JP2004500700A - Ｂｇａハンダ合金球を保護コーティングするための方法 - Google Patents

Ｂｇａハンダ合金球を保護コーティングするための方法 Download PDF

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Publication number
JP2004500700A
JP2004500700A JP2001500332A JP2001500332A JP2004500700A JP 2004500700 A JP2004500700 A JP 2004500700A JP 2001500332 A JP2001500332 A JP 2001500332A JP 2001500332 A JP2001500332 A JP 2001500332A JP 2004500700 A JP2004500700 A JP 2004500700A
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JP
Japan
Prior art keywords
chamber
solder
solvent
present
vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001500332A
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English (en)
Japanese (ja)
Other versions
JP2004500700A5 (enExample
Inventor
ミノグ，　ジェラード　アール．
Original Assignee
アルファ・メタルズ・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/584,674 external-priority patent/US6506448B1/en
Application filed by アルファ・メタルズ・インコーポレーテッド filed Critical アルファ・メタルズ・インコーポレーテッド
Publication of JP2004500700A publication Critical patent/JP2004500700A/ja
Publication of JP2004500700A5 publication Critical patent/JP2004500700A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2001500332A 1999-06-01 2000-06-01 Ｂｇａハンダ合金球を保護コーティングするための方法 Pending JP2004500700A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13703199P 1999-06-01 1999-06-01
US09/584,674 US6506448B1 (en) 1999-06-01 2000-05-31 Method of protective coating BGA solder alloy spheres
PCT/US2000/015220 WO2000074132A1 (en) 1999-06-01 2000-06-01 Method of protective coating bga solder alloy spheres

Publications (2)

Publication Number Publication Date
JP2004500700A true JP2004500700A (ja) 2004-01-08
JP2004500700A5 JP2004500700A5 (enExample) 2007-08-02

Family

ID=26834838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001500332A Pending JP2004500700A (ja) 1999-06-01 2000-06-01 Ｂｇａハンダ合金球を保護コーティングするための方法

Country Status (4)

Country Link
EP (1) EP1232524A1 (enExample)
JP (1) JP2004500700A (enExample)
KR (1) KR100725075B1 (enExample)
AU (1) AU5315600A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272007A (en) * 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors

Also Published As

Publication number Publication date
AU5315600A (en) 2000-12-18
KR100725075B1 (ko) 2007-06-08
EP1232524A1 (en) 2002-08-21
KR20020008211A (ko) 2002-01-29

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