KR100721351B1

KR100721351B1 - Lazer marking device for a semiconductor package

Info

Publication number: KR100721351B1
Application number: KR1020050069285A
Authority: KR
Inventors: 이주성
Original assignee: 한국 고덴시 주식회사
Priority date: 2005-07-29
Filing date: 2005-07-29
Publication date: 2007-05-25
Also published as: KR20070014543A

Abstract

The present invention relates to a laser marking apparatus for a semiconductor package, and more particularly, to a transfer marking apparatus for transferring a semiconductor package to a marking unit and a fixing apparatus for fixing the semiconductor package during marking, To a marking portion, and the transfer preparation and the marking can be performed at the same time, so that the productivity can be improved.

The present invention is characterized in that the above-described present invention provides a semiconductor device comprising: a loading section for supplying a semiconductor package to a conveying platform; a conveying section for conveying the semiconductor package supplied through the loading section; a laser marking section for marking the conveyed semiconductor package; And a foreign matter removing unit for sucking a synthetic resin branch generated while marking the fixing unit for fixing the semiconductor package, wherein a fixing pin inserted into the semiconductor package loaded on the transfer table is formed on the transfer unit and the fixing unit.

Description

TECHNICAL FIELD [0001] The present invention relates to a laser marking apparatus for a semiconductor package,

1 is a schematic diagram of a laser marking apparatus for a conventional semiconductor package,

2 is a partial explanatory view showing a transfer section of a laser marking apparatus for a conventional semiconductor package,

3 is a schematic configuration diagram of a laser marking apparatus for a semiconductor package according to the present invention.

The present invention relates to a laser marking apparatus for a semiconductor package, and more particularly to a laser marking apparatus for a semiconductor package, which comprises a transfer section for transferring a semiconductor package to a marking section and a fixing section for fixing the semiconductor package during marking, To a laser marking apparatus for a semiconductor package in which transferring and marking can be performed at the same time.

Generally, a semiconductor package is an electronic device capable of controlling the amount of electric charge carried by electrons and holes in a semiconductor, and having a specific operation function for a voltage and an electric current applied from an appropriate terminal. Such a semiconductor device forms a wafer From manufacturing processes to packaging to protect the chips.

During the assembly and testing process of the semiconductor package, various types of information such as the type of the semiconductor chip, the logo of the manufacturer, the date of assembly, and the date of assembly are displayed on the upper and lower surfaces of the semiconductor package using ink or laser.

The semiconductor package is transferred to a singulation apparatus and cut to a predetermined size to produce a semiconductor package of the finished product.

The marking process is divided into a laser marking marking a specific character on the surface of the semiconductor package using a laser and an ink mark mark marking a specific character on the surface of the semiconductor package using a type plate.

Ink marking provides a clearer marking than laser marking, but laser marking is becoming increasingly common due to various convenience and ease of maintenance.

The laser marking is advantageous in that no static electricity is generated by the non-intaglio marking by the laser light and the high productivity is guaranteed by marking up to several hundreds per second.

The conventional laser marking apparatus for a semiconductor package as described above is shown in FIGS. 1 and 2. FIG.

1 to 2, reference numeral 1 denotes a semiconductor package, 2 denotes a loading section, 3 denotes a transfer section, 4 denotes a laser marking section, 5 denotes a foreign substance removing section, and 6 denotes a transfer pin.

As shown in the drawings, a conventional laser marking apparatus for a semiconductor package includes a loading section 2 on which a semiconductor package 1 is mounted, a transfer section 3 for transferring a semiconductor package supplied from the loading section 2, A laser marking unit 4 for marking the surface of the semiconductor package 1 transferred by the transfer unit 3 and a foreign matter removing unit 5 for removing molding resin dust generated by the marking.

The transfer unit 3 of the laser marking apparatus for a semiconductor package as described above is inserted into the lead frame of the connected semiconductor package 1 supplied from the loading unit 2 and is provided with a transfer pin 6 And the semiconductor package 1 was transferred.

However, since the transferring unit 3 can not perform marking until the transferring unit returns to the marking position after transferring the marked semiconductor package after marking the semiconductor package, the process is complicated and the productivity of the marking is lowered.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method and apparatus for transferring a semiconductor package to a marking unit, It is an object of the present invention to provide a laser marking apparatus for a semiconductor package which can simultaneously perform a marking process and a transfer process in which productivity is expected to be improved.

