KR100715785B1 - Positioning device, exposure apparatus, and device manufacturing method - Google Patents

Abstract

The present invention provides a reaction force canceling technique which is very suitable for the increase in size of the positioning device having two stages and the suppression of deterioration of precision. The positioning device 100 drives the surface plate 10, the first stage 18, the second stage 19, the first stage 18, and the second stage 19 driven on the surface plate 10. And a first reaction force canceling mechanism for canceling the reaction force accompanying the second reaction force, and a second reaction force canceling mechanism for canceling the reaction force accompanying driving of the first stage 18 and the second stage 19. When the first stage 18 and the second stage 19 are driven for the first processing, the first reaction force canceling mechanism among the first and second reaction force canceling mechanisms is operated, and the first stage for the second processing. (18) In the case where the second stage 19 is being driven, at least a second reaction force canceling mechanism among the first and second reaction force canceling mechanisms is operated.

Description

Positioning device, exposure device and device manufacturing method {POSITIONING DEVICE, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD}

1 is a plan view showing a schematic configuration of a positioning device according to a first embodiment of the present invention.

2 is a side view showing a schematic configuration of a positioning device of a first embodiment of the present invention;

Fig. 3 is a plan view (first embodiment) for explaining the offsetting operation of the driving reaction force (including the half moment generated by this) during parallel execution of the exposure process and the alignment process.

Fig. 4 is a side view illustrating the offset operation of the drive reaction force (including the half moment generated by this) during parallel execution of the exposure process and the alignment process (first embodiment).

FIG. 5 is a view for explaining the operation of canceling the driving reaction force and the half moment when the two stages are replaced (first embodiment). FIG.

6 is a plan view showing a schematic configuration of a positioning device according to a second embodiment of the present invention.

Fig. 7 is a side view showing a schematic configuration of a positioning device of a second embodiment of the present invention.

Fig. 8 is a plan view (second embodiment) for explaining a canceling operation of a drive reaction force (including a half moment generated by this) during parallel execution of an exposure process and an alignment process.

Fig. 9 is a side view illustrating the offset operation of the drive reaction force (including the half moment generated by this) during parallel execution of the exposure process and the alignment process (second embodiment).

FIG. 10 is a view for explaining the operation of canceling the driving reaction force and the half moment when the two stages are replaced (second embodiment)

11 is a plan view showing a schematic configuration of a positioning device of a third embodiment of the present invention.

12 is a side view showing a schematic configuration of a positioning device of a third embodiment of the present invention;

FIG. 13 is a view for explaining the operation of canceling the driving reaction force and the half moment when the two stages are replaced (third embodiment). FIG.

14 is a diagram schematically showing an example of the configuration of an exposure apparatus in which a positioning apparatus represented by the positioning apparatus described as the first to third embodiments is assembled as a twin stage type wafer stage apparatus.

15 shows the flow of the overall manufacturing process of a semiconductor device;

16 shows a detailed flow of a wafer process.

<Description of the symbols for the main parts of the drawings>

1: object 5: projection optical system

8: alignment optical system 10: surface plate

11: Damping mechanism 12: X mass

13: Y mass 14: ω X rotor

15: ωY rotor 16: ωZ rotor

18, 19: stage 24, 25, 26: thrust generating mechanism

27: support 28: support mechanism

37: exposure plate 38: alignment plate
39: plate coupling mechanism

100, 200, 300: positioning device 410: lighting system

420: disc holding unit 430: wafer stage device

500: exposure apparatus

The present invention relates to a positioning device having two stages, an exposure device having the positioning device, and a device manufacturing method using the exposure device.

In a stage device (positioning device) for positioning a stage, the reaction force (drive reaction force) generated with the movement of the stage deteriorates the positioning accuracy of the stage and increases the time required for positioning. It becomes a problem. Here, the driving reaction force of the stage can be expressed by the product of the stage mass and the acceleration, and the driving reaction force increases as the thrust for driving the stage increases and the weight of the stage increases.

In particular, regarding the stage apparatus (wafer stage, reticle stage) to be incorporated in the semiconductor exposure apparatus, it is necessary to shorten the movement time of the stage in order to improve productivity. Therefore, it is important to increase the acceleration and the top speed of the stage. Moreover, in order to improve the productivity per wafer, the wafer size is increasing, and the stage is also enlarged and weighted with it.

For this reason, a large reaction force is generated along with the movement of the stage, which causes deformation and vibration of the entire exposure apparatus, resulting in deterioration of the positional accuracy of the stage and further deterioration of the exposure accuracy.

As a countermeasure against drive reaction of a stage, Patent Literature 1 discloses a positioning device having a mass that moves so as to eliminate the drive reaction acting on the surface plate when the stage is driven, and a guide that guides the mass body. Patent Document 1 also discloses a rotating mass that rotates so as to eliminate the drive reaction force in the Z axis center (ωz direction), and a guide for supporting the rotating mass.

[Patent Document 1]

Japanese Patent Application Laid-Open No. 11-243132

In recent years, in order to improve the processing speed or throughput of an exposure apparatus, two stages are performed in parallel with an exposure process for projecting a pattern onto a wafer and exposing the wafer, and an alignment process for performing alignment of the wafer. There is a stage device that makes it possible. Such a stage device is called a twin stage device, or simply a twin stage.

In the twin stage apparatus, each stage moves a large range in order to prevent the two stages from contacting each other when the two stages are replaced between the exposure area under the projection optical system and the alignment area under the alignment optical system. In this case, the driving reaction force to be canceled becomes large, and in order to cancel reaction force by a mass body (rotational mass body), it is necessary to enlarge and weight a mass body. This can lead to deformation of the surface plate supporting the mass body, enlargement of the entire apparatus, and increase in heat generation accompanying driving of the mass body.

Moreover, as a countermeasure against drive reaction force, as a method of applying a force from the outside to the surface plate, there is a possibility that the vibration transmitted to the outside may be transmitted to the stage via the floor, which may cause the deterioration of precision. This particularly affects the performance of the exposure apparatus during the exposure process and the alignment process.

This invention is made | formed based on the said subject recognition, For example, it aims at providing the reaction force cancellation technique suitable for the suppression of the enlargement of the positioning apparatus which has two stages, and the precision deterioration.

A first aspect of the present invention relates to a positioning device, wherein the positioning device includes a surface plate, first and second stages driven on the surface plate, and a reaction force accompanying driving of the first and second stages. A first reaction force canceling mechanism for canceling and a second reaction force canceling mechanism for canceling reaction forces accompanying driving of the first and second stages are provided. In the positioning device, when the first and second stages are driven for the first processing, the first reaction force canceling mechanism among the first and second reaction force canceling mechanisms is operated, and the second At least the second reaction force canceling mechanism of the first and second reaction force canceling mechanisms operates when the first and second stages are being driven.

According to a very suitable embodiment of the present invention, the first treatment may comprise a treatment for an article on the first stage and a treatment for an article on the second stage. Alternatively, the first process may include a process for executing a process for the article on the first stage and a process for the article on the second stage in parallel.

According to a very suitable embodiment of the present invention, it is preferable that the first reaction force canceling mechanism is arranged inside the surface plate and the second reaction force canceling mechanism is arranged outside the surface plate to drive the surface plate.

According to a very preferred embodiment of the present invention, the first reaction force canceling mechanism includes a mechanism for canceling the reaction force in the translational direction occurring along with the driving of the first and second stages, and the driving of the first and second stages. It is preferable to include the mechanism which cancels the moment which generate | occur | produces as reaction with this.

According to a very preferred embodiment of the present invention, the first reaction force canceling mechanism comprises: one or more translation movable units moving in a direction to cancel the reaction force in the translational direction generated with the driving of the first and second stages; It is preferable to include three or more rotation movable parts which rotate in the direction which cancels the moment which arises as a reaction with the drive of a 1st, 2nd stage.

According to a very preferred embodiment of the present invention, the second reaction force canceling mechanism includes a mechanism for canceling the reaction force in the translational direction occurring along with the driving of the first and second stages, and the driving of the first and second stages. It is preferable to include the mechanism which cancels the moment which generate | occur | produces as reaction with this.

According to a very preferred embodiment of the present invention, the second reaction force canceling mechanism is recoiled with the reaction force in the translational direction generated with the driving of the first and second stages, and with the driving of the first and second stages. It is preferable to include three or more thrust generating mechanisms for generating a thrust with respect to the surface plate in the direction of canceling the moment generated as.

According to a very preferred embodiment of the present invention, the second reaction force canceling mechanism includes one or more of the thrust generators disposed on the first side surface of the surface plate and a second surface of the surface plate orthogonal to the first side surface. It is preferable to include two or more of said thrust generating mechanisms arranged on the side surface.

According to a very suitable embodiment of the present invention, in the first processing, the first stage and the second stage are driven in the first region 21 and the second region 22, and in the second processing, the first stage is performed. The second stage is preferably driven in the third region 23 which is wider than the first and second regions.

According to a very preferred embodiment of the present invention, the first processing is a direction of rotation of a moment generated as a reaction with driving of the first stage and a direction of rotation of a moment generated as a reaction with driving of the second stage. It is preferable to be implemented so that it is different.

According to a very suitable embodiment of the present invention, the first processing is a sum of a moment generated as a reaction with the driving of the first stage and a moment generated as the reaction with the driving of the second stage. It is preferable to implement so that it may become the following.

According to a very suitable embodiment of the present invention, the surface plate includes a first surface plate supporting one side of the first and second stages and the other side supporting the first and second stages in the first process. It is preferable to include two surface plates.

According to a very suitable embodiment of the present invention, the positioning device combines the first surface plate and the second surface plate in the second process, and the first surface plate and the second surface plate in the first process. It is also preferable to have a coupling mechanism for releasing.

According to a very suitable embodiment of the present invention, the first treatment is performed on an exposure treatment on an article supported by one of the first and second stages, and on an article supported by the other of the first and second stages. And an alignment process for the second stage, and the second process preferably includes replacement of the first and second stages.

According to a very suitable embodiment of the present invention, the second treatment may also include a treatment of replacing an article supported by one of the first and second stages with another article.

