KR100674679B1 - Encapsulation system of organic light emitting diodes - Google Patents

Abstract

An encapsulation system of an OLED(Organic Light Emitting Diode) is provided to prevent a glass substrate from being damaged due to a vibration of a robot by not horizontally moving a carrier robot. In an encapsulation system of an OLED, a plurality of carrier chambers(11,21,31,41) transfers a glass substrate or a cap. A carrier robot(60) is fixed to bottoms of the carrier chambers(11,21,31,41). An arm of the carrier robot(60) rotates. A glass substrate supplying unit(20) supplies the glass substrate to the carrier chambers(11,21,31,41). A cap supplying unit(340) supplies the cap to the carrier chambers(11,21,31,41). At least one process chamber(12) adheres the glass substrate to the cap. And, the glass substrate supplying unit(20), the cap supplying unit(340), and the process chamber(12) are arranged adjacently to each other to be directly connected to the carrier chambers(11,21,31,41), respectively.

Description

Encapsulation system of Organic Light Emitting Diodes

1 is a cross-sectional view showing the structure of a conventional organic light emitting device.

2 schematically shows a sealing system of a conventional organic light emitting device.

Figure 3 schematically shows an encapsulation system of an organic light emitting device according to the present invention.

** Description of the symbols for the main parts of the drawings **

11, 21, 31, 41: conveying chamber 12: process chamber

13: Unloading chamber 20: Glass substrate supply part

22: glass stalker 30: primary processing unit

32: plasma chamber 33: moisture absorbent attachment module

34: loading chamber 40: secondary processing unit

42: adhesive coating module 51, 53: buffer chamber

52: gas chamber 60: carrier robot

The present invention relates to an encapsulation system of an organic light emitting device, and more particularly, to an encapsulation system of an organic light emitting device capable of remarkably reducing equipment area and shortening processing time by organically configuring each chamber or module. will be.

Recently, with the rapid development of information and communication technology and the expansion of the market, flat panel displays have been in the spotlight as display devices. Such flat panel displays include liquid crystal displays, plasma display panels, organic light emitting diodes, and the like.

Among them, the organic light emitting device has very good advantages such as fast response speed, lower power consumption than conventional liquid crystal display, light weight, ultra thin without needing a back light device, and high brightness. As a result, it is attracting attention as a next generation display device.

In the organic light emitting device, an anode film, an organic thin film, and a cathode film are sequentially coated on a substrate, and a suitable energy difference is formed in the organic film by emitting a voltage between the anode and the cathode, thereby emitting light by itself. That is, the excitation energy left by recombination of injected electrons and holes is generated as light. In this case, since the wavelength of light generated according to the amount of the dopant of the organic material may be adjusted, full color may be realized.

Although the detailed structure of the organic light emitting diode is not shown in the drawing, an anode, a hole injection layer, a hole transport layer, an emission layer, and an electron transport layer are deposited on a substrate. A layer, an electron injection layer, and a cathode are stacked in this order. In this case, ITO (Indium Tin Oxide) having a small sheet resistance and good permeability is mainly used as the anode. And an organic thin film is composed of a hole injection layer, a hole transport layer, light emitting layer, an electron transport layer, the electron injection layer, the multi-layer to increase the light emitting efficiency, an organic material used for the light emitting layer is Alq _3, TPD, PBD, m-MTDATA, TCTA. In addition, a LiF-Al metal film is used as the cathode. And since the organic thin film is very weak against moisture and oxygen in the air, a cap for increasing the life time of the device is sealed.

Referring to Figure 1 will be described the structure of the organic light emitting device 100 is sealed cap 120 made of a glass material.

As shown, a moisture absorbent 121 is attached to the inside of the cap 120 to reduce the influence of the gas generated in the organic light emitting layer 111 inside the organic light emitting device 100 and moisture and oxygen from the outside, The cap 120 has a rectangular shape in plan view, and an extension portion protruding a predetermined height in one direction is formed at an end of each side, and an adhesive 122 is coated to form a seal line having a predetermined width on the cross section of the cap 120. ) Is bonded to the glass substrate 110 on which the organic light emitting layer 111 is deposited to block the penetration of moisture and oxygen from the outside. At this time, a predetermined space 123 is formed between the cap 120 and the glass substrate 110.

