KR100634137B1 - Process for preparing capsule-type adhesive and polymer adhesion-beads encapsulated by melamine resin - Google Patents

Process for preparing capsule-type adhesive and polymer adhesion-beads encapsulated by melamine resin Download PDF

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KR100634137B1
KR100634137B1 KR1020050092899A KR20050092899A KR100634137B1 KR 100634137 B1 KR100634137 B1 KR 100634137B1 KR 1020050092899 A KR1020050092899 A KR 1020050092899A KR 20050092899 A KR20050092899 A KR 20050092899A KR 100634137 B1 KR100634137 B1 KR 100634137B1
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adhesive
melamine
polymer
resin
capsule
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이기창
이상윤
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경상대학교산학협력단
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds

Abstract

Provided is a method for preparing an capsulated adhesive of a polymer adhesion bead which can be stored and transported in a powder state even at a room temperature and is excellent in the durability of particle surface. The method comprises the steps of dissolving 0.5-1 wt% of sodium dodecyl benzenesulfonate in distilled water; adding melamine and a formalin resin in a ratio of 1:1.7 to 1:2.5 by mol to the obtained solution and stirring it at 60-70 deg.C for 20-40 min; and adding a polymer adhesion bead to the obtained solution to crosslink the melamine resin and the formalin rein under an acidic condition, thereby capsulating the polymer adhesion bead. The capsulated adhesive has a size of 3-15 micrometers. Preferably the amount of the polymer adhesion bead is 75-80 wt% to 20-25 wt% of melamine and formalin resin.

Description

멜라민 수지를 이용한 고분자 접착비드의 캡슐형 접착제의 제조방법{Process for preparing capsule-type adhesive and polymer adhesion-beads encapsulated by melamine resin}Process for preparing capsule-type adhesive and polymer adhesion-beads encapsulated by melamine resin

도 1은 현탁 중합법에 의해 제조된 고분자 접착비드를 촬영한 사진이다. 1 is a photograph of the polymer adhesive beads produced by the suspension polymerization method.

도 2(A) 내지 도 2(E)는 실시예 1 내지 2와 비교예 1 내지 3에 의해 제조된 캡슐형 접착제에서 캡슐의 형태를 촬영한 사진이다.2 (A) to 2 (E) is a photograph of the shape of the capsule in the capsule adhesive prepared by Examples 1 and 2 and Comparative Examples 1 to 3.

도 3은 고분자 접착비드와 본 발명에 따른 접착비드-캡슐 접착제의 온도에 따른 형태변화를 나타낸 사진이다.Figure 3 is a photograph showing the change in shape of the polymer adhesive beads and the adhesive bead-capsule adhesive according to the present invention.

도 4는 기존의 용액상태의 접착제와 본 발명에 따른 캡슐형 접착제로 다공질체인 활성탄의 접착을 수행한 결과를 나타낸 도면이다. Figure 4 is a view showing the result of performing the bonding of the activated carbon, which is a porous body with an adhesive in the conventional solution state and the capsule adhesive according to the present invention.

도 5는 도 4에서 제조한 활성탄 시트 표면의 SEM 사진이다. FIG. 5 is a SEM photograph of the surface of the activated carbon sheet prepared in FIG. 4.

본 발명은 멜라민 수지를 이용하여 고분자 접착비드를 캡슐화한 접착제에 관한 것이다. The present invention relates to an adhesive encapsulating polymer adhesive beads using a melamine resin.

대부분의 고무계 점접착제는 상온에서 점도가 큰 액체상으로 유리전이온도는 -20 내지 -60℃에 이른다. 이런 점액 상태의 점접착제는 주로 용기에 담아 밀봉하여 보관하며, 사용함에 있어서 고점도와 끈적거림에 의해 점착 작업성이 더디고 원활하지 못한 문제점이 있었다.Most rubber adhesives have a high viscosity at room temperature and have a glass transition temperature of -20 to -60 ° C. The adhesive agent in the state of the mucous is mainly contained in a container and sealed and stored, there is a problem that the adhesive workability is slow and smooth due to high viscosity and stickiness in use.

