KR100782403B1 - Method for manufacturing circuit board - Google Patents

Abstract

A method for manufacturing a circuit board is provided to improve flatness and easily emit heat by forming a circuit inside a substrate, to reduce the warpage of the substrate, and to improve the reliability of ion-migration between the adjacent circuits. A method for manufacturing a circuit board includes the steps of: forming a circuit pattern and a conductive embossed pattern corresponding to a cavity part on a transfer carrier(S100); transferring the conductive embossed pattern on an insulation substrate by compressing one side of the transfer carrier and one side of the insulation substrate to face each other(S200); removing the conductive embossed pattern transferred on the insulation substrate(S300); and planarizing the insulation substrate.

Description

Circuit board manufacturing method {Method for manufacturing circuit board}

1 is a flowchart illustrating a method of forming a conductive relief pattern on a transfer carrier according to an exemplary embodiment of the present invention.

2 is a flow chart showing a circuit board manufacturing method according to an embodiment of the present invention.

Figure 3 is a flow chart showing a circuit board manufacturing method according to another embodiment of the present invention.

Figure 4 is a flow chart showing a circuit board manufacturing method according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

12 photosensitive film 14 seed layer

16: transfer carrier 18: first photoresist

20: conductive material 22: second photoresist

19: first intaglio pattern 23: second intaglio pattern

24: conductive embossed pattern 26: insulating substrate

28: etching resist 30: pressurized carrier

32: circuit pattern 34: cavity

The present invention relates to a circuit board manufacturing method.

Recently, the package technology is also required to fine pattern, miniaturization, high performance, high integration, according to the trend of light and short and high performance of electronic products. Accordingly, such a trend is reflected in the semiconductor memory field, and a package having a board on chip (BOC) structure is known as a package of a high speed DRAM or the like. In addition, the technology of the package of the embedded (embedded) structure that can reduce the overall thickness of the package by mounting the electronic device in the substrate for thinning the package is known.

In accordance with the demand for fine circuit patterning, thinning, high integration, and high performance of such packages, fine circuit patterning, thinning, and high integration are also required for substrates used in BOC packages or embedded structure packages. Required.

Substrate fabrication used in a BOC package or an embedded structure package according to the prior art forms a circuit by photolithography, a cavity in which a slot for connecting a semiconductor memory device and a substrate is formed in a BOC package, The cavity for mounting the electronics in the package of the embedded structure was formed by a punching or router process.

Photolithography, a technique for producing microcircuit patterns widely used until now, is a method of forming a pattern on a substrate coated with a photoresist thin film. However, the size of the formed pattern is limited by the optical diffraction phenomenon and the resolution is almost proportional to the wavelength of the light used. Therefore, as the degree of integration of semiconductor devices increases, shorter wavelength exposure techniques are required in order to form fine patterns. This method causes non-uniformity of the CD (critical dimension) of the photoresist pattern, thereby making the photoresist pattern a mask. The circuit pattern formed by patterning is formed in a different form from the one originally desired. There is a problem in that the photoresist pattern is changed by erosion of the photoresist due to reaction of impurities and photoresist generated during the process. In addition, the circuit pattern formed according to the above method is exposed on the upper portion of the insulating substrate so that the overall height of the substrate is high, and an under cut occurs at the junction portion of the circuit pattern and the insulating substrate so that the circuit is separated from the insulating substrate. There is a problem.

In addition, the method of manufacturing a substrate having a cavity used in a BOC package or an embedded structure package according to the prior art has a high cost of a conventional punching process or a router process for processing the cavity, and breakage of the substrate during cavity processing. There was a problem that caused a lot of defects in the substrate.

The present invention is to provide a circuit board manufacturing method that can easily manufacture a high-density microcircuit pattern on the substrate, the circuit pattern is embedded in the substrate can reduce the overall thickness of the substrate.

In addition, the present invention is to provide a circuit board manufacturing method having a high process density of the cavity by manufacturing the cavity formed on the substrate by the etching process.

