KR100643428B1 - A bonding device for packaging film - Google Patents

Abstract

The present invention relates to a bonding apparatus for an electronic packaging film. According to the present invention, there is provided a bonding apparatus for attaching a packaging film having an adhesive layer and a release film attached to one surface of the adhesive layer to a member to be connected, the bonding apparatus comprising: at least two feed reels each of which the film is wound; Transfer means for transferring the film onto the connected member; A cutter member for cutting the adhesive layer to fit the size of the connected member; Pressing means for pressing the adhesive layer of the film to the side to be connected; And a recovery reel provided with a number corresponding to the supply reel to recover the release film separated from the film.

Anisotropic conductive film, bonding device, LCD, TCP

Description

Bonding apparatus for electronic packaging film {A bonding device for packaging film}

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to.

1 is a cross-sectional view schematically showing the configuration of a general anisotropic conductive film.

2 schematically shows a bonding apparatus according to the prior art;

Figure 3 is a side sectional view showing a state in which a member to be connected is connected by a bonding apparatus according to the prior art.

4 schematically illustrates a bonding apparatus according to a preferred embodiment of the present invention.

5 is a plan view showing a state in which a member to be connected is connected by a bonding apparatus according to a preferred embodiment of the present invention.

FIG. 6 is a side cross-sectional view taken along line VI-VI of FIG. 5. FIG.

7 is a side cross-sectional view showing a state in which a member to be connected is connected by a bonding apparatus according to another embodiment of the present invention.

8 is a side cross-sectional view showing a state in which a member to be connected is connected by a bonding apparatus according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110, 111 ... feed reel 120 ... transport

130 ... cutter member 140 ... crimping means

150, 151 ... Reel reel 161, 162 ... Fixing means

170 ... Separator 180 ... Crimping Jig

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a bonding apparatus for films, and more particularly to a bonding apparatus having a multi-reel for simultaneously connecting films having different characteristics to a connected member.

In general, anisotropic conductive film (ACF) is a connection material that is used when the material of the connected member is special or the pitch of signal wiring is minute and the member and the member cannot be attached by soldering. .

The anisotropic conductive film is typically used as a connecting material for packaging LCD panels, printed circuit boards (PCBs), driving ICs, etc. in LCD modules. More specifically, a plurality of driving ICs are mounted in the LCD module to drive thin film transistor (TFT) patterns. The driving IC is largely mounted on the LCD panel through a COG (Chip On Glass) mounting method, which is a method of mounting the LCD panel in the gate area and the data area without a separate structure, and a tape carrier package (TCP) equipped with the driving IC. It is divided into TAB (Tape Automated Bonding) mounting method, which indirectly mounts a driving IC in the gate area and the data area of the circuit.

Regardless of which mounting method is adopted, it is difficult to use means such as soldering because the electrodes on the driver IC element side and the electrodes on the LCD panel side are formed at minute pitch intervals. For this reason, an anisotropic conductive film is used to electrically connect the electrode on the driver IC side and the electrode on the panel side.

Referring to FIG. 1, the anisotropic conductive film 30 according to the related art is obtained by dispersing conductive particles 30b in an insulating adhesive 30a and is thermocompression-bonded between intervening members 10 and 20. Then, the conductive particles 30b are interposed between the opposite electrodes 11 and 21 to electrically connect the electrodes 11 and 21. At this time, insulation is maintained between neighboring electrodes. That is, the anisotropic conductive film 30 is a connection material which maintains insulation on the x-y plane and has conductivity on the z-axis.

The anisotropic conductive film 30 is bonded to the members 10 and 20 to be connected using the bonding apparatus as shown in FIG. 2. More specifically, the bonding apparatus according to the prior art is sequentially unwound in a state in which the anisotropic conductive film 30 is wound on the feed reel 1 on which it is wound, and then transferred onto the connected member 10. Then, the anisotropic conductive film 30 is crimped | bonded by the crimping part 4 to the predetermined position of the to-be-connected member 10 and 20. FIG. At this time, the release film 30 ′ attached to the back surface of the anisotropic conductive film 30 is recovered by the recovery reel 5.