본 발명은 이러한 불편한 점을 해소하기 위하여 점액상태의 끈적끈적한 고분자 접착비드에 상온에서 끈적임이 없는 외부물질, 이른 바 멜라민-포르말린의 가교반응 등에 의해 생성되는 고분자막으로 캡슐화함으로써 분말상태를 이루도록 하고, 그로 인해 사용 시에 외벽에 적절한 압력을 가해 붕괴시켜 내부 물질이 점접착력을 나타내도록 함으로써 보관, 이동, 작업성, 점접착 효율성 등에서 편리한 새로운 개념의 접착제를 제공하는데 그 목적이 있는 것이다. The present invention is to form a powder state by encapsulating in the mucous sticky polymer adhesive beads in the mucous state of the polymer film produced by a non-sticky foreign material at room temperature, so-called melamine-formalin crosslinking reaction, Its purpose is to provide a new concept of adhesive that is convenient in storage, transport, workability, and adhesive efficiency by applying the appropriate pressure to the outer wall and causing the internal material to exhibit adhesive force when used.

본 발명의 캡슐형태의 접착제는 입자 안정제인 도데실벤젠슬폰산 나트륨염을 증류수에 용해한 후 멜라민과 포르말린을 부가하고, 60 내지 70℃에서 20 내지 40분간 교반하고, 여기에 고분자 접착비드를 첨가하고 산성조건 하에서 다음 반응식과 같이 멜라민과 포르말린의 가교반응을 통해서 고분자 접착비드를 캡슐화시키는 구성으로 이루어진 것을 특징으로 한다.In the capsule adhesive of the present invention, dodecylbenzenesulfonic acid sodium salt, a particle stabilizer, is dissolved in distilled water, and then melamine and formalin are added, stirred at 60 to 70 ° C. for 20 to 40 minutes, and polymer adhesive beads are added thereto. Under acidic conditions, it is characterized by consisting of a polymer encapsulated beads through the cross-linking reaction of melamine and formalin as shown in the following scheme.

Figure 112005056018100-pat00001
Figure 112005056018100-pat00001

이와 같은 본 발명을 더욱 상세하게 설명하면 다음과 같다.The present invention will be described in more detail as follows.

본 발명에서 사용하는 고분자 접착비드는 다음과 같은 방법으로 제조된다. 즉, 2-에틸헥실 아크릴레이트, 스티렌, 아크릴산을 단량체로 하고, 개시제, 유화제, 분산제를 사용하여 질소 기류 하에서 70℃에서 4시간 동안 반응시켜서 30 내지 100㎛의 크기를 갖는 점액상태의 고분자 접착비드를 제조한다. 상기의 현탁중합법에 의해 제조된 고분자 접착비드를 촬영한 사진은 도 1과 같다. Polymer adhesive beads used in the present invention are prepared by the following method. That is, a polymer adhesive bead having a size of 30 to 100 μm using 2-ethylhexyl acrylate, styrene, and acrylic acid as a monomer and reacting at 70 ° C. for 4 hours using an initiator, an emulsifier, and a dispersant. To prepare. A photograph of the polymer adhesive beads prepared by the suspension polymerization method is shown in FIG. 1.

이와 같은 고분자 접착비드를 고분자 막으로 캡술화한 캡슐형태의 접착제는 먼저 입자 안정제로서 도데실벤젠술폰산 나트륨염을 증류수에 대해 0.5 내지 1중량% 정도로 용해한다. 만일 안정제를 1중량%를 초과하거나 0.5중량% 미만으로 할 경우에는 분산제에 의한 포말 형성으로 캡슐화를 저해하게 되므로 상기의 비율로 하는 것이 바람직하다. The capsule-type adhesive in which such polymer adhesive beads are encapsulated with a polymer membrane first dissolves sodium dodecylbenzenesulfonate salt as a particle stabilizer at about 0.5 to 1% by weight based on distilled water. If the stabilizer is more than 1% by weight or less than 0.5% by weight, it is preferable to make the above ratio since encapsulation is inhibited by foam formation by the dispersant.

다음에 상기 용액에 멜라민과 포르말린수지를 몰 비율로 1 : 1.7 내지 1 : 2.5의 비율, 바람직하게는 1 : 1.9의 비율로 부가하고, 60 내지 70℃에서 400 내지 600 rpm의 속도로 20 내지 40분간 교반한 다음, 실온에서 냉각한 후, 위에서 제조한 고분자 접착비드를 첨가한다. Next, melamine and formalin resin are added to the solution in a molar ratio of 1: 1.7 to 1: 2.5, preferably in a ratio of 1: 1.9, and 20 to 40 at a speed of 400 to 600 rpm at 60 to 70 ° C. After stirring for a minute, the mixture is cooled at room temperature, and then the polymer adhesive beads prepared above are added.

여기서, 고분자 접착비드의 첨가량은 멜라민과 포르말린 수지 20 내지 25중 량%에 대해 75 내지 80중량%로 첨가하는 것이 가장 바람직하다. 만일 멜라민과 포르말린 수지를 20중량% 미만으로 사용할 경우에는 캡슐형성이 효율이 매우 낮아지게 되고, 표면의 두께가 낮아 상온에서는 형태가 유지되나, 60℃에서 건조할 경우 외벽이 붕괴되는 형상이 나타나 좋지 않게 된다. 반대로 25중량%를 초과할 경우에는 외벽이 너무 두꺼워져 프레스에 의한 접착가공시 내부 물질의 접착효율이 낮아지게 되어 바림직하지 못하게 된다. Here, the addition amount of the polymer adhesive beads is most preferably added at 75 to 80% by weight relative to 20 to 25% by weight of melamine and formalin resin. If the melamine and formalin resin is used at less than 20% by weight, the efficiency of encapsulation is very low, and the surface thickness is low so that the shape is maintained at room temperature, but when dried at 60 ° C, the outer wall collapses. Will not. On the contrary, if it exceeds 25% by weight, the outer wall becomes too thick, and the adhesion efficiency of the inner material is lowered during the adhesive processing by the press, which is not desirable.

다음에 이들을 400 내지 600 rpm으로 교반하면서 0.2N HCl을 부가하여 pH를 산성조건인 4로 맞추고, 다음 반응식과 같이 멜라민과 포르말린의 가교반응을 이루게 한 다음에 50 내지 70℃에서 3 내지 5시간 동안 반응시키면 고분자 막의 두께가 약 3 내지 15㎛ 정도인 캡슐 타입의 접착제가 제조되게 된다. Next, the mixture was stirred at 400 to 600 rpm, and 0.2N HCl was added to adjust the pH to 4, which is an acidic condition. Then, a crosslinking reaction of melamine and formalin was carried out as shown in the following scheme, and then the mixture was heated at 50 to 70 ° C. for 3 to 5 hours. After the reaction, a capsule-type adhesive having a thickness of about 3 to 15 µm is produced.

Figure 112005056018100-pat00002
Figure 112005056018100-pat00002

이와 같은 본 발명을 실시예 및 비교예에 의거하여 더욱 상세하게 설명하면 다음과 같다.The present invention will be described in more detail based on Examples and Comparative Examples as follows.

제조예Production Example 1 : 고분자  1: polymer 접착비드의Adhesive beads 제조 Produce

2-에틸헥실 아크릴레이트(Yakuri Chem, Japan) 31.9g, 물 102.65g, 스티렌 (Kanto Chem, Japan) 1.3g, 아크릴산(Junsei Chem, Japan) 1g을 단량체로 하고, 개시제로 2,2'-아조비스(이소부티로니트릴)(Fluka, Germany) 0.1g, 유화제로 Triton X-100(Sigma-Aldrich Co., U.S.A) 4.9g, 분산제로 Acrylsol ASE-60(Rohm and Haas, U.S.A) 1.35g를 사용하여 질소 기류하에서 70℃에서 4시간 동안 반응시켜서 입자 범위가 30 내지 100㎛인 점액상태의 고분자 접착비드를 제조하였다.31.9 g of 2-ethylhexyl acrylate (Yakuri Chem, Japan), 102.65 g of water, 1.3 g of styrene (Kanto Chem, Japan), 1 g of acrylic acid (Junsei Chem, Japan) as monomers, and 2,2'-azo as an initiator 0.1 g of bis (isobutyronitrile) (Fluka, Germany), 4.9 g of Triton X-100 (Sigma-Aldrich Co., USA) as emulsifier, 1.35 g of Acrylsol ASE-60 (Rohm and Haas, USA) as dispersant The reaction mixture was reacted for 4 hours at 70 ° C. under a nitrogen stream to prepare a polymer adhesive bead in a slime state having a particle range of 30 to 100 μm.

