KR100215828B1 - Semiconductor manufacturing device - Google Patents
Semiconductor manufacturing device Download PDFInfo
- Publication number
- KR100215828B1 KR100215828B1 KR1019960052562A KR19960052562A KR100215828B1 KR 100215828 B1 KR100215828 B1 KR 100215828B1 KR 1019960052562 A KR1019960052562 A KR 1019960052562A KR 19960052562 A KR19960052562 A KR 19960052562A KR 100215828 B1 KR100215828 B1 KR 100215828B1
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- wafer
- gas
- cassette
- semiconductor manufacturing
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 반도체 제조장치에 관한 것으로, 특히 웨이퍼를 감지하는데 적당하도록 한 반도체 제조장치에 관한 것이다.TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a semiconductor manufacturing apparatus adapted to detect a wafer.
이를위한 본 발명의 반도체 제조장치는 슬랫트가 있어 상기 슬랫트상에 웨이퍼를 위치 시키는 카세트부와; 상기 카세트부에 가스를 분출하는 가스 분출부와; 상기 가스 분출부에서 분출된 가스를 상기 카세트부를 통해 감지하여 웨이퍼 유무를 판단하는 센서가 있는 웨이퍼 감지부를 포함하여 구성됨을 특징으로 한다.The semiconductor manufacturing apparatus of the present invention for this purpose has a slat and a cassette for positioning the wafer on the slat; A gas ejection section for ejecting gas into the cassette section; And a wafer detection unit having a sensor for detecting a gas ejected from the gas ejection unit through the cassette to determine the presence or absence of a wafer.
Description
본 발명은 반도체 제조장치에 관한 것으로, 특히 웨이퍼를 감지하는데 적당하도록 한 반도체 제조장치에 관한 것이다.TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a semiconductor manufacturing apparatus adapted to detect a wafer.
이하, 첨부된 도면을 참조하여 종래의 반도체 제조장치에 대하여 설명하면 다음과 같다.Hereinafter, a conventional semiconductor manufacturing apparatus will be described with reference to the accompanying drawings.
도 1은 종래의 웨이퍼 감지 장치의 펑면도이다.1 is a plan view of a conventional wafer sensing device.
도 1에 도시한 바와같이 웨이퍼 감지 장치는 각 슬랫트(slate)가 있어 상기 슬랫트상에 웨이퍼를 위치 시키는 카세트부(2)와, 상기 카세트부(2)에 광센서(Optical Sensor)가 있어 레이져 빔을 조사 시키는 발광부(1)와, 상기 발광부(1)에서 조사한 레이져 빔을 상기 카세트부(2)를 통해 감지하여 웨이퍼 유무를 판단하는 센서(senser)가 있는 수광부(3)로 구성되어 있다.As shown in FIG. 1, the wafer sensing apparatus has a respective slat, which includes a cassette unit 2 for placing a wafer on the slat, and an optical sensor in the cassette unit 2. It consists of a light emitting unit (1) for irradiating the beam, and a light receiving unit (3) having a sensor (senser) for detecting the presence or absence of a wafer by detecting the laser beam irradiated from the light emitting unit (1) have.
여기서 발광부(1) 혹은 카세트부(2)에 구동 모터가 있어, 발광부(1) 또는 카세트부(2)를 승강과 하강을 시킨다.Here, there is a drive motor in the light emitting portion 1 or the cassette portion 2, which causes the light emitting portion 1 or the cassette portion 2 to be raised and lowered.
이와같은 종래의 웨이퍼 감지장치의 동작을 설명하면 다음과 같다.Referring to the operation of the conventional wafer detection device as follows.