A second aspect of the present invention relates to an exposure apparatus, wherein the exposure apparatus includes a projection optical system, an alignment optical system, a substrate stage configured to perform an exposure process using the projection optical system and an alignment process using the alignment optical system in parallel. And a substrate stage apparatus comprising: a surface plate, first and second stages driven on the surface plate, a first reaction force canceling mechanism for canceling reaction forces accompanying driving of the first and second stages; And a second reaction force canceling mechanism for canceling reaction force accompanying driving of the first and second stages. In the positioning device, when the first and second stages are driven for the first processing, the first reaction force canceling mechanism among the first and second reaction force canceling mechanisms is operated, and for the second processing, At least the second reaction force canceling mechanism of the first and second reaction force canceling mechanisms is operated when the first and second stages are being driven.

A third aspect of the present invention relates to a device manufacturing method, the method comprising the step of forming a latent image pattern on the photosensitive agent of the substrate on which the photosensitive agent is applied by the exposure apparatus, and developing the photosensitive agent .

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, the preferred embodiment of this invention is described, referring an accompanying drawing.

[First Embodiment]

1 and 2 are diagrams showing a schematic configuration of a positioning device according to a first embodiment of the present invention, where FIG. 1 is a plan view and FIG. 2 is a side view. The positioning device 100 shown in Figs. 1 and 2 is configured as a positioning device (twin stage device) having two stages, and the reaction force cancellation cancels out the reaction force (driving reaction force) generated by driving the stage. A mechanism is provided.

The positioning device 100 has a first stage 18 and a second stage 19 on the surface plate 10. A chuck device is typically mounted on each stage 18, 19, and the chuck device can hold a substrate 1 such as a wafer to be positioned, for example, a wafer. The stages 18, 19 are typically floated above the surface plate 10 by air bearings.

The surface plate 10 can be supported on the support base 27 via a vibration suppression mechanism 11 such as an air mount. The vibration damping mechanism 11 suppresses the transmission of vibration between the floor and the surface plate 10 via the support 27.

The stages 18 and 19 may be driven by a planar motor of, for example, a planar pulse motor driving method or a planar Lorentz motor driving method. In the planar pulse motor driving method, a platen (not shown) is formed on the surface plate 10, and XY electron driving units (not shown) are formed on the stages 18 and 19, and XY electrons are formed. By generating a moving magnetic field in the drive unit, the stages 18 and 19 can be freely moved independently in the X and Y directions (two directions). In the planar Lorentz motor driving method, the surface plate 10 is provided with a coil part (not shown) in which XY coils are arranged, and a magnet group (not shown) is formed in the stages 18 and 19, and flows through the X, Y, and ω Z coils. By controlling the current, the stages 18 and 19 can be freely moved independently in the X, Y, and Z directions (3 directions).

The stages 18 and 19 are typically arranged with an X bar mirror not shown perpendicular to the X axis direction and a Y bar mirror not shown perpendicular to the Y axis direction. By irradiating the measurement light to the X-bar mirrors and Y-bar mirrors arranged on the stages 18 and 19 by an X interferometer not shown and a Y and ω Z interferometer not shown attached to a predetermined measurement standard, 19 can measure the current position. The X-bar mirrors of the stages 18 and 19 have a length at which any one of the plurality of X interferometers enters the measurement light even when the stages 18 and 19 are at any position on the surface plate 10. The Y bar mirrors of the stages 18 and 19 each have a length at which the measurement light of any one of the plurality of Y interferometers and the measurement light of any of the plurality of? Z interferometers are incident. Thereby, the position of the stages 18 and 19 can be measured in the whole area of the movable area on the surface plate 10.

The stages 18 and 19 may be connected with signal cables, power cables, decompression lines, pressure air lines, refrigerant lines for temperature control of the heat source of the stage, and the like.

In this embodiment, the reaction force canceling system includes a first reaction force canceling mechanism and a second reaction force canceling mechanism.

The first reaction force canceling mechanism may include the X mass 12, the Y mass 13, the ω X rotor 14, the ω Y rotor 15, the ω Z rotor 16, and their driving mechanism (not shown). The X mass 12, the Y mass 13, the ω X rotor 14, the ω Y rotor 15, the ω Z rotor 16, and their driving mechanisms (not shown) have the surface plate 10 as a hollow structure. It is preferable to arrange in the surface plate 10.

In order to cancel the drive reaction force in the translational direction that occurs along with the driving of the stages 18 and 19, the X mass 12 and the Y mass 13 are disposed so as to be able to translate in the X and Y directions, respectively. And Y are driven in the X and Y directions by the drive mechanism. That is, the drive reaction force in the X direction generated with the driving of the stages 18 and 19 is canceled out by the mass reaction force in the X direction generated by the X drive mechanism driving the X mass 12 in the X direction. In addition, the drive reaction force in the Y direction generated in conjunction with the driving of the stages 18 and 19 is canceled by the mass reaction force in the Y direction generated by the Y drive mechanism driving the Y mass 13 in the Y direction.

The X and Y driving mechanisms driving the X mass 12 and the Y mass 13, respectively, are constituted of, for example, a linear motor, and the stator of the linear motor is fixed to the surface plate 10 so that the mover of the linear motor is X. It may be a part of the mass 12 and the Y mass 13. However, depending on the required precision, a contact drive mechanism such as a ball screw may be employed instead of the linear motor.

In the structural example shown in FIG. 1, FIG. 2, the two X mass 12 and the two Y mass 13 are arrange | positioned. Here, two X masses 12 are arranged axially symmetric with respect to the center of the table 10, and two Y masses 13 are arranged axially symmetric with respect to the center of the table 10, and two X masses are arranged. By driving (12) by the same thrust and driving two Y masses 13 by the same thrust, a moment is generated in connection with the driving of the two X masses 12 and the two Y masses 13. The work reaction force accompanying driving of the stages 18 and 19 is canceled by the sum of the X mass reaction force and the Y mass reaction force generated by the driving of the two X mass 12 and the two Y mass 13 without work. can do. However, the number of two X masses 12 and Y masses 13 may be any number as long as one or more.

ΩX in order to cancel the moment generated by the reaction force generated in conjunction with the driving of the stages 18 and 19, that is, the moment (hereinafter referred to as half-moment) generated as a reaction with the driving of the stages 18 and 19, The rotor 14, the ω Y rotor 15, and the ω Z rotor 16 are disposed so as to be rotatable at the center of the X axis, the Y axis, and the Z axis, respectively, and the X axis, the Y axis, the Y axis, Rotation is driven to the center of Z axis. That is, the half moment of the X axis center generated with the driving of the stages 18 and 19 is canceled by the rotor half moment generated by the ω X driving mechanism rotating the ω X rotor 14 to the X axis center. In addition, the half moment of the Y axis center generated in conjunction with the driving of the stages 18 and 19 is canceled by the rotor half moment generated by the ω Y driving mechanism rotating the ω Y rotor 15 to the Y axis center. In addition, the half moment of the Z axis center generated in conjunction with the drive of the stages 18 and 19 is canceled by the rotor half moment generated by the ω Z driving mechanism rotating the ω Z rotor 16 to the Z axis center.

The ωX, ωY and ωZ driving mechanisms driving the ωX, ωY and ωZ rotors 13, 14 and 15 are constituted by, for example, a motor having a coil and a magnet, and the stator of the motor is fixed to the surface plate 10 The motor (rotor) of the motor can be part of the ωX, ωY and ωZ rotors 13, 14 and 15. The configuration of the rotor is described in detail in Japanese Patent Application Laid-Open No. 11-190786.

1 and 2, two ωX rotors 14 and two ωY rotors 15 are arranged. Here, two ω X rotors 14 are placed on a line parallel to the X axis through the center of the platen 10, and two ω Y rotors 15 are parallel to the Y axis through the center of the plate 10. Arranged on the cutting line, the half moment accompanying the driving of the stages 18 and 19 is canceled out by the force of the rotor half moment generated due to the driving of the two ω X rotors 14 and the two ω Y rotors 15. can do.

Also, two ω X rotors 14 are placed on a line parallel to the X axis and symmetrical with respect to the center position of the base plate 10, and two ω Y rotors are placed on a line parallel to the Y axis. The two ωX rotors 14 are disposed at symmetrical positions with respect to the center position of the center, and the two ωX rotors 14 are driven by the same thrust and the two ωY rotors 15 are driven by the same thrust. And the half moment generated with the driving of the stages 18 and 19 by the combined force of the rotor half moments generated with the driving of the two ω Y rotors 15. However, if the number of ωX rotor 14 and ωY rotor 15 is one or more, how many may be sufficient.

The second reaction force canceling mechanism may include a Y thrust generating mechanism 24, a first X thrust generating mechanism 25, and a second X thrust generating mechanism 26 driving the surface plate 10, respectively. The thrust generating mechanisms 24, 25 and 26 are supported by the support mechanism 28 fixed to the bottom surface.

The Y thrust generating mechanism 24, the first X thrust generating mechanism 25, and the second in order to offset the driving reaction force (including the half moment generated by this) due to the driving of the stages 18 and 19. The X thrust generating mechanism 26 drives the surface plate 10 by a thrust reverse to the driving reaction force (including the half moment generated by this). Thereby, the force acting on the surface plate 10 becomes a balance relationship. The driving reaction force in the Y direction by the driving of the stages 18 and 19 cancels by the thrust of the Y thrust generating mechanism 24, and the driving reaction force in the X direction and the ω Z direction (Z by the driving of the stages 18 and 19). The half moment of the shaft center is canceled by the thrust of the first X thrust generating mechanism 25 and the second X thrust generating mechanism 26. Reaction force of thrust acting on the surface plate 10 by the thrust generating mechanisms 24, 25, and 26 in order to cancel the drive reaction force (including the half moment generated by this) due to the driving of the stages 18 and 19 The silver escapes to the bottom surface via the support mechanism 28.

1 and 2, one thrust generating mechanism 24 for driving the surface plate 10 in the Y direction, and two thrust generating mechanisms 25 for driving the surface plate 10 in the X direction. 26), the second reaction force canceling mechanism is constituted. However, the second reaction force canceling mechanism may be constituted by two thrust generating mechanisms for driving the surface plate 10 in the Y direction and one thrust generating mechanism for driving the surface plate 10 in the X direction. Further, by applying the thrust distribution, a plurality of thrust generating mechanisms can be arranged in both the X direction and the Y direction.

