KR100652290B1 - Orient plate - Google Patents

Orient plate Download PDF

Info

Publication number
KR100652290B1
KR100652290B1 KR1020020086373A KR20020086373A KR100652290B1 KR 100652290 B1 KR100652290 B1 KR 100652290B1 KR 1020020086373 A KR1020020086373 A KR 1020020086373A KR 20020086373 A KR20020086373 A KR 20020086373A KR 100652290 B1 KR100652290 B1 KR 100652290B1
Authority
KR
South Korea
Prior art keywords
orient
wafer
plate
pad
orient plate
Prior art date
Application number
KR1020020086373A
Other languages
Korean (ko)
Other versions
KR20040059868A (en
Inventor
김민선
Original Assignee
동부일렉트로닉스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동부일렉트로닉스 주식회사 filed Critical 동부일렉트로닉스 주식회사
Priority to KR1020020086373A priority Critical patent/KR100652290B1/en
Publication of KR20040059868A publication Critical patent/KR20040059868A/en
Application granted granted Critical
Publication of KR100652290B1 publication Critical patent/KR100652290B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

본 발명은 오리엔트 플레이트에 관한 것으로서, 상측면에 웨이퍼(W)가 안착되는 오리엔트 패드(11)가 설치되며, 하측에 모터(12)에 의해 회전하도록 회전축(13)이 형성되는 오리엔트 플레이트(10)에 있어서, 오리엔트 패드(11)는 링형상으로 형성되며, 그 중심이 오리엔트 플레이트(10)의 회전중심과 일치하도록 설치되는 것으로서, 웨이퍼가 오리엔트 패드에 안정적으로 지지되며, 오리엔트 플레이트로부터 웨이퍼가 슬라이딩됨을 미리 감지하여 오리엔트 플레이트의 회전을 정지시킴으로써 웨이퍼가 추락하여 파손되는 것을 방지하는 효과를 가지고 있다.The present invention relates to an orient plate, which has an orient pad (11) on which a wafer (W) is seated on an upper side, and an orient plate (10) on which a rotating shaft (13) is formed to rotate by a motor (12). In the orient pad 11 is formed in a ring shape, the center is installed so as to coincide with the center of rotation of the orient plate 10, the wafer is stably supported on the orient pad, the wafer is slid from the orient plate By detecting in advance the rotation of the orient plate has an effect of preventing the wafer from falling and breaking.

Description

오리엔트 플레이트{ORIENT PLATE}Orient Plate {ORIENT PLATE}

도 1은 종래의 오리엔트 플레이트를 도시한 정면도이고,1 is a front view showing a conventional orient plate,

도 2는 종래의 오리엔트 플레이트를 도시한 평면도이고,2 is a plan view showing a conventional orient plate,

도 3은 본 발명에 따른 오리엔트 플레이트를 도시한 정면도이고,3 is a front view showing an orient plate according to the present invention,

도 4는 본 발명에 따른 오리엔트 플레이트를 도시한 평면도이다.4 is a plan view showing an orient plate according to the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

10 ; 오리엔트 플레이트 11 ; 오리엔트 패드10; Orient plate 11; Orient Pad

12 ; 모터 13 ; 회전축12; Motor 13; Axis of rotation

14 ; 감지센서 15 ; 제어부14; Detecting sensor 15; Control

본 발명은 오리엔트 플레이트에 관한 것으로서, 보다 상세하게는 웨이퍼가 오리엔트 패드에 안정적으로 지지되며, 오리엔트 플레이트로부터 웨이퍼가 슬라이딩됨을 미리 감지하여 오리엔트 플레이트의 회전을 정지시키는 오리엔트 플레이트에 관한 것이다.The present invention relates to an orient plate, and more particularly, to an orient plate, in which a wafer is stably supported on an orient pad and stops rotation of the orient plate by detecting in advance that the wafer is slid from the orient plate.

