KR100674317B1 - Electroless plating basket - Google Patents

Abstract

 The present invention relates to an electroless plating basket.

In particular, Teflon coating is applied to the basket to prevent plating on the basket, and the side board guide and the bottom substrate guide are formed of Teflon material to fix the substrate when inserting the substrate and to prevent the phenomenon of the plate guide being plated during plating. It relates to an electroless plating basket.

In addition, the present invention, the front surface is open, the multilayer frame is formed of a hexagonal frame having a Teflon coating; A plurality of side substrate guides fixed to both sides of each layer of the frame and formed of a pair of Teflon materials; A plurality of slides having respective ends of each end fixed to the pair of side substrate guides in each layer and arranged side by side to be spaced apart from each other so that the substrates to be inserted are spaced from each other and having a Teflon coating; A pair of hook portions formed on an upper side of the frame to suspend the frame on a hanger; And a plurality of lower substrate guides having a Teflon coating formed on the lowermost layer in a direction crossing the rods in order to prevent the inserted substrate from being separated from the outside.

Electroless, Plating, Basket, Basket, Plating Tank

Description

Electroless Plating Basket {Electroless plating basket}

1 is a perspective view of an electroless plating basket according to the prior art.

Figure 2 is a perspective view of an electroless plating basket according to an embodiment of the present invention.

 3A is a perspective view of the side substrate guide of FIG. 2, FIG. 3B is a front view of the side substrate guide of FIG. 2, FIG. 3C is a rear view of the side substrate guide of FIG. 2, FIG. 3D is a plan view of the side substrate guide, 3E is a bottom view of the side substrate guide.

4A is a perspective view of the bottom substrate guide of FIG. 2, FIG. 4B is a front view of the bottom substrate guide of FIG. 2, and FIG. 4C is a plan view of the bottom substrate guide of FIG. 2.

5A is a perspective view of the upper substrate guide of FIG. 2, FIG. 5B is a perspective view of the upper substrate guide fixing part of FIG. 2, and FIG. 5C is a perspective view of a slider of the upper substrate guide of FIG. 2.

6 is a partially enlarged view of the hook of FIG. 2;

7 is an exploded perspective view of the brace and the side substrate guide of FIG. 2.

<Explanation of symbols for the main parts of the drawings>

10 frame 12 side board guide

13: rod 14: hanger

15: upper substrate guide 16: lower substrate guide

The present invention relates to an electroless plating basket.

In particular, Teflon coating is applied to the basket to prevent plating on the basket, and the side board guide and the bottom substrate guide are formed of Teflon material to fix the substrate when inserting the substrate and to prevent the phenomenon of the plate guide being plated during plating. It relates to an electroless plating basket.

The printed circuit board includes a circuit pattern and a pad portion on a substrate, and in general, the circuit pattern and the pad portion are made of copper.

However, since the copper layer exposed to the outside is oxidized with time, the reliability of the semiconductor and the printed circuit board is degraded, and thus a gold plating process of the pad part is essentially performed as a surface treatment for preventing the copper layer.

On the other hand, in the electroless gold plating process, when the metal pad to be plated is required to have soldering characteristics, a thin gold plating having a thickness of 0.05 to 0.1 μm is applied through reduction gold plating, and bonding or the like is required. In this case, a thick gold plating of 0.5 μm or more is applied through substitutional gold plating.

For example, US Pat. No. 6,383,269 uses a solder mask to form an electroless nickel layer on a portion of a circuit pattern to be gold plated, and then includes gold containing potassium cyanide, one or more organic conductive salts, and one or more reducing agents. A method of manufacturing a printed circuit board by contacting an immersion plating liquid is disclosed.

U. S. Patent No. 5,178, 918 also discloses a method of electroless plating by contacting a gold immersion plating solution containing potassium cyanide, potassium hydroxide, potassium cyanide, an organic acid and a stabilizer on a substrate.

On the other hand, Japanese Patent Laid-Open No. 7-7243 forms an amorphous first electroless nickel film on a copper portion to be plated with gold, and forms a crystalline second electroless nickel film. An electroless gold plating method is disclosed. In addition, improved techniques for forming nickel-gold plated layers on copper layers are disclosed in US Pat. Nos. 5,173,130 and 5,235,139.

In this regard, a schematic gold plating process of a printed circuit board according to the related art will be described. After forming a patterned circuit and a pad portion on a substrate according to a method well known in the art, photo solder is formed on the remaining portions except the pad portion. A mask layer is formed.

