KR100648354B1 - Cooling apparatus type computer using micro cooling system - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for a computer, in particular to a cooling device using a thin plate cooling means.

The cooling device for a computer according to the present invention includes a heat sink having a heat dissipation fan on one side and a seating groove therein; An MCS seating portion seated on an inner center bottom of the heat sink; The refrigeration cycle is bonded to the upper surface of the MCS seating portion and the opposite side is opposed to the CPU of the motherboard, and the heat exchange is repeated by condensation and vaporization by using capillary phenomenon for heat cooling generated from the CPU. Thin plate cooling means; It characterized in that it comprises a coil spring for giving a predetermined elasticity when fastening the motherboard to the heat sink for protection of the CPU and the thin plate-shaped cooling means.

Heat sink, heat sink, CPU, cooling means

Description

Cooling apparatus type computer using micro cooling system

1 is a block diagram showing a conventional notebook computer cooling device.

Figure 2 is an exploded perspective view of a computer cooling device using a thin plate cooling means according to an embodiment of the present invention.

Figure 3 is a combined state of the computer cooling device using a thin plate cooling means according to an embodiment of the present invention.

Figure 4 is an illustration of the coupling of the cooling device for a computer using a thin plate cooling means according to an embodiment of the present invention.

5 is a plan view of a thin plate cooling means according to an embodiment of the present invention.

6 is a cross-sectional view taken along line AA ′ of FIG. 5.

FIG. 7 is a cross-sectional view taken along line BB ′ of FIG. 5.

8 is a cross-sectional view taken along line CC ′ of FIG. 5.

<Description of the symbols for the main parts of the drawings>

100 ... heat sink 110 ... heat sink

120 ... Thin-plate Cooling Unit 130 ... CPU                 

101 ... sitting groove 102 ... MCS seat

104 Guide protrusion 106 Screw hole

107,109 ... screw 108 ... coil spring

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for a computer in a portable computer, in particular using a thin plate cooling means (MCS).

In recent years, the design rule is reduced according to the trend of high integration of semiconductor devices, and as the line width of the electronic circuits constituting the semiconductor devices is reduced, the number of devices per unit area increases, thereby increasing the number of devices. Miniaturization and high performance have been achieved, but heat dissipation rate per unit area of the semiconductor chip is further increased. This increase in heat dissipation rate degrades the performance of the semiconductor device, shortens the lifespan and ultimately degrades the reliability of the system employing the semiconductor device. In particular, in the semiconductor device, various parameter values are sensitively changed according to the operating temperature, thereby deteriorating the characteristics of the integrated circuit.

As the heat dissipation rate is increased, cooling technology has also been developed. As a conventional cooling technology, a fin fan cooling method, a thermoelectric cooling method, a water-jet cooling method, and an immersion method are used. ) Cooling method, heat pipe cooling method.                         

The fin fan cooling method is a method of forced cooling by using a fin and a fan, but has been used for many decades, but has a problem of low cooling efficiency compared to noise, vibration, and a large volume. In recent years, due to the problem that the heat generated from the fan car is necessary, the trend has been avoided.

The thermoelectric element cooling method using the Peltier effect has no noise and vibration, but a large driving power source is required, and according to the energy conservation law, there is a problem that an excessive heat dissipation device is required at the hot junction. In addition, the liquid injection cooling method is excellent in efficiency and the mainstream of the cooler research, but the structure is complicated and there is a problem that a pump driving power for the injection is required. Meanwhile, in the case of the submersible cooling method, there is a natural cycle thermosyphon which does not require a separate driving power, but since it is heavily influenced by gravity, it is robust when applied to personal portable electronic equipment. There is a problem that is difficult.

Due to the above problems, the heat pipe cooling method has been widely applied in various shapes as a compact cooling device due to the advantages that the structure is simple and easy to manufacture.

In the recently released processors, the CPU is modularized and detachable to a connector installed on the motherboard. When the CPU is modularized, upgrade is possible when a new CPU module is released. In other words, in the past, only desktop PCs can be upgraded, and in the case of notebook computers, upgrades are not possible due to CPUs attached to the motherboard, but upgrades are possible due to the modularization of the CPU.

As the modularization of the CPU in the notebook computer as described above, there is a need to change the structure of the heat dissipation module for dissipating heat generated by the CPU during the operation of the system. At this time, the heat generated from the CPU causes a malfunction and at the same time shortens the life of the product, so a structure for quickly dissipating heat is required.

1 is a view showing a heat radiation structure of a notebook computer according to the prior art.

Referring to FIG. 1, a thermal pad 12 is disposed on an upper portion of the CPU 11, and first and second heat sinks 13 and 14 are disposed thereon. In this case, the first and second heat sinks 13 and 14 are connected by a heat pipe 15. The reason why the heat sink is divided into the first and second heat sinks 13 and 14 is to disassemble the first heat sink 13 and replace the CPU 11 immediately without disassembling many parts during the upgrade operation. For sake.

In addition to the above configuration, the notebook computer is provided with a fan 16 for quickly dissipating the heat inside.

As a result, looking at the heat dissipation path in the conventional heat dissipation structure, the heat generated during operation in the CPU 11 is the heat transfer pad 12, the first heat sink 13, the heat pipe 15, the second heat sink 14 ) Is sequentially emitted to the interior space of the notebook computer. At this time, the fan 16 is operated to exchange the heated air inside with the cold air outside to cool down the space inside the notebook computer.

However, the heat dissipation structure of the notebook computer according to the prior art as described above should be in close contact with the heat transfer pad 12 and the first heat dissipation plate 13 attached to the upper surface of the CPU 11 to be in close contact with a screw during installation. This is a cumbersome problem.

In addition, since the heat sinks 13 and 14 are separated into two, and the heat sinks are connected to each other by a heat pipe, there is a problem that the heat transfer surface is reduced and the heat dissipation efficiency is lowered.

The present invention has been made to solve the above problems, to provide a fixing device of the thin plate-shaped cooling means that circulates naturally with little influence of gravity without the supply of external power.

The first purpose is to position the thin plate cooling unit seated inside the heat sink having a heat dissipation fan on one side to a predetermined height, and to fix the CPU to the upper surface of the thin plate cooling means, so that the thin plate cooling means together with the heat dissipation of the CPU, It is an object of the present invention to provide a cooling device for a computer using a thin plate cooling means that can be mounted on the device.

The second object is to provide a cooling device for a computer using a thin plate cooling means made of a glass or copper material, the thin plate cooling means can be fastened between the heat sink and the motherboard by a coil spring for close contact with the CPU. There is this.

Cooling device for a computer using a thin plate cooling means according to the present invention for achieving the above object,

In the cooling device for a computer,                     

A heat sink having a heat dissipation fan on one side and a seating groove therein;

An MCS seating portion seated on an inner center bottom of the heat sink;

Thin plate cooling means having a refrigeration cycle that is bonded to the upper surface of the MCS seating portion and opposite to the processor, the heat exchange is repeated by condensation and vaporization by using capillary phenomenon for heat cooling generated from the processor. Characterized in that it comprises a.

Preferably, the method further includes a coil spring for giving a predetermined elasticity to the screw fastening degree between the motherboard and the heat sink to protect the processor and the thin plate cooling means.

Preferably, the heat sink and the MCS seating portion is screwed and then taped, and the MCS seating portion and the thin plate cooling means are made of copper and are brazed.

Preferably, the heat dissipation plate is formed on the outer periphery on which the MCS seat is seated, thereby forming a plurality of guide protrusions having a seating surface having a predetermined height to prevent separation, and the thin plate cooling means is parallel to the seat by the MCS seat and the seating surface. It is done.

Hereinafter, with reference to the accompanying drawings as follows.

2 is an exploded perspective view of a computer cooling apparatus using a thin plate cooling means according to an embodiment of the present invention, Figure 3 is a combined state diagram of a computer cooling apparatus using a thin plate cooling means according to an embodiment of the present invention.

2 and 3, a heat sink 100 having a seating portion 102 and a guide protrusion 104 as an inner groove 101, a heat dissipation fan 110 coupled to one side of the heat sink, and the heat sink ( Thin plate cooling means 130 having a refrigeration cycle that is bonded to the upper surface of the MCS seating part 102 of 100) and the opposite side thereof faces the CPU, and performs heat exchange by repeating condensation and vaporization by using capillary action. And, the heat sink 100 is configured to include a coil spring 108 and a screw 109 to give elasticity according to the fastening onto the CPU of the motherboard.

Referring to the accompanying drawings, a computer cooling apparatus using a thin plate cooling means according to an embodiment of the present invention configured as described above is as follows.

Referring to FIG. 2, the cooling device includes a heat dissipation plate 100, a heat dissipation fan 110, and a thin plate cooling means (MCS: Micro cooling system) 120 to cool the CPU 130. The inside has a seating groove 101 that can be coupled to the thin plate-shaped cooling means 120 and the CPU 130, the heat dissipation fan 101 is coupled to one side, the heat generated from the CPU 130 inside the heat sink to the outside Discharged.

The heat sink 100 is made of aluminum, the MCS seat 102 is protruded and coupled to the center of the mounting groove 101. Here, the MCS seating part 102 is made of copper, and the screw 107 is fastened to the screw hole 102a from the outside to the inside to be tapped.

On the upper surface of the MCS seat 102, a thin plate cooling means (MCS) 120 is placed in contact with the surface, the thin plate cooling means 120 performs heat exchange by repeating condensation and vaporization by itself using a capillary phenomenon. It is a system with a refrigeration cycle.

The thin plate cooling means 120 is made of copper, and the bottom surface and the upper surface of the MCS seat 102 are brazed and fixed. As an embodiment, when the thin plate cooling means 120 is a material or other material capable of brazing bonding, the thin plate cooling means 120 may be fixed by screwing or the like by bonding between bonding surfaces or drilling a screw hole.

Here, the assembly in which the thin plate cooling means 120 and the MCS seating unit 102 are integrally coupled is screwed to the MCS seating unit 102 through a screw hole 102a that is machined on the rear surface of the heat sink 100. Done. That is, the screw 107 can be fastened by pre-tapping a plurality of screw holes in the MCS seating portion 102. In this case, as an optimal heat dissipation condition for fixing the CPU 130 to the motherboard, the height of the MCS seat 102 may be adjusted according to the space between the main board, the bottom surface of the heat sink 100, and the CPU. .

The thin plate cooling means 120 is provided with a refrigerant injection hole 121 to form an internal circulation loop in a vacuum, and then the production is completed by injecting a refrigerant and sealing the refrigerant injection hole.

In addition, when the MCS seat 102 and the thin plate cooling means 120 is fixed to the inside of the heat sink 100, the thin plate cooling means 120 protrudes to the left and right of the MCS seat 102 (104) It is seated on the seating surface 105 to prevent flow. Here, the guide protrusion 104 may be installed in a plurality of "b" shape to prevent the front / rear / left / right flow while maintaining the horizontal cooling means 120 is horizontal. In addition, the height of the seating surface 105 is formed to be substantially the same as the height of the MCS seating portion (102).

As described above, when the cooling device is assembled as shown in FIG. 3, after assembling the CPU 130 on the motherboard, the upper surface of the CPU 130 and the thin plate-shaped cooling means 120 are brought into close contact with the heat sink 100. ) Inverted and combined as shown in FIG. 4.

At this time, as shown in Figure 4, after the thin-plate cooling means 120 and the CPU in close contact, through the screw holes 106 formed on each outer side of the back of the heat sink 100 using a coil spring 108 109 to fix the heat sink 100 to the motherboard. That is, the coil spring 108 prevents external shock from being transmitted to the CPU 130 and the thin plate cooling means between the heat sink 100 and the motherboard.

On the other hand, Figure 5 is a plan view of a thin plate cooling means 120 according to an embodiment of the present invention, a cross-sectional view schematically showing a cross-section in the XZ plane cut line AA 'of Figure 6, Figure 7 5 is a cross-sectional view taken along line BB ′, and FIG. 8 is a cross-sectional view taken along line CC ′ of FIG. 5.

5 to 8, the thin plate cooling means 200 is configured such that a circulation loop of the refrigerant is formed inside the rectangular housing 212. The refrigerant is circulated in the direction of the arrow, and transfers the heat of the external heat source in contact with the cooling means 200 to cool by using latent heat during phase change between the liquid phase and the gas phase.

The housing 212 is, for example, a semiconductor material such as silicon or gallium, a new material laminated material such as a self-assembled monolayer (SAM), a metal material such as copper or aluminum having excellent thermal conductivity, and an alloy thereof. It can be made of a variety of materials, such as materials, ceramic materials, polymer materials such as plastic, crystalline materials such as diamond. In particular, when the external heat source is a semiconductor chip (ie, a CPU), the contact heat resistance may be minimized by forming the same material as the surface material of the external heat source. In addition, the housing 212 may be formed to be integral with the surface material of the external heat source in the manufacturing process of the semiconductor chip.

Meanwhile, the refrigerant used in the present invention may be selected from various refrigerants that may cause a phase change between the liquid phase and the gas phase by heat generated from an external CPU. For example, in the case of water or an alcohol-based refrigerant, the heat capacity is large, and the contact angle due to the surface tension with the inner wall of the semiconductor material is small, so that the flow rate of the refrigerant is increased, which is advantageous to transfer a large amount of heat. In addition, since there is no problem of environmental pollution unlike the freon refrigerant, even if leaked by the minute crack of the circulation loop-like housing 212, the problem of environmental pollution does not occur.

On the other hand, the circulation loop of the refrigerant, the evaporator 204 is connected to one end of the refrigerant storage unit 202 from the refrigerant storage unit 202 formed in one end of the inside of the housing 212 in the direction of the arrow in the figure ), The gaseous phase refrigerant moving unit 206, the condensation unit 208, and the liquid phase liquid moving unit 210 are sequentially configured to circulate back to the refrigerant storage unit 202.

The refrigerant storage unit 202 has an appropriate volume so that a predetermined amount of liquid refrigerant can be stored.

An evaporation unit 204 is connected to an outlet side of the refrigerant storage unit 202, and the evaporation unit 204 has a plurality of first microchannels 220 as shown in FIG. Are arranged in a monolayer. The evaporator 204 vaporizes a liquid refrigerant charged in the first microchannel 220 by heat absorbed from an external heat source to evaporate the refrigerant in a gaseous phase.

6 and 7, the depth of the first microchannel 220 is thinner than that of the refrigerant storage unit 202. In the first microchannel 220, the liquid refrigerant stored in the refrigerant storage unit 202 is discharged from the refrigerant storage unit 202 by surface tension and capillary phenomenon with an inner wall of the first microchannel 220. Partially filled to a predetermined portion of the first microchannel 220, the depth or cross-sectional area of the first microchannel 220 is set such that the surface tension in the first microchannel 220 is greater than gravity. .

In addition, the cross section of the first microchannel 220 may be formed in various shapes such as a circle, an oval, a rectangle, a square, and a polygon in addition to being formed in a quadrangle, and having a cross-sectional area along the longitudinal direction of the first microchannel 220. The amount of surface tension between the inner wall of the first microchannel 220 and the refrigerant can be controlled by increasing or decreasing the number of grooves, and a plurality of grooves are formed on the inner wall of the first microchannel 220 or the first microchannel ( A plurality of nodes may be provided to change the cross-sectional area of the channel along the longitudinal direction of the 220 to determine the movement direction of the refrigerant or control the movement speed of the refrigerant.

Meanwhile, the condenser 208 is formed at a position spaced apart from the first microchannels 220 of the evaporator 204 by a predetermined distance on the same plane in the longitudinal direction. As illustrated in FIG. 8, the condenser 208 includes a plurality of second microchannels arranged in a single layer on the same plane to condense the refrigerant in the vaporized and moved gaseous phase in the first microchannel 220. 222.                     

In addition, referring to FIG. 8, the depth of the second microchannel 222 is formed deeper than the depth of the first microchannel 220, but is not limited thereto. The liquefied liquid refrigerant condensed in the condenser 208 is partially filled to a predetermined portion of the second microchannel 222 by surface tension and capillary phenomenon with the inner wall of the second microchannel 222. In the second microchannel 222, the depth or the cross-sectional area of the second microchannel 222 is set such that the surface tension is greater than gravity.

In addition, in order to improve the effect of heat dissipation, a plurality of fins may be formed on the outside of the housing 212 adjacent to the condensation unit 208, the heat emitted to the outside from the condensation unit 208 when formed as fins Can be recycled and driven to circulate the surrounding air. In addition, when the fin is formed in a microstructure including a thermoelectric element, the heat emitted from the condenser 208 may be converted into electrical energy and used as energy for fine driving.

In addition, by forming the volume of the condensation unit 208 larger than the volume of the evaporation unit 204, it is possible to easily condense the gaseous refrigerant in the condensation unit 208 even by surrounding convection.

Meanwhile, a gas phase refrigerant moving unit serving as a passage through which the refrigerant in the gas phase may move between the first microchannel 220 of the evaporator 204 and the second microchannel 222 of the condenser 208. 206 is located. In the gas phase refrigerant moving unit 206, a plurality of first guides 218 are formed to uniformly move the vaporized gas refrigerant in the direction of the condensation unit 208. As shown in FIG. The cross-sectional area of the first microchannel 220 that flows out is formed to be wider than the cross-sectional area of the outlet side.

Meanwhile, as shown in FIG. 8, the liquid refrigerant condensed in the second microchannel 222 between the outlet side of the second microchannel 222 of the condenser 208 and the refrigerant storage 202. The liquid refrigerant moving part 210 is moved. The liquid phase refrigerant moving unit 210 is separated from the gas phase refrigerant moving unit 206 and configured to have a different flow direction of the refrigerant.

The gas phase refrigerant moving part 206 and the liquid refrigerant moving part 210 are thermally and physically separated from each other by the heat insulating part 216, and the heat insulating part 216 is sealed in the housing 212. It may be configured in a form that is present or may be configured to open to penetrate the top and bottom of the housing 212. When sealed in the housing 212, the heat insulating part 216 may be maintained in a vacuum state or filled with a heat insulating material.

On the other hand, as shown in Figure 5, the liquid refrigerant moving part 210 is located symmetrically in both directions along the outer sides of the housing 212. The refrigerant circulation loop symmetrically formed along the outer edge of the housing 212 is a very advantageous structure in the case of a thin plate shape, especially when the aspect ratio of the cross section is large, and effectively convectively diffuses the heat flow in the radial direction in a large area. Can be. By disposing two liquid refrigerant moving parts 210 along the edge of the cooling means 200, it is advantageous to subcool the refrigerant in the flow path and lower the inlet temperature of the evaporator 204. It means that it can transfer heat energy. In addition, the bidirectional circulation loop is inclined such that the gravity means of the liquid refrigerant moving part 210 in both directions is different from the cooling means 200 based on the X-axis direction according to the installation position of the cooling means 200. In this case, when the refrigerant is not circulated to one of the liquid refrigerant moving parts 210 by the gravity head, it is advantageous in that the refrigerant can be smoothly flowed through the other liquid refrigerant moving parts 210.

In addition, the liquid refrigerant moving part 210 may include at least one third microchannel in which the surface tension between the liquid refrigerant and the inner wall of the liquid refrigerant moving part 210 is greater than gravity so that the liquid refrigerant moving part 210 is hardly affected by gravity. The liquid refrigerant moving part 210 may include a plurality of grooves (not shown) in the liquid refrigerant moving part 210 or separated into two or more flow paths so as to reduce the influence of gravity.

On the other hand, a plurality of guide the movement of the liquid refrigerant to the boundary portion of the refrigerant storage unit 202 and the liquid refrigerant moving unit 210 and the boundary portion of the condensation unit 208 and the liquid refrigerant moving unit 210 The second guide (not shown) may be further formed to reduce the loss caused by the rapid turning of the refrigerant flow.

On the other hand, as described above, the refrigerant storage unit 202 is configured to have a suitable volume enough to supply a sufficient amount of refrigerant even under a heat load of a variable heat source, the rapid drying in the evaporator 104 In order to prevent the out phenomenon, it is preferable to install close to the inlet side of the evaporator 204, which can supply the refrigerant quickly, but when installed too close to the evaporator 204, the housing 212 in contact with the external heat source Unnecessary bubbles may be generated by the heat transferred to the bottom surface of the. The growth of the bubble blocks the inlet of the first microchannel 220 of the evaporator 204 and the refrigerant storage unit because the supply of the refrigerant may be stopped to cause dry out of the refrigerant in the evaporator 204. The housing in a direction orthogonal to the heat flow direction on the bottom surface of the housing 212 in contact with the external heat source at the boundary between the refrigerant storage unit 202 and the evaporator 204 to suppress heat transfer to the 202. It is preferable to form a thin thickness of the bottom surface of the, for example, a groove may be formed on the bottom surface of the housing 212.

As described above, the computer cooling apparatus using the thin plate cooling means according to the present invention uses a capillary phenomenon to produce a thin plate cooling means having a refrigerating cycle for performing heat exchange by repeating condensation and vaporization by itself. In this case, the heat generated by the CPU can be cooled more effectively even in a narrow space.

Claims (4)

In the cooling device for a computer, A heat sink having a heat dissipation fan on one side and a seating groove therein; An MCS seating portion seated on an inner center bottom of the heat sink; Thin plate cooling means having a refrigeration cycle that is bonded to the upper surface of the MCS seating portion and opposite to the processor, the heat exchange is repeated by condensation and vaporization by using capillary phenomenon for heat cooling generated from the processor. Cooling device for a computer using a thin plate cooling means comprising a. The method of claim 1, Cooling device for a computer using a thin plate cooling means further comprises a coil spring for giving a predetermined elasticity to the screw fastening degree between the motherboard and the heat sink for the protection of the processor and the thin plate cooling means. The method of claim 1, The heat sink and the MCS seating portion is screwed and then taped. The MCS seating portion and the thin plate cooling means is a copper material, the cooling device for a computer using the thin plate cooling means, characterized in that the brazing bonding. The method of claim 1, The heat sink has a plurality of guide protrusions having a seating surface of a predetermined height around the outer periphery on which the MCS seating part is seated to prevent detachment, and the thin plate type cooling means is parallel to the seating surface by the MCS seating part and the seating surface. Computer cooling device using cooling means.

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