KR100717145B1 - Method and device for placing and remelting shaped pieces consisting of solder material - Google Patents

Abstract

The present invention provides a method and apparatus for on-board solder placement and remelting, wherein a plurality of solders are disposed on a bond pad array consisting of a plurality of bond pads 28 of a substrate 23 and then remelted solder on the bond pads. Thus, a template device 21, 40, 51, 56, 65, 75 having a plurality of template holes for accommodating solder on the opposite sides of the substrates 23, 49, 64 having the bonding pad arrangement 29 is provided. Arranged to receive solder in the individual bond pads (28, 50, 63); The laser energy is applied to the solder contained in the plate holes 27, 48, 61, 70 through the template device by using the laser device arranged behind the template devices 21, 40, 51, 56, 65, 75. It is characterized by.

Description

Method and device for placing and remelting solder on a substrate {Method and device for placing and remelting shaped pieces consisting of solder material}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a method and apparatus for solder placement and remelting on a substrate, and more particularly, after placing solder material on a bonding pad array consisting of a plurality of bond pads of a substrate. A method and apparatus for solder placement and remelting on a substrate for remelting the solder on the bonding pad arrangement.

The methods are used in a process called "wafer bumping" in the production of chip-size packages or ball grid arrays. Basically, the methods involve the production of a number of standardized bond pad metallization regions or contact metallization regions in a particular arrangement on a substrate surface. The following methods have been used so far to achieve this effect.

In the first method, the solder deposits are arranged or arranged on the bonding pads as a separate arrangement method, and then separate thermal energy, for example, laser energy, is applied to remelt the solder deposits or the solder moldings.

In a second method, for example in a mask application process, the solder deposit is applied as a paste-like material and subsequently remelted in an oven for all solder deposits at the same time.

The first method is the result of the individual application of thermal energy to the solder deposits or the molded parts of the solder, which results in the substrate being exposed to as little thermal load as possible, especially when laser energy is used. However, the method is very slow in speed of implementation.

The second method is a fast remelting process that can increase throughput with high production volumes. However, the achievement of the method results in an increase in production cost due to an increase in required production equipment costs. In addition, depending on the shape of the substrate processed in this manner, problems may arise due to the heat load more than a degree.
WO 98/12738 introduces a method in which an aperture screen corresponding to a bonding pad of a substrate is provided in an opening screen arranged on a substrate comprising a bonding pad arrangement, and then a vacuum pipette inserts individual solder into the opening of the opening screen. Doing. The arrangement is preheated in an oven and then the solder is melted by the application of xenon light projected from the side of the opening screen facing and spaced apart from the substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve this problem of the prior art, and provides a method and apparatus for economically placing and remelting a plurality of solders on a bonding pad of a substrate while at the same time thermally exposing the substrate. Its purpose is to.

In order to achieve the above object, the solder placement and remelting method on a substrate of the present invention firstly arranges a template device having a plurality of template holes to accommodate solder on the opposite side of the substrate having a bonding pad arrangement. Place solder in the bond pad. Then, the plate hole is scanned with an optical scanning device for inspecting the solder, and then laser energy is applied to the solder contained in the plate hole through the template device by using a laser device arranged behind the template device.
This makes it possible to find inspection points as soon as possible before doing any QA testing that may occur after a remelting operation. Moreover, the laser device can only be adjusted when the solder is placed on a particular bond pad, thereby avoiding any thermal loss of the substrate due to the bond pads being directly exposed to laser energy.

In this way, the method according to the present invention is particularly combined with the above method, which includes a laser remelting process which is adaptable on the substrate, especially in the case of heat treatment, which is suitable for performing a time-saving arrangement.

In particular, in a preferred variant of the method, the singling-out necessary to make the individual molded parts of the solder is carried out from the molded parts of the solder contained in the template device within the template device itself, whereby the template The template holes arranged in the opening screen of the device) are filled. By this variant of the method, the template device itself is provided as a reservoir of solder, thereby eliminating the need for a separate supply device for supplying solder to the template device.

Also, as a highly preferred variant of the method, the individual withdrawal of the solder from the template device is by removing the solder from a plurality of solders arranged outside the template device. Thus, during this removal, the template holes of the template device arranged in the opening screen are filled.

With this modification, the template device itself is provided as a removal device, eliminating the need to provide a separation device for removing solder from the template device and supplying solder to the template device.

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It has also proven to be more desirable if the laser energy is applied to the solder through an optical scanning device already used to inspect the solder.

In a variant of the method, if the template device itself is provided as the reservoir of solder as described, the opening screen of the template device is opened by a filling chamber which is open toward the opening screen and is movable over the opening screen. It will be easy to fill the solder with the template holes arranged in the.

In a variant of the method according to the invention in which the template device itself is provided as a reservoir of solder, a more preferred option is by means of a paddle-wheel device which rotates about the drive shaft and moves in parallel with the opening screen surface. And a configuration for filling the plate holes disposed in the opening screen of the template device.

In the above-mentioned variant of the method according to the invention, i.e. when the template device itself is provided as a removal device for removing the solder from the solder reservoir, the solder is filled with template holes located in the opening screen of the template device. If so, it is preferable to be filled by a pressure below atmospheric pressure.

Irrespective of the modifications mentioned above in the implementation of the process according to the invention, in some cases the solder contained in the template holes may be exposed such that it is brought into contact with the bonding pads by a pressure above atmospheric pressure applied in the template device. Can be. It can also be brought into contact by the mechanical pressure of the template device itself.

In implementing the method according to the invention, a particularly suitable device according to the invention provides a template device comprising a container for receiving a plurality of solders. Here, the template device comprises a container wall arrangement designed like an opening screen for transporting solders to the bonding pad arrangement, wherein the opening screen is an individual for drawing solder from a plurality of solders and placing them on separate bonding pads of the bonding pad arrangement. And a drawing device, wherein the solder is arranged to be exposed in the template hole of the opening screen so that the solder can be exposed to laser energy by a laser device arranged behind the template device.

For better implementation, the individual take-out device is preferably designed to be movable above the opening screen. The individual take-out device may be a filling chamber which is opened towards the opening screen and moved above the opening screen.

As a further option, it is preferred to include a separate take-off device which is designed as a paddle wheel device which is movable on top of the opening screen and is bounded by the paddle of the paddle wheel of the paddle wheel device and has a radially open transport boundary.

If a separate take-off device is contained in a closed space formed by a transparent rear wall of the template device disposed opposite the opening screen, apart from the design, it is arranged on the bond pads on the bond pad arrangement of the substrate at a pressure above atmospheric pressure. Each of the solders can be pressed. The same applies to the remelting process. It is further preferred if an atmospheric protective gas is used here to produce a pressure above atmospheric pressure.

In an alternative embodiment of the device according to the invention, the template device itself comprises a housing having an opening screen having a plurality of template holes for receiving solder and a transparent back wall disposed opposite the opening screen. It may be a take out device.

If a pressure lower than atmospheric pressure is applied to the template device, it may itself be provided as a removal device and a separate take-out device for removing the solders from the reservoir for storing the solders. In this case, the removal of the solder from the reservoir causes the sub-atmospheric pressure to act so that the template holes are automatically filled.

If the diameter of the template holes formed in the opening screen is smaller than the smallest of the solders, when subatmospheric pressure is applied, it is possible to support the solders with partial vacuum acting on the cross section of the template holes, which is extraction And at the same time, the arrangement of the exposed solders makes it possible to mechanically press the solders corresponding to the bonding pads of the bonding pad arrangement by the template device.

If the diameter of the template holes formed in the opening screen is larger than the largest diameter of the solders and the distance between the opening screen and the rear wall is smaller than the smallest diameter of the solders, It is possible to arrange the solder therein, which in turn enables remelting operations to the largest extent in the template apparatus.

It would be more desirable if the side wall of the filling chamber and the wall structure of the opening screen, which were movable at the top of the opening screen, could move across the opening screen surface. This allows contact of the aperture screen with a very large range of substrate surfaces even if the surface of the substrate is not flat.

To achieve this result, the wall structure should consist of at least three layers consisting of two durable outer surface layers and a soft compressive layer interposed therebetween. Here, it would be more desirable if the compressive layer is made of plastic material and the outer surface layer is made of metal.