Next, an electroless nickel plating solution mainly containing citric acid was treated on the pad portion for about 20 minutes at about 85 ° C. to form a nickel plating layer having a phosphorus content of about 5 to 8% having a thickness of about 3 to 6 μm. Let's do it. Then, the substitution type immersion gold plating solution is contacted on the nickel plating layer to form an electroless gold plating layer of 0.5 µm or more.

Electroless plating apparatuses, on the other hand, vary from simple devices that work manually using plating baths to automated mass production devices. Japanese Patent Application Laid-open No. Hei 5-98455 discloses a plating apparatus capable of forming a uniform plating film on a printed circuit board.

The disclosed plating apparatus includes a plating bath made of resin or an inert metal, a plating solution stored in the plating bath, a plated object, a hanger on which a plurality of plated objects are suspended, and a plated material hanging on a hanger by moving the hanger from side to side up and down, right and left, It is provided with the rocking apparatus which moves to up-and-down or zigzag, the plating liquid stirring means which circulates the plating liquid of a plating tank, and provides air.

Here, although not disclosed in detail in Japanese Patent Application Laid-Open No. 5-98455, the electroless plating apparatus according to the prior art uses a plating basket to suspend a plated object to a hanger, an example of which is shown in FIG. As described above, the front surface is opened and a multi-layer frame 1 and a pair of side substrate guides 2a, 2a ', 2b, 2b', 2c 'and 2c fixed to both sides of each layer of the frame 1 are fixed. '), A plurality of slides (3), each end of which is fixed to a pair of side substrate guides (2a, 2a', 2b, 2b ', 2c, 2c'), spaced at regular intervals and arranged side by side; A pair of hook parts 4 and 4 'for hanging the frame 1 on a hanger are provided.

The electroless plating basket according to the prior art has a problem that it is difficult to control the thickness of the gold plating because too much gold is deposited on the frame (1) and the shaft (3) during electroless gold plating.

In addition, the side substrate guides 2a, 2a ', 2b, 2b', 2c, and 2c 'formed on both sides of the frame 1 have a problem in that they are separated from the side when the plating liquid is stirred.

Furthermore, since the hook portions 4 and 4 'are hanged without any fixing means on the hangers, there is a problem that the frame 1 swings when the plating liquid is circulated.

In addition, when electroless gold plating, there is a problem that the substrate is separated to the upper side or the lower side by the stirring of the plating liquid and the vertical and horizontal movement by the rocking device of the frame (1).

The present invention for solving the above problems, the frame and the guide using a Teflon material and the side substrate guide using a Teflon material to reduce the amount of gold during plating and to provide an electroless plating basket It is done.

In addition, the present invention provides an electroless plating basket which further includes a lower substrate guide in the lowermost layer and an upper substrate guide in the upper layer so that the substrate does not escape during stirring of the plating liquid and swinging of the frame. It is for that purpose.

In addition, an object of the present invention is to provide a non-electrolytic plating basket which provides a fixing means capable of fixing the hanger for attaching the frame to the hanger to the hanger so that the frame does not shake when the frame swings.

The present invention for achieving the above object, the front surface is open, the multilayer is formed of a hexagonal frame having a Teflon coating; A plurality of side substrate guides fixed to both sides of each layer of the frame and formed of a pair of Teflon materials; A plurality of slides having respective ends of each end fixed to the pair of side substrate guides in each layer and arranged side by side to be spaced apart from each other so that the substrates to be inserted are spaced from each other and having a Teflon coating; A pair of hook portions formed on an upper side of the frame to suspend the frame on a hanger; And a plurality of lower substrate guides formed on a lowermost layer in a direction crossing the rods in order to prevent the inserted substrate from being separated from the outside, and having a Teflon coating.

Now, with reference to the drawings of Figure 2 will be described in detail the electroless plating basket according to an embodiment of the present invention.

2 is a perspective view of an electroless plating basket according to an embodiment of the present invention.

Referring to the drawings, the electroless plating basket according to an embodiment of the present invention is the front surface is open, a pair of side surfaces fixed to the side of each layer of the frame 10, the frame is formed of a multi-layer Each end of each end is fixed to the substrate guides 12a, 12a ', 12b, 12b', 12c, 12c 'and the pair of side substrate guides 12a, 12a', 12b, 12b ', 12c, 12c'. A plurality of guides 13, hangers 14 and 14 'for hanging the frame 10 on a hanger, and in a direction crossing the guides 13 on the lowermost layer and the uppermost side to prevent the substrate from being separated outwardly. The upper or lower substrate guides 15, 15 ', 16 and 16' are formed.