According to an aspect of the present invention, a method of manufacturing a circuit board having a circuit pattern and a cavity, comprising the steps of: (a) forming a conductive embossed pattern corresponding to the circuit pattern and the cavity on the transfer carrier, (b) a conductive embossed pattern Compressing one surface of the formed transfer carrier and one surface of the insulating substrate to face each other to transfer the conductive embossed pattern to the insulating substrate, and (c) removing the conductive embossed pattern corresponding to the cavity transferred to the insulating substrate. A circuit board manufacturing method is provided. After step (c), the method may further include planarizing the insulating substrate.

The insulating substrate comprises at least one of a thermoplastic resin and a glass epoxy resin, and step (b) is performed while the insulating substrate is softened.

Step (a) comprises: (a1) selectively forming a first photoresist on the transfer carrier to form a first intaglio pattern corresponding to the circuit pattern and the cavity, (a2) filling a conductive material in the first intaglio pattern (A3) removing the first photoresist, and (a4) selectively forming a second photoresist on one surface of the transfer carrier from which the first photoresist has been removed to form a second negative pattern corresponding to the cavity. And (a5) filling the conductive material in the second intaglio pattern, and (a6) removing the second photoresist.

Step (a2) may be performed by electroplating, and step (a5) may be performed by electroplating.

Step (b) may be performed by pressing the transfer carrier and the press carrier by placing the press carrier on the other surface of the insulating substrate.

Step (c) includes (c1) selectively forming an etching resist on the insulating substrate to form an intaglio pattern corresponding to the cavity, (c2) etching the intaglio pattern portion corresponding to the cavity and (c3) And removing the etching resist.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

Hereinafter, a preferred embodiment of a circuit board manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings, in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and Duplicate explanations will be omitted.

1 is a flowchart illustrating a method of forming a conductive relief pattern on a transfer carrier according to an exemplary embodiment of the present invention. Referring to FIG. 1, the photosensitive film 12, the seed layer 14, the transfer carrier 16, the first photoresist 18, the conductive material 20, the second photoresist 22, and the first intaglio pattern 19, the second intaglio pattern 23, and the conductive embossed pattern 24 are shown.

In this embodiment, the conductive embossed pattern 24 refers to a circuit pattern to be formed on an insulating substrate and a conductive material embossed on the transfer carrier 16 corresponding to the cavity to be removed by an etching process. 20).

In the method of forming the conductive relief pattern 24 on the transfer carrier 16, the first photoresist 18 is selectively formed on the transfer carrier 16 to form a first intaglio pattern 19 corresponding to the circuit pattern and the cavity. ), And the first photoresist 18 is removed after the conductive material 20 is filled in the first intaglio pattern 19. Through this process, a conductive embossed pattern corresponding to the circuit pattern and the cavity is primarily formed, but the cavity is formed through the entire thickness of the substrate, so that the conductive material 20 is formed on the conductive embossed pattern corresponding to the cavity. It is necessary to fill the gap to form an embossed conductive pattern corresponding to the cavity portion equal to the total thickness of the insulating substrate or to be larger than the thickness of the insulating substrate. Accordingly, after the first photoresist 18 is removed, a second photoresist 22 is selectively formed on one surface of the transfer carrier 16 from which the first photoresist 18 has been removed, so that the second photoresist 22 corresponds to the cavity. After the intaglio pattern 23 is formed and the second intaglio pattern 23 is filled with the conductive material 20, the second photoresist 22 is removed. By doing in this way, the conductive embossed pattern 24 corresponding to a circuit pattern and a cavity part can be formed. At this time, the conductive embossed pattern corresponding to the cavity is formed to be equal to or larger than the thickness of the insulating substrate.

Looking at the method of forming the conductive embossed pattern 24 in more detail, by applying a photosensitive material on one surface of the transfer carrier 16 (Fig. 1 (a)), a photomask is produced corresponding to the circuit pattern and cavity Then, it is laminated on the transfer carrier 16 to which the photosensitive material is applied and then exposed to ultraviolet rays. After exposure, the uncured portion of the photosensitive material is developed with a developer to form a first intaglio pattern 19 corresponding to the circuit pattern and the cavity on one surface of the transfer carrier 16 (FIG. 1B).