It is another object of the present invention to provide a semiconductor device and a method for manufacturing the semiconductor device, which can transfer the semiconductor package to the marking portion while leaving the semiconductor package, And to provide a laser marking method for a semiconductor package which is expected to improve productivity.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a loading section for supplying a semiconductor package to a transfer table; a transfer section for transferring the semiconductor package supplied through the loading section to the marking section; A laser marking unit for marking the transferred semiconductor package, and a foreign matter removing unit for sucking synthetic resin dust generated while marking the transferred semiconductor package.

In the present invention, the loading unit is a loading device that feeds the semiconductor package as it is transported. In the practice of the invention, the loading device can be made using a conventional loading device as long as it can safely supply the semiconductor package to the transfer table, and there is no particular limitation. In a preferred embodiment of the present invention, the loading device pushes the semiconductor packages of the multi-layer tray on which the semiconductor packages are mounted for each tray one by one using the push device installed on one side of the tray, and feeds them.

In the present invention, the transfer unit is a transfer device for transferring a semiconductor package, which is transferred from the loading unit, to a part where laser marking is performed along a transfer belt. In one embodiment of the present invention, the conveying device is composed of a moving member moving along the conveying table and being displaced, and a first fixing pin provided on the moving member and movable up and down.

In the embodiment of the present invention, the first fixing pin is inserted into a hole formed in a lead frame of the semiconductor package, and the lead frame of the semiconductor package is fixed so as not to move away from the conveyance belt when the moving member is moved.

In the present invention, a plurality of the first fixing pins may be formed on the moving member, and the first fixing pins may be appropriately adjusted according to the length of the semiconductor package.

In the transferring apparatus according to the present invention, after the semiconductor package is moved to the laser marking apparatus, the moving member is returned to the point where the semiconductor package is loaded. In the practice of the invention, the shifting member may be repositioned in the same path as the path where the loading of the semiconductor package moves from the point at which laser marking is performed, or may be restored via another path. In a preferred embodiment of the invention, when a plurality of semiconductor packages move, it is preferable that they are retracted through different paths to avoid interference between the transfer devices. In one preferred embodiment of the present invention, the movable member may be moved to the original position by using an auxiliary device which moves the movable member to the point where the loading is performed after releasing the movable member from the guide path, .

In the present invention, the fixing portion is a fixing device configured to fix the semiconductor package transferred by the transfer device during the marking process. According to an embodiment of the present invention, the fixing device comprises a fixing base on which the semiconductor package is placed and a fixing member formed on the fixing base to prevent movement of the semiconductor package encased in the fixing base. In a preferred embodiment of the present invention, the fixing member is a second fixing pin that can be inserted into another hole formed in the semiconductor package.

In one embodiment of the present invention, the second fixing pin or the fixing base is formed to be able to move up and down so that the second fixing pin can be inserted into or removed from the semiconductor package. In a preferred embodiment of the present invention, a fixing table is vertically structured so that the second fixing pin can be inserted into or removed from the semiconductor package.

In one preferred embodiment of the present invention, in order to avoid interference with the conveyance device, the conveyance device is preferably installed at the upper end of the conveyance platform, and the fixed platform is installed at the lower end of the conveyance platform.

In the present invention, the laser marking apparatus can be a conventional laser marking apparatus used in the art, and there is no particular limitation.

In the present invention, the generated foreign matter removing unit is provided for sucking synthetic resin dust generated during laser marking, and can be manufactured using a general suction device, and there is no particular limitation.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, including the steps of: supplying a semiconductor package to a conveyance platform; conveying the semiconductor package supplied to the conveyance platform to a laser marking section using a conveyance device; Securing the semiconductor package; Repositioning the transfer device while laser marking the semiconductor package; The transfer station; And discharging the semiconductor package along a transfer belt.

In the present invention, the step of supplying the semiconductor package to the conveying platform is performed by a loading device installed close to the conveying platform. The loading device can be made using a conventional loading device, and there is no particular limitation. In a preferred embodiment of the present invention, the loading device pushes the semiconductor packages of the multi-layer tray on which the semiconductor packages are mounted for each tray one by one using the push device installed on one side of the tray, and feeds them.

In one embodiment of the present invention, the step of moving the semiconductor package supplied to the conveyance belt to the laser marking unit is performed by a transfer device. In one embodiment of the present invention, the transfer device is composed of a moving member moving along a guide portion provided parallel to a position where laser marking is performed along a transfer belt, and a first fixing pin installed on the moving member and being movable up and down .