일반적으로, 반도체 소자를 제조하기 위하여 여러 가지 단위공정을 거치게 되며, 이러한 단위 공정중 이온주입공정을 비롯한 몇몇 공정에서는 기준이 되는 패턴 방향에 맞추어 공정을 진행하게 된다. 따라서, 공정 진행전에 웨이퍼에 형성되 어 있는 반도체 소자의 패턴의 방향을 일정하게 맞추는 작업이 필수적이다.In general, the semiconductor device is subjected to various unit processes to manufacture a semiconductor device, and in some of the unit processes, including the ion implantation process, the process is performed in accordance with the reference pattern direction. Therefore, it is essential to constantly adjust the direction of the pattern of the semiconductor element formed on the wafer before the process proceeds.

종래의 공정 진행전에 웨이퍼에 형성되는 반도체 소자의 패턴의 방향을 일정하게 맞추는 오리엔트 플레이트를 첨부된 도면을 참조하여 설명하면 다음과 같다.Referring to the accompanying drawings, an orient plate for uniformly aligning the direction of a pattern of a semiconductor element formed on a wafer before proceeding with the conventional process is as follows.

도 1은 종래의 오리엔트 플레이트를 도시한 정면도이고, 도 2는 종래의 오리엔트 플레이트를 도시한 평면도이다. 도시된 바와 같이, 종래의 오리엔트 플레이트(1)는 상측면에 웨이퍼(W)의 일점을 각각 지지하는 세 개의 오리엔트 패드(1a)가 설치되며, 하측에 모터(1b)에 의해 회전하는 회전축(1c)이 구비된다.1 is a front view showing a conventional orient plate, Figure 2 is a plan view showing a conventional orient plate. As shown in the drawing, the conventional orient plate 1 has three orient pads 1a each supporting one point of the wafer W on an upper side thereof, and a rotating shaft 1c rotated by a motor 1b on the lower side thereof. ) Is provided.

이와 같은, 종래의 오리엔트 플레이트(1)는 세 개의 오리엔트 패드(1a)가 웨이퍼(W) 백면의 세 지점을 각각 지지하는데, 웨이퍼(W) 백면을 지지하는 오리엔트 패드(1a)의 면적이 작을 뿐만 아니라 웨이퍼(W) 백면을 연속적으로 지지하는 것이 아니라 단지 세 지점만을 지지하게 되어 오리엔트 플레이트(1)가 회전시 오리엔트 패드(1a)로부터 웨이퍼(W)가 슬라이딩되는 경우가 빈번하게 발생하는 문제점을 가지고 있었다.As described above, the conventional orient plate 1 has three orient pads 1a respectively supporting three points on the back surface of the wafer W, and the area of the orient pad 1a supporting the back surface of the wafer W is small. Instead, the wafer W does not support the back surface continuously but only three points, so that the wafer W frequently slides from the orient pad 1a when the orient plate 1 rotates. there was.

특히, 오리엔트 플레이트(1)를 자주 사용할 경우 웨이퍼(W) 백면에 부착된 PR 잔여물 및 기타 성분에 의해 오리엔트 패드(1a)가 오염되어 오리엔트시 웨이퍼(W)와 오리엔트 패드(1a)와의 접촉력이 떨어져서 오리엔트 플레이트(1) 회전시 웨이퍼(W)가 오리엔트 플레이트(1)로부터 추락하여 지면과의 충돌로 파손되는 문제점을 가지고 있었다.In particular, when the orient plate 1 is frequently used, the orient pad 1a is contaminated by the PR residue and other components attached to the back surface of the wafer W, so that the contact force between the wafer W and the orient pad 1a at the time of orientation is reduced. When the orientation of the orient plate 1 is rotated, the wafer W has fallen from the orient plate 1 and has a problem of being damaged by collision with the ground.

본 발명은 상술한 종래의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 웨이퍼가 오리엔트 패드에 안정적으로 지지되며, 오리엔트 플레이트로부터 웨이퍼가 슬라이딩됨을 미리 감지하여 오리엔트 플레이트의 회전을 정지시킴으로써 웨이퍼가 추락하여 파손되는 것을 방지하는 오리엔트 플레이트를 제공하는데 있다.The present invention is to solve the above-mentioned conventional problems, the object of the present invention is that the wafer is stably supported on the orient pad, the wafer is dropped by stopping the rotation of the orient plate in advance by detecting that the wafer is slid from the orient plate An orient plate is provided to prevent breakage.