Referring to Figure 2 will be briefly described a system for encapsulating the organic light emitting layer by capping the glass substrate on which the organic light emitting layer is formed.

The conventional encapsulation system 200 includes a prealign module 220 for prealigning a glass substrate and a cap coated with an adhesive, which is an ultraviolet curable resin, and a transfer module 211 for transferring the prealigned glass substrate and the cap. And two process chambers 212 adjacent to the transfer module 211.

The prealign module 220 carries out a cap and a glass substrate, and mechanically aligns the first alignment. The prealign is generally an alignment using an alignment pin and an alignment hole.

The process chamber 212 is provided with a UV lamp for curing the adhesive, which is an ultraviolet curable resin, and a dedicated photo mask for protecting the organic light emitting layer from UV light.

In addition, a second transfer module 231 for transferring a glass substrate and a cap to the pre-align module 220 is provided. On one side of the second conveyance module 231, a glass stocker 232 on which a glass substrate is loaded, and a cap manufacturing unit are disposed.

The cap manufacturing unit carries a loading chamber 253 for loading the cap member, two plasma chambers 252 for removing moisture or organic matter attached to the cap member, and a third conveyance for conveying the plasma chamber 252. Module 251. As a result, a buffer chamber 261 for temporarily storing a cap member from which moisture or organic matter has been removed, a fourth conveying module 241 for carrying in the cap member through the buffer chamber 261, and the fourth conveying module 241. Adjacent to each of the two) is a moisture absorbent attachment module 242 and two adhesive coating module 243 is located.

In addition, each conveying module is provided with a conveying robot 260 for conveying a glass substrate or a cap. The conveying robot 260 is typically a lower portion conveying horizontally along a guide rail 265 and the guide rail 265. A jig 261, an upper jig 262 rotating in an upper portion of the lower jig 261, an elastic link member 263 fixed to the upper jig, and an end of the link member 263. Arm 264.

However, the conventional encapsulation system 200 has a problem that the glass substrate or the like may be damaged by the vibration of the transport robot because the transport robot 260 carries or transports the glass substrate or the cap while horizontally moving along the guide rail 265. There was this.

In addition, the transfer module has a problem that particles are attached to the substrate or the cap because the process is performed in an atmospheric pressure atmosphere.

In order to solve this problem, air purifying means has been added in the related art. However, since the conveying chamber is a non-vacuum atmosphere and a lot of particles are generated by the horizontal movement of the robot, it is necessary to frequently change the filter of the air purifying means. Still remained.

In particular, since the system itself is not organically constructed, there is a problem that the installation area is remarkably large, and thus the process time is long.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to encapsulate an organic light emitting device capable of remarkably reducing equipment area and shortening processing time by organically configuring each chamber or module. In providing.

In order to solve the above technical problem, the glass substrate on which the organic light emitting layer is deposited according to the present invention is sealed, a system for encapsulating a cap to which an absorbent is attached and an adhesive is applied, and a carrier robot on which an arm rotates is fixed to the lower portion of the glass substrate. Or a conveying chamber for conveying a cap; A glass substrate supply unit supplying the glass substrate to the transfer chamber; A cap supply part supplying the cap to the conveying chamber; And at least one process chamber for attaching the glass substrate and the cap to each other, wherein the glass substrate supply unit, the cap supply unit, and the process chamber are disposed adjacent to each other so as to be directly connected to the transfer chamber.

The glass substrate supply unit may further include a second conveyance chamber for carrying or conveying the glass substrate; And at least one glass stocker glass stocker on which the glass substrate is loaded. A buffer chamber is further provided between the transfer chamber and the second transfer chamber.