According to an embodiment of the present invention, the step of moving the semiconductor package supplied to the conveyance belt to the laser marking unit includes the steps of inserting the first fixing pin into the semiconductor package, Moving to the marking portion; And detaching the first fixing pin.

In the present invention, the step of fixing the semiconductor package is a step of fixing the moved semiconductor package using a fixing device. According to an embodiment of the present invention, the fixing device comprises a fixing base on which the semiconductor package is placed and a fixing member formed on the fixing base to prevent movement of the semiconductor package encased in the fixing base. According to a preferred embodiment of the present invention, the fixing member is a second fixing pin that can be inserted into another hole formed in the semiconductor package, and the second fixing pin is inserted and fixed to the semiconductor package detached from the transfer device. In a preferred embodiment of the present invention, the second fixing pin is inserted into a hole formed in the lead frame of the semiconductor package.

In the present invention, the step of repositioning the transfer device while laser marking the semiconductor package is a process in which the laser marking process and the in-position process of the transfer device are performed at the same time. In one embodiment of the present invention, the laser marking can be performed using a conventional laser marking apparatus, and there is no particular limitation.

In one embodiment of the present invention, the step of returning the transfer device to the original position is performed by moving the semiconductor package to a laser marking device and then returning to a point where the semiconductor package is loaded. In one embodiment of the present invention, the moving member is moved along a connected guide bar extending from a point where laser marking is performed to a point where laser marking is performed, to a point where laser marking is performed, So that interference with another semiconductor package moved from the loading unit to the laser marking apparatus can be avoided. According to another embodiment of the present invention, the retracting process may be performed using an auxiliary device that picks up the moving member at a point where laser marking is performed, moves to a point where loading is performed, and then seats the moving member. As will be appreciated by those skilled in the art, in order for the shifting member to be in place, the semiconductor package is first released from the first fixing pin.

According to the present invention, the step of discharging the marked semiconductor package includes a step of detaching the semiconductor package from the fixing device, and a step of pushing the marked semiconductor package and discharging the marked semiconductor package. According to an embodiment of the present invention, the semiconductor package is detached from the semiconductor package by removing the second fixing pin provided on the fixing table by lowering the fixing table provided at the lower end of the transfer table. According to an embodiment of the present invention, the separated semiconductor package may be pushed out by the next semiconductor package transferred for marking by the transfer device.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a schematic view of a laser marking apparatus for a semiconductor package according to the present invention, FIG. 4 is a view showing a transfer section of a laser marking apparatus for a semiconductor package according to the present invention, 1 is a view showing a fixing device of a laser marking apparatus for a package.

As shown therein, the laser marking apparatus for a semiconductor package of the present invention includes a loading device 3 for supplying a semiconductor package 1 to a transfer table 2 and a semiconductor package supplied through the loading device 3 to a marking position A fixing device 5 for fixing the transferred semiconductor package, and a laser marking device 6 for marking the transferred semiconductor package.

The loading device 3 of the semiconductor package as described above includes a multi-stage tray 31, a support table 32 for supporting the multi-stage tray 31, and a pushing device 33 for pushing the semiconductor package 1 from one side . The semiconductor package 1 is mounted on the multi-stage tray 31. When the semiconductor package 1 is positioned at an appropriate height by the upward and downward movement of the support table 32, The semiconductor package is pushed to the right and placed on the transfer table 2.

The transfer device 4 as described above is provided with a moving member 41 which moves along a guide bar 44 provided parallel to the conveying table 2 and a first fixing pin 42 ). The first fixing pins 42 are formed on the lower side so as to be inserted into the lead frame of the semiconductor package 1 supplied from the loading device 3, Is inserted into the lead frame so as not to fluctuate during conveyance.

The fixing device 5 includes a fixing base 51 and a second fixing pin 52 protruded to be inserted into the lead frame of the semiconductor package 1, (Not shown) capable of moving up and down. The second fixing pin 52 is inserted into the lead frame so that the semiconductor package 1 does not fluctuate during the marking process.

The marking device 6 as described above is installed at the upper end of the conveyance table 2 and marks the semiconductor package 1 fixed by the second fixing pins 52 of the fixing table.

The operation and effect of the present invention constructed as described above will be described below.