이와 같은 목적을 실현하기 위한 본 발명은, 하측에 회전축이 형성되는 오리엔트 플레이트에 있어서, 상측면에 웨이퍼가 안착되도록 설치되고, 웨이퍼의 백면을 원을 따라 연속적으로 지지하도록 상측에 지지면이 형성됨과 아울러 링형상으로 형성되며, 그 중심이 오리엔트 플레이트의 회전중심과 일치하는 오리엔트 패드와, 회전축을 회전시키는 모터와, 오리엔트 패드에 장착된 웨이퍼 부근의 하측으로 치우치도록 설치되고, 웨이퍼의 가장자리에 인접하여 수직되게 통과하도록 빛을 출력하며, 웨이퍼가 오리엔트 패드로부터 슬라이딩시 웨이퍼에 의해 반사되는 빛을 도로 수신받아 웨이퍼 감지신호를 출력하는 감지센서와, 감지센서로부터 출력되는 웨이퍼 감지신호를 수신받아서 모터를 정지시키도록 제어신호를 출력하는 제어부를 포함하는 것을 특징으로 한다.The present invention for achieving the above object is, in an orient plate having a rotating shaft formed on the lower side, the upper surface is installed so that the wafer is seated, the support surface is formed on the upper side to continuously support the back surface of the wafer along the circle and In addition, it is formed in a ring shape, and its center is installed so as to be biased downwardly in the vicinity of the wafer mounted on the orient pad, an orient pad having a center of rotation of the orient plate, a motor for rotating the rotation axis, and an orient pad. Outputs light to pass vertically, and receives the light reflected by the wafer when the wafer slides from the orient pad, and outputs the wafer detection signal, and receives the wafer detection signal output from the detection sensor to operate the motor. Comprising a control unit for outputting a control signal to stop It characterized.

이하, 본 발명의 가장 바람직한 실시예를 첨부한 도면을 참조하여 본 발명의 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 더욱 상세히 설명하기로 한다.DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

도 3은 본 발명에 따른 오리엔트 플레이트를 도시한 정면도이고, 도 4는 본 발명에 따른 오리엔트 플레이트를 도시한 평면도이다. 도시된 바와 같이, 본 발명에 따른 오리엔트 플레이트(10) 상측면에 링형상으로 형성됨과 아울러 그 중심이 오리엔트 플레이트(10)의 회전중심과 일치하도록 오리엔트 패드(11)가 설치되며, 하측에 모터(12)에 의해 회전하는 회전축(13)이 형성된다.Figure 3 is a front view showing an orient plate according to the present invention, Figure 4 is a plan view showing an orient plate according to the present invention. As shown, the orient plate 11 is formed in a ring shape on the upper side of the orient plate 10 according to the present invention, the orient pad 11 is installed so that its center coincides with the rotation center of the orient plate 10, and the motor ( The rotating shaft 13 which rotates by 12) is formed.

오리엔트 패드(11)는 하나로 이루어져 있으며, 상측에 웨이퍼(W) 백면을 지지하도록 지지면(11a)이 형성된다. The orient pad 11 consists of one, and the support surface 11a is formed in the upper side so that the back surface of the wafer W may be supported.                     

한편, 본 발명에 따른 오리엔트 플레이트(10)는 오리엔트 패드(11)로부터 웨이퍼(W)가 슬라이딩시 이를 감지하여 모터(12)를 정지시키기 위하여 감지센서(14)와, 제어부(15)를 포함할 수 있다.Meanwhile, the orient plate 10 according to the present invention may include a detection sensor 14 and a controller 15 to stop the motor 12 by detecting the wafer W when the wafer W is sliding from the orient pad 11. Can be.

감지센서(14)는 도 3에 도시된 바와 같이, 오리엔트 패드(11)에 장착된 웨이퍼(W) 부근의 하측으로 치우치도록 설치되고, 오리엔트 패드(11)상의 웨이퍼(W) 가장자리와 인접하는 곳을 수직되게 통과하도록 빛을 출력하며, 웨이퍼(W)가 오리엔트 패드(11)로부터 슬라이딩시 웨이퍼(W)에 의해 반사되는 빛을 도로 수신받아 웨이퍼 감지신호를 제어부(15)로 출력한다.As shown in FIG. 3, the sensing sensor 14 is installed to be biased downward near the wafer W mounted on the orient pad 11 and adjacent to the edge of the wafer W on the orient pad 11. The light is output so as to vertically pass through the place, and the wafer W receives the light reflected by the wafer W when the wafer W slides from the orient pad 11 and outputs a wafer detection signal to the controller 15.