먼저, 발광부(1)의 구동 모터를 동작시켜 상기 발광부(1)을 아래로 부터 위로 움직이면서 카세트부(2)의 각 슬랫트 별로 레이져 빔을 조사시켜 웨이퍼를 통과한 빛과 웨이퍼에 막혀 통과하지 못한 빛을 수광부(3)의 센서가 감지하여 웨이퍼의 유무를 판단한다.First, the driving motor of the light emitting unit 1 is operated to move the light emitting unit 1 from the bottom up to irradiate a laser beam for each slat of the cassette unit 2 to block the light passing through the wafer and the wafer. The sensor of the light-receiving unit 3 detects the light that failed to determine whether the wafer is present.
이어서, 다시 상기 발광부(1)을 위로 부터 아래로 움직이면서 카세트부(2)의 각 슬랫트 별로 레이져 빔을 조사시켜 웨이퍼를 통과한 빛과 웨이퍼에 막혀 통과하지 못한 빛을 수광부(3)의 센서가 감지하는 동작을 반복하여 웨이퍼 유무 판단에 대한 확인작업을 한다.Subsequently, while moving the light emitting unit 1 from top to bottom, the laser beam is irradiated for each slat of the cassette unit 2 so that the light passing through the wafer and the light not blocked by the wafer are not passed through the sensor of the light receiving unit 3. Repeats the sensing operation to check the wafer presence.
여기서 발광부(1)의 구동 모터가 동작하여 승강, 하강 할수도 있고, 카세트부(2)의 구동 모터가 동작하여 승강, 하강 할수도 있다.In this case, the driving motor of the light emitting unit 1 may operate to move up and down, and the drive motor of the cassette unit 2 may operate to move up and down.
그러나 이상에서 설명한 바와같이 종래의 반도체 제조장치에 있어서는 다음과 같은 문제점이 있었다.However, as described above, the conventional semiconductor manufacturing apparatus has the following problems.
첫째, 웨이퍼를 하나하나 개별적으로 인식해야 하므로 처리능력이 떨어진다. 둘째, 발광부 또는 카세트부를 구동 모터로 동작하므로 구동 모터를 동작 시키기 위한 제어부 구정이 복잡하다.First, the wafers need to be individually recognized, resulting in poor throughput. Second, since the light emitting unit or the cassette unit operates as a driving motor, the control unit for operating the driving motor is complicated.
셋째, 발광부에 고가의 광센서를 사용해야 한다.Third, an expensive optical sensor should be used for the light emitting part.
본 발명은 이와같은 문제점을 해결하기 위하여 안출한 것으로 가스를 이용하여 웨이퍼 감지를 인식하는 웨이퍼 감지장치를 제공하는데 그 목적이 있다.An object of the present invention is to provide a wafer sensing device for recognizing wafer detection using a gas to solve such a problem.
도 1은 종래의 웨이퍼 감지 장치 평면도1 is a plan view of a conventional wafer sensing device
도 2는 본 발명의 웨이퍼 감지 장치 펑면도Figure 2 is a plan view of the wafer sensing device of the present invention
도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings
20 : 가스 분출부 21 : 카세트부20 gas ejection part 21 cassette part
22 : 웨이퍼 감지부22: wafer detection unit
이와같은 목적을 달성하기 위한 본 발명의 반도체 제조장치는 슬랫트가 있어 상기 슬랫트상에 웨이퍼를 위치시키는 카세트부와;상기 카세트부에 가스를 분출하는 가스 분출부와; 상기 가스 분출부에서 분출된 가스를 상기 카세트부를 통해 감지하여 웨이퍼 유무를 판단하는 센서가 있는 웨이퍼 감지부를 포함하여 구성됨을 특징으로 한다.The semiconductor manufacturing apparatus of the present invention for achieving the above object includes a cassette having a slat to position the wafer on the slat; a gas ejecting portion for ejecting gas into the cassette; And a wafer detection unit having a sensor for detecting a gas ejected from the gas ejection unit through the cassette to determine the presence or absence of a wafer.
이하, 첨부된 도면을 참조하여 본 발명의 반도체 제조장치에 대하여 보다 상세히 설명하면 다음과 같다.Hereinafter, a semiconductor manufacturing apparatus of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 웨이퍼 감지 장치 평면도이다.2 is a plan view of a wafer sensing apparatus of the present invention.