실시예Example 1 One

입자 안정제인 도데실벤젠술폰산 나트륨염(SDBS, Junsei, Japan) 0.5중량%를 증류수 99.5중량%에 용해 한 후 멜라민수지(Acros organics, U.S.A)와 포르말린수지(Daejung Chem, Korea)를 1 : 1.9의 몰 비율로 하여 부가하고, 65℃에서 500 rpm으로 30분간 교반하였다. 실온에서 냉각한 후 멜라민과 포르말린 수지 80중량%에 대해 제조예 1에서 제조한 고분자 접착비드 20중량%를 첨가하고, 500 rpm으로 교반하며, 0.2N HCl을 부가하여 pH 4로 맞추었다. 멜라민수지와 포르말린수지의 가교반응을 이룬 후 60℃에서 4시간 동안 진행하여 캡슐형 접착제를 제조하였다. 제조된 캡슐형 접착제의 막의 두께는 3 내지 10㎛ 이었다.Melt resin (Acros organics, USA) and formalin resin (Daejung Chem, Korea) were dissolved in 0.5 wt% of dodecylbenzenesulfonate sodium salt (SDBS, Junsei, Japan), a particle stabilizer, in 99.5 wt% of distilled water. It added in the molar ratio and stirred for 30 minutes at 500 rpm at 65 degreeC. After cooling to room temperature, 20% by weight of the polymer adhesive beads prepared in Preparation Example 1 were added to 80% by weight of melamine and formalin resin, and the mixture was stirred at 500 rpm, and adjusted to pH 4 by addition of 0.2N HCl. After the crosslinking reaction of the melamine resin and formalin resin was carried out at 60 ℃ for 4 hours to prepare a capsule adhesive. The thickness of the prepared capsule adhesive was 3 to 10 탆.

실시예Example 2 2

입자 안정제인 도데실벤젠술폰산 나트륨염(SDBS, Junsei, Japan) 0.5중량%를 증류수 99.5중량%에 용해 한 후 멜라민수지(Acros organics, U.S.A)와 포르말린수지(Daejung Chem, Korea)를 1 : 1.9의 몰 비율로 하여 부가하고, 65℃에서 500 rpm 으로 30분간 교반하였다. 실온에서 냉각한 후 멜라민과 포르말린 수지 20중량%에 대해 제조예 1에서 제조한 고분자 접착비드 80중량%를 첨가하고, 500 rpm으로 교반하며, 0.2N HCl을 부가하여 pH 4로 맞추었다. 멜라민수지와 포르말린수지의 가교반응을 이룬 후 60℃에서 4시간 동안 진행하여 캡슐형 접착제를 제조하였다. 제조된 캡슐형 접착제의 막의 두께는 10 내지 15㎛ 이었다.Melt resin (Acros organics, USA) and formalin resin (Daejung Chem, Korea) were dissolved in 0.5 wt% of dodecylbenzenesulfonate sodium salt (SDBS, Junsei, Japan), a particle stabilizer, in 99.5 wt% of distilled water. It added in the molar ratio and stirred for 30 minutes at 500 rpm at 65 degreeC. After cooling to room temperature, 80% by weight of the polymer adhesive beads prepared in Preparation Example 1 were added to 20% by weight of melamine and formalin resin, and the mixture was stirred at 500 rpm, and adjusted to pH 4 by addition of 0.2N HCl. After the crosslinking reaction of the melamine resin and formalin resin was carried out at 60 ℃ for 4 hours to prepare a capsule adhesive. The thickness of the prepared capsule adhesive was 10 to 15 mu m.