Here, the frame 10 has a rectangular parallelepiped shape because the length of the substrate to be plated as a hexagon is longer than the length of the plate, and forms a multilayer to properly fix the substrate so that the substrate vibrates severely during plating. To prevent it.

The frame 10 forms three layers in the figure, but the number of layers can be increased as necessary. However, if the number of layers is increased a lot, but the substrate is firmly fixed to the frame 10, the plating area is increased by that much, so that it may be difficult to control the plating thickness of the plating.

Side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'are provided on the side of each layer of the frame 10, and FIG. 3a in the drawing shows these side substrate guides 12a, 12a', 12b, 12b ', 12c, 12c', FIG. 3b is a front view of the side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c ', and FIG. 3c is a side substrate guide 12a, 12a', 12b, 12b ', 12c, 12c'), FIG. 3d is a top view of the side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c ', and FIG. 3e is a side substrate guide 12a, 12a ', 12b, 12b', 12c, 12c ').

As shown in the perspective view of FIG. 3A and the front view of FIG. 3B, the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'have accommodation grooves 20 through which the substrate can be accommodated in the longitudinal direction. ) Is formed in the plurality can be accommodated in the receiving groove 20 can be fixed.

At this time, the width of the receiving groove 20 formed in the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'may be slightly wider than the thickness of the substrate, because of the plating bath in which the basket is installed. Due to the high temperature, the side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c 'are able to expand in volume and thus reduce their width during plating so that such narrowing does not cause the substrate to warp. to be.

In addition, fixing grooves 22 and 22 'are formed at both sides of the side substrate guides 12a, 12a', 12b, 12b ', 12c, and 12c', as shown in the perspective view of FIG. The side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c 'can be firmly fixed to the frame 10 when inserted into the longitudinal braces.

In addition, a plurality of fixing grooves 23a, 23b, and 23c are formed in the bottom surface of the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c ', as shown in the bottom view of FIG. 3e. As shown in a partially enlarged perspective view of the frame of FIG. 7, the fixing rods 30a, 30b, and 30c of the frame 10 are fitted into the fixing grooves 23a, 23b, and 23c to guide the side substrate during the plating process. (12a, 12a ', 12b, 12b', 12c, 12c ') can be prevented from escaping outward.

In addition, the diameters of the fixing grooves 23a, 23b, 23c at the bottom of the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'are determined by the diameters of the fixing rods 30a, 30b, and 30c. When approximated, the adhesion of the fixing rods 23a, 23b, and 23c of the fixing rods 30a, 30b, and 30c is high, so that the side substrate guides 12a, 12a ', 12b, 12b', 12c 'and 12c' are applied during the plating process. It can be prevented from falling off.

Of course, the front surface of the side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c 'has a plurality of insertion grooves 32 are formed in the transverse direction so that both ends of the guide 13 can be inserted and fixed. do. At this time, the position of the insertion groove 32 is not important, but the fixing grooves 23a, 23b, and 23c of the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'are provided with the side substrate guides 12a, 12a ', 12b', 12b ', 12c' and 12c ', which are formed upward from the bottom surface and have a certain depth, the side substrate guides 12a, 12a', 12b, 12b ', 12c and 12c'. It is preferable that it is formed below.

Next, the slide 13 fixed to the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'is made of stainless steel, for example, and is coated with Teflon.

And, the base 13 is arranged side by side at a constant interval so that a plurality of substrates to be inserted to ensure a constant space between each other.

Here, the frame 10 and the base 13 is made of Teflon coating so that almost no gold is deposited during electroless gold plating, and as a result, it is possible to reduce the cost when cleaning the basket and to speed up the cleaning time. Make sure

In addition, the side substrate guides 12a, 12a ', 12b, 12b', 12c, and 12c 'and the lower surface substrate guides 16 and 16' are made of teflon, so that gold is hardly deposited during electroless gold plating. This will save money when cleaning the basket and reduce the cleaning time.

Meanwhile, the lower substrate guides 16 and 16 ′ in the lower layer of the frame 10 are rectangular pillars, and the uneven portions (not shown) are inserted into the substrate as shown in the perspective view of FIG. 4A and the front view of FIG. 4B. 40 is formed perpendicular to the longitudinal direction to fix the inserted substrate. Of course, the lower substrate guides 16 and 16 ′ may be formed in a cylindrical columnar shape as well as in a cylinder or the like.

4A and 4B, as shown in the front view, fixing grooves 42 and 42 ′ are formed at both side surfaces of the substrate guides 16 and 16 ′, so that the structure of the frame is inserted into the substrate guides ( 16, 16 'are securely fixed to the frame 10.