The thrust generating method of each thrust generating mechanism 24, 25, 26 should just provide a thrust to the surface plate 10, For example, the thrust generating method using a linear motor, using the electromagnetic adsorption force of an electronic chuck, etc. Thrust generation method etc. can be employ | adopted.

An exposure apparatus having a positioning device 100 having two stages 18 and 19 has a process of performing exposure to a wafer in an exposure procedure (exposure process) and a process of performing alignment of a wafer (alignment process). In parallel. Exposure processing of the wafer 1 on one stage (the stage 18 in FIGS. 1 and 2) is performed by the projection optical system 5 in the area of the “exposure side” on the left side in FIGS. 1 and 2. Then, alignment processing of the wafer 1 on the other stage (the stage 19 in FIGS. 1 and 2) is performed by the alignment optical system 8 in the area of the "alignment side" on the right side.

The exposure process and the alignment process are performed in parallel, and the stage 18 and the stage 19 are replaced at the time when each process is completed. As a result, the stage where the wafer alignment process is completed is moved from the "alignment side" region to the "exposure side" region, and the exposure process is performed on the wafer on the stage. Moreover, the stage in which the exposure process of the wafer is completed moves from the area of "exposure side" to the area of "alignment side". At this time, the wafer is recovered by a wafer transfer system not shown from above the stage, and a new wafer is provided on the stage. By repeating this procedure, the wafer exposure process can be performed continuously.

Here, in the exposure process, the exposure driving range necessary for measuring the wafer 1 and the reference mark 20 and exposing the wafer 1 (in Fig. 1, the driving range of the center of the stage is illustrated). What is necessary is just to drive a stage in (21). In addition, in the alignment process performed in parallel with the exposure process, the stage is positioned within the alignment driving range (the driving range of the center of the stage is illustrated in FIG. 1) necessary for the alignment process of the wafer 1. You just drive

On the other hand, when the two stages 18 and 19 are replaced, the driving range at the time of replacing the stage wider than the respective ranges of the driving range 21 at the time of exposure and the driving range 22 at the alignment (in FIG. It is necessary to move the stages 18 and 19 in 23). This is to prevent the stages 18 and 19 from interfering with each other. For this reason, when the stages 18 and 19 are replaced, the parallel processing of the exposure process and the alignment process in which the stages 18 and 19 are driven within the driving range 21 during exposure and the driving range 22 during alignment is performed. Even large driving reaction occurs. In addition, when the stages 18 and 19 are replaced, since the stages 18 and 19 are driven in opposite directions to each other, the driving reaction force includes a large half moment in the ω Z direction (rotation of the Z axis center).

In the positioning apparatus 100 of this embodiment, when the stages 18 and 19 are located within the driving range 21 during exposure and the driving range 22 during alignment, that is, parallel execution between exposure processing and alignment processing. At the time, the first reaction force canceling mechanism cancels the driving reaction force acting on the surface plate 10 in conjunction with the driving of the stages 18 and 19 in the surface plate 10. This drive reaction force includes a drive reaction force in the X and Y translation directions and a half moment in the ωX, ωY and ωZ directions. In the parallel processing between the exposure process and the alignment process, the reaction reaction force (including the half moment) is canceled by the first reaction force canceling mechanism fixed to the surface plate 10, whereby the reaction force is transmitted to the outside of the surface plate 10. It is possible to prevent vibration and deformation of the projection optical system 5 and the alignment optical system 8, and to perform exposure processing and alignment processing with higher accuracy.

In the positioning device 100 of this embodiment, when the stages 18 and 19 are replaced, as described above, the stages 18 and 19 are exposed in the driving range 23 during the stage replacement, that is, the exposure. It moves within the range larger than the time drive range 21 and the alignment time drive range 22. The positioning device 100 drives the surface plate 10 by the second reaction force canceling mechanism when the stages 18 and 19 are replaced, thereby driving the drive reaction force (half moment) accompanying the drive of the stages 18 and 19. Inclusive). When the stages 18 and 19 are replaced, the drive reaction force accompanying the drive of the stages 18 and 19 is canceled by the second reaction force canceling mechanism, thereby driving the drive reaction force in the X and Y translation directions in the surface plate 10 and The half moment in the ω Z direction (rotation of the Z axis center) can be canceled.

Here, when the stages 18 and 19 are replaced, the driving force of the stages 18 and 19 is greater than that of the driving range 21 during exposure and the driving range 22 during alignment (in particular, the half moment in the ω Z direction). ) Is generated. By increasing the thrust generated by the first X thrust generating mechanism 25 and the second X thrust generating mechanism 26, the half moment in the ωZ direction of the surface plate 10 can be canceled. In addition, in the second reaction force canceling mechanism, the reaction force of the thrust acting on the surface plate 10 escapes to the bottom surface via the support mechanism 28, and affects the reaction force to the outside of the positioning device 100. Since the stages 18 and 19 do not perform the exposure process and the alignment process, they do not adversely affect the performance of the exposure apparatus.

In this embodiment, as described above, the stage 18 is operated by the first reaction force canceling mechanism when performing the exposure and alignment processing in parallel, and by the second reaction force canceling mechanism when the stages 18 and 19 are replaced. , 19) to offset the drive reaction (including half moment generated by it) accompanying the drive.

Accordingly, the first reaction force canceling mechanism includes the driving reaction force (including the half moment generated by this) when the stages 18 and 19 move within the driving range 21 during exposure and the driving range 22 during alignment. It is enough to be able to offset. Accordingly, each mass and each rotor of the first reaction force canceling mechanism generates a driving reaction force generated when the stages 18 and 19 drive within the driving range 21 during exposure and the driving range 22 during alignment. It is sufficient to have a load and a stroke corresponding to the half moment). On the other hand, unlike this embodiment, if the drive reaction force at the time of replacing the stages 18 and 19 by the X mass 12 and the Y mass 13 is to be canceled, the X mass 12 and the Y mass 13 are used. The stroke required for is longer.

It is sufficient that the ωZ rotor 16 has a load corresponding to the half moment generated during the driving of the stages 18 and 10 in the driving range 21 during exposure and the driving range 22 during alignment. On the other hand, unlike this embodiment, when the half-moments at the time of replacing the stages 18 and 19 are canceled by the ωZ rotor 16, the load required for the ωZ rotor 16 becomes larger.

3 and 4 are diagrams for explaining the offsetting operation of the drive reaction force (including the half moment generated by this) during parallel execution of the exposure process and the alignment process, FIG. 3 is a plan view, and FIG. Side view.

3 and 4, the stage 18 is used for the exposure operation of the wafer 1 in the driving range 21 during the exposure on the surface plate 10, and the stage 19 is on the surface plate 10. It is used for the alignment operation | movement of the wafer 1 in the drive range 22 at the time of alignment. The stage 18 is accelerated in the stage acceleration direction (-Y direction) 29, and the stage 19 is accelerated in the stage acceleration direction (+ Y direction) 30.

When the stages 18 and 19 are provided for the exposure process of the wafer 1 and the alignment process of the wafer 1, the reaction force is canceled by the first reaction force canceling mechanism.

Here, a method of canceling, by the first reaction force canceling mechanism, the driving reaction force acting on the surface plate 10 when the stages 18 and 19 are accelerated within the driving range 21 during exposure and the driving range 22 during alignment. Explain.

The driving of the stage 18 exerts a driving reaction force F1 on the surface plate 10 in the + Y direction, and the driving of the stage 19 exerts a driving reaction force F2 on the surface plate 10 in the -Y direction. When these two driving reaction forces are acting on the surface plate 10, when the combined force of the driving reaction force F1 and the driving reaction force F2 is not zero, the surface force of the driving reaction force F1 + F2 in the translation direction of the Y direction in the surface plate 10. Works. In this example, since the absolute value of the drive reaction force F1 is smaller than the absolute value of the drive reaction force F2, the combined force F1 + F2 of the drive reaction force acts in the -Y direction. The Y mass 13 is translated in the Y direction so as to cancel the force F1 + F2 of the driving reaction force, and the mass reaction force -F acting on the surface plate 10 is generated in the opposite direction to the force F1 + F2 of the driving reaction force. . In this example, since the mass reaction force is generated by the two Y masses 13, the force of the mass reaction force -F generated by the two Y masses 13 -2F is the same as the force F1 + F2 of the driving reaction force, respectively. To be done. As a result, the drive reaction force F1 + F2 acted by the stage 18 and the stage 19 and the mass reaction force -2F at the time of driving the two Y masses 13 in the Y direction are balanced to form the surface plate 10. Offsets the reaction force acting on

Next, a method of canceling the half moment between the X axis center and the Z axis center acting on the surface plate 10 generated when the stages 18 and 19 are accelerated by the first reaction force canceling mechanism will be described. The stage 18 applies the drive reaction force F1 to the surface plate 10 in the + Y direction, and the stage 19 applies the drive reaction force F2 to the surface plate 10 in the -Y direction. Since the acting point of the drive reaction force F1 of the stage 18 and the drive reaction force F2 of the stage 19 does not coincide with the center of the base 10, the base plate 100 is driven by the drive reaction force F1 accompanying the drive of the stage 18. The half moment mlx1 of the X-axis center and the half moment mlz1 of the Z-axis center are applied, and the half moment mlx2 of the X-axis center and the Z-axis center are driven by the driving reaction force F2 accompanying the drive of the stage 19. The half moment of mlz2 is applied.

Regarding the moment of the Z-axis center, the driving force of the stage 18 and the stage 19 causes the surface plate 10 to apply a half moment force obtained by combining the half moment mlz1 and the half moment mlz2. In order to offset this half-moment force, the ωZ rotor 16 is rotated so that the rotor half-moment -mlz is acted in the reverse direction to the half-moment force combined with the half moment mlz1 and the half moment mlz2 acting on the surface plate 10. Thereby, the half-moment force which combined the half moment mlz1 and the half moment mlz2 which act on the surface plate 10 at the time of driving of the stages 18 and 19, and acts on the surface plate 10 at the time of rotation of (omega) Z rotor 16 The rotor half moment -mlz is equilibrated to cancel the moment in the surface plate 10.

Regarding the moment of the X-axis center, the half-moment force of the half moment mlx1 and the half moment mlx2 is applied to the surface plate 10 by the driving of the stages 18 and 19. In order to offset this half-moment force, the ωX rotor 14 is rotated so that the rotor half-moment -mlx acts in the reverse direction to the half-moment force combined with the half moment mlx1 and the half moment mlx2 acting on the surface plate 10. In this embodiment, since the rotor half moment is generated by the two ωX rotors 14, the sum of the combined force of the half rotor moment -mlx and the half moment forces generated by the two ωX rotors 14 respectively is O. To be Thereby, the half-moment force which combined the half moment mlx1 and the half moment mlx2 which act on the surface plate 10 at the time of driving of the stages 18 and 19, and acts on the surface plate 10 at the time of rotation of (ωx) rotor 14 The rotor half-moment -2mlx is balanced, and the half-moment acting on the surface plate 10 is canceled out.

In addition, about the method of obtaining a specific half moment, since it is described in Unexamined-Japanese-Patent No. 11-190786, detailed description is abbreviate | omitted.

Here, the case where the stages 18 and 19 are accelerated in the opposite direction along the Y axis has been described as an example. However, the case where the stages 18 and 19 are accelerated in the same direction along the Y axis, the Y mass 13, Using the ωZ rotor 16 and ωX rotor 14, the driving reaction force (including the half moment generated by this) can be canceled out. In the case where the stages 18 and 19 are accelerated in the same direction or in the opposite direction along the X axis, the driving reaction force is also applied using the X mass 12, the ωZ rotor 16, and the ωY rotor 15. And half moments that occur). Similarly, in the case where the stages 18 and 19 are accelerated in synchronization with the X and Y directions, the X mass 12, the Y mass 13, the ω Z rotor 16, the ω Y rotor 15, and the ω X rotor ( 14) can be used to offset the drive reaction (including the half moment generated by it).

As described above, the driving reaction force generated when the respective stages are freely driven in the X and Y directions when the wafer exposure processing and the wafer alignment processing are performed (including the half moment generated by this) Can be canceled by the first reaction force canceling mechanism.

In addition, when the exposure process and the alignment process are performed, the reaction reaction force and the half moment by each stage are canceled by the first reaction force canceling mechanism, so that the influence of the reaction force to the outside of the positioning device is eliminated. As a result, vibrations and deformations of the projection optical system and the alignment optical system are eliminated, so that exposure processing and alignment processing with higher accuracy can be executed.

The first reaction force canceling mechanism has a driving reaction force and a half moment of each stage acting on the surface plate 10 when the exposure process and the alignment process are performed within the driving range 21 during exposure and the driving range 22 during alignment. It is sufficient to have a load and a stroke that can offset. Therefore, the stroke of the X mass 12 and the Y mass 13 can be shortened, and the load of the ω Z rotor 16 can be reduced, so that the first reaction force canceling mechanism can be reduced in size and weight.

The half moment in the ω Z direction generated by the driving of each stage is calculated by adding the sum of the half moments in the ω Z direction generated by each stage when each stage generates the half moment in the same ω Z rotation direction. This must be canceled out, and the load required on the ωZ rotor 16 becomes large. Thus, the load of the ωZ rotor 16 is set so that the half moment in the ωZ direction generated when one stage is driven within the driving range 21 during exposure and the driving range 22 during alignment is offset. The other stage can be driven so as not to generate a load in the same ωZ rotational direction, whereby the load on the ωZ rotor 16 can be further reduced.

In addition, the ωZ rotor 16 can cancel the sum of the half moments in the ωZ direction that the ωZ rotor 16 can cancel in advance, and the sum of the half moments in the ωZ direction generated by the driving of each stage. It is preferable to control the order of each stage so as not to exceed the half moment value in the ωZ direction. In this manner as well, the load on the ωZ rotor 16 can be further reduced.

Fig. 5 is a view for explaining the operation of canceling the driving reaction force and the half moment when the two stages are replaced.

In FIG. 5, stage 18 and stage 19 are replaced. The stage 18 is accelerated in the stage acceleration direction (-Y direction) 29, and the stage 19 is accelerated in the stage acceleration direction (+ Y direction) 30.

In order to prevent the stages 18 and 19 from interfering with each other when the stages 18 and 19 are replaced, the stages 18 and 19 are driven during exposure in a range not exceeding the center position of the driving range 23 during the stage replacement. Range 21 moves to the outside of the drive range 22 during alignment. Therefore, a greater ωZ direction is generated during the exposure and alignment processing, that is, when the stages 18 and 19 are driven within the driving range 21 during exposure and the driving range 22 during alignment. Thus, when the stages 18 and 19 are replaced, the driving reaction force is canceled by the second reaction force canceling mechanism.

The method of canceling the drive reaction force acting on the surface plate 10 when the stages 18 and 19 are accelerated in the replacement of the stages 18 and 19 by the reaction force canceling mechanism will be described. The driving of the stage 19 exerts a driving reaction force F1 in the + Y direction on the surface plate 10, and the stage 19 exerts a driving reaction force F2 in the -Y direction on the surface plate 10. In this example, since the driving reaction force F1 and the driving reaction force F2 are the same forces acting in the opposite directions, the driving reaction force F1 and the driving reaction force F2 cancel each other in the surface plate 10 and the stages 18 and 19 are placed on the surface plate 10. The combined force of the driving reaction force by the driving of) is not applied.

When the force between the drive reaction force F1 and the drive reaction force F2 is not 0, the force F1 + F2 of the drive reaction force acts on the surface plate 10 in the translational direction of the Y direction. Thus, the Y thrust generating mechanism 24 imparts a thrust in the opposite direction to the force F1 + F2 of the driving reaction force to the surface plate 10. Thereby, the force acting on the surface plate 10 is in a balance relationship, and the reaction reaction force acting on the surface plate 10 can be canceled by the reaction force canceling mechanism.

Next, a method of canceling the half moment of the Z axis center acting on the surface plate 10 by the second reaction force canceling mechanism when the stages 18 and 19 are accelerated will be described. The stage 18 applies the drive reaction force F1 to the surface plate 10 in the + Y direction, and the stage 19 applies the drive reaction force F2 to the surface plate 10 in the -Y direction. Since the acting points of the drive reaction force F1 of the stage 18 and the drive reaction force F2 of the stage 19 do not coincide with the center of the base 10, the Z axis center is formed on the base 10 by the drive reaction force F1 of the stage 18. The half moment mlz1 'of Z-axis is applied, and the half moment mlz2' of the Z-axis center is applied to the surface plate 10 by the driving reaction force F2 of the stage 19. When the half moments of the two Z-axis centers are actuated by the driving of the stage 18 and the stage 19, the half moment force of the half moment mlz1 'and the half moment mlz2' is applied to the surface plate 10.

Here, when the stages are replaced, since the stages 18 and 19 are isolated in the X direction so that the stages 18 and 19 do not interfere with each other, the stages 18 and 19 are driven in the normal exposure range 21 and the alignment range during the alignment ( 22) a greater moment moment force in the ωZ direction is generated than when driven in the cylinder. In order to offset this half-moment force in the ω Z direction, the first X thrust generating mechanism 25 imparts thrust FX1 in the -X direction to the surface plate 10 and the second X thrust generating mechanism 26 is +. Thrust FX2 in the X direction is applied to the surface plate 10. Thereby, the thrust moment equal to the half moment force which combined the half moment mlz1 'and the half moment mlz2' which generate | occur | produced by the drive of the stages 18 and 19 is made to act on the surface plate 10 in reverse. The half moment mlz1 'and the half moment mlz2' generated by the driving of the stages 18 and 19 by the thrust moment generated by the first X thrust generating mechanism 25 and the second X thrust generating mechanism 26. The half-moment forces combined with each other become a balanced relationship, and the moment in the ω Z direction acting on the surface plate 10 can be canceled by the second reaction force canceling mechanism.

In the positioning device 100 of this embodiment, when the stages 18 and 19 are replaced, the half moment is generated in the ωX direction by the driving of the stages 18 and 19, but the half moment in the ωX direction is generated. The magnitude of is the half moment in the ωX direction generated when the stages 18 and 19 are driven in the exposure driving range 21 and the alignment driving range 22 during the parallel execution of the exposure processing and the alignment processing. Is equivalent to The reason for this is that the distance between each center position of the stages 18 and 19 and the center position of the base 10 is determined by the range of the stages 18 and 19 within the driving range 21 during exposure and the driving range 22 during alignment. This is because it is the same when driving and when the stages 18 and 19 are replaced. For this reason, the half-moment in the ω-X direction generated by the driving of the stages 18 and 19 is the ωX rotor 14 serving as the first reaction force canceling mechanism as in the case of performing exposure processing and wafer alignment processing of the wafer. It can cancel by rotating driving. However, when the stage is replaced, a thrust generating mechanism (actuator) for canceling the half moment in the ω X direction acting on the surface plate 10 may be separately provided as part of the second reaction force canceling mechanism.

Here, the case where the stages 18 and 19 are accelerated in opposite directions along the Y axis has been described as an example. However, in the replacement operation of the stages 18 and 19, the stages 18 and 19 are driven in a certain direction. Even in this case, the stages 18 and 19 are caused by applying a thrust to the surface plate 10 by the Y thrust generating mechanism 24, the first X thrust generating mechanism 25, and the second X thrust generating mechanism 26. The driving reaction force in the XY direction and the half moment in the ωZ direction can be canceled by the driving of.

As described above, the driving reaction force and the half moment generated at the time of replacing the stages 18 and 19 can be canceled by the second reaction force canceling mechanism. In addition, you may cancel the drive reaction force and the reaction moment which generate | occur | produce at the time of replacing the stages 18 and 19 by both a 1st reaction mechanism and a 2nd reaction mechanism.

When canceling the drive reaction force and the anti-moment generated during the replacement of the stages 18 and 19 by the second reaction force canceling mechanism, the reaction force of the thrust acting on the surface plate 10 is interposed between the support mechanism 28 and the bottom surface. Exits and affects the reaction force to the outside of the positioning device 100. However, since the exposure process and the alignment process are not performed at the time of replacing the stage, the performance of the exposure apparatus is not adversely affected.