In this embodiment, the photosensitive film 12 (for example, a dry film can be used as the photosensitive film 12) is used as the photosensitive material, and is laminated on the transfer carrier 16, and this is an artwork film or the like. The photomask is selectively exposed and developed to form a first intaglio pattern 19 corresponding to the circuit pattern and the cavity. On the other hand, it is also possible to form a photosensitive film 12 layer by coating a liquid photosensitive material on the transfer carrier 16.

When the photosensitive film 12 laminated on one surface of the transfer carrier 16 is selectively exposed and developed, the uncured photosensitive film 12 which is not exposed by the photomask on the transfer carrier 16 is removed, and the exposure is performed. The cured photosensitive film 12 may remain to form a first intaglio pattern 19 corresponding to the circuit pattern and the cavity. At this time, the cured photosensitive film becomes the first photoresist 18.

When the first intaglio pattern 19 is formed on the transfer carrier 16, the conductive material 20 is filled in the first intaglio pattern 19. The method of filling the first intaglio pattern 19 with the conductive material 20 includes plating with electroless and / or electrolytic plating, filling with a conductive paste, filling with a conductive ink by inkjet printing, and conductive polymer. A method apparent to those skilled in the art, such as a method of polymerizing and charging, may be used. As the conductive material 20 filled in the first intaglio pattern 19, a conductive material known to those skilled in the art may be used, such as aluminum (Al), silver (Ag), copper (Cu), and chromium (Cr).

In the present exemplary embodiment, a seed layer 14 is formed on a surface on which the conductive embossed pattern 24 of the transfer carrier 16 is formed, and electroplating is performed on the electrode to form the first engraved pattern 19. The conductive material 20 is filled in. In the case where the transfer carrier 16 is a metal plate, electroplating can be performed immediately.

On the other hand, when the transfer carrier 16 is made of a resin, not a metal plate, the electroless plating is first performed to form the seed layer 14, and then electroplated with the electrode to conduct the first intaglio pattern 19. It is also possible to fill the material 20 (see FIG. 1C).

When the conductive material 20 is filled in the first intaglio pattern 19, the first photoresist 18 is removed to form a conductive embossed pattern corresponding to the circuit pattern and the cavity. d)).

As described above, the conductive embossed pattern 24 corresponding to the cavity should be formed to be the same as or larger than the thickness of the insulating substrate, so that the transfer carrier 16 of the first photoresist 18 is removed. The photosensitive material is applied to one surface again (FIG. 1E), a photomask is manufactured corresponding to the cavity, and the photomask is laminated on the transfer carrier 16 to which the photosensitive material is applied, and then exposed to ultraviolet rays. After exposure, the uncured portion of the photosensitive material is developed with a developer to form a second intaglio pattern 23 corresponding to the cavity on one surface of the transfer carrier 16 (FIG. 1 (f)). In this case, the second negative pattern 23 is formed only at a position corresponding to the cavity. In this embodiment, the photosensitive film 12 (for example, a dry film can be used as the photosensitive film 12) is used as the photosensitive material, and is laminated on the transfer carrier 16, and this is an artwork film or the like. The photomask is selectively exposed and developed to form a second intaglio pattern 23 corresponding to the cavity 34. At this time, the photosensitive material cured by exposure forms the second photoresist 22. On the other hand, it is also possible to form a photosensitive film 12 layer by coating a liquid photosensitive material on the transfer carrier 16.

When the second intaglio pattern 23 is formed on the transfer carrier 16, the conductive material 20 is filled in the second intaglio pattern 23 corresponding to the cavity to form the conductive embossed pattern 24 corresponding to the cavity. To make the height of the same as the thickness of the substrate or more than the thickness of the substrate.

The method of filling the second intaglio pattern 23 with the conductive material 20 may be performed in various ways as described above. However, in the present embodiment, the second intaglio pattern is formed by electroplating the previously formed conductive material 20 with an electrode. The electroconductive material 20 is filled in 23 (refer FIG. 1G).

Subsequently, when the second photoresist 22 is removed, a conductive relief pattern 24 corresponding to the circuit pattern and the cavity is formed in the carrier (see FIG. 1H).