비교예Comparative example 1 One

입자 안정제인 도데실벤젠술폰산 나트륨염(SDBS, Junsei, Japan) 0.5중량%를 증류수 99.5중량%에 용해 한 후 멜라민수지(Acros organics, U.S.A)와 포르말린수지(Daejung Chem, Korea)를 1 : 1.9의 몰 비율로 하여 부가하고, 65℃에서 500 rpm으로 30분간 교반하였다. 실온에서 냉각한 후 멜라민과 포르말린 수지 12중량%에 대해 제조예 1에서 제조한 고분자 접착비드 88중량%를 첨가하고, 500 rpm으로 교반하며, 0.2N HCl을 부가하여 pH 4로 맞추었다. 멜라민수지와 포르말린수지의 가교반응을 이룬 후 60℃에서 4시간 동안 진행하여 캡슐형 접착제를 제조하였다. 제조된 캡슐형 접착제의 막의 두께는 3 내지 5㎛ 이었다.Melt resin (Acros organics, USA) and formalin resin (Daejung Chem, Korea) were dissolved in 0.5 wt% of dodecylbenzenesulfonate sodium salt (SDBS, Junsei, Japan), a particle stabilizer, in 99.5 wt% of distilled water. It added in the molar ratio and stirred for 30 minutes at 500 rpm at 65 degreeC. After cooling to room temperature, 88% by weight of the polymer adhesive beads prepared in Preparation Example 1 were added to 12% by weight of the melamine and formalin resin, stirred at 500 rpm, and adjusted to pH 4 by addition of 0.2N HCl. After the crosslinking reaction of the melamine resin and formalin resin was carried out at 60 ℃ for 4 hours to prepare a capsule adhesive. The thickness of the prepared capsule adhesive was 3 to 5 탆.

비교예Comparative example 2 2

입자 안정제인 도데실벤젠술폰산 나트륨염(SDBS, Junsei, Japan) 0.5중량%를 증류수 99.5중량%에 용해 한 후 멜라민수지(Acros organics, U.S.A)와 포르말린수지(Daejung Chem, Korea)를 1 : 1.9의 몰 비율로 하여 부가하고, 65℃에서 500 rpm 으로 30분간 교반하였다. 실온에서 냉각한 후 멜라민과 포르말린 수지 15중량%에 대해 제조예 1에서 제조한 고분자 접착비드 85중량%를 첨가하고, 500 rpm으로 교반하며, 0.2N HCl을 부가하여 pH 4로 맞추었다. 멜라민수지와 포르말린수지의 가교반응을 이룬 후 60℃에서 4시간 동안 진행하여 캡슐형 접착제를 제조하였다. 제조된 캡슐형 접착제의 막의 두께는 3 내지 8㎛ 이었다.Melt resin (Acros organics, USA) and formalin resin (Daejung Chem, Korea) were dissolved in 0.5 wt% of dodecylbenzenesulfonate sodium salt (SDBS, Junsei, Japan), a particle stabilizer, in 99.5 wt% of distilled water. It added in the molar ratio and stirred for 30 minutes at 500 rpm at 65 degreeC. After cooling to room temperature, 85% by weight of the polymer adhesive beads prepared in Preparation Example 1 were added to 15% by weight of melamine and formalin resin, and the mixture was stirred at 500 rpm, and adjusted to pH 4 by addition of 0.2N HCl. After the crosslinking reaction of the melamine resin and formalin resin was carried out at 60 ℃ for 4 hours to prepare a capsule adhesive. The film thickness of the prepared capsule adhesive was 3 to 8 mu m.

비교예Comparative example 3 3

입자 안정제인 도데실벤젠술폰산 나트륨염(SDBS, Junsei, Japan) 0.5중량%를 증류수 99.5중량%에 용해 한 후 멜라민수지(Acros organics, U.S.A)와 포르말린수지(Daejung Chem, Korea)를 1 : 1.9의 몰 비율로 하여 부가하고, 65℃에서 500 rpm으로 30분간 교반하였다. 실온에서 냉각한 후 멜라민과 포르말린 수지 33중량%에 대해 제조예 1에서 제조한 고분자 접착비드 67중량%를 첨가하고, 500 rpm으로 교반하며, 0.2N HCl을 부가하여 pH 4로 맞추었다. 멜라민수지와 포르말린수지의 가교반응을 이룬 후 60℃에서 4시간 동안 진행하여 캡슐형 접착제를 제조하였다. 제조된 캡슐형 접착제의 막의 두께는 10 내지 20㎛ 이었다.Melt resin (Acros organics, USA) and formalin resin (Daejung Chem, Korea) were dissolved in 0.5 wt% of dodecylbenzenesulfonate sodium salt (SDBS, Junsei, Japan), a particle stabilizer, in 99.5 wt% of distilled water. It added in the molar ratio and stirred for 30 minutes at 500 rpm at 65 degreeC. After cooling at room temperature, 67% by weight of the polymer adhesive beads prepared in Preparation Example 1 were added to 33% by weight of the melamine and formalin resin, and the mixture was stirred at 500 rpm, and adjusted to pH 4 by addition of 0.2N HCl. After the crosslinking reaction of the melamine resin and formalin resin was carried out at 60 ℃ for 4 hours to prepare a capsule adhesive. The film thickness of the prepared capsule adhesive was 10-20 탆.

첨부 도면 중 도 2(A) 내지 도 2(E)는 실시예 1 내지 2와 비교예 1 내지 3에 의해 제조된 캡슐형 접착제에서 캡슐의 형태를 촬영한 사진이다. 도 2(A)(비교예 1)에 의하면, 멜라민수지와 포르말린 수지의 양이 적어 캡슐형성 효율이 매우 낮음을 알 수 있고, 도 2(B)(비교예 2)에 의하면, 멜라민수지와 포르말린 수지의 양이 비교예 1의 경우 보다는 많아 외벽형성은 이루어지고 표면두께가 낮아 상온에서는 형태가 유지되나, 60℃에서 건조할 경우 외벽이 붕괴되는 현상이 나타났음을 알 수 있다. 그리고 도 2(E)(비교예 3)에 의하면, 멜라민 수지와 포르말린 수지의 양이 과다하여 외벽이 너무 두꺼워 프레스에 의한 접착가공 시 내부물질의 접착효율이 낮아짐을 알 수 있었다. 2 (A) to 2 (E) of the accompanying drawings are photographs of the shape of the capsule in the capsule adhesive prepared by Examples 1 to 2 and Comparative Examples 1 to 3. According to FIG. 2 (A) (Comparative Example 1), the amount of melamine resin and formalin resin is small and the capsule formation efficiency is very low. According to FIG. 2 (B) (Comparative Example 2), melamine resin and formalin The amount of the resin is larger than in the case of Comparative Example 1, the outer wall is formed and the surface thickness is low, the shape is maintained at room temperature, it can be seen that the phenomenon that the outer wall collapses when dried at 60 ℃. In addition, according to FIG. 2E (Comparative Example 3), the amount of melamine resin and formalin resin is excessive and the outer wall is so thick that the adhesion efficiency of the inner material is lowered during the adhesive processing by the press.

반면에 도 2(C)(실시예 1)와 도 2(D)(실시예 2)는 멜라민수지와 포르말린 수지의 양이 적절하여 입자표면의 내구성이 우수하고, 70℃의 가열, 건조에도 형태가 유지되며, 내부 물질의 손실도 없음을 알 수 있었다.On the other hand, Fig. 2 (C) (Example 1) and Fig. 2 (D) (Example 2) are suitable for melamine resin and formalin resin, so that the durability of the particle surface is excellent, and the shape is excellent even when heated and dried at 70 ° C. It was found that there is no loss of internal material.

첨부 도면 중 도 3은 고분자 접착비드와 본 발명에 따른 접착비드-캡슐 접착제의 온도에 따른 형태변화를 나타낸 사진이다. 도 3(a)는 제조예 1에서 제조한 수분산 상태의 고분자 접착비드를 보여주고 있으며, 도 3(b)와 도3(c)는 각각 실온에서 현미경의 슬라이드글라스 위에 제조예 1에서 제조한 시료를 올려놓고 5분과 30분이 경과한 시점의 고분자 접착비드 간의 응집현상을 보여주고 있다. 대부분의 제조예 1에서 제조한 고분자 접착비드는 그 표면이 응집되었음을 알 수 있다.Figure 3 of the accompanying drawings is a photograph showing the change in shape of the polymer adhesive beads and the adhesive bead-capsule adhesive according to the present invention. Figure 3 (a) shows the polymer adhesive beads in the aqueous dispersion state prepared in Preparation Example 1, Figure 3 (b) and Figure 3 (c) is prepared in Preparation Example 1 on the slide glass of the microscope at room temperature, respectively 5 and 30 minutes after the sample is placed, the cohesion between polymer adhesive beads is shown. It can be seen that most of the polymer adhesive beads prepared in Preparation Example 1 had their surfaces aggregated.

반면에, 본 발명의 실시예 1과 실시예 2에서 제조된 고분자 접착비드의 캡슐형 접착제는 반응 직후의 사진이 도 3(d)이며, 도 3(e)와 도 3(f)는 각각 60℃와 70℃에서 24시간 열처리한 후의 사진을 나타낸 것이다. 도 3(e)와 도 3(f)에 의하면 가열 후 24시간이 경과하여도 입자들의 응집이 일어나지 않았으며, 입자형태의 변화도 관찰되지 않았다.On the other hand, the capsule adhesive of the polymer adhesive beads prepared in Example 1 and Example 2 of the present invention is a picture immediately after the reaction is shown in Figure 3 (d), Figure 3 (e) and Figure 3 (f) is 60 The picture after heat-processing at 70 degreeC and 70 degreeC for 24 hours is shown. According to FIG. 3 (e) and FIG. 3 (f), even after 24 hours of heating, aggregation of particles did not occur, and no change in particle form was observed.

첨부 도면 중 도 4는 기존의 용액상태의 접착제와 본 발명에 따른 캡슐형 접착제로 다공질체인 활성탄의 접착을 수행한 결과를 나타낸 도면으로서 도 4(A)에 의하면, 기존의 접착제에 의해 활성탄을 접착시켰을 때, 접착제가 다공질체의 구멍을 막아 다공성을 유지하기 어려움을 알았으며, 도 4(B)와 같이 본 발명의 캡슐형 접착제를 사용한 경우에는 다공성이 유지되었으며, 고분자 접착비드들이 다공질체인 활성탄을 부분적으로 묶는 역할을 수행하여 원하는 형태를 지닌 활성탄 시트를 제조할 수 있음을 알 수 있었다.  4 is a view showing a result of performing the bonding of the activated carbon which is a porous body with the adhesive of the conventional solution state and the capsule adhesive according to the present invention. According to FIG. 4 (A), the activated carbon is adhered by the existing adhesive. When it was made, it was found that the adhesive blocked the pores of the porous body to maintain the porosity, and when the capsule adhesive of the present invention was used as shown in FIG. 4 (B), the porosity was maintained, and the polymer adhesive beads were activated carbon having a porous body. It was found that the activated carbon sheet having the desired shape can be manufactured by performing a partially binding role.

첨부도면 중 도 5는 도 4에서 제조한 활성탄 시트의 표면의 SEM 사진으로서 본 발명에 따른 캡슐형 접착제를 사용한 경우 그 표면이 다공질체를 보임을 알 수 있었다.5 is an SEM image of the surface of the activated carbon sheet prepared in FIG. 4, and when the capsule adhesive according to the present invention is used, the surface shows a porous body.

본 발명에 따른 고분자 접착비드의 캡슐형 접착제는 입자표면의 내구성이 우수하고, 70℃의 가열, 건조에서도 형태가 유지되며, 내부 물질의 손실도 없는 효과가 있다. The capsule adhesive of the polymer adhesive bead according to the present invention has excellent durability of the surface of the particles, the shape is maintained even after heating and drying at 70 ℃, there is no effect of loss of the internal material.

이에 따라 본 발명에 따른 캡슐형 접착제는 실온에서 분말상태로서 보관, 이동할 수 있으며, 작업성도 편리하고, 점접착 효율성 면에서도 유용한 새로운 개념의 접착제로 사용될 수 있다. Accordingly, the capsule adhesive according to the present invention can be stored and moved as a powder at room temperature, and can be used as an adhesive of a new concept useful in terms of workability and useful in terms of adhesive adhesion efficiency.

본 발명에 따른 캡슐형 접착제를 이용하여 다공성 물질인 활성탄의 접착을 통해 원하는 형태의 다공성을 지닌 활성탄 시트를 제조할 수 있다. Using the capsule adhesive according to the present invention it is possible to produce an activated carbon sheet having a porosity of the desired form through the adhesion of activated carbon as a porous material.

Claims (3)

입자 안정제인 도데실벤젠슬폰산 나트륨염을 증류수에 대해 0.5 내지 1중량%정도로 용해한 후 상기 용액에 멜라민과 포르말린 수지를 몰 비율로 1 : 1.7 내지 1 : 2.5로 혼합하여 부가하고, 60 내지 70℃에서 20 내지 40분간 교반하고, 여기에 고분자 접착비드를 첨가한 후 산성조건 하에서 멜라민수지와 포르말린수지의 가교반응을 통해서 고분자 접착비드를 3 내지 15㎛의 크기로 캡슐화하여서 제조되는 것을 특징으로 하는 고분자 접착비드의 캡슐형 접착제의 제조방법.Dodecylbenzenesulfonic acid sodium salt, a particle stabilizer, was dissolved at about 0.5 to 1% by weight with respect to distilled water, and then melamine and formalin resin were added to the solution in a molar ratio of 1: 1.7 to 1: 2.5, and then added at 60 to 70 ° C. After stirring for 20 to 40 minutes, the polymer adhesive beads are added to the polymer, characterized in that the polymer is prepared by encapsulating the polymer adhesive beads in the size of 3 to 15㎛ through a crosslinking reaction of the melamine resin and formalin resin under acidic conditions Method for producing a capsule adhesive of adhesive beads. 제 1항에 있어서, 상기 고분자 접착비드의 첨가량은 멜라민과 포르말린 수지 20 내지 25중량%에 대해 75 내지 80중량%로 첨가하는 것을 특징으로 하는 고분자 접착비드의 캡슐형 접착제의 제조방법.The method of claim 1, wherein the polymer adhesive beads are added in an amount of 75 to 80% by weight based on 20 to 25% by weight of melamine and formalin resin. 제 1항에 있어서, 상기 가교반응은 수지용액에 고분자 접착비드를 첨가하고, 이들을 400 내지 600 rpm으로 교반하면서 0.2N HCl을 부가하여 pH를 4로 맞춘 후에 50 내지 70℃에서 3 내지 5시간 동안 반응시켜서 되는 것을 특징으로 하는 고분자 접착비드의 캡슐형 접착제의 제조방법. The method of claim 1, wherein the crosslinking reaction is performed by adding polymer adhesive beads to the resin solution and adjusting the pH to 4 by adding 0.2N HCl while stirring them at 400 to 600 rpm for 3 to 5 hours at 50 to 70 ° C. A method for producing a capsule adhesive of polymer adhesive beads, characterized in that the reaction.
KR1020050092899A 2005-10-04 2005-10-04 Process for preparing capsule-type adhesive and polymer adhesion-beads encapsulated by melamine resin KR100634137B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010000621A (en) * 2000-10-10 2001-01-05 조석형 method for preparing microcapsules
KR20020071793A (en) * 2002-06-05 2002-09-13 조석형 Preparation of epoxy type adhesives
KR20040030405A (en) * 2000-09-06 2004-04-09 애플톤 페이퍼즈 인코포레이티드 In situ microencapsulated adhesive
KR20040083215A (en) * 2003-03-21 2004-10-01 한국화학연구원 Functional capsules with photo-degradable activity and enhanced antibacterial and sterilizing activity, and process for preparing them

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040030405A (en) * 2000-09-06 2004-04-09 애플톤 페이퍼즈 인코포레이티드 In situ microencapsulated adhesive
KR20010000621A (en) * 2000-10-10 2001-01-05 조석형 method for preparing microcapsules
KR20020071793A (en) * 2002-06-05 2002-09-13 조석형 Preparation of epoxy type adhesives
KR20040083215A (en) * 2003-03-21 2004-10-01 한국화학연구원 Functional capsules with photo-degradable activity and enhanced antibacterial and sterilizing activity, and process for preparing them

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