Second Embodiment

6 and 7 are diagrams showing a schematic configuration of a positioning device according to a second embodiment of the present invention. FIG. 6 is a plan view and FIG. 7 is a side view.

The positioning device 200 of the second embodiment arranges the exposure base 37 in the area of the "exposure side" where the projection optical system 5 performs the exposure processing of the wafer, and the alignment optical system 8 is arranged on the alignment optical system 8. By this, the alignment base 38 is arranged in the "alignment side" area where the wafer alignment process is performed. These surface plates 37 and 38 can be supported by a vibration suppression mechanism 11 such as an air mount, respectively. The vibration damping mechanism 11 suppresses the transmission of vibration between the floor and the surface plates 37 and 38 via the support 27.

As in the first embodiment, the stages 18 and 19 are lifted up by the air bearings on the respective surface plates 37 and 38. The stages 18 and 19 can move freely on the respective surface plates 37 and 38 by, for example, a planar motor stage mechanism of a planar pulse motor drive method or a planar Lorentz motor drive method.

In addition, similarly to the first embodiment, the positions of the stages 18 and 19 are measured in the entire area on the base plates 37 and 38 by means of bar mirrors arranged in the respective stages and interferometers mounted on predetermined measurement standards. It is possible.

In addition, the stages 18 and 19 may be connected with signal cables, power cables, pressure reducing lines, pressure air lines, refrigerant lines for adjusting the temperature of the heat source of the stage, and the like.

The positioning device 200 of the second embodiment includes the first reaction force canceling mechanism and the second reaction force described in the first embodiment in order to cancel the drive reaction force and the half moment generated by the driving of the stages 18 and 19. The offset mechanism is arranged in each of the surface plates 37 and 38.

In the exposure plate 37, as the first reaction force canceling mechanism, the X mass 12, the Y mass 13, the ω X rotor 24, the ω Y rotor 15, the ω Z rotor 16, and a driving mechanism for driving them are provided. At the same time, a first Y thrust generating mechanism 34, a second Y thrust generating mechanism 35, and an X thrust generating mechanism 36 are provided as the second reaction force canceling mechanism.

The alignment plate 38 is provided with the X mass 12, the Y mass 13, the ωX rotor 14, the ωY rotor 15, the ωZ rotor 16 and their driving mechanisms as the first reaction force canceling mechanism. As the second reaction force canceling mechanism, a first Y thrust generating mechanism 31, a second Y thrust generating mechanism 32, and an X thrust generating mechanism 33 are provided.

Similar to the first embodiment, in the first reaction force canceling mechanism disposed on each of the surface plates 37 and 38, in order to cancel the driving reaction force caused by the driving of the stages 18 and 19, the X mass 12 and the Y mass In order to translate (13) and offset the half moment by the drive of the stages 18 and 19, the ωX rotor 14, the ωY rotor 15, and the ωZ rotor 16 are rotationally driven.

In addition, in the second stage reaction force canceling mechanism arranged about each of the surface plates 37 and 38 as in the first embodiment, the drive reaction force caused by the driving of the stages 18 and 19 (the half moment generated by this) In order to offset the surface plate, the alignment plate (in the exposure plate 37) is formed by the first Y thrust generation mechanism 34, the second Y thrust generation mechanism 35, and the X thrust generation mechanism 36. In 38), the first Y thrust generating mechanism 31, the second Y thrust generating mechanism 32, and the X thrust generating mechanism 33 generate a thrust in the opposite direction to the driving reaction force and the half moment, thereby driving. Offset reaction forces and half moments.

In the exposure apparatus provided with the positioning apparatus 200 of the above structure, similarly to 1st Embodiment, the exposure process and alignment process in a semiconductor exposure procedure are performed in parallel. Exposure processing is performed on the wafer 1 on one stage by the projection optical system 5 in the area of "exposure side" on the left side in FIGS. 6 and 7, and within the area of "alignment side" on the right side. The alignment optical system 8 performs alignment processing on the wafer 1 on the other stage.

The exposure process and the alignment process are executed in parallel, and the stage 18 and the stage 19 are replaced at the end of each process. As a result, the stage where the wafer alignment process is completed is moved from the "alignment side" region to the "exposure side" region, and the exposure process is performed on the wafer on the stage. Moreover, the stage in which the exposure process of the wafer is completed moves from the area of the "exposure side" to the area of the "alignment side". At this time, the wafer is recovered by a wafer transfer system not shown from above the stage, and a new wafer is provided on the stage. By repeating this procedure, the wafer exposure process can be performed continuously.

In the exposure process, as in the first embodiment, the exposure driving range required for measuring the wafer 1 and the reference mark 20 and for exposing the wafer 1 (see FIG. 8; The stage may be driven within the driving range of the center part. Moreover, in the alignment process performed in parallel with the exposure process, in the alignment drive range (refer FIG. 8; the drive range of the center part of a stage is illustrated in FIG. 8) required for the alignment process of the wafer 1 (22). You can drive the stage at.

On the other hand, when the two stages 18 and 19 are replaced, the driving range at the time of replacing the stage which is wider than the respective ranges of the driving range 21 at the time of exposure and the driving range 22 at the alignment (see Fig. 8; It is necessary to move the stages 18 and 19 in the center 23 of the stage. This is to prevent the stages 18 and 19 from interfering with each other. For this reason, when the stages 18 and 19 are replaced, the parallel processing of the exposure process and the alignment process in which the stages 18 and 19 are driven within the driving range 21 during exposure and the driving range 22 during alignment is performed. Even large driving reaction occurs. In addition, when the stages 18 and 19 are replaced, since the stages 18 and 19 are driven in opposite directions to each other, the driving reaction force includes a large half moment in the ω Z direction (rotation of the Z axis center).

Thus, in the positioning device 200 of the second embodiment, the driving range 21 and the alignment plate 38 are exposed when the stages 18 and 19 are exposed on the exposure plate 37 in the same manner as the first embodiment. Is located within the driving range 22 at the time of alignment, that is, at the time of parallel execution between the exposure process and the alignment process, the stage 18 is disposed by the first reaction force canceling mechanism disposed on the respective surface plates 37 and 38. 19, the driving reaction force and the half moment associated with the driving of 19 are canceled in each of the surface plates 37 and 38.

In the parallel processing between the exposure process of the wafer and the alignment process of the wafer, the first reaction force canceling mechanism cancels the driving reaction force and the half moment associated with the driving of the stages 18 and 19, respectively. ), The driving reaction force in the X and Y translation directions and the half moments in the ωX, ωY and ωZ directions can be canceled. This eliminates the influence of reaction forces to the outside of the positioning device 200, thereby preventing vibration and deformation of the projection optical system 5 and the alignment optical system 8 and the like, thereby providing more accurate exposure and alignment processing. You can run

In the positioning device 200, as in the first embodiment, the stages 18 and 19 are driven by driving the surface plates 37 and 38 by the second reaction force canceling mechanism when the stages 18 and 19 are replaced. The driving reaction and the half moment that accompany the driving are canceled out. When the stages 18 and 19 are replaced, the drive reaction force in the X and Y translation directions accompanying the drive of the stages 18 and 19 and the half moment in the ω Z direction are canceled by the second reaction force canceling mechanism.

Here, when the stages 18 and 19 are replaced, the stage 18 and 19 have a larger driving reaction force (in particular, half moment in the ω Z direction) than when the driving range 21 is exposed and the driving range 22 is aligned. Is generated. By increasing the thrust generated by the first X thrust generating mechanism 25 and the second X thrust generating mechanism 26, the half moment in the ωZ direction of the surface plate 10 can be canceled. In addition, in the second reaction force canceling mechanism, the reaction force of the thrust acting on the surface plate 10 escapes to the bottom surface via the support mechanism 28, and affects the reaction force to the outside of the positioning device 100. Since the stages 18 and 19 do not perform the exposure process and the alignment process, they do not adversely affect the performance of the exposure apparatus.

Similarly to the first embodiment, when the stages 18 and 19 are replaced, the drive reaction force accompanying the driving of the stages 18 and 19 by means of the second reaction force canceling mechanism disposed on the respective surface plates 37 and 38. The half moment is canceled in each plate 37, 38. Accordingly, the first reaction force canceling mechanism disposed on each of the surface plates 37 and 38 includes the driving reaction force and reaction when the stages 18 and 19 move within the driving range 21 during exposure and the driving range 22 during alignment. It is sufficient that the moment can be canceled in the respective tables 37 and 38.

Therefore, each mass and each rotor of the first reaction force canceling mechanism is adapted to drive the driving reaction force and the anti-moment generated when the stages 18 and 19 drive within the driving range 21 during exposure and the driving range 22 during alignment. It is enough to have an offsetting load and stroke. On the other hand, unlike this embodiment, when the drive reaction force at the time of replacing the stages 18 and 19 by the X mass 12 and the Y mass 13 is to be canceled, the X mass 12 and the Y mass 13 are used. The stroke required for is longer.

It is sufficient that the ωZ rotor 16 has a load corresponding to the half moment generated during the driving of the stages 18 and 19 in the driving range 21 during exposure and the driving range 22 during alignment. On the other hand, unlike this embodiment, when the half-moments at the time of replacing the stages 18 and 19 are canceled by the ωZ rotor 16, the load required for the ωZ rotor 16 becomes larger.

8 and 9 are diagrams for explaining the offsetting operation of the drive reaction force (including the half moment generated by this) during parallel execution of the exposure process and the alignment process, FIG. 8 is a plan view, and FIG. Side view.

8 and 9, the stage 18 is used for the exposure operation of the wafer 1 in the driving range 21 during the exposure on the exposure plate 37, and the stage 19 is the alignment plate 38. It is used for the alignment operation | movement of the wafer 1 in the drive range 22 at the time of the above alignment. The stage 18 is accelerated in the stage acceleration direction 29 (in the -Y direction), and the stage 19 is accelerated in the stage acceleration direction (+ Y direction) 30.

When the stages 18 and 19 are provided for the exposure process of the wafer 1 and the alignment process of the wafer 1 on the base plates 37 and 38, the first reaction force disposed on the respective base plates 37 and 38. The reaction force is canceled by the offset mechanism.

Here, a method of canceling the driving reaction force and the anti-moment during the exposure treatment by the first reaction force canceling mechanism disposed on the exposure plate 37 and the alignment treatment by the first reaction force canceling mechanism disposed on the alignment plate 38 It is the same as the offset method of driving reaction force and half moment. Therefore, hereinafter, the driving reaction force and the half moment accompanying the driving of the stage when the exposure process is being performed on the wafer 1 on the stage within the exposure driving range 21 on the exposure plate 37 will be described. The offset operation will be described.

A method of canceling the drive reaction force acting on the exposure plate 37 by the first reaction force canceling mechanism when the stage 18 is accelerated in the driving range 21 during exposure on the exposure plate 37 will be described. The driving of the stage 18 exerts a driving reaction force F1 in the + Y direction with respect to the exposure plate 37. The Y mass 13 is translated in the Y direction so as to cancel this drive reaction force F1, thereby generating a mass reaction force -F acting on the exposure plate 37 in the opposite direction to the drive reaction force F1. In this example, since the mass reaction force is generated by the two Y masses 13, the sum of the mass reaction force -F generated by the two Y masses 13 and the driving reaction force F1 are balanced to produce an exposure surface. Offset reaction forces within (37).

Next, a method of canceling the half moment between the X axis center and the Z axis center acting on the exposure plate 37 when the stage 18 is accelerated by the first reaction force canceling mechanism will be described. The driving of the stage 18 exerts a driving reaction force F1 in the + Y direction with respect to the exposure plate 37. Since the acting point of the drive reaction force F1 does not coincide with the center of the exposure platen 37, the half plate moment of the X axis center and the half moment mlz1 of the z axis center are applied to the exposure plate 37 by the drive reaction force F1.

With respect to the moment of the Z axis, the half moment mlz1 in the ω Z direction is applied to the exposure plate 37 by the driving of the stage 18. In order to cancel the half moment in the ω Z direction acting on the exposure plate 37, the ω Z rotor 16 is rotated so that the rotor half moment -mlz acts in the opposite direction to the half moment mlz1 acting on the exposure plate 37. . This equilibrates the half moment mlz1 acting on the exposure plate 37 when the stage 18 is driven, and the rotor half moment -mlz acting on the exposure plate 37 when the ωZ rotor 16 is rotated. Thus, the moment force in the ωz direction in the exposure plate 37 is canceled out.

Regarding the moment of the X axis center, the half plate moment mlx1 in the ω X direction is applied to the exposure plate 37 by the driving of the stage 18. In order to cancel the half-moment force in the ωX direction acting on the exposure plate 37, the ωX rotor 14 is rotated so that the rotor half moment -mlx acts in the opposite direction to the half moment mlx1 acting on the exposure plate 37. Let's do it. Thereby, the half-moment mlx1 acting on the exposure platen 37 at the time of driving the stage 18 and the rotor half-moment -mlx acting on the exposure platen 37 at the time of rotation of the? The moment force in the ωX direction in the surface plate 37 is canceled out.

Here, the driving reaction force and reaction accompanying the driving of the stage 18 when the stage 18 is provided to the exposure process of the wafer 1 within the exposure range 21 during the exposure on the exposure plate 37. The operation of canceling the moment by the first reaction force canceling mechanism arranged on the exposure plate 37 has been described. Even when the stage 19 is provided for the alignment process of the wafer 1 within the drive range 22 during the alignment on the alignment plate 38, the stage 19 is driven in the same manner as described above. The accompanying drive reaction force and half moment can be canceled by the first reaction force mechanism disposed on the alignment base 38.

Here, although the case where each stage is accelerated in the opposite direction along the Y axis has been described, the case where each stage is accelerated in the same direction along the Y axis is similarly arranged in the Y mass 13 and the ω Z rotor ( 16), the drive reaction force and the half moment can be canceled by using the ωX rotor 14. Also, in the case where each stage is accelerated in the same direction or in the opposite direction along the X axis, the driving reaction force and the X mass 12, the ωZ rotor 16, and the ωY rotor 15 are similarly arranged on each surface plate. The half moment can be offset. Also, in the case where each stage is accelerated in synchronism in the X direction and the Y direction, the X mass 12, the Y mass 13, the ωZ rotor 16, and the ωY rotor 15 are similarly arranged on each surface plate. The driving reaction force and the half moment can be canceled by using the ωX rotor 14.

As described above, in the exposure processing of the wafer and the alignment of the wafer, each surface plate includes driving reaction force (including half moment generated by this) generated when each stage is driven in the X and Y directions. The reaction force can be canceled by using the first reaction force canceling mechanism disposed in the upper portion.

In addition, the first reaction force canceling mechanism disposed on each surface plate drives the reaction reaction force (including the half moment generated by this) caused by the driving of each stage when the exposure process and the alignment process are performed in parallel. By canceling, the influence of the reaction force to the outside of the positioning device is eliminated. This eliminates the influence of vibration and deformation of the projection optical system and the alignment optical system, and can perform exposure processing and alignment processing with higher accuracy.

In addition, since the exposure plate 37 and the alignment plate 38 are disposed separately, the driving reaction force and half moment of the stage provided for the exposure processing of the wafer and the stage driving reaction force and half moment provided for the alignment process of the wafer are provided. Does not interfere with each other, so that exposure processing and alignment processing with higher accuracy can be executed.

Further, the first reaction force canceling mechanism disposed on each surface plate is provided on each surface plate when the exposure process of the wafer and the alignment process of the wafer are performed within the drive range 21 during exposure and the drive range 22 during alignment. It is necessary to have a load and a stroke that can counteract the acting reaction force (including the half moment generated by this). Therefore, the stroke of the X mass 12 and the Y mass 13 can be shortened and the load of the ω Z rotor 16 can be made smaller than in the first embodiment, so that the first reaction force canceling mechanism can be reduced in size and weight. have.

FIG. 10 is a diagram for explaining the operation of canceling the driving reaction force and the half moment when the two stages are replaced.

In FIG. 10, stage 18 and stage 19 are replaced. The stage 18 is accelerated in the stage acceleration direction (-Y direction) 29 and the stage 2 is accelerated in the stage acceleration direction (+ Y direction) 30.

In order to prevent the stages 18 and 19 from interfering with each other when the stages 18 and 19 are replaced, the stages 18 and 19 have a range not exceeding the center position of the driving range 23 when the stages are replaced. The drive range 21 moves to the outside of the drive range 22 during alignment. Therefore, a greater ωZ direction is generated during the exposure and alignment processing, that is, when the stages 18 and 19 are driven within the driving range 21 during exposure and the driving range 22 during alignment. Thus, when the stages 18 and 19 are replaced, the driving reaction force is canceled by the second reaction force canceling mechanism.

In the replacement of the stage, the method of canceling the driving reaction force and the half moment accompanying the driving of the stage by the second reaction force canceling mechanism disposed on the exposure plate 37 is the second reaction force offset disposed on the alignment plate 38. It is the same as the method of canceling the drive reaction force and the half moment accompanying the drive of a stage by a mechanism. So, below, the method of canceling the drive reaction force and half moment accompanying drive of a stage by the 2nd reaction force canceling mechanism arrange | positioned at the exposure surface plate 37 is demonstrated.

In the replacement of the stage, the drive reaction force acting on the exposure plate 37 when the stage 18 is accelerated is canceled by the second reaction force canceling mechanism disposed on the exposure plate 37. The stage 18 applies the drive reaction force F1 in the + Y direction to the exposure platen 37. The first Y thrust generating mechanism 34 and the second Y thrust generating mechanism 35 apply the thrust opposite to the driving reaction force F1 to the exposure plate 37 so as to cancel the driving reaction force F1. Thereby, the force acting on the exposure surface plate 37 becomes a balance relationship, and the drive reaction force which acts on the exposure surface plate 37 can be canceled by the 2nd reaction force canceling mechanism.

Next, a method of canceling the half moment of the Z axis center acting on the exposure plate 37 when the stage 18 is accelerated by the second reaction force canceling mechanism will be described. The stage 18 applies the drive reaction force F1 in the + Y direction to the exposure platen 37. Since the operating point of the driving reaction force F1 does not coincide with the center of the exposure base 37, the half moment mlz1 'in the ω Z direction is applied to the exposure base 37 by the driving reaction force F1. Here, since the stages 18 and 19 are isolated in the X direction so that the stages 18 and 19 do not interfere with each other when the stages are replaced, the stages 18 and 19 are driven in the normal exposure range 21 and in the alignment range 22. The larger the moment moment force in the ωZ direction than in the case of driving in the cross-section. In order to cancel this half-moment in the ω Z direction, the first Y thrust generating mechanism 34 applies the thrust FX1 in the + Y direction to the exposure plate 37, and the second Y thrust generating mechanism 35 Thrust FX2 in the -Y direction is applied to the exposure plate 37. As a result, a thrust moment equivalent to the half moment mlz1 'generated by the driving of the stage 18 in the opposite direction is applied to the exposure plate 37. The thrust moment generated by the first Y thrust generating mechanism 34 and the second Y thrust generating mechanism 35 and the half moment mlz1 'generated by the driving of the stage 18 are in a balance relationship. The half moment in the ω Z direction acting on the exposure plate 37 can be canceled by the second reaction force canceling mechanism.

In the positioning device 200 of this embodiment, when the stages 18 and 19 are replaced, the half moment is also generated in the ωX direction by the drive of the stage 18, but the magnitude of the half moment in the ωX direction. Is equal to the half moment in the ω X direction generated when the stage 18 is driven within the driving range 21 during exposure during the parallel execution of the exposure process and the alignment process. This is because the distance between the center position of the stage 18 and the center position of the exposure plate 37 is the same at the time of driving in the driving range 21 at the time of exposure and at the time of replacing the stage. For this reason, the half-moment in the ωX direction generated by the driving of the stage 18 rotates the ωX rotor 14, which is the first reaction force canceling mechanism, as in the case of performing the wafer exposure process and the wafer alignment process. It can cancel by driving. However, when the stage is replaced, a thrust generating mechanism (actuator) for canceling the half moment in the ω X direction acting on the exposure platen 37 may be separately provided as part of the second reaction force canceling mechanism.