2 is a flowchart illustrating a circuit board manufacturing method according to an exemplary embodiment of the present invention. Referring to FIG. 2, the seed layer 14, the transfer carrier 16, the conductive relief pattern 24, the insulating substrate 26, and the etching resist 28 are illustrated.

As described above, when the conductive relief pattern 24 is formed on one surface of the transfer carrier 16, the conductive relief pattern 24 is transferred to the insulating substrate 26 to transfer the circuit pattern 32 and the cavity 34. The branch can manufacture a circuit board. That is, the conductive embossed pattern 24 corresponding to the circuit pattern 32 and the cavity 34 is formed on the transfer carrier 16, and one surface and the insulating substrate of the transfer carrier 16 on which the conductive embossed pattern 24 are formed. One surface of the substrate 26 is compressed to face the conductive embossed pattern 24 on the insulating substrate 26. If the conductive embossed pattern 24 corresponding to the cavity 34 is removed from the conductive embossed pattern 24 corresponding to the circuit pattern 32 and the cavity 34 transferred to the insulating substrate 26, the circuit pattern 32 is removed. ) Is embedded on the insulating substrate 26, a circuit board having a cavity 34 formed in the insulating substrate 26 can be manufactured.

Referring to FIG. 2, a method of manufacturing a circuit board having a circuit pattern 32 and a cavity 34 is described. First, the circuit pattern 32 and the cavity 34 formed on the transfer carrier 16 may correspond to each other. A method of transferring the conductive embossed pattern 24 to the insulating substrate 26 includes a transfer carrier 16 on which the conductive embossed pattern 24 is formed, as shown in FIGS. 2A, 2B and 2C. One surface and the insulating substrate 26 are pressed, the transfer carrier 16 is separated, and the conductive embossed pattern 24 is transferred to the insulating substrate 26.

The insulating substrate 26 includes at least one of a thermoplastic resin and a glass epoxy resin. When the conductive embossed pattern 24 is transferred to the insulating substrate 26, the insulating substrate 26 is in a soft state. That is, the insulating substrate 26 is made soft by heating above the softening temperature of the thermoplastic or / and glass epoxy resin, and then the conductive embossed pattern 24 formed on the transfer carrier 16 by embossing is insulated from the soft substrate. After the transfer carrier 16 is removed and the insulating substrate 26 is cured, the conductive embossed pattern 24 is embedded in the insulating substrate 26.

On the other hand, it is also possible to use a prepreg made of a semi-cured state by infiltrating the thermosetting resin into the glass fiber as the insulating substrate 26.

Next, a method of removing the conductive embossed pattern 24 corresponding to the cavity 34 from the conductive embossed pattern 24 corresponding to the circuit pattern 32 and the cavity 34 transferred to the insulating substrate 26. The etching resist 28 is selectively formed on the insulating substrate 26 to form an intaglio pattern corresponding to the cavity 34, the portion of the intaglio pattern corresponding to the cavity 34 is etched, and the remaining etching is performed. The resist 28 is removed. The etching resist 28 coats the photosensitive material on the insulating substrate 26 (FIG. 2D), fabricates a photomask corresponding to the cavity 34, and then applies the photosensitive material to the insulating substrate 26. ) And then exposed to ultraviolet light. After exposure, the uncured portion of the photosensitive material is developed with a developer to form an etching resist 28 (Fig. 2 (e)). In this embodiment, the photosensitive film 12 (for example, a dry film can be used as the photosensitive film 12) is used as the photosensitive material, and is laminated on the insulating substrate 26, and this is an artwork film or the like. The etching resist 28 is formed by selectively exposing and developing the photomask to form an intaglio pattern corresponding to the cavity 34. At this time, the photosensitive material cured by exposure becomes the etching resist 28. On the other hand, it is also possible to form a photosensitive film 12 layer by coating a liquid photosensitive material on the insulating substrate 26.