3 is a side cross-sectional view showing a state in which the anisotropic conductive film 30 connects the portion to be connected, for example, the LCD panel 10 and the TCP 20, by a bonding apparatus according to the prior art. Referring to FIG. 3, after the anisotropic conductive film 30 is attached to the ITO electrode portion 10a on which the gate and data input pads are formed in the LCD panel 10, a part of the ITO electrode 10b is exposed to corrode and mechanically. There are problems such as stability risks. In order to solve this problem, a protective material such as silicon is applied to the exposed ITO layer 10b. However, such a protective material is usually applied in a paste state, so it is not easy to adjust the flow rate and align the position of the material in the application process. In addition, it is easy to leave the residues of the protective material, there is a problem that the paste residues are accumulated on the bottom of the device to require continuous cleaning and management.

The present invention has been made to solve the above problems, and at the same time as the anisotropic conductive film is pressed to the member to be connected, the present invention provides a packaging film bonding apparatus that can proceed to the process of forming the exposed electrode portion protective layer. It is for that purpose.

In the bonding apparatus according to the present invention for achieving the above object in the bonding apparatus for attaching a packaging film having an adhesive layer and a release film attached to one surface of the adhesive layer to the member to be connected, at least two of each film is wound More feed reels; Transfer means for transferring the film onto the connected member; A cutter member for cutting the adhesive layer to fit the size of the connected member; Pressing means for pressing the adhesive layer of the film to the side to be connected; And a recovery reel provided with a number corresponding to the supply reel to recover the release film separated from the film.

Preferably, the two or more feed reels and the corresponding reel reel form a corresponding line such that each film is pressed into a different position on the member to be connected.

Here, the two or more supply reels may wind up a film having different characteristics.

Preferably, one of the two or more feed reels may be wound around the anisotropic conductive film, and at least one or more feed reels may be wound by the protective film.

The protective film may be a non-conductive film or an anisotropic conductive film having a low density of conductive particles.

On the other hand, the crimping portion is a crimping toolbar that compresses onto the connected member by transferring heat and pressure directly to the film; And an up / down cylinder for moving the pressing toolbar up and down.

According to another embodiment of the present invention, a fixing clamp for stably maintaining the transfer of the film; and a branching roller for separating the release film from the adhesive layer in the film pressed on the connected member;

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

4 is a view schematically showing a bonding apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 4, the bonding apparatus according to the present embodiment includes a supply reel 110 for supplying a film, a conveying means 120 for transporting the film, a cutter member 130 for cutting the film, and a crimping means for compressing the film. 140 and a recovery reel 150 for recovering the release film attached to one surface of the compressed film 30.

The supply reel 110 is attached to the bonding apparatus in a state in which the film is wound to provide a film, and includes a first supply reel 111 and a second supply reel 112 provided at predetermined intervals from each other. do.

The first supply reel 111 is wound with an anisotropic conductive film 30 for electrically connecting an electrode to a connected member such as an LCD panel, a TPC, or a printed circuit board, for example. For example, after the anisotropic conductive film 30 is pressed to a predetermined position of the member to be connected, the second supply reel 112 is wound with a protective film 31 covering and protecting the electrode part exposed on the member to be connected. The protective film 31 may be a non-conductive film (NCF) or an anisotropic conductive film having a low density of conductive particles. However, the present invention is not limited thereto, and various modifications may be employed to protect the exposed electrode.

Although two supply reels 110 have been described above, a plurality of supply reels may be employed to wind another protective film, including a supply reel to wind the anisotropic conductive film. In addition, the kind of film wound on the plurality of supply reels may be variously adopted. For example, three supply reels are provided so that one anisotropic conductive film is wound to connect a member to be connected, and the other two supply reels are wound with a protective film such as a non-conductive film or an anisotropic conductive film having a low density of conductive particles. Three supply reels may be installed at predetermined intervals according to the compression position of the film.