The cap supply unit may further include a third conveying chamber for carrying or conveying the cap member; At least one plasma chamber for plasma treating the cap member; And a moisture absorbent attachment module attaching an absorbent to the cap member subjected to plasma treatment, wherein each of the plasma chamber and the attachment module is disposed adjacent to the third transport chamber; And

A fourth conveying chamber for carrying in or conveying the cap member that has been primarily processed; And at least one adhesive applying module adjacent to the fourth conveying chamber and applying an adhesive, which is an ultraviolet curable resin, to the cap member.

In addition, a degas chamber for temporarily storing the caps treated first and second treatment and pumping the gas discharged from the adhesive may be further provided.

In addition, the conveying chamber, the second conveying chamber, the third conveying chamber and the fourth conveying chamber is preferably provided with a vacuum pump and air purifying means.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention.

Referring to FIG. 3, the present embodiment includes a transfer chamber 11, a glass substrate supply unit 20, a cap supply unit 340, a process chamber 12, and an unloading chamber 13.

The conveying chamber 11 is provided with a conveying robot 60 in a vacuum chamber having a hexagonal cross section, and two process chambers 12 are disposed adjacent to the side wall of the conveying chamber 11. Able to know.

The process chamber 12 is embedded with a UV lamp and a photo mask as in the prior art.

The glass substrate supply unit 20 is provided with a second transfer chamber 21 for transferring the glass substrate and two glass stockers 22 disposed adjacent to one side of the second transfer chamber 21. In addition, a buffer chamber 53 for temporarily storing a glass substrate is provided between the transfer chamber 11 and the second transfer chamber 21.

The cap supply unit 340 has a loading chamber 34 in which a cap member is loaded, and a conveying robot 60 is provided inside the vacuum chamber having a hexagonal cross section to convey the cap member. And a primary processing unit 30 including two plasma chambers 32 and a moisture absorbent attachment module 33 adjacent to the sidewalls of the transfer chamber 31, respectively.

In addition, the cap supply unit includes a fourth conveying chamber 41 disposed between the third conveying chamber 31 and the buffer chamber 51, and two provided on both side walls of the fourth conveying chamber 41. The secondary treatment part 40 which consists of the adhesive application module 42 is provided.

In addition, a degas chamber 52 is disposed between the conveying chamber 11 and the fourth conveying chamber 41.

In particular, the transport robots built into each of the transport chambers 11, 21, 31, and 41 according to the present embodiment include a lower jig 61 fixedly attached to the lower part of the chamber, and a rotational motion at the upper part of the lower jig 61. It consists of an upper jig 62, an elastic link member 63 fixed to the upper jig, and an arm 64 coupled to an end of the link member 63. That is, the transport robot 60 according to the present embodiment does not move horizontally along the guide rail. It just makes a rotary motion. In addition, each conveying chamber is provided with a vacuum pump for pumping and an air purifying means.

On the other hand, each chamber except the moisture absorbent attachment module 33 and the adhesive coating module 42 are all vacuum chambers in which the process is performed in a vacuum atmosphere. Therefore, in order to create a vacuum atmosphere, a vacuum pump is formed in each chamber.

Hereinafter, the operation of the present embodiment will be described.

The cap member in the loading chamber 34 is transferred to the plasma chamber 32 using the robot 60 of the third transfer chamber 31 to plasma-process the cap member to remove moisture or organic matter. Next, the cap member treated with plasma is transferred to the moisture absorbent attachment module 33 using the transport robot 60 to attach the moisture absorbent.

The cap member treated as above is carried into the fourth conveying chamber 41 through the buffer chamber 51. The carried cap member is transferred to the adhesive coating module 42 and coated with an adhesive, which is an ultraviolet curable resin. In particular, in this embodiment, two plasma chambers 32, a moisture absorbent attachment module 33, and an adhesive application module 42 are formed, respectively, so that the process time is shortened.

The cap manufactured by the secondary treatment as described above is transferred to the process chamber 12 through the transfer robot 60 of the transfer chamber 11 through the degas chamber 52. The degas chamber 52 discharges gas generated from the applied adhesive to the outside.