Here, when the stage is replaced, the stage at the time of moving the stage 18 on the alignment plate 38 from the exposure plate 37 in the driving range 23 during the stage replacement on the exposure plate 37 ( An operation of canceling the driving reaction force and the half moment accompanying the driving of 18) by the second reaction force canceling mechanism arranged on the exposure plate 37 has been described. The alignment plate 38 is also about the drive reaction force and the half moment accompanying the drive of the stage 19 on the alignment plate 38 when the stage 19 is moved from the alignment plate 38 to the exposure plate 37. Can be canceled by the second reaction force canceling mechanism arranged in

In addition, although the case where each stage accelerated in the opposite direction along the Y-axis was demonstrated here as an example, even when the stages 18 and 19 are driven in any direction, when each stage is replaced, each The thrust generating mechanism arranged on the surface plate exerts a thrust force on each surface plate, so that the driving reaction force in the XY direction and the half moment in the ω Z direction generated by the driving of each stage can be canceled.

As mentioned above, the drive reaction force and the half moment which generate | occur | produce with respect to each surface plate at the time of replacing the stages 18 and 19 can be canceled by the 2nd reaction force canceling mechanism arrange | positioned at each surface plate. Moreover, you may cancel by both the 1st reaction force mechanism arrange | positioned at each surface plate, and the 2nd reaction force mechanism arrange | positioned at each surface plate.

When canceling the drive reaction force and the anti-moment generated during the replacement of the stages 18 and 19 by the second reaction force canceling mechanism, the reaction force of the thrust acting on the surface plates 37 and 38 via the support mechanism 28. Exit to the bottom surface, and affects the reaction force to the outside of the positioning device (100). However, since the exposure process and the alignment process are not performed at the time of replacing the stage, the performance of the exposure apparatus is not adversely affected.

[Third Embodiment]

11 and 12 are diagrams showing a schematic configuration of a positioning device of a third embodiment of the present invention, FIG. 11 is a plan view, and FIG. 12 is a side view.

In the positioning device 300 of the third embodiment, the first reaction force canceling mechanism is the same as in the second embodiment, and the X mass 12, the Y mass 13, the ω X rotor 14, and the ω Y rotor (15), the ωZ rotor 16 is disposed on both of the exposure plate 37 and the alignment plate 38.

The positioning device 300 of the third embodiment includes a surface coupling mechanism 39 for coupling the exposure surface 37 and the alignment surface 38. The second reaction force canceling mechanism includes a Y thrust generating mechanism 24, a first X thrust generating mechanism 25, and a second X thrust generating mechanism 26, and the second reaction force canceling mechanism includes a surface plate coupling mechanism 39 Y thrust generating mechanism 24, first in order to cancel the driving reaction force and the half moment caused by the driving of the stages 18 and 19 in the state where the exposure plate 37 and the alignment plate 38 are coupled to each other. The X thrust generation mechanism 25 and the second X thrust generation mechanism 26 are applied to the surface plates 37 and 38 in which the thrust opposite to the driving reaction force and the half moment are combined.

The surface plate coupling mechanism 39 for coupling the exposure plate 37 and the alignment plate 38 has various methods, for example, a method using an electron attraction force of an electronic chuck, a method using a vacuum adsorption force, a method using an electrostatic adsorption force, It may be configured in a manner using a mechanical clamp mechanism.

It is preferable to arrange the positioning mechanism for positioning them in the six-axis direction on the exposure plate 37 and the alignment plate 38. In this case, when the exposure base 37 and the alignment base 38 are coupled by the surface coupling mechanism 39, the stage moving surface of the exposure base 37 and the stage moving surface of the alignment base 38 coincide with each other. The surface plate 37 and 38 can be coupled by the surface plate coupling mechanism 39, and the replacement operation of the stages 18 and 19 can be performed smoothly.

As a mechanism for positioning the surface plates 37 and 38, respectively, for example, a method of forming a kinematic coupling on each surface plate and positioning at the time of joining the surface plate, forming an inclined surface on the mating surface of each surface plate There are methods for positioning in the state of being fitted at the time of coupling of the surface plate, but any positioning mechanism that performs positioning in the 6-axis direction of each surface plate can be used.

In the positioning device 300 of the third embodiment, as in the second embodiment, the respective stages 18 and 19 are driven at the exposure range 21 on the base plates 37 and 38 and driven at alignment. When driven within the range 22 and the exposure process and the alignment process are being performed, the drive reaction force accompanying the drive of the stages 18 and 19 by the first reaction force canceling mechanism disposed on the surface plates 37 and 38 and The half moment is canceled in each plate 37, 38. In addition, when the stages 18 and 19 are driven and replaced in the drive range 23 during stage replacement, the drive reaction forces and the half moments accompanying the drive of the stages 18 and 19 are canceled out by the second reaction force canceling mechanism. .

By the first reaction force canceling mechanism in the third embodiment, the operation of canceling the driving reaction force and the half moment accompanying the driving of the stages 18 and 19 in parallel execution of the exposure process and the alignment process is performed. It is the same as that of 2nd Embodiment. That is, in parallel execution of the exposure process and the alignment process, the driving reaction force and the half moment generated when the stages 18 and 19 are driven by using the first reaction force canceling mechanism arranged on the respective surface plates 37 and 38. Can be offset.

It is a figure explaining the canceling operation of the drive reaction force and the half moment at the time of replacing two stages.

In FIG. 13, stage 18 and stage 19 are replaced. The stage 18 is accelerated in the stage acceleration direction (-Y direction) 29, and the stage 19 is accelerated in the stage acceleration direction (+ Y direction) 30.

When the stages 18 and 19 are replaced, the stages 18 and 19 do not exceed the center position of the drive range 23 when the stage is replaced, the drive range 21 when exposed and the drive range 22 when aligned. Move to the outside of). Therefore, a greater ωZ direction is generated during the exposure and alignment processing, that is, when the stages 18 and 19 are driven within the driving range 21 during exposure and the driving range 22 during alignment. Thus, when the stages 18 and 19 are replaced, the driving reaction force is canceled by the second reaction force canceling mechanism.

When the exposure process of the wafer and the alignment process of the wafer are finished on each of the surfaces, the exposure surface 37 and the alignment surface 38 are coupled by the surface coupling mechanism 39. Next, the operation of replacing the stages 18 and 19 is performed. At this time, in FIG. 13, the stage 18 is accelerated in the stage acceleration direction (-Y direction) 29, and the stage 19 is accelerated in the stage acceleration direction (+ Y direction) 30. The stage 18 applies the drive reaction force F1 in the + Y direction with respect to the exposure plate 37, and the stage 19 applies the drive reaction force F2 in the -Y direction with respect to the alignment plate 38. At this time, since the exposure surface 37 and the alignment surface 38 are coupled by the surface coupling mechanism 39, the exposure surface 37 and the alignment surface 38 can be regarded as one surface surface. In this example, the driving reaction force F1 and the driving reaction force F2 are forces acting in the reverse direction with the same magnitude, so that the driving reaction force F1 and the driving reaction force F2 cancel each other in the combined surface plate, and the combined surface plates 37 and 38 respectively have a respective force. The driving reaction force due to the driving of the stages 18 and 19 does not work.

In addition, when the force of the driving reaction force F1 and the driving reaction force F2 is not 0, the driving reaction force force F1 + F2 is applied to the combined surface plates 37 and 38 in the translational direction of the Y direction. The force acting on the combined surface plates 37 and 38 by the Y thrust generating mechanism 24 is applied to the surface plates 37 and 38 in the opposite direction to the driving reaction force F1 + F2, and the force acting on the combined surface plates 37 and 38 is in a balance relationship. The driving reaction force acting on the combined surface plates 37 and 38 can be canceled by the second reaction force canceling mechanism.

Next, a method of canceling by the second reaction force canceling mechanism the half moment of the Z axis center acting on the combined plates 37 and 38 when the stages 18 and 19 are accelerated. The stage 18 applies the drive reaction force F1 in the + Y direction with respect to the exposure plate 37, and the stage 19 applies the drive reaction force F2 in the -Y direction with respect to the alignment plate 38. Since the acting points of the driving reaction force F1 of the stage 18 and the driving reaction force F2 of the stage 19 do not coincide with the centers of the combined base plates 37 and 38, the surface plate 37 and 38 coupled by the driving reaction force F1 are combined. The half moment mlz1 'at the center of the Z axis is applied, and the half moment mlz2' at the center of the Z axis is applied to the combined plates 37 and 38 by the driving reaction force F2. By driving the stage 18 and the stage 19, the combined half plates 37 and 38 act on the combined half moments mlz1 'and half moments mlz2'. Here, since the stages 18 and 19 are isolated in the X direction so that the stages 18 and 19 do not interfere with each other when the stages are replaced, the stages 18 and 19 are driven in the normal exposure range 21 and in the alignment range 22. The larger the moment moment force in the ωZ direction than in the case of driving in the cross-section. In order to cancel the half-moment force in the ω Z direction acting on the combined plates 37 and 38, the first X thrust generating mechanism 25 transfers the thrust FX1 in the -X direction to the combined plates 37 and 38. The second X thrust generating mechanism 26 applies the thrust FX2 in the + X direction to the combined plates 37 and 38. Thereby, it acts on the surface plates 37 and 38 to which the thrust moment equivalent to the half moment combined with the half moment mlz1 'and the half moment mlz2' which generate | occur | produce by the drive of the stages 18 and 19 were combined in the opposite direction. The half moment mlz1 'and the half moment mlz2 generated by the driving of the respective stages 18 and 19 by the thrust moment generated in the first X thrust generating mechanism 25 and the second X thrust generating mechanism 26. The combined half moments are in a balanced relationship, and the second reaction force canceling mechanism can cancel the half moments in the ω Z direction acting on the combined plates 37 and 38.