When the intaglio pattern corresponding to the cavity 34 is formed on the insulating substrate 26, an etching solution is applied to the insulating substrate 26 to form an electroconductive pattern corresponding to the cavity 34 and transferred to the insulating substrate 26. Embossed pattern can be removed. As a result, the cavity 34 is formed in the insulating substrate 26. In this case, the etching liquid cannot reach the regions other than the intaglio pattern formed corresponding to the cavity 34, so that etching is not performed. When the cavity 34 is formed in the insulating substrate 26 by etching, the etching resist 28 is removed. On one surface of the insulating substrate 26 from which the etching resist 28 has been removed, the seed layer 14 adhered to the conductive embossed pattern 24 during the transfer process of the conductive embossed pattern 24 remains, and the seed layer ( 14) is removed through the planarization operation to be described later.

Finally, when the planarization operation is performed on the surface of the insulating substrate 26 on which the circuit pattern 32 and the cavity 34 are formed, a circuit board on which the circuit pattern 32 and the cavity 34 are formed may be manufactured ( See FIG. 2 (h)). Planarization is performed by etching one or both surfaces of the insulating substrate 26 or through chemical mechanical polishing (CMP).

As described above, a circuit board having a cavity for embedding electronic elements of a slot of a BOC board or an embedded structure package and a circuit pattern 32 embedded in an insulating substrate may be manufactured. The fine circuit pattern 32 can be manufactured by the above-described transfer process, and the processing precision of the cavity 34 is high. The figure located at the bottom of FIG. 2 (h) shows the plane of the circuit board having the circuit pattern and the cavity formed according to the above-described method.

3 is a flowchart illustrating a circuit board manufacturing method according to another exemplary embodiment of the present invention. Referring to FIG. 3, the seed layer 14, the transfer carrier 16, the pressing carrier 30, the conductive embossed pattern 24, the insulating substrate 26, the etching resist 28, the circuit pattern 32, and the cavity Part 34 is shown.

When the conductive embossed pattern 24 formed on one surface of the transfer carrier 16 is transferred to the insulating substrate 26, one surface of the transfer carrier 16 on which the conductive embossed pattern 24 is formed is formed on one surface of the insulating substrate 26. Disposed to face each other, the pressing carrier 30 is placed against the other surface of the insulating substrate 26 to compress the transfer carrier 16 and the pressing carrier 30 to transfer the conductive embossed pattern 24 to the insulating substrate 26. Done. The reason for this configuration is that the pressing carrier 30 can be pressurized at the same pressure during compression, thereby increasing the accuracy of the transfer of the circuit pattern 32.

Referring to FIG. 3, a method of manufacturing a circuit board having a circuit pattern 32 and a cavity 34 is as shown in FIGS. 3A, 3B, and 3C. The conductive carrier pattern 24 is insulated by crimping the transfer carrier 16 and the pressing carrier 30 by interposing an insulating substrate 26 between one surface of the transfer carrier 16 on which the 24 is formed and the pressing carrier 30. To be embedded in the substrate 26. In this case, the insulating substrate 26 includes at least one of a thermoplastic resin and a glass epoxy resin. When the conductive embossed pattern 24 is transferred to the insulating substrate 26, the insulating substrate 26 is in a soft state. That is, the insulating substrate 26 is made soft by heating above the softening temperature of the thermoplastic or / and glass epoxy resin, and then the conductive embossed pattern 24 formed on the transfer carrier 16 by embossing is insulated from the soft substrate. 26) and then separate the transfer carrier 16 and the pressure carrier (30). On the other hand, it is also possible to use a prepreg made of a semi-cured state by infiltrating the thermosetting resin into the glass fiber as the insulating substrate 26.

Next, as shown in (d), (e) and (f) of FIG. 3, the conductive relief pattern 24 corresponding to the circuit pattern 32 and the cavity 34 transferred to the insulating substrate 26 is shown. ), The conductive embossed pattern 24 corresponding to the cavity 34 is removed.

In order to remove the conductive embossed pattern 24 corresponding to the cavity 34, an etching resist 28 is selectively formed on both surfaces of the insulating substrate 26 to form an intaglio pattern corresponding to the cavity 34. .