Meanwhile, the glass substrate on which the organic light emitting layer is deposited is also transferred to the transfer chamber 11 through the second transfer chamber 21 and the buffer chamber 53, and then to the process chamber 12.

As described above, when the cap and the glass substrate are loaded into the process chamber 12, the cap and the glass substrate are pre-aligned and vision aligned. In other words, the alignment is performed first by the alignment pin and the alignment hole, and the alignment mark is checked by vision.

After the cap, the glass substrate and the photo mask are aligned as above, the adhesive is cured by irradiating UV light with a UV lamp and bonding. Thereafter, it is completed by unloading the bonded elements.

In addition, when a lot of particles are generated in each of the conveying chambers while performing the above-described process, the particles are first pumped by a vacuum pump, and then particles are removed by operating the air purifying means.

According to the present invention, since the encapsulation system of the organic light emitting device is organically configured, in particular, since the transport robot is a cluster method of conveying a glass substrate or a cap by rotating an arm while the transport robot is fixed and attached to the lower part of the transport chamber, the system is equipped with a system. The area can be significantly reduced, and the process time can be shortened.

In addition, since the transport robot does not move horizontally, damage to the glass substrate due to the vibration of the robot can be prevented.

In addition, the conveying chamber equipped with a conveying robot is pumped by a vacuum pump, thereby minimizing particle problems since the conveying substrate or cap is conveyed in a vacuum atmosphere.

In addition, since the primary purification is performed by the pumping, it is possible to shorten the operating time of the purification means, thereby extending the life of the filter.

Claims (9)

In a system in which the organic light emitting layer is encapsulated by covering a glass substrate on which the organic light emitting layer is deposited, a cap with an absorbent attached thereto and an adhesive applied thereto, A conveying chamber in which a conveying robot having an arm rotated is fixed to the lower part and conveying the glass substrate or the cap; A glass substrate supply unit supplying the glass substrate to the transfer chamber; A cap supply part supplying the cap to the conveying chamber; And At least one process chamber for bonding the glass substrate and the cap; consisting of, And the glass substrate supply part, the cap supply part, and the process chamber are disposed adjacent to each other so as to be directly connected to the transfer chamber. The method of claim 1, The glass substrate supply unit, A second transport chamber for carrying in or transporting the glass substrate; And At least one glass stocker (glass stocker) is the glass substrate is loaded; Encapsulation system of an organic light emitting device comprising a. The method of claim 2, An encapsulation system of an organic light emitting device, characterized in that a buffer chamber is further provided between the conveying chamber and the second conveying chamber. The method of claim 1, The cap supply unit, Plasma treatment of the cap member, the primary processing unit for attaching the moisture absorbent; And Encapsulation system of an organic light-emitting device comprising a; secondary processing unit for manufacturing the cap by applying an adhesive to the cap member treated first. The method of claim 4, wherein The primary processing unit, A third conveying chamber for carrying in or conveying the cap member; At least one plasma chamber for plasma treating the cap member; And It comprises a; a moisture absorbent attachment module for attaching a moisture absorbent to the cap member is plasma-treated, Each of the plasma chamber and the attachment module is disposed adjacent to each other so as to be directly connected to the third transfer chamber. The method of claim 4, wherein The secondary processing unit, A fourth conveying chamber for carrying in or conveying the cap member that has been primarily processed; And And at least one adhesive coating module directly connected to the fourth conveying chamber and applying an adhesive to the cap member. The method of claim 6, An encapsulation system of an organic light emitting device, characterized in that a second buffer chamber is further provided between the third conveyance chamber and the fourth conveyance chamber. The method of claim 4, wherein The cap supply unit, And a degas chamber for temporarily storing the caps treated first and secondly and pumping the gas discharged from the adhesive. The encapsulation system of the organic light emitting diode further comprises. The method of claim 6, And the conveying chamber, the second conveying chamber, the third conveying chamber and the fourth conveying chamber are provided with a vacuum pump and an air purifying means.

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