KR100684500B1 - A solder ball attach plate using mems tech and making method therefore - Google Patents

Abstract

A method for manufacturing a solder ball attach plate using a MEMS technology for use in semiconductor device manufacture equipment and the solder ball attach plate are provided to reduce the size and to improve the accuracy of the solder ball attach plate by simultaneously forming through-holes by wet-etching. First and second materials(20,30) are cleaned. A thin films(22,32) for etch protection are formed on upper and lower surfaces of the first and the second materials. A photoresist is applied on the thin films to form etch layers(23,33). An exposing process is performed by using masks having different shapes and the etch layers are developed to form patterns of the masks. A dry etching performed on the exposed thin films. A wet etching process is performed on the exposed first and second materials to form through-holes. The first material is laminated on the second materials to be polished.

Description

A method of manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology and a solder ball attach plate using MEMS tech and making method therefore}

1 to 22 are cross-sectional views illustrating a method for manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology and a ball solder attach plate according to the present invention.

Explanation of symbols on the main parts of the drawings

10: ball solder attach plate 20: first material (plate)

30: second material (plate) 21, 31: through hole

22, 32: thin film for etching mask 23, 33: photo etching layer

24, 34: mask

The present invention relates to a method for manufacturing a ball lead attach plate for a semiconductor device manufacturing facility using MEMS technology and to a ball lead attach plate thereof, and more particularly, to a microminiature and ultra precision that cannot be manufactured by mechanical processing using MEMS technology. Manufacture of semiconductor devices using MEMS technology that enables mounting of solders with required integration on the substrate for manufacturing highly integrated semiconductor devices by manufacturing high-performance ball solder attachment plates The present invention relates to a method for producing a ball solder attachment plate for equipment and a ball lead attachment plate.

In general, a conventional ball solder attach plate is a key component of a ball solder attach tool for performing a solder attachment process in a semiconductor manufacturing process. It has a vertically penetrating pin hole, and is mounted on the lower surface of the ball lead attach tool, the eject pin is assembled to the pin hole to operate up and down, so that the eject pin in the state where the ball lead is accommodated in the ball accommodating part. Ejecting and attaching the solder lead on a substrate for manufacturing a semiconductor device, such a conventional solder lead plate was manufactured by precision machining.

However, in the conventional method of manufacturing a ball solder attach plate as described above, as a semiconductor device is gradually developed into a high integration, the solder lead attach plate must be further miniaturized and refined to manufacture such a semiconductor device. There was a problem in that it is not possible to manufacture a ball lead attach plate to have the required size and precision.

The present invention has been made in view of the conventional problems as described above, the object of the present invention is that by using MEMS technology to produce a ball-bolt attach plate with excellent performance while having a very small and ultra-precision that can not be produced by mechanical processing In addition, the present invention provides a method for manufacturing a ball solder attachment plate for a semiconductor device manufacturing facility using MEMS technology, which can mount a lead solder to a required integration level on a substrate for manufacturing a semiconductor device that is becoming highly integrated.

In addition, another object of the present invention is to provide a ball solder attach plate manufactured according to the manufacturing method of the present invention.

The object of the present invention is to clean the first and second materials; Forming a thin film for etching protection on upper and lower surfaces of each material; Forming a photolithography layer by coating a photosensitive material on the etch protection thin film; Performing an exposure process using a mask having a pattern having a different shape, and developing to form a pattern of the mask on the photolithography layer; Performing dry etching on the etch protection thin film exposed by the pattern formation of the photolithography layer; Forming a through hole by performing a wet etching process on the first material and the second material exposed by dry etching; Stacking and bonding the first material on the second material such that the centerline of the through hole formed by the wet etching process is located on one axis; It can be achieved by the manufacturing method of the ball solder attachment plate for semiconductor device manufacturing equipment using the MEMS technique, characterized in that the step of horizontally polishing the upper surface of the first material so that the laminated material has the required thickness. .