When the intaglio pattern corresponding to the cavity 34 is formed on the insulating substrate 26, an etchant is applied to the insulating substrate 26 to form an electroconductive pattern corresponding to the cavity 34 and transferred to the insulating substrate 26. Embossed pattern 24 can be removed. When the cavity 34 is formed in the insulating substrate 26 by etching, the etching resist 28 is removed.

Finally, as shown in (g) and (h) of FIG. 3, one or both surfaces of the insulating substrate 26 from which the etching resist 28 has been removed are conductive embossed patterns during the transfer process of the conductive embossed pattern 24. The seed layer 14 adhered to (24) remains and this seed layer 14 is removed through a planarization operation.

When the planarization operation is performed on the surface of the insulating substrate 26 on which the circuit pattern 32 and the cavity 34 are formed, a circuit board on which the circuit pattern 32 and the cavity 34 are formed may be manufactured.

Planarization is performed by etching one or both surfaces of the insulating substrate 26 or through chemical mechanical polishing (CMP). The figure located at the bottom of FIG. 3H shows a plane of a circuit board having a circuit pattern and a cavity formed according to the above-described method.

4 is a flowchart illustrating a circuit board manufacturing method according to an exemplary embodiment of the present invention. Referring to FIG. 4, in step S100, a conductive relief pattern corresponding to a circuit pattern and a cavity is formed on the transfer carrier. A photosensitive material is coated on one surface of the transfer carrier, a photomask is made corresponding to the circuit pattern and the cavity, and the photomask is laminated on the transfer carrier coated with the photosensitive material and exposed to ultraviolet rays. After exposure, the uncured portion of the photosensitive material is developed with a developer to form a first intaglio pattern corresponding to the circuit pattern and the cavity on one surface of the transfer carrier (S110). At this time, the cured photosensitive film turns into a first photoresist.

When the first intaglio pattern is formed on the transfer carrier, a conductive material is filled in the first intaglio pattern. The method of filling the first intaglio pattern with a conductive material may include plating with electroless and / or electrolytic plating, filling with a conductive paste, filling with a conductive ink by inkjet printing, and filling with a conductive polymer. Methods apparent to those skilled in the art can be used. As the conductive material 18 filled in the first intaglio pattern, a conductive material known to those skilled in the art may be used, such as aluminum (Al), silver (Ag), copper (Cu), and chromium (Cr).

In the present exemplary embodiment, a seed layer is formed on a surface on which the conductive embossed pattern of the transfer carrier is formed, and electrolytic plating is performed on the electrode to fill the first intaglio pattern with a conductive material. In the case where the transfer carrier is a metal plate, electroplating may be performed immediately (S120).

When the conductive material is filled in the first intaglio pattern, the first photoresist is removed to form an electroconductive embossed pattern corresponding to the circuit pattern and the cavity primarily (S130).

As described above, since the conductive embossed pattern corresponding to the cavity must be formed to be the same as or larger than the thickness of the substrate, the photosensitive material is applied to one surface of the transfer carrier from which the first photoresist is removed, and the cavity is formed. After manufacturing a photomask corresponding to the laminated on the transfer carrier coated with the photosensitive material and exposed to ultraviolet light. After exposure, the uncured portion of the photosensitive material is developed with a developer to form a second intaglio pattern corresponding to the cavity on one surface of the transfer carrier (S140).

When the second intaglio pattern is formed on the transfer carrier, the conductive material is filled in the second intaglio pattern corresponding to the cavity again to make the height of the conductive embossed pattern corresponding to the cavity equal to or greater than the thickness of the substrate. To form.

The method of filling the second intaglio pattern with the conductive material may be performed in various ways as described above. However, in the present embodiment, the conductive material is filled in the second intaglio pattern by electroplating the previously formed conductive material with an electrode (S150). .

Subsequently, when the second photoresist is removed, a conductive relief pattern corresponding to the circuit pattern and the cavity is formed in the carrier (S160).

In step S200, the conductive embossed pattern formed on the transfer carrier is transferred to the insulating substrate. That is, a conductive embossed pattern corresponding to the circuit pattern and the cavity is formed on the transfer carrier, and one side of the transfer carrier on which the conductive embossed pattern is formed and one side of the insulating substrate are pressed to face each other to transfer the conductive embossed pattern to the insulating substrate.