In the positioning device 300 of this embodiment, when the stages 18 and 19 are replaced, the half moment is generated in the ωX direction by the driving of the stages 18 and 19, but the half moment in the ωX direction is generated. The magnitude of is equal to the half moment in the ω X direction generated when the stage 18 is driven within the driving range 21 during exposure during the parallel execution of the exposure process and the alignment process. The reason for this is that the distance from the center position of the surface plates 37 and 38 combined with the respective center positions of the stages 17 and 18 is different from that in the driving range 21 during exposure and the driving range 22 during alignment. This is because it is the same when the stage is replaced. For this reason, the half-moment in the ω-X direction generated by the driving of the stages 18 and 19 is the ωX rotor 14 serving as the first reaction force canceling mechanism as in the case of performing exposure processing and wafer alignment processing of the wafer. It can cancel by rotating driving. However, when the stage is replaced, a thrust generating mechanism (actuator) for canceling the half moment in the ω X direction acting on the combined platen 37 and 38 may be separately provided as part of the second reaction force canceling mechanism.

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Here, the case where the stages 18 and 19 are accelerated in the opposite direction along the Y axis has been described as an example. However, in the replacement operation of the stages 18 and 19, the stages 18 and 19 are driven in a certain direction. Even in this case, the thrust generating mechanism 24, the first X thrust generating mechanism 25, and the second X thrust generating mechanism 26 exert a thrust on the combined base plates 37 and 38, thereby providing a stage. The driving reaction force in the XY direction and the half moment in the ωZ direction can be canceled by the driving of (18, 19).

As described above, the driving reaction force and the half moment generated at the time of replacing the stages 18 and 19 can be canceled by the second reaction force canceling mechanism. In addition, you may cancel the drive reaction force and the reaction moment which generate | occur | produce at the time of replacing the stages 18 and 19 by both a 1st reaction mechanism and a 2nd reaction mechanism.

When canceling the drive reaction force and the anti-moment generated during the replacement of the stages 18 and 19 by the second reaction force canceling mechanism, the reaction force of the thrust acting on the surface plate 10 is interposed between the support mechanism 28 and the bottom surface. Exits and exerts a reaction force on the outside of the positioning device 100. However, since the exposure process and the alignment process are not executed at the time of replacing the stage, the performance of the exposure apparatus is not adversely affected.

[Modification]

In the first to third embodiments, a planar motor having degrees of freedom in the XY direction has been described. However, even if this is replaced by an XY stage device in which a single degree of freedom stage device using a linear motor and a ball screw as a driving source is superposed. do. Moreover, the structure which arrange | positions the XY stage apparatus which superimposed the stage apparatus of 1 degree of freedom on the exposure side, and the alignment side, respectively, and each XY stage apparatus changes each stage may implement | achieve a stage replacement. Also in the above structure, the same effect as the positioning apparatus in 1st-3rd embodiment can be acquired.

In each of the first to third embodiments, although each surface plate is configured on the air mount, an air bearing is formed on each surface plate, and each surface plate floats on the stage support by the air bearing so that it can operate freely. do. Also in the structure which supports each surface plate through an air bearing, the effect similar to 1st-3rd embodiment can be acquired. Here, an air bearing is an example of the mechanism which supports a surface plate so that a movement can be carried out by non-contact, You may employ | adopt another non-contact support mechanism instead of an air bearing.

In the first to third embodiments, the first reaction force canceling mechanism cancels the driving reaction force and the half moment accompanying the driving of each stage by the first reaction force canceling mechanism in parallel execution of the wafer exposure process and the wafer alignment process. When not performing the alignment process, the second reaction force canceling mechanism (or the first and second reaction force canceling mechanisms) cancels the driving reaction force and the half moment accompanying the driving of each stage.

In this case, two reaction force canceling mechanisms can be switched on the basis of a command such as an exposure command and an alignment command. When each stage is driven within the driving range during exposure and the driving range during alignment, the first reaction force canceling mechanism cancels the driving reaction force and half moment accompanying the driving of each stage, Is driven outside the driving range at the time of exposure and the driving range at the time of alignment, the driving reaction force and the half moment accompanying the driving of each stage by the second reaction force canceling mechanism (or the first and second reaction force canceling mechanisms). The same effect can be obtained even if it cancels out. In this case, the drive range at the time of exposure and the drive range at the time of alignment are determined beforehand, and the two reaction force canceling mechanisms can be switched depending on whether the measurement result of the stage position is within the drive range or outside the drive range.

In this manner, the first reaction force canceling mechanism and the second reaction force canceling mechanism may be used separately according to the operation contents of each stage, and the first reaction force canceling mechanism and the second reaction force canceling according to the area where the operation of each stage is performed. You may use the apparatus separately.

In the first to third embodiments, the second reaction force canceling mechanism (or the first and second reaction force) is performed when each stage is replaced so that each stage passes outside the driving range during exposure and the driving range during alignment. Offset mechanism) cancels the drive reaction force and the half moment accompanying the drive of each stage. However, offsetting of the drive reaction force by the second reaction force canceling mechanism can be performed in conjunction with various stage driving when the exposure process and the alignment process are not executed. The offset of the driving reaction force by the second reaction force canceling mechanism may be performed, for example, in conjunction with driving of the stage required when collecting an object such as a wafer from the stage, or supplying an object such as a wafer to the stage.

[Configuration example of exposure apparatus]

Fig. 14 shows a positioning device represented by the positioning devices 100, 200 and 300 described as the first to third embodiments as a twin stage type wafer stage device (substrate stage device) 430. It is a figure which shows schematically the structural example of an exposure apparatus.

The exposure apparatus 500 includes, for example, a disc holding portion 420 holding a disc R, an illumination system 410 for illuminating the disc R, a projection optical system 5 for projecting a pattern of the disc R, and an alignment process. An alignment optical system 8 and a wafer stage apparatus 430 are provided. The exposure apparatus 500 can form the latent image pattern on the photosensitive agent on the wafer continuously while performing the exposure process and the alignment process in parallel using the two stages 18 and 19.

[Device manufacturing method]

Next, a manufacturing process of a semiconductor device using the above exposure apparatus will be described. 15 is a diagram showing the flow of the overall manufacturing process of the semiconductor device. In step 1 (circuit design), the circuit design of the semiconductor device is performed. In step 2 (mask fabrication), a mask is fabricated based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and the actual circuit is formed on the wafer by lithography using the above mask and wafer. The following step 5 (assembly) is called a post-process, and is a step of semiconductor chip formation using the wafer produced in step 4, and includes an assembly step such as an assembly step (dicing and bonding) and a packaging step (chip sealing). do. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device fabricated in step 5 are performed. Through this process, the semiconductor device is completed and shipped (step 7).

16 is a diagram showing the detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern is transferred to the wafer by the above exposure apparatus. In step 17 (development), the exposed wafer is developed. In step 18 (etching), portions other than the developed resist image are deleted. In step 19 (resist stripping), the unnecessary resist is removed after etching. By repeating these steps, a circuit pattern is formed multiplely on a wafer.

According to the present invention, it is possible to provide a reaction force canceling technique which is very suitable for suppressing the increase in size and deterioration of precision of a positioning device having two stages.

Claims (18)

Surface plate; First and second stages driven on the surface plate; A first reaction force canceling mechanism including a driving mechanism for driving the movable part in a direction to cancel the reaction force generated by the driving of the first and second stages; And And a second reaction force canceling mechanism including a thrust generating mechanism for generating a thrust in a direction to cancel reaction force accompanying driving of the first and second stages, The first reaction force canceling mechanism is operated among the first and second reaction force canceling mechanisms when the first and second stages are being driven for the exposure process and the alignment process. At least the second reaction force canceling mechanism of the first and second reaction force canceling mechanisms is operated when the first and second stages are being driven for the replacement of the first and second stages. . delete The method of claim 1, And the exposure process and the alignment process are performed in parallel. The method of claim 1, And the first reaction force canceling mechanism is disposed inside the surface plate, and the second reaction force canceling mechanism is disposed outside the surface plate to drive the surface plate. The method of claim 1, The movable portion includes first and second movable portions, and the drive mechanism drives the first movable portion in the translational direction in a direction that cancels the reaction force in the translational direction generated with the driving of the first and second stages. And a second mechanism for rotating the second movable portion in a direction to cancel a moment generated as a reaction with the drive of the first and second stages. The method of claim 1, The movable part is generated as a reaction with at least one translation moving part moving in a direction that cancels the reaction force in the translational direction generated with the driving of the first and second stages, and with the driving of the first and second stages. And at least three rotary movable parts for rotating in a direction to cancel the moment. The method of claim 1, The thrust generating mechanism includes a first mechanism for generating a thrust on the surface plate in a direction that cancels the reaction force in the translational direction generated with the driving of the first and second stages, and the driving of the first and second stages. And a second mechanism for generating a thrust on the surface plate in a direction to cancel the moment generated as a reaction. The method of claim 1, The thrust generating mechanism is provided on the surface plate in a direction that cancels the reaction force in the translational direction generated with the driving of the first and second stages and the moment generated by the reaction with the driving of the first and second stages. And at least three thrust generating portions for generating a thrust force. The method of claim 8, An exposure apparatus according to claim 1, wherein the first thrust generating portion is disposed on the first side surface of the surface plate, and the second thrust generating portion is disposed on the second side surface of the surface plate orthogonal to the first side surface. The method of claim 1, In the exposure process and the alignment process, the first stage and the second stage are driven in the first region 21 and the second region 22, and in the replacement process, the first and second stages are An exposure apparatus characterized by being driven in a third region (23) wider than the first and second regions. The method of claim 1, The exposure process and the alignment process are performed such that the rotational direction of the moment generated as a reaction with the driving of the first stage is different from the rotational direction of the moment generated as the reaction with the driving of the second stage. Exposure apparatus. The method of claim 1, The exposure process and the alignment process are performed such that the sum of the moment generated as a reaction with the driving of the first stage and the moment generated as the reaction with the driving of the second stage is equal to or less than a predetermined value. Exposure apparatus. The method of claim 1, The surface plate includes a first surface plate supporting one side of the first and second stages and a second surface plate supporting the other side of the first and second stages in the exposure process and the alignment process. An exposure apparatus characterized by the above-mentioned. The method of claim 13, And a coupling mechanism for coupling the first surface plate and the second surface plate in the replacement process and releasing the coupling between the first surface plate and the second surface plate in the exposure process and the alignment process. An exposure apparatus, characterized in that. delete delete delete Forming a latent image pattern on the photosensitive agent of the substrate coated with the photosensitive agent by the exposure apparatus according to claim 1; And Developing the photosensitive agent Device manufacturing method comprising a.

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