Although the lower surface substrate guides 16 and 16 'are provided with two in the drawing, the number of substrate guides 16 and 16' may be increased as necessary. Difficulties can arise.

Next, the top layer of the frame 10 has side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c in addition to the supporting structures of the side substrate guides 12a, 12a ', 12b, 12b', 12c, 12c '. ') Is further provided with fixing structures (18, 18') for firmly fixing the side substrate guides (12a, 12a ', 12b, 12b', 12c, 12c ') to the fixing structures (18a, 18'). Fix it tightly with fixing straps (19, 19 ').

In addition, upper substrate guides 15 and 15 'are formed on the upper surface of the uppermost layer. As shown in FIG. 5A, the upper substrate guides 15 and 15' are different from the lower substrate guides 16 and 16 '. 50), and the end portion 50 is bent as shown in the exploded perspective view of FIG. 5C.

The top substrate guides 15, 15 ′ are c-shaped high shown in the perspective view of FIGS. 5a and 5b installed on the front structure 11 and the back structure 11, 11 ′ of the frame 10. It is inserted into the fixing groove 53 formed in the government parts 51 and 51 'and is firmly fixed by the fixing rivets 52 and 52'.

On the other hand, hangers 14 and 14 'are formed on both sides of the uppermost layer, so that the basket can be placed in the plating bath by hanging the basket on the hanger of the plating apparatus.

A partial enlarged view of the hook portions 14 and 14 'is shown in FIG. 6, wherein the hook portions 14 and 14 are protrusions protruding from the C-shaped locking portion 60 and one surface of the locking portion 60. (62), a fixing screw (64) inserted into the through hole formed in the projection (62), and an operating lever (66) for winding the fixing screw (64).

The hook portions 14 and 14 'hang the C-shaped hook portion 60 on the hanger so that the basket is suspended on the hanger, and the operating lever 66 is rotated so that one side of the fixing screw 64 hangs forward. To make sure that it is tightly fixed to the hanger.

According to the present invention as described above, there is an effect to ensure the stability of the quality by fundamentally solving the possibility of foreign matters generated when the basket during the air shock for defoaming without the fixing device of the prior art.

In addition, according to the present invention, there is an effect to fundamentally eliminate the possibility of damage to the equipment and substrate damage that could be caused by interference with the inner wall of the tank by reducing the side width.

In addition, according to the present invention, by increasing the height of the side substrate guide of the intermediate portion to facilitate the insertion of the substrate and there is an effect that essentially eliminates the possibility of substrate damage due to the product missing.

In addition, according to the present invention, by installing the upper substrate guide for preventing the separation of the upper substrate of the basket, even during air shock for defoaming, it is stably maintained by the mounting of the substrate to prevent the phenomenon of plating on the substrate guide grooves due to substrate damage and plating solution pooling There is an effect that can lead to an improvement in quality or productivity.

In addition, according to the present invention, the lower substrate guide is further provided to prevent the substrate from leaving the lower surface, thereby solving the problem of unplating due to substrate breakage and inter-substrate contact.

Claims (4)

delete A hexagonal frame having an open front surface, including a plurality of side braces for forming layers on both sides thereof, and having a multi-layered structure and having a Teflon coating; A plurality of side substrate guides fixed to both sides of each layer of the frame and formed of a pair of Teflon materials; A plurality of slides having respective ends of each end fixed to the pair of side substrate guides in each layer and arranged side by side to be spaced apart from each other so that the substrates to be inserted are spaced from each other and having a Teflon coating; A pair of hook portions formed on an upper side of the frame to suspend the frame on a hanger; In order to prevent the substrate to be inserted is separated from the outside is formed in the direction crossing the rod on the lowermost layer, and includes a plurality of lower substrate guides having a Teflon coating, A plurality of fixing grooves are formed on the lower surface of the side substrate guide toward the upper side, and each side side brace of the frame is protruded upward in a rod shape and inserted into and fixed to the fixing groove of the side substrate guide. An electroless plating basket, characterized in that a fixed rod is formed. The method of claim 2, Both sides are fixed to the uppermost brace of the frame, the electroless plating basket further comprises a plurality of top substrate guides formed in a direction crossing the rod, to prevent the separation of the inserted substrate. The method of claim 2, The hook portion, A U-shaped locking portion formed above the frame to suspend the frame on a hanger; A protruding portion protruding from one surface of the locking portion and having a through hole formed therein; A fixing screw inserted into the through hole formed in the protrusion part; And An electroless plating basket comprising an actuating lever for winding the fixing screw.

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