The transfer means 120 transfers the films 30 and 31 unwound from the supply reel 110 onto the connected member 10. The transfer means 120 may include a transfer clamp 122 that transfers the films 30 and 31 by receiving a transfer force from the up / down cylinder 121 that provides power and the up / down cylinder 121. . However, the present invention is not limited thereto, and various configurations capable of providing a conveying force to the films 30 and 31 may be employed.

The cutter member 130 cuts the films 30 and 31, which have been transferred onto the connected member 10 by the transfer means 120, to match the attachment size of the connected member 10. More specifically, in the films 30 and 31 consisting of the adhesive layers 30a and 31a and the release films 30b and 31b attached to one surface of the adhesive layers 30a and 31a, only the adhesive layers 30a and 31a are cut. do. Therefore, as will be described later, only the adhesive layers 30a and 30b of the films 30 and 31 are pressed onto the connected member 10 and the release films 30b and 31b are recovered as described below.

The crimping means 140 transmits heat and pressure to the films 30 and 31 and compresses them on the member to be connected 10. The pressing means 140 includes a pressing toolbar 141 which is in direct contact with the films 30 and 31 and an up / down cylinder 142 which enables the vertical movement of the pressing toolbar 141.

The recovery reel 150 includes a first recovery reel 151 corresponding to the first supply reel 111 and a second recovery reel 152 corresponding to the second supply reel 112. The first recovery reel 151 recovers the release film 30a of the film 30 unwound from the first supply reel 111, and the second recovery reel 152 is unwound from the second supply reel 112. The release film 31a of the film 31 is recovered. Preferably, the first and second recovery reels (151, 152) is a film (30, 31), such as an anisotropic conductive film and a protective film wound on each of the feed reel (111, 112) is pressed at different positions of the member to be connected A line corresponding to the positions of the first supply reel 111 and the second supply reel 112 provided at predetermined intervals may be formed.

Although the recovery reel 150 has been described as being provided with two, a plurality of supply reels may be employed according to the number of supply reels 110 installed in the bonding apparatus.

Preferably, the bonding apparatus has a fixing member (161, 162) is installed in the conveying path of the film (30, 31) to maintain a stable transport of the film (30, 31) conveyed by the conveying means 140 It includes more. At least one fixing member 161 and 162 may be installed, for example, a fixing clamp may be employed. However, the present invention is not limited thereto, and various modifications may be adopted to fix the films 30 and 31.

More preferably, the bonding apparatus may further include a separator 170 for separating the release films 30b and 31b from the adhesive layers 30a and 31a of the films 30 and 31 pressed onto the connected member 10. Can be. As a result, the recovery of the release films 30b and 31b by the recovery reel 150 may be performed more smoothly. In addition, the bonding apparatus may further include a crimping jig 180 for mounting the member 10 to be connected.

Hereinafter, the operation of the bonding apparatus having the above configuration will be described.

First, the anisotropic conductive film 30 wound on the first supply reel 111 and the protective film 31 wound on the second supply reel 112 are sequentially unwound and connected by the transfer means 120. Conveyed onto the member 10. In this case, the film 30, 31 may be stably maintained by the fixing members 161 and 162.

The cutter member 130 provided on the path to be transported onto the connected member 10 may be formed so as to match the size of the connected member 10 before the films 30 and 31 are transported onto the connected member 10. 30, 31). At this time, the cutter member 130 cuts only the adhesive layers 30a and 31a of the films 30 and 31, and does not cut the release films 30b and 31b, so that the continuous release of the release films 30b and 31b will be described later. Allow recovery.

The anisotropic conductive film 30 and the protective film 31 transferred onto the connected member 10 are simultaneously pressed to a predetermined position of the connected member 10 by the crimping means 140. That is, the pressing toolbar 141 moving downward by the up / down cylinder 142 is pressed while transferring heat and pressure to the anisotropic conductive film 30 and the protective film 31. At this time, the anisotropic conductive film 30 is pressed to the electrode portion to be connected, the protective film 31 is pressed to the electrode portion exposed after the anisotropic conductive film 30 is pressed. As a result, a process of applying a separate silicon paste or the like can be omitted, thereby preventing generation of problems caused by using a protective material in the form of a paste.

