4989599A (en) Solder ball placement apparatus
HUP0201843A2 (en) A method of processing a metallic alloy, a modified alloy composition and a method of producing the modified alloy composition
AU2002363992A1 (en) Method of powder coating weldable substrates
AU6450096A (en) Metal ball grid electronic package
AU4858800A (en) Copper alloy
AU2003234437A1 (en) Method of making coatings comprising an intermetallic compound and coatings made therewith
AU679631B2 (en) High-strength solder alloy
EP1432848A4 (en) PROCESS AND COMPOSITION FOR ELECTRODEPOSITION OF TIN OR HIGH SPEED TIN ALLOYS
SG83221A1 (en) Alloy composition and plating method
AU5745800A (en) Method of fabricating metal electronic enclosures
AU5315600A (en) Method of protective coating bga solder alloy spheres
HUP0203608A3 (en) Coating an aluminium alloy substrate
AU5556800A (en) Solder alloy
AU2002317451A1 (en) Lead-free solder alloy
IL115501A0 (en) Alloy solder clad substrate

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase