DE19838532A1 - Process for placing number of solder-material shaped pieces on connecting surface arrangement of substrate and for melting them onto surfaces - Google Patents

Abstract

Placing a number of solder material shaped pieces on a connecting surface arrangement of a substrate and for melting the shaped pieces onto the surfaces comprises arranging a template device (21) with a number of openings (27) and subjecting the pieces arranged in the openings to a laser device. Placing a number of solder material shaped pieces on a connecting surface arrangement of a substrate having a number of connecting surfaces and for melting the shaped pieces onto the surfaces comprises: (i) arranging a template device (21) with a number of template openings (27) to accommodate solder-material shaped pieces relative to a substrate provided with a connecting surface arrangement so that the shaped pieces are assigned to the individual connecting surfaces; and (ii) subjecting the solder-material shaped pieces accommodated in the template openings to a laser device (39) located to the rear of the template device so that the shaped pieces are treated to laser energy through the template device.

Description

The present invention relates to a method for placing a A plurality of solder material moldings on a plurality of Terminal pads arrangement of a Substrate and for subsequent remelting of the solder material shape pieces on the pads. In addition, the present concerns Invention a Vorrich suitable for performing this method tung.

Methods of the type mentioned at the outset are used, for example, in so-called "wafer bumping" in the manufacture of so-called "Chip-size packages" or in the production of "Ball Grid Array's "is used. Basically, the aforementioned procedure to ensure that a large number of uniformly or contact metallizations in a predetermined distribution order to produce a substrate surface. So far, there are procedures for this used in which either the placement or arrangement of Solder material depots on the pads in a single placement process and the subsequent remelting by a separate Beauf hitting the solder material depots or solder material fittings with heat  energy, for example laser energy, takes place, or for example as a pasty in a mask application process Material are applied and the subsequent remelting in a furnace for all solder material depots is carried out simultaneously.

A particular advantage of the first method is that through the occasional loading of the solder material depots or solder material fittings with thermal energy, especially in the case of Use of laser energy, the lowest possible heat stress chung for the substrate. On the other hand, this turns out However, the procedure is also correspondingly lengthy to carry out. With the second method, in particular due to the fast-running remelting process with large throughputs high numbers in production possible. However, with the Implementation of such a method, in particular due to the high equipment costs, high manufacturing costs. In addition Problems arise depending on the type of substrates treated in this way due to the high temperature load.

The present invention is therefore based on the object, a Ver drive of the type mentioned or one to carry out a to propose such a suitable device, the the placement and subsequent remelting of a plurality of Solder material shaped pieces on pads of a substrate if possible inexpensive and yet with the lowest possible thermal Allows substrate stress.

This task is accomplished by a process with the characteristics of the An claim 1 or a device with the features of claim 10 or 15 solved.

In the method according to the invention, the arrangement is carried out first a stencil device with a plurality of stencil openings gene for receiving solder material fittings compared to one a pad arrangement substrate, such that the Solder material shaped pieces are assigned to the individual connection surfaces,  and then an exposure to the stencil openings recorded solder material pieces with a back to the Scha bloneneinrichtung arranged laser device, such that the solder material shaped pieces through the template device with laser energy are applied.

The method according to the invention accordingly combines one for implementation a particularly time-saving placement process Stencil process with one for the substrate with regard to ther mix stresses particularly gentle laser remelting processes.

In a particularly preferred variant of the method, the Application of the individual pieces of solder material necessary development in the template device itself from a quantity of in the Stencil device recorded solder material fittings filling in a perforated disc of the template device arranged stencil openings. Serves in this process variant the template device itself as a reservoir for the solder material shape pieces, so that a separate loading device for loading the template device with solder material fittings is not necessary is.

In a likewise very advantageous variant of the method, this is done a separation of the solder material shaped pieces by the templates direction by removing solder material fittings from an outside the template device arranged amount of solder material form pieces, such that the arranged in a perforated disc during removal neten stencil openings of the stencil device are filled.

Here, the template device itself serves as a removal device, so that a separate device for removing and feeding Solder material shaped pieces for template installation is not necessary.

Regardless of the choice of the aforementioned variants, it proves to be advantageous if before loading the solder material fittings with  Laser energy a scan of the template openings with an opti rule scanning device for the detection of solder material fittings he follows.

This makes it possible, on the one hand, to correct defects very early, ie still before any quality check following the remelting process detection. On the other hand, the laser device can be dependent the presence of the solder material molding on the subject fenden pad are triggered, so that a thermal damage supply of the substrate as a result of direct laser exposure to the Pad can be excluded.

It also proves to be particularly advantageous if the application of the solder material pieces with laser energy via the optical scanning stone direction is also used to detect the shape of solder material pieces is used.

When carrying out the process variant in which, as above, he thinks the template device itself as a reservoir for the solder material Alformstücke serves, it proves to be advantageous if the filling the Scha arranged in a perforated disc of the template device blonenöffnungen by means of a movable over the perforated disc and filling chamber open towards the perforated disc.

Another advantageous possibility when performing the variant of inventive method, in which the template device itself serves as a reservoir for the solder material fittings, consists in the Filling the arranged in a perforated disc of the template device stencil openings by means of a parallel to the surface of the Perforated disc movable wing rotating about its axis of movement carry out wheel device.

When performing the above-described variant of the invention Process in which the template device itself is a removal Direction for removing the solder material fittings from a reservoir serves for solder material fittings, it proves to be advantageous if the  Filling the arranged in a perforated disc of the template device neten stencil openings by means of negative pressure.

Regardless of the variants described above for carrying out the The method according to the invention can in any case be based on that in the Stencil openings recorded solder material pieces exercised Contact pressure to create a contact with the contact end surfaces by means of a formed in the template device Overpressure are generated. It is also possible to use the touch contact via a mechanical contact pressure of the template device itself to create.

In particular for the implementation of the method according to the invention a suitable device according to the invention is a stencil device with a receptacle for holding a lot of solder Material molded pieces provided, the receiving container being a Perforated disc designed container wall for the transfer of solder material Alformstücke on the pad arrangement, and the Provide perforated disc with a separating device, such that from the amount of solder material fittings, individual and individual end faces of the pad arrangement assigned in templates Openings of the perforated disk soldered material expo be arranged and rearwards by means of a laser device are exposed to laser energy.

According to an advantageous embodiment, the separation is direction movable across the perforated disc. It can the separating device as one over the perforated disk movable filling chamber open towards the perforated disc. Another advantageous option is the singulation device as a wing movable over the perforated disc wheel device with vanes of an impeller of the impeller device training limited, radially open transport chamber departments the.  

If the separating facility is independent of its training in a closed space formed by the template device is included, which is arranged opposite the perforated disc Is transparent, it is possible to apply the isolated pieces of solder material on the pads of the An end surface arrangement of the substrate or the remelting process overlaid with an overpressure. It proves to be particularly advantageous in this context if a Protective gas atmosphere is used.

In an alternative embodiment of the device according to the invention trained the template device itself as a separating device det and has a housing with a perforated disc, which with a A plurality of template openings for receiving solder material form pieces is provided, and a transpa opposite the perforated disc pension back wall.

Such a stencil device can be under vacuum acts as a separation and / or removal facility Removal of solder material fittings from a reservoir of Lotmate rialformteile serve, then due to the removal of Solder material fittings from the reservoir through the vacuum opening enabled the template openings to be filled automatically gene results.

If the template openings formed in the perforated disc in Diameters are smaller than the smallest diameter of the solder material fittings, it is possible to apply the Solder material fittings against the opening cross sections of the templates to suck openings, so that at the same time with the separation also an exposed arrangement of the solder material moldings that it enables the solder material fittings over the template device mechanically against the pads of the pad assembly to press.  

If the template openings formed in the perforated disc in Diameters are larger than the largest diameter of the solder material fittings and one between the perforated disc and the rear wall distance formed is smaller than the smallest diameter of the solder material fittings, it is possible to erect the solder material fittings keeping the isolated arrangement inside the template device to arrange the subsequent remelting process as much as possible to be able to perform within the template.

It proves to be particularly advantageous if the perforated disc and / or Side walls of the filling chamber that can be moved over the perforated disc a flexible wall structure transverse to the surface area of the perforated disc exhibit. This makes it possible, even with any uneven training formation of the substrate surface as far as possible to the substrate surface to achieve surface-conforming formation of the perforated disc.

For this purpose, the wall structure can have at least three layers with a twi arranged two wear-resistant surface layers th and resiliently formed compression layer. As It proves to be particularly advantageous if the compression layer of plastic and the surface layers of metal are trained.

Preferred variants of the invention are described below Process as well as preferred versions used here the device according to the invention with reference to the drawings explained. Show it:

Fig. 1 is a schematic representation of a variant of the inventive method SEN;

Fig. 2 shows a variant of the method according to the invention using a Schablonenein device provided with a filling chamber before being arranged on a substrate surface and carrying out the remelting process;

Fig. 3, the stencil device shown in Figure 2 to order on the substrate surface.

Fig. 4 is a plan view of the template device shown in Figs. 2 and 3;

5 shows a further variant of the process according to the invention using a template means provided with an impeller prior to assembly on a substrate surface and carry out the remelting.

. Fig. 6 is shown in Fig template means 5 represented by an arrangement, on the substrate surface;

Fig. 7, the stencil device shown in Figures 5 and 6 in plan view.

Fig. 8 shows a further embodiment of a template means after ingestion of solder material;

Fig. 9, the stencil device shown in Fig. 8 after taking solder material fittings;

Fig. 10 shows a further embodiment of the template means prior to assembly of a substrate surface;

. Fig. 11 is shown in Fig template means 10 shown by an arrangement, on a substrate surface;

FIG. 12 is a partial bottom view of the gene in Figures 10 and 11 dargestell th template means showing of Schablonenöffnun.

Fig. 13 is an enlarged sectional view of a stencil opening according to section line XIII-XIII in Fig. 12;

Figure 14 is an embodiment of a stencil device in plan view with a plurality of template segments.

Fig. 15 is a sectional view of a filling chamber shown in Fig. 14;

FIG. 16 shows a sectional illustration through a template segment shown in FIG. 14 along the section line XVI-XVI in FIG. 14;

Fig. 17 is a fragmentary enlargement of the section shown in Figure 16 Darge;

Fig. 18 shows a variant of the wing wheel device shown in Figs. 5, 6 and 7.

Fig. 1 shows a schematic representation of a way to implement a method for placing solder material fittings 20 for a subsequent remelting process. For this purpose, a Schablonenein device 21 is provided which has a housing 22 made of a perforated disk 24 arranged opposite a substrate 23 , a transparent rear wall 25 arranged opposite the perforated disk 24 and a side wall frame 26 connecting the rear wall 25 to the perforated disk 24 .

The perforated disk 24 has template openings 27 , in which the solder material fittings 20 are arranged so that they are each in contact with associated pads 28 of a connection surface arrangement 29 of the substrate 23 .

As can be seen from FIG. 1, the stencil device 21 is provided with a pressure connection 30 , which enables an interior 31 of the stencil device 21 to be subjected to a gas pressure. In the configuration shown in FIG. 1, the solder material shaped pieces 20 are acted upon by an overpressure formed in the interior 31 , so that a contact is made between the solder material shaped pieces 20 and the associated connection surfaces 28 of the substrate 23 . In this configuration, a remelting process explained below can be initiated.

To carry out the remelting process, as shown in FIG. 1 by way of example, above the transparent rear wall 25 of the Schablonenein device 21, an optical scanning device 32 is arranged, which comprises a pivoting mirror 33 , which is angeord net in a scanning beam path 34 . In the present case designed as a beam deflecting prism 35 is arranged in the scanning beam 34, a Auskopp development of a detector beam path 36 from the scanning beam 34 permits. Depending on the rotational position of the swivel mirror 33, the detector beam path 36 establishes the optical connection between the individual solder material shaped pieces 20 or the associated connection surfaces 28 of the substrate 23 . In the present case, at the end of the detector beam path 36 there is an infrared detector 37 and a solder material detector 38, for example a CCD camera. At the end of the scanning beam path 34 there is a laser device 39 which, depending on the rotational position of the pivoting mirror 33, enables the individual shaped pieces of solder material 20 to be exposed to laser energy.

Although not shown for the sake of the simplified illustration in FIG. 1, the swivel mirror 33 has not only a swivel axis running transversely to the plane of the drawing, but also a swivel axis running in the plane of the drawing, so that an overall flat scanning of the template device 21 or of the solder material shaped pieces 20 accommodated therein is possible.

To carry out the remelting process, triggered by the solder material detector 38 , a stop of the biaxial pivoting movement of the pivoting mirror 33 and also triggered by the solder material detector 38 activates the laser device 39 to act upon the respectively detected solder material molding 20 with laser energy. During operation of the laser device 39 of the infrared detector 37 allows a temperature control with optional depending on changes made to the setting values of the laser device. 39

FIG. 2 shows a template device 40 which, like the template device 21 shown in FIG. 1, is provided with a perforated disk 41 , a transparent rear wall 42 , a side wall frame 43 and a pressure connection 44 . In an interior 45 there is a filling chamber 47 formed here from four side walls 46 , which is limited in the vorlie case up and down by the rear wall 42 or the perforated disc 41 . In the filling chamber 47 , a plurality of solder material fittings 20 are arranged, which are used to fill stencil openings 48 in the perforated disc 41 .

Below the template device 40 shown in FIG. 2 is a substrate 49 , which in the present case has a surface curvature with a deflection d.

As Fig. 3 shows, the template means the perforated disc is nestled in the arrangement 40 on the surface of the substrate 49 to the upper surface 41 of the substrate 49 at. After reaching this conformed state, the filling chamber 47 is moved translationally over the perforated disc 41 , 20 solder material fittings 20 being separated into the stencil openings 48 of the perforated disc 41 from the amount of solder material moldings 20 arranged in the filling chamber 47 .

This process is shown in FIG. 4 in a top view of the stencil device 40 , the transparent rear wall 42 exposing the interior 45 of the stencil device 40 .

The top view shown in Fig. 4 clearly shows that due to the translational movement of the filling chamber 47, a filling of the stencil openings 48 in the perforated disc 41 is set. After the perforated disc 41 has been completely filled and the filling chamber 47 has moved back into the starting position shown in FIG. 2, laser energy, as described with reference to FIG. 1, can now be applied to the individual shaped pieces of solder material 20 . In this case, the interior 45 can be charged with an inert gas atmosphere via the pressure connection 44 provided in the side wall frame 43 , which, in addition to an oxydation-free remelting process, also enables the desired contact pressure of the solder material fittings 20 against connection surfaces 50 of the substrate 49 ( FIG. 3).

Fig. 5 shows a stencil device 51 which, in accordance with the stencil device 40 shown in FIGS . 2 to 4, has a perforated disc 41 , a rear wall 42 , a side wall frame 43 and a pressure connection 44 .

Deviating from the stencil device 40 shown in FIGS. 2 to 4, the stencil device 51 is provided with an impeller device 52 which replaces the filling chamber 47 used in the stencil device 40 . The impeller device 52 has an impeller 53 with vanes 54 which, as can be seen in particular from FIG. 7, extend over the width of the interior 45 . As can also be seen from FIGS. 6 and 7, the impeller device 52 for filling the template openings 48 in the perforated disk 41 is moved in translation and overlaid with a rotation over the perforated disk 41 . The impeller device 52 drives the amount of solder material pieces 20 in front of it, with 54 preferably shaped ela stically formed wings 54 solder material pieces 20 in the template openings 48 .

In order to prevent that before placing the template device 51 on the substrate 49 solder material pieces 20 can get out of the template openings 48 , the perforated disk 41 is provided with a closing disk 55 , which has a matching hole pattern 41 and by relative displacement relative to the hole disc 41 in its closed position shown in FIG. 5 enables a closure of the template openings 48 . In their Darge shown in Fig. 6 open position, the openings in the closing plate 55 are in an alignment with the template openings 48 arrangement.

In FIGS. 8 and 9 a stencil 56 is shown, the same pieces as a removal device for removing Lotmaterialform 20 is from a reservoir 57th For this purpose, the stencil device 56 is lowered with its perforated disc 58 into the reservoir 57 and an interior 59 of the stencil device 56 is acted upon by a Druckan circuit 61 with negative pressure. Due to the fact that the solder material moldings 20 are larger in diameter than template openings 60 in a perforated disk 58 of the stencil device 56 , isolated solder material moldings 20 remain when exposed to the template device 56 from the reservoir 57 at opening cross sections 62 of the template openings 60 in exposed Adhere position.

Fig. 9 shows the processing performed in preparation for a subsequent remelting arrangement of Lotmaterialformstücke chen 20 to 63 of a substrate 64. Anschlußflä. As can be seen from FIG. 9, in this embodiment of the stencil device 56, the contact pressure of the solder material fittings 20 against the contact surfaces 63 , which is necessary for touch contact, can also take place mechanically via a contact pressure exerted on the stencil device or by the weight of the stencil device 56 .

In Figs. 10 and 11 is a template 65 which, as is suitable in FIGS. Template means 56 shown 8 and 9 and for occasional removal of solder material 20 from a reservoir 57, in a removal position (Fig. 10) and an application position ( Fig. 11) shown. Like the template device 56 shown in FIGS. 8 and 9, the template device 65 is also provided with a perforated disk 66 , a transparent rear wall 67 and a side wall frame 68 . As Fig. 10 also shows 69 is formed by a gap or distance a between the perforated disk 66 and the rear wall 67, an inner space, where the distance a is smaller than the diameter d of Lotmaterialformstücke 20th On the other hand, the diameters D of template openings 70 in the perforated disk 66 are larger than the diameters d of the solder material shaped pieces 20 . Therefore arises when the inner space is acted upon with negative pressure over 69 pressure ports 71 in the side wall frame 68, which provided in Fig. 10 Darge configuration in which the Lotmaterialformstücke 20 in the saddle blonenöffnungen 70 are added adhesive.

In the application position shown in FIG. 11, the template device 65 is arranged at a short distance above the substrate 64 . To produce a contact between the solder material fittings 20 and associated pads 63 of the substrate 64 , the interior 69 is pressurized via the pressure connections 71 .

In Figs. 12 and 13 is in a cut-away view a Unteran the perforated disc 66 view, which shows that the perforated disk is provided with a contact surface 72 of 66 which blonenöffnungen each saddle 70 has interconnecting channels 73rd As FIG. 13 makes clear, the channels 73 allow an outflow of a gas under pressure in the interior 69 , so that for the defined arrangement of the template device 65 or the perforated disk 66, a contact of the contact surface 72 with the substrate 64 is possible without this this would prevent the outflow of the pressurized gas.

FIG. 14 shows a perforated disk 74 of a template device 75 in plan view, which has a plurality of template segments 76 . The template device 75 is provided with a filling chamber 47 which has already been described in terms of its function and structure. From the sectional view of the filling chamber 47 according to FIG. 15 it is clear that the Seitenwän de 46 of the filling chamber 47 have a multi-layered wall structure transversely to the surface area of the perforated disk 74 . A compression layer 79 made of a resilient plastic, for example polyamide, is located between two outer surface layers 77 and 78 made of metal and wear-resistant.

FIG. 16 shows a partial sectional view of the perforated disk 74 and FIG. 17 finally shows an enlarged detail of this partial sectional view. It is clear from FIG. 17 that the perforated disk 74 has a wall structure which essentially corresponds to the side walls 46 of the filling chamber 47 . A resiliently formed compression layer 82 is located between two outer, wear-resistant surface layers 80 , 81 .

In cooperation, the side walls 46 of the filling chamber 47 constructed in this way and the perforated disk 74 have a deformability, as is shown, for example, in FIG. 3, the perforated disk 41 shown there having a wall structure identical to the perforated disk 74 with respect to the wall structure. Fig. 3 makes it clear that even such greater surface curvatures or deformations of the substrate can be compensated for by such a wall structure, so that impairments in the implementation of the method described with the aid of various variants and embodiments for placement and for remelting a plurality of solder material moldings on connection surfaces of a Substrate can be largely prevented.

Fig. 18 shows an impeller 83 as a variant of that shown in FIGS. 5, 6 and 7, impeller means 52. Like the Flügelradein direction 52 , the impeller device 83 in a Schabloneneinrich device 84 is guided translationally with its axis of rotation 85 . For this purpose, lateral guide slots 93 are provided in the template device 84 in the present exemplary embodiment. As indicated by the arrows in FIG. 18, an opposite rotation can be superimposed on the translation of the axis of rotation 85 in the present exemplary embodiment. As can be seen from FIG. 18, the axis of rotation 85 is provided with a gas supply 86 , which in the present case is designed as a bore, and which opens into gas outlet devices 87 extending along the axis of rotation 85 . The gas outlet devices 87 can be designed, for example, as longitudinal slots or as rows of bores. Regardless of the design, the gas outlet devices 87 open into transport chamber divisions 89 delimited by vanes 88 of the impeller device 83 and, as can also be seen from FIG. 18, allow the application of a gas flow 90 to solder material pieces 20 arranged in the transport chamber departments 89 . The gas flow 90 serves, on the one hand, to remove solder material pieces 20 possibly adhering to the elastic wings 88 . On the other hand, the gas flow 90 serves to support the effect of the impeller device 83 , which acts like a doctor blade.

In particular, when the solder material shaped pieces 20 are acted upon by a gas flow 90 made of inert gas, it makes sense to cover an interior 91 of the stencil device 84 with a transparent cover 92 , for example a glass pane. In order to counteract adhesion of the solder material shaped pieces 20 on the wings 88 , the use of dry gases has proven to be advantageous. The use of nitrogen for the gas flow also proves to be advantageous.

Claims (20)

1. A method for placing a plurality of solder material pieces on a connection area arrangement of a substrate having a plurality of connection areas and for subsequently remelting the solder material shaped pieces on the connection areas;
characterized by the process steps:

• - Arrangement of a stencil device ( 21 , 40 , 51 , 56 , 65 , 75 ) with a plurality of stencil openings ( 27 , 48 , 61 , 70 ) for receiving solder material moldings ( 20 ) opposite a substrate ( 23 ) provided with a pad arrangement ( 29 ) , 49 , 64 ) such that the solder material fittings are assigned to the individual connection surfaces ( 28 , 50 , 63 ),
• - Actuation of the solder material shaped pieces ( 20 ) received in the template openings ( 27 , 48 , 61 , 70 ) with a laser device ( 39 ) arranged at the rear of the template device ( 21 , 40 , 51 , 56 , 65 , 75 ), such that the solder material shaped pieces pass through laser energy is applied through the template device.