Then, the separators 170 separate the adhesive layers 30a and 31a and the release films 30b and 31b of the compressed films 30 and 31. The release films 30b and 31b thus separated are wound around the first and second recovery reels 151 and 152 installed to correspond to the first and second supply reels 111 and 112, and are continuously collected.

On the other hand, in the above description has been described a pressing process for pressing on one of the connected member 10 of the two connected member (10, 20) to be connected. After this pressing process, the other bonded member 20 is placed on the press-fitted films 30 and 31 to perform the main pressing process by the pressing means 140 to finish the bonding process of the film.

5 is a plan view showing a state in which the films 30, 31 connect the connected members 10, 20 by the bonding apparatus according to the present invention, and FIG. 6 is a side cross-sectional view taken along the line VI-VI of FIG. .

5 and 6, in the LCD panel 10 including the color substrate 13 and the TFT substrate 14, anisotropic conductivity is formed between the TPC 20 and the electrode portion 10a on which the gate and the data input pad are formed. The film 30 is sandwiched and pressed. As a result, the TPC 20 equipped with the driving IC 21 and the electrodes of the LCD panel 10 are electrically connected. In addition, the protective film 31 is attached to a portion where the anisotropic conductive film 30 is not attached, thereby preventing the electrode from being exposed to the outside to be corroded or damaged.

7 and 8 are side cross-sectional views illustrating a state in which the films 30 and 31 are pressed onto the connected member 10 by the bonding apparatus according to other embodiments of the present invention. In Fig. 7 and Fig. 8, the same reference numerals as in the previously shown drawings refer to the same members having the same function, and thus description thereof will be omitted.

Referring to FIG. 7, a protective film 31 is attached to a portion where the anisotropic conductive film 30 is not attached to the electrode end portion 10c of the TCP side LCD panel. This prevents a short circuit between the output pad and the signal line in the electrode end portion 10c.

In addition, referring to Figure 8, by using the bonding apparatus of the present invention is provided with three supply reel and recovery reel, one feed reel is wound anisotropic conductive film, and the other two supply reel, the anisotropic conductive After attaching the film 30, the protective film 31 may be attached to both sides of the portion where the anisotropic conductive film 30 is not attached.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

As described above, according to the present invention, a protective layer can be formed simultaneously with the pressing process of the anisotropic film without additional equipment on the electrode portion exposed after the anisotropic film is attached to the member to be connected. Therefore, the connection between the members to be connected can be made more reliable in a simpler process.

Claims (6)

A bonding apparatus for attaching a packaging film having an adhesive layer and a release film attached to one surface of the adhesive layer to a member to be connected, At least two feed reels, each of which is wound around the film and is spaced apart according to respective positions of pressing the film on the member to be connected; Transfer means for transferring the film onto the connected member; A cutter member for cutting the adhesive layer to fit the size of the connected member; Pressing means for pressing the adhesive layer of the film to the side to be connected; And And a recovery reel provided with a number corresponding to the supply reel to recover the release film separated from the film. The method of claim 1, The two or more supply reel and recovery reel, Bonding apparatus, characterized in that for forming a line corresponding to each film is pressed at different positions of the member to be connected. The method of claim 1, Bonding device, characterized in that one of the two or more feed reel winding the anisotropic conductive film, at least one feed reel winding the protective film. The method of claim 3, wherein the protective film, A non-conductive film or an anisotropic conductive film having a low density of conductive particles, characterized in that the bonding apparatus. The method of claim 1, wherein the pressing means, A pressing toolbar that compresses the heat and pressure directly onto the film to be connected to the member; And Bonding device comprising a; up / down cylinder for moving the pressing toolbar up and down. The method according to any one of claims 1 to 5, Fixing member for stably maintaining the transfer of the film; And And a separator for separating the release film from the adhesive layer on the film compressed on the connected member.

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