The pushing device 33 pushes the first semiconductor package 1 placed on the first end of the multi-stage tray 31 positioned at a horizontal height with the conveying platform 2 to move the conveying platform 2. After the pushing device 33 pushes the first semiconductor package 1, the multi-stage tray 31 is raised so that the second end is positioned to be parallel to the height of the conveying table 2. [

When the semiconductor package 1 is inserted into the conveyance table 2, a sensor (not shown) senses this, and the first fixing pin 42 attached to the conveyance rod 41 is lowered, And inserted into the opening formed in the lead frame. When the first fixing pin 42 is inserted, the semiconductor package 1 is fixed to the first fixing pin 42 and is moved to the position where the laser marking apparatus is located along the transfer table 2 .

When the semiconductor package 1 is moved to a position where the laser marking apparatus is located, the first fixing pin 42 is lifted and the semiconductor package 1 is detached from the first fixing pin 42. When the first fixing pin 42 is detached, the fixing base 51 located at the lower end of the conveyance table 2 is raised and the second fixing pin 52 provided on the fixing base 51 is pressed against the upper surface of the semiconductor package 2 Is inserted into another opening formed in the lead frame, thereby fixing the semiconductor package (1).

When the semiconductor package 2 is fixed, the laser marking apparatus performs marking, and while the laser marking apparatus marks the semiconductor package 1, the movable member 41 is moved to another path (not shown) leading from the laser marking apparatus to the loading apparatus (Not shown) through which the second semiconductor package 1 " is inserted. When the laser marking is completed, the fixing table 51 is lowered and the second fixing pin is detached from the semiconductor package 1.

When the transfer rod is transferred to the position where the laser marking device is located by repeating the step of inserting and moving the first fixing pin 41 into the second semiconductor package 1 ", and the second semiconductor package 1 " The first semiconductor package is moved by the second semiconductor package 1 " The semiconductor packages marked by the repetition of the process are discharged from the conveyance belt 2 to the discharge stand 20.

Thus, during the marking process of the semiconductor package 1, the semiconductor package to be next marked can be moved to the marking location.

As described above, the present invention can simultaneously perform laser marking of the semiconductor package and resetting of the transfer device to transfer the other semiconductor package, thereby improving productivity.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limited to the embodiments set forth herein. Various changes and modifications may be made by those skilled in the art.

Claims

A transfer unit 4 for transferring the semiconductor package to a position where laser marking is performed along with a transfer unit 1 for supplying the semiconductor package to the transfer unit 2 and a transfer unit for transferring the semiconductor package supplied through the loading unit 1 to the marking unit, A fixing part 5 for fixing the transferred semiconductor package, a laser marking part 6 for marking the transferred semiconductor package, and a foreign matter removing part 7 for sucking synthetic resin dust generated while marking ,

The transfer unit 4 is formed with a first fixing pin 42 for fixing the semiconductor package 1 during transfer and a semiconductor package 1 separated from the transfer unit 1 is marked on the fixing unit 5, A second fixing pin 52 for fixing the second fixing pin 52 is formed,

The first fixing pin 42 is inserted into an opening formed at one side of the semiconductor package lead frame and the second feeding pin 52 is inserted into an opening formed at the other side of the semiconductor package lead frame. The laser marking device for semiconductor.

The laser marking apparatus for semiconductor according to claim 1, characterized in that the transfer section (4) comprises means capable of being retracted for transfer of another semiconductor package (1 ") during marking of the semiconductor package (1).

delete

A method of laser marking a semiconductor package,

Supplying a semiconductor package to a transfer table using a loading device,

Wherein the semiconductor package is transported by a first fixing pin formed on the transporting device while being transported along the transporting platform by the transporting device, Fixed to the device;

Detaching the semiconductor package from the transfer device;

Fixing the semiconductor package, wherein the semiconductor package is fixed by a second fixing pin formed on a fixing device;

Laser marking the semiconductor package while the transfer device is in place;

Releasing the marked semiconductor package from the second fixing pin;

Discharging the marked semiconductor package

Wherein the marking method comprises the steps of:

The semiconductor package according to claim 4, wherein the first fixing pin (42) is inserted into an opening formed at one side of the semiconductor package lead frame, and the second feeding pin (52) is inserted into an opening formed at the other side of the semiconductor package lead frame Wherein the semiconductor package is a semiconductor laser.