In step S300, the conductive embossed pattern corresponding to the cavity is removed from the conductive pattern corresponding to the circuit pattern and the cavity transferred to the insulating substrate.

An etching resist is selectively formed on the insulating substrate to form an intaglio pattern corresponding to the cavity. The etching resist applies a photosensitive material to an insulating substrate, fabricates a photomask corresponding to the cavity, and laminates the photoresist on an insulating substrate coated with the photosensitive material, and then exposes it to ultraviolet rays. After exposure, the uncured portion of the photosensitive material is developed by using a developer (S310). When the intaglio pattern corresponding to the cavity is formed on the insulating substrate, an etching solution may be applied to the insulation substrate to form the corresponding cavity, and the conductive embossed pattern transferred to the insulation substrate may be removed. As a result, a cavity may be formed in the insulating substrate. In this case, since the etching liquid cannot reach the regions other than the intaglio pattern corresponding to the cavity, the etching is not performed (S320). When the cavity is formed in the insulating substrate by etching, the etching resist is removed (S330). On one surface of the insulating substrate from which the etching resist is removed, a seed layer adhered to the conductive embossed pattern is left in the transfer process of the conductive embossed pattern, and the seed layer is removed through a planarization operation which will be described later.

Finally, when the planarization operation is performed on the surface of the insulating substrate on which the circuit pattern and the cavity are formed, a circuit board on which the circuit pattern and the cavity are formed may be manufactured. Planarization is performed by etching one or both sides of the insulating substrate or by chemical mechanical polishing (CMP).

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

According to a preferred embodiment of the present invention as described above, it is possible to manufacture a circuit board having a high-density circuit, the circuit board manufactured as described above is a circuit is formed inside the substrate has a high adhesive force between the circuit and the substrate of the circuit Peeling is less and the overall thickness of the substrate can be reduced.

In addition, since the circuit is formed inside the substrate, the flatness is excellent and heat dissipation is easy. In addition, the warpage of the substrate is less generated, and the reliability of ion-migration between adjacent circuits can be increased.

 In addition, the process is simpler and cheaper than the conventional cavity machining process, and the machining precision of the cavity can be increased.

Claims (8)

A method of manufacturing a circuit board having a circuit pattern and a cavity, (a) forming a conductive relief pattern corresponding to the circuit pattern and the cavity in the transfer carrier; (b) compressing the conductive embossed pattern onto the insulating substrate by compressing one surface of the transfer carrier on which the conductive embossed pattern is formed and one surface of the insulating substrate to face each other; And (c) removing the conductive embossed pattern corresponding to the cavity portion transferred to the insulating substrate. The method of claim 1, After step (c), And planarizing the insulating substrate. The method of claim 1, The insulating substrate includes at least one of a thermoplastic resin and a glass epoxy resin, wherein in the step (b) the insulating substrate manufacturing method, characterized in that the softening state. The method of claim 1, Step (a) is, (a1) selectively forming a first photoresist on the transfer carrier to form a first intaglio pattern corresponding to the circuit pattern and the cavity; (a2) filling a first conductive pattern with a conductive material; (a3) removing the first photoresist; (a4) selectively forming a second photoresist on one surface of the transfer carrier from which the first photoresist has been removed to form a second negative pattern corresponding to the cavity; (a5) filling a second conductive pattern with a conductive material; And (a6) A method of manufacturing a circuit board comprising the step of removing the second photoresist. The method of claim 4, wherein Step (a2) is, A method of manufacturing a circuit board, which is performed by electroplating. The method of claim 4, wherein Step (a5) is, A method of manufacturing a circuit board, which is performed by electroplating. The method of claim 1, Step (b) is, Placing a pressing carrier on the other surface of the insulating substrate, the circuit board manufacturing method, characterized in that carried out by pressing the carrier and the pressing carrier. The method of claim 1, Step (c) is, (c1) selectively forming an etching resist on the insulating substrate to form an intaglio pattern corresponding to the cavity; (c2) etching the intaglio pattern portion corresponding to the cavity; And (c3) removing the etching resist.

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