1 is a configuration diagram showing an embodiment of a solder placement and remelting method on a substrate according to the present invention.

Figure 2 is a cross-sectional view showing a state before the template device including the filling chamber in the method according to the invention is arranged on the substrate surface and performing the remelting operation.

3 is a cross-sectional view showing a state in which the template device is arranged on the substrate surface in FIG.

4 is a plan view illustrating the template apparatus of FIGS. 2 and 3.

5 is a cross-sectional view showing a state before a template device including a paddle wheel device in the method according to the present invention is arranged on a substrate surface and before remelting is performed.

FIG. 6 is a cross-sectional view illustrating a state in which the template apparatus is arranged on the substrate surface in FIG. 5.

7 is a plan view illustrating the template apparatus of FIGS. 5 and 6.

Fig. 8 is a cross sectional view showing another embodiment of the template apparatus after the solder is received.

FIG. 9 is a cross-sectional view showing a state in which the template apparatus according to FIG. 8 is arranged on the substrate surface. FIG.

10 is a cross sectional view showing yet another embodiment of a template device before being arranged on a substrate surface.

FIG. 11 is a cross-sectional view showing the template device of FIG. 10 after being arranged on the substrate surface. FIG.

Fig. 12 is a partial cutaway view of the template device showing the template holes of Figs. 10 and 11 as viewed from the bottom.

FIG. 13 is an enlarged cross-sectional view of the template hole according to XIII-XIII of FIG. 12.

14 is a plan view showing an embodiment of a template apparatus having a plurality of template elements.

15 is a cross-sectional view illustrating the filling chamber of FIG. 14.

FIG. 16 is a cross-sectional view illustrating a template device according to XVI-VI of FIG. 14.

17 is an enlarged cross-sectional view illustrating a portion of FIG. 16.

FIG. 18 is a side view illustrating another embodiment of the paddle wheel device of FIGS. 5, 6, and 7.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1 is a configuration diagram for achieving a method of disposing a solder 20 and then performing a remelting operation. To achieve this effect, the opening screen 24 disposed on the opposite side of the substrate 23, the transparent rear wall 25 arranged on the opposite side of the opening screen 24, and the opening screen 24 and the rear wall 25 are removed. There is provided a template device 21 comprising a housing 22 made of side wall frames 26 to which it is connected.

The opening screen 24 includes a template hole 27 in which solder 20 is arranged to make contact with the bonding pad 28 of the bonding pad arrangement 29 of the substrate 23.

As shown in FIG. 1, the template apparatus 21 includes a pressure connecting portion 30 to enable gas pressure application to the internal space 31 of the template apparatus 21. As shown in the configuration of FIG. 1, a pressure higher than atmospheric pressure is applied to the solder 20 in the internal space 31, and the bonding pad 28 of the substrate 23 is brought into contact with the solder 20. Bring. This configuration can be in the initial state of the remelting operation (described below).

As described in FIG. 1, in order to perform the remelting operation, an optical scanning device 32 is disposed on the transparent rear wall 25 of the template device 32, which scanning device is located in the scanning beam passage 34. And a bearing mirror 33 arranged thereon.

In the case of the present invention, a beam deflecting device 35 made of a prism is disposed in the scanning beam path 34, and the beam deflecting device enables separation of the detector light path 36 from the scanning beam path 34. It can be done. By alternating the positions of the bearing mirrors 33, the detector light path 36 optically connects the individual solders 20 and the bonding pads 28 of the substrate 23. In the case of the present invention, not only an infrared detector 37 but also a solder detector 38 such as a CDD camera is provided at the end of the detector light path 36. At the end of the scanning beam path 34, a laser device 39 is provided which can apply laser energy to each solder 20 depending on the positional shift of the bearing mirror 33. As shown in FIG.

Although not shown in FIG. 1, the bearing mirror 33 includes the bearing axis extending across the plane of the drawing as well as the bearing axis along the plane of the drawing, the template device 21 or the solder 20 housed therein. To enable scanning.

In order to perform the remelting operation, the movement of the two axes of the bearing mirror 33 is stopped and the solder detector 38 is operated. The laser device 39 is operated to apply laser energy to each solder 20, and the solder detector is activated to detect it. If individual variations of the settings of the laser device 39 made are possible, temperature measurements are possible with the infrared detector 37 during operation of the laser device 39.                 

As shown in FIG. 2, a template device 40 similar to FIG. 1 includes an opening screen 41, a transparent rear wall 42, a side wall frame 43 and a pressure connection 44. The filling chamber 47 located in the interior space 45 is of the present invention in which, in the example of the present invention, four side walls 46 and a top and a bottom are defined by the rear wall 42 and the opening screen 41 respectively. Includes cases. A plurality of solders 20 arranged in the filling chamber 47 are used to fill the template hole 48 in the opening screen 41.

Below the template device 40 shown in Fig. 2 is a substrate 49 having a curved surface bent by d as in the case of the present invention.

As shown in FIG. 3, when the template device 40 is arranged on the surface of the substrate 49, the opening screen 41 is bent along the surface of the substrate 49. Following this state, the filling chamber 47 moves along a deformed curve on the opening screen 41. In this process, the solders 20 are individually drawn out from the group of solders 20 arranged in the filling chamber 47 and received in the template holes 48 of the opening screen 41.

This process can be seen by observing the internal space 45 of the template device 40 through the transparent rear wall 42 as shown in FIG. 4, which is a plan view of the template device 40.

In the plan view of FIG. 4, the solder moves to the template hole 48 in the opening screen 41 by the changed movement of the filling chamber. When the opening screen 41 is completely filled and the filling chamber 47 is returned to its original state as shown in FIG. 2, laser energy is applied to each solder 20 as shown in FIG. 1. Inert atmospheric gas may be applied to the internal space 45 through the pressure connection 44 provided in the side wall frame 43. Apart from the non-oxidation remelting operation, the inert atmospheric gas is supplied at the pressure required to pressurize the solder corresponding to the bonding pad 50 of the substrate 49 (FIG. 3).

The template device 51 in the same manner as the template device 40 of FIGS. 2 to 4 shown in FIG. 5 includes an opening screen 41, a rear wall 42, a side wall frame 43 and a pressure connection 44. do.

In contrast to the template device 40 shown in FIGS. 2 to 4, the template device 51 includes a paddle wheel device 52 instead of the filling chamber 47 used for the template device 40. The paddle wheel device 52 includes a paddle wheel 53 having paddles 54 extending across the width of the inner space 45 as shown in FIG. 6 and 7, the paddle wheel device 52 moves along the opening screen 41 having a curve that is repeatedly deformed to fill solder in the template hole 48 in the opening screen 41. As shown in FIG. In this process, the paddle wheel device 52 pushes the solder 20 group forward while the paddle 54 elastically moves the solder 20 into the template hole 48.

The opening screen 41 has the same hole pattern as that of the opening screen 41 in order to prevent the solder 20 from deviating from the template hole 48 before the template device 51 is arranged on the substrate 49. It includes a sealed screen 55 having a.

The sealing screen slides in relation to the opening screen 41 to close the template hole 48 when it is moved to the closed position as shown in FIG. And, as shown in Fig. 6, the openings in the closed screen 55 in the open position are arranged and aligned to be the same as the template holes 48.

The template device 56 shown in FIGS. 8 and 9 provides a removal device for removing the solder 20 from the reservoir 57. In order to achieve this effect, the template device 56 having the hole mask 58 is lowered to the reservoir 57 and the pressure below atmospheric pressure is passed through the pressure connecting portion 61 to the internal space 59 of the template device 56. Is applied. Due to the fact that the diameter of the solder 20 is larger than the diameter of the plate hole 60 in the opening screen 58 of the template device 56, the template device 56 is withdrawn from the reservoir 57. Solder 20 drawn out at the exposed position of the hole shown in the cross-sectional view of the hole 60 remains suspended.

As a preparation step for the next remelting operation, FIG. 9 shows that solder is arranged on the bonding pad 63 of the substrate 64. As shown in FIG. 9, in this embodiment, the pressure necessary for the solder 20 corresponding to the bonding pad 63 may be applied by the inherent weight of the template device 56 or by applying mechanical pressure by the template device. have.

Similar to the template device 56 shown in Figs. 8 and 9, the template device 65 shown in Figs. 10 and 11 is suitable for drawing and removing the solder 20 from the reservoir 57. Figs. Fig. 10 shows the removal position while Fig. 11 shows the application position. As in the case of the template device 56 shown in FIGS. 8 and 9, the template device 65 also includes an opening screen 66, a transparent rear wall 67 and a side wall frame 68. In addition, as shown in FIG. 10, an internal space 69 or a gap is formed by the gap between the opening screen 66 and the rear wall 67. The gap is smaller than the diameter d of the solder 20. In contrast, the diameter D of the template hole 70 in the opening screen 66 is larger than the diameter d of the solder 20. Thus, if a pressure below atmospheric pressure is applied to the inner space 69 through the pressure connection 71 in the side wall frame 68, as a result, the solder 20 is stuck to the template hole 70 as shown in FIG. Are accepted.

In the application position of FIG. 11, the template device 65 is arranged on the substrate 64 to form a fine gap. Then, a pressure higher than atmospheric pressure is applied to the inner space 69 through the pressure connecting portion 71 so that the solder 20 and the bonding pad 63 of the substrate 64 come into contact with each other.

As shown in Figs. 12 and 13, the opening screen 66 includes a contact surface 72 in contact with each narrow hole 73 in contact with each template hole 70. As shown in Figs.

As shown in FIG. 13, the narrow passage 73 flows into the inner passage 69 while maintaining a gas pressure higher than atmospheric pressure. This allows the contact surface 72 to contact the substrate 64 and can clarify the arrangement of the template device 65 or the opening screen 66 without preventing the discharge of gas maintained at a pressure higher than atmospheric pressure. have.

FIG. 14 is a plan view of an opening screen 74 of a template device 75 including a plurality of template elements 76. The template device 75 includes a filling chamber 47 whose function and shape have already been described. Fig. 15 shows a cross section of the filling chamber 47, in which the side wall 46 of the filling chamber 47 moves across the surface of the opening screen 77 having a multi-layered wall structure. A compression layer 79 made of a soft plastic material, for example polyamide, is inserted between two outer surface layers 77 and 78 of metal to withstand the resistance.

FIG. 16 is a partial sectional view of the opening screen 74, and FIG. 17 is an enlarged view of this partial sectional view. As shown in FIG. 17, the wall shape of the opening screen 74 necessarily coincides with the shape of the side wall 46 of the filling chamber 47. The soft compressive layer 82 is sandwiched between two outer surface layers 80 and 81 that can withstand resistance.

The complex effect of the side wall 46 formed by this way of the filling chamber 47 and the opening screen 74 is deformable as in the example shown in FIG. 3. The wall shape of the opening screen 41 shown in FIG. 3 is the same as the wall shape of the opening screen 74. As shown in FIG. 3, the wall shape as described above can even compensate for the major surface curvature or deformation of the substrate.

As a result, any disturbances can be prevented when various solder placement and remelting methods are performed on the bonding pads of the substrate by various embodiments.

FIG. 18 shows a paddlewheel device 83 as an embodiment of the paddlewheel device 52 shown in FIGS. 5, 6 and 7. As in the case of the paddle wheel device 52, the rotational axis 85 of the paddle wheel device 83 is guided into the template device 84 in a deformed passage. In order to achieve this effect, the embodiment of the present invention includes a side guide slot 93 provided into the template device 84. As in the arrow direction of FIG. 18, the movement of the rotation shaft 85 may occur at the same time as the reverse rotation. As shown in FIG. 18, the rotation shaft 85 includes a gas inlet 86 in the form of a drill hole, as in the case of the present invention, which guides the gas discharge device 87 extending along the rotation shaft 85. The gas discharge device may be, for example, a long slot or a row of drill holes. Regardless of the embodiment, the gas outlet 87 guides the transfer of the chamber compartment 89 defined by the paddle 88 of the paddle wheel device 83. Also, as shown in FIG. 18, these gas discharge devices can apply a gas flow 90 to the solder 20 arranged in the chamber compartment 89 to be transferred. The gas flow 90 is used to remove any solder 20 that is free to hang on the resilient paddle 88. The gas flow is also used to continue the performance of the paddle wheel device 83 as a method of wing repair.

In particular, if the gas flow 90 of the inert gas is applied to the solder 20, it will be convenient to use a transparent cover 92 such as a window glass covering the interior space 91 of the template device 84. The use of dry gases will be convenient to neutralize the solder hanging on paddle 88. The use of nitrogen through gas flow will also be convenient.

As described above, the method and apparatus for solder placement and remelting on a substrate according to the present invention achieve the effect of thermally exposing the substrate as little as possible and economically arranging and remelting a plurality of solders on a bonding pad of the substrate. .

As described above, the present invention has been described only with respect to specific examples, but it will be apparent to those skilled in the art that various changes and modifications can be made within the technical spirit of the present invention based on the above specific examples. And modifications belong to the appended claims.

Claims (20)

delete delete delete A template having a plurality of template holes 27, 48, 61, 70 for accommodating the solder 20 opposite the substrates 23, 49, 64 having the bonding pad arrangement 29. Arranging devices 21, 40, 51, 56, 65, 75 to receive solder 20 in individual bond pads 28, 50, 63, and inspect solder 20 The scanning holes 27, 48, 61, 70 with the optical scanning device 32, and placed behind the template devices 21, 40, 51, 56, 65, 75. The laser device is applied to the solder contained in the plate holes 27, 48, 61, and 70 through the template device, so that a plurality of bonding pads on the bond pad arrangement of the substrate are formed. A method of solder placement and remelting on a substrate in which solder is placed and then remelted solder on the bond pads, The template holes 56 and 65 remove the solder 20 one by one from the plurality of solders 57 outside of the template device, and are disposed in the opening screens 58 and 66 and disposed in the opening screens 58 and 66. ) And applying laser energy to the solder (20) via an optical scanning device (32). A template having a plurality of template holes 27, 48, 61, 70 for accommodating the solder 20 opposite the substrates 23, 49, 64 having the bonding pad arrangement 29. Arranging devices 21, 40, 51, 56, 65, 75 to receive solder 20 in individual bond pads 28, 50, 63, and inspect solder 20 The scanning holes 27, 48, 61, 70 with the optical scanning device 32, and placed behind the template devices 21, 40, 51, 56, 65, 75. The laser device is applied to the solder contained in the plate holes 27, 48, 61, and 70 through the template device, so that a plurality of bonding pads on the bond pad arrangement of the substrate are formed. A method of solder placement and remelting on a substrate in which solder is placed and then remelted solder on the bond pads, The solders 20 are removed one by one from the solder group accommodated in the template devices 45 and 51, and filled into the template holes 48 of the opening screen 41, and are movable on the opening screen. A solder placement and remelting method on a substrate, characterized in that the solder 20 is filled with a template hole 48 arranged in the opening screen 41 of the template device 40 by a peeling chamber 47 that is open toward the surface. . A template having a plurality of template holes 27, 48, 61, 70 for accommodating the solder 20 opposite the substrates 23, 49, 64 having the bonding pad arrangement 29. Arranging devices 21, 40, 51, 56, 65, 75 to receive solder 20 in individual bond pads 28, 50, 63, and inspect solder 20 The scanning holes 27, 48, 61, 70 with the optical scanning device 32, and placed behind the template devices 21, 40, 51, 56, 65, 75. The laser device is applied to the solder contained in the plate holes 27, 48, 61, and 70 through the template device, so that a plurality of bonding pads on the bond pad arrangement of the substrate are formed. A method of solder placement and remelting on a substrate in which solder is placed and then remelted solder on the bond pads, The solders 20 are removed one by one from the solder group accommodated in the template devices 45 and 51, and filled into the plate holes 48 of the opening screen 41, and rotated on their drive shafts, and the surface of the opening screen is rotated. A method of solder placement and remelting on a substrate, characterized in that solder is filled in a template hole (48) arranged in an opening screen (41) of the template device (51) by a paddle wheel device (52) guided in parallel. A template having a plurality of template holes 27, 48, 61, 70 for accommodating the solder 20 opposite the substrates 23, 49, 64 having the bonding pad arrangement 29. Arranging devices 21, 40, 51, 56, 65, 75 to receive solder 20 in individual bond pads 28, 50, 63, and inspect solder 20 The scanning holes 27, 48, 61, 70 with the optical scanning device 32, and placed behind the template devices 21, 40, 51, 56, 65, 75. The laser device is applied to the solder contained in the plate holes 27, 48, 61, and 70 through the template device, so that a plurality of bonding pads on the bond pad arrangement of the substrate are formed. A method of solder placement and remelting on a substrate in which solder is placed and then remelted solder on the bond pads, The template holes 56 and 65 remove the solder 20 one by one from the plurality of solders 57 outside of the template device, and are disposed in the opening screens 58 and 66 and disposed in the opening screens 58 and 66. ) And the solder is filled in the template holes 60 and 70 disposed in the opening screens 58 and 66 of the template apparatus 56 and 65 in an environment of subatmospheric pressure. Solder Placement and Remelting Method. The method according to any one of claims 4 to 7, A method for arranging and remelting solder on a substrate, characterized in that the solder (20) included in the template hole (70) is pressed to a contact with the bonding pad (63) by applying pressure above atmospheric pressure. delete delete delete After arranging a plurality of solders 20 on the bonding pad arrangement 29 made up of the plurality of bonding pads 50 of the substrate 49, the solder on the bonding pads is remelted, and the bonding pad arrangement 29 The solder in the template hole 48 of the opening screen 41 corresponding to the individual bonding pads 50 is received so as to be exposed, the solder is exposed to the laser energy by the rear laser device 39, and the opening screen 41 is exposed. Is used to transport solder onto the bond pad arrangement 29 and is designed like a container wall of the template 40 and 51 including containers 47 and 51 for supporting a plurality of solders, each of which is individually In the solder placement and re-melting apparatus on a substrate comprising a take-out device 47, 52, The individual take-off devices 47 and 52 are paddle wheel devices 52 which are manufactured to be movable above the opening screen 41 and have a radially open transport boundary bounded by the paddle 54. Solder placement and remelting apparatus on a board | substrate. The method of claim 12, The individual take-out devices 47 and 52 are housed in a closed space 45 formed by the transparent rear wall 42 of the template device 40, 51 opposite the opening screen 41. Solder placement and remelting apparatus on a substrate. Placing a plurality of solders 20 on a bond pad arrangement consisting of a plurality of bond pads 63 of the substrate 64, then remelting the solder on the bond pads, a plurality of template holes 60 to receive the solder. In the on-board solder placement and remelting apparatus comprising an opening screen (58) (66) having a) 70, The opening screens 58 and 66 include a transparent rear wall 67 disposed opposite the opening screen and serve as a separate drawing device for the template 56 and 65, wherein the solder on the substrate is provided. Batch and remelting apparatus. The method of claim 14, The diameter of the template hole 60 formed in the opening screen 58 is smaller than the smallest diameter of the solder 20, so that the pressure of the internal space 59 of the template device 56 is increased through the pressure connecting portion 61. A solder placement and remelting apparatus on a substrate, characterized in that the solder (20) is suspended in the template hole (60) while being lower than atmospheric pressure. The method of claim 14, The diameter of the template hole 70 formed in the opening screen 66 is larger than the largest diameter of the solder 20, and the distance between the opening screen and the rear wall 67 is smaller than the smallest diameter of the solder. Solder placement and remelting apparatus on a substrate. The method according to any one of claims 12 to 16, The wall structure of the opening screens 24, 41, 58, 66, 74 and / or the sidewalls 46 of the filling chamber 47 moveable on top of the opening screen are across the opening screen surface. Solder placement and remelting apparatus on a substrate, characterized in that it is formed to be movable. The method of claim 17, And the wall structure consists of at least three layers having a flexible compressive layer 79, 82 between two durable outer surface layers 77, 78, 80, 81. Remelting device. The method of claim 18, Wherein the compressive layer (79) (82) is made of plastic and the outer surface layer (77) (78) (80) (81) is made of metal. delete

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