It is also an object of the present invention to clean the first and second materials; Forming a thin film for etching protection on upper and lower surfaces of each material; Forming a photolithography layer by coating a photosensitive material on each of the etch protection thin films; Performing an exposure process using a mask having a pattern having a different shape, and developing to form a pattern of the mask on each of the photographic layers; Performing dry etching on each of the etch protective thin films exposed by the patterning of each photolithography layer; Forming a through hole by performing a wet etching process on upper and lower surfaces of the first material and the second material exposed by dry etching; Stacking and bonding the first material on the second material such that the centerline of the through hole formed by the wet etching process is located on one axis; It can be achieved by the manufacturing method of the ball solder attachment plate for semiconductor device manufacturing equipment using the MEMS technique, characterized in that the step of horizontally polishing the upper surface of the first material so that the laminated material has the required thickness. .

Another object of the present invention is a first plate formed with a plurality of through holes are formed in the desired pattern with the required spacing and diameter; A semiconductor having a plurality of through holes formed in a desired pattern with a required spacing and diameter, and composed of a second plate laminated and bonded on the first plate so that the center line of the through holes is located on one axis; It can be achieved by a ball lead attach plate for device manufacturing equipment.

Hereinafter, a method of manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology and a ball solder attach plate thereof will be described in detail with reference to the accompanying drawings.

1 to 22 are cross-sectional views illustrating a method of manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology and a ball solder attach plate according to the present invention.

1 to 22, an embodiment of a method of manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology according to the present invention may include washing the first and second materials 20 and 30. Wow; Forming etch protection thin films (22) (32) on the upper and lower surfaces of each material (20) (30); Forming a photo etching layer (23, 33) by applying a photosensitive material on the etch protection thin film (22) (32); Performing an exposure process using masks 24 and 34 having patterns having different shapes, and developing them to form patterns of the masks 24 and 34 on the photoetch layers 23 and 33; ; Performing dry etching on the etch protective thin films 22 and 32 exposed by the pattern formation of the photo etching layers 23 and 33; Forming a through hole (21) (31) by performing a wet etching process on the first material (20) and the second material (30) exposed by dry etching; Stacking and bonding the first material 20 on the second material 30 so that the center line of the through holes 21 and 31 formed by the wet etching process is positioned on one axis; And grinding the upper surface of the first material 20 horizontally so that the laminated material has the required thickness.

Here, the through hole 21 of the first material 20 is formed smaller in diameter than the through hole 31 of the second material 30.

Such a manufacturing method forms the through holes 21 and 31 for the first and second materials 20 and 30 by wet etching only on the upper surfaces of the first and second materials 20 and 30. The formation of the through holes 21 and 31 may be somewhat slow.

In addition, another embodiment of the manufacturing method of the ball solder attachment plate for semiconductor device manufacturing equipment using MEMS technology according to the present invention comprises the steps of washing the first and second materials (20) (30); Forming etch protection thin films (22) (32) on the upper and lower surfaces of each material (20) (30); Forming photo etch layers (23) (33) by coating a photosensitive material on each of the etch protection thin films (22) (32); An exposure process is performed using masks 24 and 34 having patterns having different shapes, and developed to form patterns of the masks 24 and 34 on the respective photoetch layers 23 and 33. Steps; Performing dry etching on each of the etch protective films 22 and 32 exposed by the patterning of each of the photo etching layers 23 and 33; Forming a through hole (21) (31) by performing a wet etching process on the upper and lower surfaces of the first material (20) and the second material (30) exposed by dry etching; Stacking and bonding the first material 20 on the second material 30 so that the center line of the through holes 21 and 31 formed by the wet etching process is positioned on one axis; And grinding the upper surface of the first material 20 horizontally so that the laminated material has the required thickness.

Here, the through hole 21 of the first material 20 is formed smaller in diameter than the through hole 31 of the second material.

This manufacturing method is a wet etching process at the same time the upper surface and the lower surface of the first and second materials 20, 30 through the through holes 21, 31 for the first and second materials 20, 30, Since the formation of the through-holes 21 and 31 is faster than that of the manufacturing method of the above-described embodiment.

The ball lead attach plate 10 for a semiconductor device manufacturing facility using MEMS technology according to the present invention has a first gap having a plurality of through holes 21 and 31 formed therethrough in a required pattern with a required spacing and diameter. Plate 20; The first plate 20 has a plurality of through holes 21 and 31 formed in a desired pattern with a required spacing and diameter, and the center line of the through holes 21 and 31 is located on one axis. It consists of a second plate 30 laminated and bonded to.