도 2에 도시한 바와같이 슬랫트가 있어 상기 슬랫트상에 웨이퍼를 위치시키는 카세트부(21)와, 상기 카세트부(21)에 가스를 분출 시키는 가스 분출부(20)와,상기 가스 분출부(20)에서 분출한 가스를 상기 카세트부(21)를 통해 감지하여 웨이퍼 유무를 판단하는 센서가 있는 웨이퍼 감지부(22)로 구성되어 있다. 이때, 가스분출부(20)에서 분출하는 가스는 N2가스를 사용하고, 웨이퍼 감지부(22)에 가스센서 또는 압력센서를 설치한다.As shown in FIG. 2, a cassette section 21 for placing a wafer on the slat, a gas ejection section 20 for ejecting gas into the cassette section 21, and a gas ejection section ( 20 is a wafer detection unit 22 having a sensor for detecting the presence of the wafer by detecting the gas ejected from the cassette 21. In this case, the gas ejected from the gas ejection unit 20 uses N 2 gas, and a gas sensor or a pressure sensor is installed in the wafer detection unit 22.
이와같은 본 발명의 웨이퍼 감지 장치의 동작을 설명하면 다음과 같다.Referring to the operation of the wafer detection device of the present invention as follows.
가스 분출부(20)에서 카세트부(21) 전면에 가스를 불어주게 되면 상기 가스분출부(20)의 가스가 웨이퍼가 있는 카세트부(21)를 통과하여 웨이퍼 감지부(22)의 가스센서 또는 압력센서가 웨이퍼의 유무를 판단한다.When gas is blown from the gas ejection unit 20 to the front of the cassette unit 21, the gas of the gas ejection unit 20 passes through the cassette unit 21 in which the wafer is located, so that the gas sensor of the wafer detection unit 22 or The pressure sensor determines the presence of the wafer.
여기서 카세트부(21) 전면에 일정한 압력으로 고르게 뷸어준 가스는 일정한 유체 역학적 거동을 하며 카세트부(21)를 통과하고, 상기 카세트부(21)의 슬랫트상에 웨이퍼가 놓여진 경우 그 웨이퍼를 통과 할때도 일정한 유체 역학적 거동을 한다.Here, the gas which is uniformly bent at a constant pressure on the front surface of the cassette unit 21 passes through the cassette unit 21 with a constant hydrodynamic behavior, and when the wafer is placed on the slat of the cassette unit 21, the gas may pass through the wafer. Even during certain hydrodynamic behavior.
이상에서 설명한 바와같이 본 발명의 반도체 제조장치에 있어서는 다음과 같은 효과가 있다.As described above, the semiconductor manufacturing apparatus of the present invention has the following effects.
전면에 걸친 조사가 가능하므로 승강, 하강하는 구동 모터가 뷸필요하고, 단 한번의 가스 분출로서 웨이퍼 유무를 판단한다.Since the survey can be conducted over the entire surface, a driving motor for raising and lowering is needed, and the presence or absence of a wafer is determined by a single gas ejection.
따라서 기존의 장비보다 제조비용을 절감하고 웨이퍼 처리능력이 향상한다.This reduces manufacturing costs and improves wafer throughput than conventional equipment.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960052562A KR100215828B1 (en) | 1996-11-07 | 1996-11-07 | Semiconductor manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960052562A KR100215828B1 (en) | 1996-11-07 | 1996-11-07 | Semiconductor manufacturing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980034503A KR19980034503A (en) | 1998-08-05 |
| KR100215828B1 true KR100215828B1 (en) | 1999-08-16 |
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ID=19481040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960052562A KR100215828B1 (en) | 1996-11-07 | 1996-11-07 | Semiconductor manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100215828B1 (en) |
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1996
- 1996-11-07 KR KR1019960052562A patent/KR100215828B1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR19980034503A (en) | 1998-08-05 |
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