KR20020071793A - Preparation of epoxy type adhesives - Google Patents

Abstract

PURPOSE: A method for preparing an epoxy-based adhesive is provided, to obtain an adhesive useful as an adhesive or a sealing agent in the engineering and construction field, which has a good storage stability and shows a rapid curing velocity when it is taken out a vessel. CONSTITUTION: The method comprises the steps of preparing a microcapsule containing an epoxy resin by using a core material; and dispersing the microcapsule containing the epoxy resin into a solvent where a curing and a catalyst are dissolved. Preferably the microcapsule is prepared by using a urea-formaldehyde resin, a melamine-formaldehyde resin, or a urea-melamine-formaldehyde resin. The epoxy resin is selected from the polyfunctional epoxy resin comprising a diglycidyl ether bisphenol A-type resin, trimethylol propane triglycidyl ether, hexanediol diglycidyl ether and ethyleneglycol diglycidyl ether.

Description

Epoxy Adhesive Preparation {Preparation of epoxy type adhesives}

The present invention provides a one-component epoxy resin composition useful as an adhesive or sealing material in civil engineering and construction, which is excellent in storage stability, has a fast curing rate when taken out of a container, and can also have flexibility; One-component curable resin compositions having excellent initial thixotropy in addition to storage stability and curability; It is excellent in storage stability and hardenability and is a latent hardener for adhesives or sealing materials in civil engineering and construction.

Conventionally, epoxy resins have excellent characteristics such as adhesion and strength, and thus have been widely used as adhesives, sealing materials or coatings in fields such as civil engineering, construction, and electronic devices. Since an epoxy resin has high reactivity, when mixed with an amine component, it easily reacts and hardens. Therefore, the two-part type | system | group was conventionally the most. On the other hand, although monolithic examination using the latent hardening agent centering on a ketamine type compound was made variously, the system which balanced the storage stability and hardenability has not been found yet.

For example, Japanese Patent Application Laid-Open No. 5-132541 describes a technique for reducing the reactivity during storage by using a long chain polyoxyylene as the backbone of the ketimine compound, and consequently increasing the storage stability. It is. However, the hardening rate at the time of taking out from a container is also slow and cannot be used as a practical one-component epoxy resin composition. Moreover, the resin composition which consists of an epoxy resin and a ketamine compound also has the fault that hardened | cured material is inferior to flexibility.

Therefore, the objective of this invention is the one-component curable resin composition which is excellent in storage stability, the hardening rate at the time of taking out from a container, and can also combine flexibility; In addition to storage stability and curability, it is to provide a one-component curable resin composition excellent in initial thixotropy.

The present invention is excellent in storage stability using microencapsulation by using epoxy resin as a core material and dispersing epoxy encapsulated microcapsules in a solution in which a curing agent and a catalyst are dissolved, and applying pressure during use to break the microcapsules and curing them. A one-component curable resin composition which has a high curing rate when taken out from a container and can also have flexibility; In addition to storage stability and curability, it is to provide a one-component curable resin composition excellent in initial thixotropy.

The present invention is to microencapsulate using the epoxy resin as a core material and to disperse the epoxy encapsulated microcapsules in a solution in which the curing agent and catalyst are dissolved, and to apply pressure when using the microcapsules from the epoxy resin flows out and reacts with the curing agent to bond A method for producing a one-component epoxy resin adhesive.

The present invention comprises first preparing a microcapsule with an epoxy resin as a wick and dispersing the epoxy resin-containing microcapsules in a solvent in which a curing agent, a catalyst and the like are dissolved.

The present invention is a urea and formaldehyde, melamine and formaldehyde, urea-formaldehyde initial condensation product or a modified product thereof, melamine-formaldehyde initial according to the method of preparing microcapsules of the Korean patent 10-2002-0012503 The microcapsules are prepared by polycondensing the condensation product or its modified product, urea-melamine-formaldehyde initial condensation product or its modified product and the like around the core epoxy resin in an acidic aqueous solution of the aforementioned water-soluble polymer.

Epoxy resin used in the present invention used diglycidyl ether bisphenol A (DGEBA), trimethylol propane triglycydyl ether (TMPGE), hexanediol diglycidyl ether (HDGE), ethyleneglycol diglycidyl ether (EDGE), etc. Diethylene triamine (DETA) and triethylene tetramine (TETA) were used, and tris- (dimethylaninomethyl) phenol (TDAP) was used as a curing accelerator.

Details are as follows.

Example 1

Prepare an aqueous solution of 3% sodium dodecylbenzenesulfonate as an anionic surfactant and add 90 g of diglycidyl ether bisphenol A (DGEBA) and trimethylol propane triglycydyl ether (TMPGE) to 90 g of the aqueous solution. Emulsify at 11,000 rpm. After 10 minutes, a 0 / W type stabilizer having an average droplet size of 3.0 micrometers is obtained, to which 20 parts of methylated methylolmelamine resin (nonvolatile component: 80 weight) is added while stirring. The reaction system is heated to 60 ° C. and the reaction is condensed for 2 hours. The reaction mixture is cooled to complete microencapsulation. The microcapsules are 3.6 micrometers in size. The microcapsules were prepared by dispersing 70 g of epoxy resin-containing microcapsules in 30% aqueous diethylene triamine (DETA) solution as a curing agent.

INDUSTRIAL APPLICABILITY The present invention is a one-component epoxy resin adhesive useful as an adhesive or sealing material in civil engineering and construction, which has excellent storage stability, has a high curing rate when taken out of a container, and can also have flexibility. .

Claims (3)

A method of producing a one-component epoxy adhesive comprising a step of preparing a microcapsule with an epoxy resin and dispersing the epoxy resin-containing microcapsule in a solvent in which a curing agent, a catalyst, and the like are dissolved. The method of claim 1, wherein the microcapsules are urea-formaldehyde resin, melamine-formaldehyde resin, urea-melamine-formaldehyde resin, or the like. The epoxy resin of claim 1 is a multifunctional epoxy resin such as diglycidyl ether bisphenol A (DGEBA) type resin, trimethylol propane triglycydyl ether (TMPGE), hexanediol diglycidyl ether (HDGE), and ethyleneglycol diglycidyl ether (EDGE). Epoxy Adhesive Preparation Method.