제어부(15)는 감지센서(14)로부터 출력되는 웨이퍼 감지신호를 수신받아 오리엔트 패드(11)로부터 웨이퍼(W)가 슬라이딩됨을 인식하여 모터(12)를 정지시키는 제어신호를 출력하여 모터(12)를 정지시킨다.The controller 15 receives the wafer detection signal output from the detection sensor 14, recognizes that the wafer W is sliding from the orient pad 11, and outputs a control signal for stopping the motor 12 to output the motor 12. To stop.

이와 같은 구조로 이루어진 오리엔트 플레이트(10)의 동작은 다음과 같이 이루어진다.Operation of the orient plate 10 having such a structure is made as follows.

오리엔트 패드(11)가 링형상으로 형성되어 오리엔트 패드(11)의 상측면이 웨이퍼(W) 백면에서 어느 지점만을 지지하는 것이 아니라 원을 따라 연속적으로 지지함으로써 오리엔트 패드(11)가 웨이퍼(W)를 안정적으로 지지한다.The orient pad 11 is formed in a ring shape so that the upper surface of the orient pad 11 is continuously supported along a circle instead of supporting only a certain point on the back surface of the wafer W. Support stably.

또한, 오리엔트 플레이트(10)가 회전할 때 오리엔트 패드(11)로부터 웨이퍼(W)가 슬라이딩시 감지센서(14)로부터 수직 상방향으로 출력되는 빛을 차단하여 반사시킴으로써 반사된 빛을 감지센서(14)가 도로 수신받아서 웨이퍼감지신호를 제어부(15)로 출력하며, 제어부(15)는 감지센서(14)로부터 웨이퍼감지신호를 수신받아 모터(12)가 정지하도록 제어한다. In addition, when the orient plate 10 rotates, when the wafer W is slid from the orient pad 11, the light reflected by blocking and reflecting the light output from the detection sensor 14 in the vertical upward direction is detected. ) Receives the road and outputs a wafer detection signal to the controller 15, and the controller 15 receives the wafer detection signal from the detection sensor 14 and controls the motor 12 to stop.                     

따라서, 웨이퍼(W)가 슬라이딩됨을 미리 감지하여 오리엔트 플레이트(10)의 회전을 정지시킴으로써 웨이퍼가 추락하여 파손되는 것을 방지한다.Therefore, the wafer W is detected in advance and the rotation of the orient plate 10 is stopped to prevent the wafer from falling and breaking.

상술한 바와 같이, 본 발명에 따른 오리엔트 플레이트는 웨이퍼가 오리엔트 패드에 안정적으로 지지되며, 오리엔트 플레이트로부터 웨이퍼가 슬라이딩됨을 미리 감지하여 오리엔트 플레이트의 회전을 정지시킴으로써 웨이퍼가 추락하여 파손되는 것을 방지하는 효과를 가지고 있다. As described above, the orient plate according to the present invention has an effect that the wafer is stably supported by the orient pad, and the wafer is slid from the orient plate in advance to stop the rotation of the orient plate to prevent the wafer from falling and breaking. Have.

이상에서 설명한 것은 본 발명에 따른 오리엔트 플레이트를 실시하기 위한 하나의 실시예에 불과한 것으로서, 본 발명은 상기한 실시예에 한정되지 않고, 이하의 특허청구범위에서 청구하는 바와 같이 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변경 실시가 가능한 범위까지 본 발명의 기술적 정신이 있다고 할 것이다.What has been described above is only one embodiment for carrying out an orient plate according to the present invention, and the present invention is not limited to the above-described embodiment, and is not limited to the scope of the present invention as claimed in the following claims. Without this, anyone skilled in the art to which the present invention pertains will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims (2)