Here, the through hole 21 of the first plate 20 is smaller than the diameter of the through hole 31 of the second plate 30, and the thickness of the second plate 30 is the first plate 20. Thinner than the thickness of.

The first substrate (plate) 20 is a pin hole in which the eject pin is assembled to be operated up and down, and the second substrate (plate) 30 is a ball accommodating portion in which ball solder is accommodated.

Method of manufacturing a ball solder attach plate for semiconductor device manufacturing equipment using the MEMS technology according to the present invention having the above configuration has a high density, high precision ball solder attach plate that can be manufactured by precision machining, MEMS technology By making it inexpensive to use, a highly integrated semiconductor device can be manufactured at a low manufacturing cost.

Method of manufacturing a ball solder attach plate for semiconductor device manufacturing equipment using MEMS technology having the above-described configuration and the ball solder attach plate are extremely small and ultra precision that cannot be manufactured by mechanical processing using MEMS technology. By making it possible to manufacture a high performance ball lead attach plate, it has the effect of mounting the lead solder to the required integration of the required size solder on the substrate for manufacturing a semiconductor device to be highly integrated.

Claims (6)

Washing the first and second materials (20) (30); Forming etch protection thin films (22) (32) on the upper and lower surfaces of each material (20) (30); Forming a photo etching layer (23, 33) by applying a photosensitive material on the etch protection thin film (22) (32); Performing an exposure process using masks 24 and 34 having patterns having different shapes, and developing them to form patterns of the masks 24 and 34 on the photoetch layers 23 and 33; ; Performing dry etching on the etch protective thin films 22 and 32 exposed by the pattern formation of the photo etching layers 23 and 33; Forming a through hole (21) (31) by performing a wet etching process on the first material (20) and the second material (30) exposed by dry etching; Stacking and bonding the first material 20 on the second material 30 so that the center line of the through holes 21 and 31 formed by the wet etching process is positioned on one axis; A method of manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology, comprising the step of horizontally polishing the upper surface of the first material (20) so that the laminated material has the required thickness. 2. The ball solder attach plate for a semiconductor device manufacturing facility using MEMS technique according to claim 1, wherein the through holes 21 and 31 of the first and second materials 20 and 30 have different diameters. Manufacturing method. Washing the first and second materials (20) (30); Forming etch protection thin films (22) (32) on the upper and lower surfaces of each material (20) (30); Forming photo etch layers (23) (33) by coating a photosensitive material on each of the etch protection thin films (22) (32); An exposure process is performed using masks 24 and 34 having patterns having different shapes, and developed to form patterns of the masks 24 and 34 on the respective photoetch layers 23 and 33. Steps; Performing dry etching on each of the etch protective films 22 and 32 exposed by the patterning of each of the photo etching layers 23 and 33; Forming a through hole (21) (31) by performing a wet etching process on the upper and lower surfaces of the first material (20) and the second material (30) exposed by dry etching; Stacking and bonding the first material 20 on the second material 30 so that the center line of the through holes 21 and 31 formed by the wet etching process is positioned on one axis; A method of manufacturing a ball solder attach plate for a semiconductor device manufacturing facility using MEMS technology, comprising the step of horizontally polishing the upper surface of the first material (20) so that the laminated material has the required thickness. A first plate 20 having a plurality of through holes 21 and 31 formed in a desired pattern with a required spacing and diameter; The first plate 20 has a plurality of through holes 21 and 31 formed in a desired pattern with a required spacing and diameter, and the center line of the through holes 21 and 31 is located on one axis. Ball solder attachment plate for a semiconductor device manufacturing equipment, characterized in that consisting of a second plate (30) laminated and bonded to. 5. The ball solder attach plate for semiconductor device manufacturing equipment according to claim 4, wherein the through hole (21) of the first plate (20) is smaller than the diameter of the through hole (31) of the second plate (30). 6. The ball solder attach plate for a semiconductor device manufacturing facility according to claim 5, wherein the thickness of the second plate (30) is thinner than that of the first plate (20). .

Images