2. The method according to claim 1, characterized in that in the template device ( 40 , 51 ) a separation of the solder material fittings ( 20 ) from a quantity of solder material fittings accommodated in the template by filling the stencil openings arranged in a perforated disc ( 41 ) ( 48 ) takes place. 3. The method according to claim 1, characterized in that the stencil device ( 56 , 65 ) a separation of the solder material shaped pieces ( 20 ) from an outside of the stencil arranged device ( 57 ) of Lotmaterialformstüc ken by filling in a perforated disc ( 58 , 66 ) arranged stencil openings ( 60 , 70 ). 4. The method according to one or more of claims 1 to 3, characterized in that before the solder material pieces ( 20 ) with Lase energy a scan of the template openings ( 27 , 48 , 61 , 70 ) with an optical scanner ( 32 ) for detecting Solder material fittings ( 20 ). 5. The method according to claim 4, characterized in that the application of the solder material pieces ( 20 ) with laser energy via the optical scanning device ( 32 ). 6. The method according to claim 2, characterized in that the filling of the perforated disc ( 41 ) of the Schablonenein direction ( 40 ) arranged stencil openings ( 48 ) by means of a movable over the perforated disc and open towards the perforated disc filling chamber ( 47 ). 7. The method according to claim 2, characterized in that the filling of the perforated disc ( 41 ) of the Schablonenein direction ( 51 ) arranged stencil openings ( 48 ) by means of a parallel to the surface of the perforated disk and rotating about its loading axis of rotation impeller device ( 52 ) . 8. The method according to claim 3, characterized in that the filling of the perforated disc ( 58 , 66 ) of the template device ( 56 , 65 ) arranged template openings ( 60 , 70 ) is carried out by means of negative pressure. 9. The method according to one or more of the preceding claims, characterized in that a pressure exerted on the solder material shaped pieces ( 20 ) received in the template openings ( 70 ) for generating a contact with the connection surfaces ( 63 ) is generated by means of overpressure. 10. Device for placing a plurality of solder material pieces ( 20 ) on a connection surface arrangement ( 29 ) having a plurality of connection surfaces ( 50 ) of a substrate ( 49 ) and for subsequently remelting the solder material shaped pieces on the connection surfaces with a receiving container ( 47 , 51 ) for receiving a quantity of solder material shaped pieces on facing stencil device ( 40 , 51 ), the receptacle having a container wall designed as a perforated disk ( 41 ) for transferring solder material shaped pieces to the connection surface arrangement ( 29 ), and the perforated disk with a single device ( 47 , 52 ) is provided in such a way that individual and individual contact surfaces ( 50 ) of the connection surface arrangement ( 29 ) associated with template material ( 48 ) of the perforated disk ( 41 ) are arranged (exposed) and are arranged in an exposed manner from the quantity of solder material fittings and by means of a Laser device ( 39 ) can be impacted with laser energy on the back. 11. The device according to claim 10, characterized in that the separating device ( 47 , 52 ) over the perforated disc ( 41 ) is designed to be movable. 12. The apparatus according to claim 11, characterized in that the separating device is designed as a filling chamber ( 47 ) which is movable over the perforated disk ( 41 ) and is open towards the perforated disk. 13. The apparatus according to claim 11, characterized in that the separating device as an over the perforated disc ( 41 ) movable impeller device ( 52 ) with wings ( 54 ) of the impeller device limited and radially open trans port chamber departments is formed. 14. The device according to one or more of claims 10 to 13, characterized in that the separating device ( 47 , 52 ) is accommodated in a closed space ( 45 ) formed by the template device ( 40 , 51 ), the opposite of which the perforated disc ( 41 ) rear wall ( 42 ) is transparent. 15. Device for placing a plurality of solder material pieces ( 20 ) on a connection surface arrangement of a substrate ( 64 ) having a plurality of connection surfaces ( 63 ) and for subsequently remelting the solder material shaped parts on the connection surfaces with a template device ( 56 , 65 ) designed as a separation device. which has a housing with a perforated disk ( 58 , 66 ) with a plurality of template openings ( 60 , 70 ) for receiving solder material moldings and opposite the perforated disk a transparent rear wall ( 67 ). 16. The apparatus according to claim 15, characterized in that the stencil openings ( 60 ) formed in the perforated disc ( 58 ) are smaller in diameter than the smallest diameter of the shaped solder material pieces ( 20 ). 17. The apparatus according to claim 15, characterized in that the stencil openings ( 70 ) formed in the perforated disk ( 66 ) are larger in diameter than the largest diameter of the solder material shaped pieces ( 20 ) and a distance formed between the perforated disk and the rear wall ( 67 ) a is smaller than the smallest diameter d of the solder material shaped pieces ( 20 ). 18. The device according to one or more of claims 10 to 17, characterized in that the perforated disc ( 24 , 41 , 58 , 66 , 74 ) and / or side walls ( 46 ) of the filling chamber ( 47 ) movable over the perforated disc have a transverse to the surface area the perforated disc have a flexible wall structure. 19. The apparatus according to claim 18, characterized in that the wall structure has at least three layers with a resiliently executed compression layer ( 79 , 82 ) between two wear-resistant surface layers ( 77 , 78 , 80 , 81 ). 20. The apparatus according to claim 19, characterized in that the compression layer ( 79 , 82 ) made of plastic and the upper surface layers ( 77 , 78 , 80 , 81 ) are made of metal.