KR100629599B1 - 실링제 경화 장치 - Google Patents
실링제 경화 장치 Download PDFInfo
- Publication number
- KR100629599B1 KR100629599B1 KR1020040107719A KR20040107719A KR100629599B1 KR 100629599 B1 KR100629599 B1 KR 100629599B1 KR 1020040107719 A KR1020040107719 A KR 1020040107719A KR 20040107719 A KR20040107719 A KR 20040107719A KR 100629599 B1 KR100629599 B1 KR 100629599B1
- Authority
- KR
- South Korea
- Prior art keywords
- light
- sealing agent
- curing
- optical filter
- irradiation window
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 51
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 40
- 238000001723 curing Methods 0.000 claims abstract description 34
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims abstract description 16
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 239000000565 sealant Substances 0.000 abstract description 11
- 230000000903 blocking effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83874—Ultraviolet [UV] curing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (2)
- 유기 전계 발광 소자에 자외선(UV광)을 조사하여 기판과 셀캡 사이에 도포된 실링제를 경화시키는 실링제 경화 장치에 있어서,UV 조사창을 가지는 UV 큐어링 챔버(UV Curing Chamber); 및상기 UV 조사창 위에 위치하는 광필터를 포함하되,상기 자외선은 상기 UV 조사창 및 상기 광필터를 통과하여 상기 실링제를 경화시키는 것을 특징으로 하는 실링제 경화 장치.
- 제 1 항에 있어서, 상기 광필터는 상기 자외선 중 250㎚ 이하의 파장을 제거하는 것을 특징으로 하는 실링제 경화 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040107719A KR100629599B1 (ko) | 2004-12-17 | 2004-12-17 | 실링제 경화 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040107719A KR100629599B1 (ko) | 2004-12-17 | 2004-12-17 | 실링제 경화 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060068828A KR20060068828A (ko) | 2006-06-21 |
KR100629599B1 true KR100629599B1 (ko) | 2006-09-27 |
Family
ID=37163079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040107719A KR100629599B1 (ko) | 2004-12-17 | 2004-12-17 | 실링제 경화 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100629599B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107611287A (zh) * | 2014-01-21 | 2018-01-19 | 科迪华公司 | 用于电子装置封装的设备和技术 |
-
2004
- 2004-12-17 KR KR1020040107719A patent/KR100629599B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20060068828A (ko) | 2006-06-21 |
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