하측에 회전축이 형성되는 오리엔트 플레이트에 있어서,In the orient plate in which the rotating shaft is formed on the lower side, 상측면에 웨이퍼가 안착되도록 설치되고, 상기 웨이퍼의 백면을 원을 따라 연속적으로 지지하도록 상측에 지지면이 형성됨과 아울러 링형상으로 형성되며, 그 중심이 상기 오리엔트 플레이트의 회전중심과 일치하는 오리엔트 패드와,An orient pad is installed on the upper side so that the wafer is seated, and a support surface is formed on the upper side to continuously support the back surface of the wafer along a circle, and is formed in a ring shape, and an orient pad whose center coincides with the center of rotation of the orient plate Wow, 상기 회전축을 회전시키는 모터와,A motor for rotating the rotary shaft; 상기 오리엔트 패드에 장착된 상기 웨이퍼 부근의 하측으로 치우치도록 설치되고, 상기 웨이퍼의 가장자리에 인접하여 수직되게 통과하도록 빛을 출력하며, 상기 웨이퍼가 상기 오리엔트 패드로부터 슬라이딩시 상기 웨이퍼에 의해 반사되는 빛을 도로 수신받아 웨이퍼 감지신호를 출력하는 감지센서와,Installed to be biased downward near the wafer mounted on the orient pad, and outputs light to pass vertically adjacent the edge of the wafer, and is reflected by the wafer when the wafer is slid from the orient pad A detection sensor that receives the signal back and outputs a wafer detection signal; 상기 감지센서로부터 출력되는 웨이퍼 감지신호를 수신받아서 상기 모터를 정지시키도록 제어신호를 출력하는 제어부A controller which receives a wafer detection signal output from the detection sensor and outputs a control signal to stop the motor 를 포함하는 오리엔트 플레이트.Orient plate comprising a. 삭제delete
KR1020020086373A 2002-12-30 2002-12-30 Orient plate KR100652290B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020020086373A KR100652290B1 (en) 2002-12-30 2002-12-30 Orient plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020086373A KR100652290B1 (en) 2002-12-30 2002-12-30 Orient plate

Publications (2)

Publication Number Publication Date
KR20040059868A KR20040059868A (en) 2004-07-06
KR100652290B1 true KR100652290B1 (en) 2006-11-29

Family

ID=37351832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020086373A KR100652290B1 (en) 2002-12-30 2002-12-30 Orient plate

Country Status (1)

Country Link
KR (1) KR100652290B1 (en)

Also Published As

Publication number Publication date
KR20040059868A (en) 2004-07-06

Similar Documents

Publication Publication Date Title
US6471464B1 (en) Wafer positioning device
US6743076B2 (en) Dicing machine
KR100652290B1 (en) Orient plate
US20190076961A1 (en) Laser processing apparatus
US20020005958A1 (en) Non-contact thickness-measuring device
JPH07120237A (en) Picture recognizing device
US5834645A (en) Methods and apparatus for the in-process detection of workpieces with a physical contact probe
CN100342516C (en) Wafer edge detector
JP2012069677A (en) Grinding apparatus
JP5662734B2 (en) Grinding equipment
JP6300653B2 (en) Grinding method
CN114734332A (en) Grinding device
JPH0817897A (en) Method for positioning wafer and manufacturing semiconductor device
JPH06169012A (en) Manufacture of dicer and semiconductor pellet
KR19990030721A (en) Wafer Rotator with Sensor to Detect Wafer Level
KR100552804B1 (en) Apparatus and method for preventing falling of wafer
CN117672885A (en) Substrate processing apparatus, control method therefor, and control apparatus
KR20010027131A (en) Apparatus for performing chemical and mechanical polishing in semiconductor processing
JP2002217159A (en) Semiconductor substrate cleaning apparatus
KR100215828B1 (en) Semiconductor manufacturing device
JP2003109999A (en) Substrate treatment device
JPH08315762A (en) Ion implantation device and ion implantation method
KR20030037009A (en) A spin scrubber for semiconductor processing
JP2002039728A (en) Method for recognizing mounting state of plate body on machine tool
KR100671557B1 (en) Edge bead remover

Legal Events

Date Code Title Description
N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20091026

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee