KR100632482B1 - Probe card for radio frequency - Google Patents

Abstract

An RF(Radio Frequency) probe card is provided to improve an impedance matching state by preventing the leak of signals at the ambient of output/input stages using a ground treatment. An RF probe card includes a jig(110) for breaking the current supplied from the outside, a plate, a pair of connectors, a ground treatment processed connection ring and a plurality of probes. The plate(120) is connected to the inside of the jig. A through hole is formed at a center portion of the plate. The plate is used for breaking a fine current. The pair of connectors(130) are vertically connected through the plate in order to connect input/output stages of an RF signal with each other. The ground treatment processed connection ring(140) is connected to the through hole of the plate. A copper part is formed on the connection ring. The plurality of probes(150) are enclosed with an insulation coating and a copper pipe. One end portion of the probe is connected with the connector and the other end portion contacts an RF element.

Description

Probe card for radio frequency

1 is an exploded perspective view showing a high frequency probe card according to an embodiment of the present invention;

FIG. 2 is a plan view showing a high frequency probe card shown in FIG. 1;

3 is a cross-sectional view taken along line III-III of the high frequency probe card shown in FIG. 2;

4 is an enlarged view in which a probe according to an embodiment of the present invention is applied to a pattern of a circuit;

5 is an enlarged view showing a portion where a connector and a probe are connected according to an embodiment of the present invention;

Figure 6 is an enlarged cross-sectional view showing a probe according to an embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

100.High-frequency probe card 110 ... Jig

120.Plate 130.Connector

140 ... connection ring 150 ... probe

160 ... Silver Epoxy

The present invention relates to a probe card, and more particularly, to a high frequency probe card for inspecting a device having high frequency characteristics in a wafer state.

Generally, in the process of manufacturing a semiconductor device, a plurality of semiconductor devices are formed on a semiconductor wafer by using a precision photographic transfer technique, and the like, and the semiconductor chip manufactured in a wafer state is a liquid crystal display (LCD) Before the assembly of the semiconductor package, the electrical characteristics are examined.

An apparatus for performing such a characteristic test is called a probe card, and the probe card is generally used to measure the high frequency response characteristic of the high frequency component, that is, the frequency characteristic. The high frequency component is a resonator and a surface acoustic wave (SAW) filter. And a duplexer or the like for processing high frequency signals in the frequency range of several tens of MHz to several GHz.

Conventional probe card is a probe that is fixed with epoxy or the like on a printed circuit board (PCB), the electricity generated by the tester when the probe is in contact with the chip pad device manufactured on the wafer A typical signal is transmitted to the device through the needle of the probe card to give the device high frequency response.

Good and bad products of the device are determined according to the high frequency response characteristics of the device.

However, in measuring the high frequency response characteristics of the high frequency devices, the conventional probe card does not cause any problem when measuring the frequency characteristics of the high frequency devices in which the assembly is completed, but when measuring the frequency characteristics of the high frequency devices in the wafer state. There is a problem in that it is difficult to block the minute current generated from the ground and the signal, difficult to match the impedance of the device to be measured, signal loss and interference occurs using the slot connector, and the life of the equipment is short.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a high frequency probe card that eliminates signal loss and interference, improves the direction of use, and maximizes lifespan.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. In addition, the objects and advantages of the invention may be realized by the means and combinations indicated in the claims.

High frequency probe card of the present invention for achieving the above object is a jig for blocking the current flowing from the outside; A plate coupled to the inside of the jig and having a through hole formed in the center thereof, and blocking a micro current by ground processing; A pair of connectors for coupling vertically through the inner surface of the plate and for connecting input and output terminals of a high frequency signal; A connection ring coupled to the through hole of the plate and having a through hole formed at an inner center thereof, thereby grounding the copper; And a plurality of probes, the outside of which is covered by an insulating coating and a copper pipe to prevent the leakage of signals, one end of which is connected to the connector, and the other end of which is in contact with the high frequency element.

In addition, the jig is preferably made of bakelite which is a synthetic resin made by reacting phenol and formalin.

Furthermore, the probe is preferably fixed to the connecting ring and the connector by silver epoxy added with silver to the epoxy.

In addition, it is preferable that the end of the probe contacting the pad of the high frequency device in the wafer state is bent downward substantially vertically.

In addition, the probe is preferably made of tungsten material.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is an exploded perspective view showing a high frequency probe card according to an embodiment of the present invention, Figure 2 is a plan view showing a state in which the high frequency probe card shown in FIG.

As shown, the high frequency probe card 100 according to the embodiment of the present invention comprises a jig 110; Plate 120; Connector 130; Connecting ring 140; And probe 150.

The jig 110 is a device that blocks the current flowing from the outside, forms the frame of the high frequency probe card 100 of the present invention, one or more screw holes 112 are formed for screwing the plate 120 It is.

In addition, the jig 110 may be made of a material of bakelite, which is a synthetic resin made by reacting phenol and formalin in order to stably block current that may be introduced from the outside.

The plate 120 has a thermal hole 122 is formed in the center and a coupling hole 124 to which the connector 130 can be coupled between the center and the outer side is formed. In addition, the plate 120 is coupled to a portion formed so as to occupy the inside of the jig 110, the screw hole 126 corresponding to the screw hole 112 of the jig 110 is formed on the outside The plate 120 and the jig 110 are coupled by screwing.

Here, the plate 120 is grounded by copper to cut off the microcurrent so that the measurement of the characteristics of the measuring device with the high frequency probe card 100 enables more accurate and reliable measurement.

The connector 130 passes through the coupling hole 124 formed in the plate 120 and is fastened by screwing the plate 120 to form an input / output end of the high frequency probe card 100. As shown in FIG. 3, the connector 130 is formed on the upper surface of the plate 120 to receive a signal applied from a test signal generator (not shown), and applies the applied signal to the connector 130. The signal is to be transmitted through the connection terminal 132.

Therefore, the connector 130 is designed to be impedance matching to prevent signal loss and interference occurring between the high frequency cable adapter when using the existing slot-type terminal, it is possible to precise measurement.

The connection ring 140 is grounded using copper, and is connected to the through hole 122 formed in the plate 120 to support the probe 150 to be described below. The connection ring 140 has a through-hole formed in the center thereof, and forms an inclined downward direction toward the center, and supports the probe 150 to be inclined.

As shown in FIGS. 3 and 4, the probe 150 is electrically connected to the connection end 132 of the connector 130. One side of the probe is connected to the connector 130, the connecting end 132 to form a bent portion, as shown in Figure 5 the other side is bent downward to contact the pad portion of the device to measure the characteristics have.

In addition, the probe 150 is formed of a tungsten material and adopts a structure fixed by the plate 120 and the connection ring 140, fixed to the plate 120 and the connection ring 140. In the bonding, a silver epoxy 160 containing silver is used in an epoxy resin.

Therefore, by using silver epoxy, which is a conductor, as compared with applying epoxy, which is a conventional insulator, stable ground treatment of the contact with the outside of the probe 150 can be performed.

6 is an enlarged cross-sectional view illustrating a probe 150 according to an embodiment of the present invention. As shown in the figure, the outer peripheral surface of the probe is electrically cut off by the insulating coating 152, and the insulating coating 152 is supported by the copper pipe 154 again.

Therefore, by blocking the minute signal generated in the high frequency signal to eliminate the loss and interference of the signal.

In addition, the probe 150 is made of a tungsten material, it is made to act to tension by adjusting the length of the probe 150 is to improve the durability for long time probing, it is possible to maintain the flatness .

Briefly looking at the process of the high frequency characteristic is inspected by the high frequency probe card 100 as described above, as shown in Figure 5 the probe 150 is in contact with the pad 210 of the device to be measured, the connector ( When a test signal is applied through a high frequency cable (not shown) connected to 130, a signal is transmitted from the connector 130 to the pad 210 through the probe 150, and the test signal from the pad 210. A signal capable of measuring high frequency characteristics according to the output is output.

As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this, The person of ordinary skill in the art to which this invention belongs, Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

As described above, according to the high frequency probe card of the present invention, it is designed to perform impedance matching by ground processing so that a signal does not flow around the output terminal and the input terminal connector, and by using copper, fine current is cut off to prevent the flow of minute current to accurately measure characteristics. Allow measurement to be made.

In addition, the probe is made of tungsten to be tensioned, thereby improving durability against long term probing and maintaining flatness.

Moreover, the probe can be operated in both directions or in four directions depending on the direction of the pad, thereby increasing the efficiency of the characteristic inspection.

Claims (5)

Jig for blocking the current flowing from the outside; A plate coupled to the inside of the jig and having a through hole formed in the center thereof, and blocking a micro current by ground processing; A pair of connectors coupled vertically through the inner surface of the plate and for connecting input and output terminals of a high frequency signal; A connection ring coupled to the through hole of the plate and having a through hole formed at an inner center thereof, thereby grounding the copper; And In order to prevent the leakage of the signal, the outside is covered with insulation coating and copper pipe, one end is connected to the connector, the other end includes a plurality of probes in contact with the high frequency device, The probe is a high frequency probe card, characterized in that fixed to the connecting ring and the connector by a silver epoxy is added to the epoxy. The method of claim 1, wherein the jig, A high frequency probe card, which is made of bakelite, a synthetic resin made by reacting phenol and formalin. delete The method of claim 1, wherein the probe, A high frequency probe card, wherein an end contacting a pad of a high frequency device in a wafer state is bent vertically downward. The method of claim 4, wherein the probe, A high frequency probe card, characterized in that the material is tungsten.

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