KR100623227B1 - Electrical printed devices fabricating method by offset printing process - Google Patents

Abstract

The present invention relates to a method of manufacturing a laminated electronic device using an offset printing method that can form a complex microcircuit wiring at low cost by using an offset printing technique, which is one of printing methods, and a film on which an image of a two-dimensional printed circuit pattern is formed. After the first step of preparing a, the second step of exposing the image on the photosensitive plate using the film, and developing the photosensitive plate exposed to the image to form a pattern portion, the pattern portion is hydrophobized and other than the pattern portion A third step of manufacturing a printing disc by hydrophilization, and attaching the printing disc to the printing roller in the stacking order and applying the conductive ink to the pattern portion in such a manner that the conductive ink is not covered with water other than the pattern portion. Including a fourth step of forming a printed circuit board by transferring the conductive ink to the substrate after being buried, For example, an electronic device having a complicated pattern can be easily formed, and an auxiliary pattern is formed between the pattern and the pattern to prevent deformation of the pattern and to stack three-dimensional complex circuit wiring.

Electronic element, printed disc, pattern, ink, cylinder, roller, photosensitive material, auxiliary pattern

Description

Manufacturing method of multilayer electronic device using offset printing method {ELECTRICAL PRINTED DEVICES FABRICATING METHOD BY OFFSET PRINTING PROCESS}

1 is a flow chart of a method for manufacturing an electronic device according to the prior art.

2 is a process chart using the electronic device manufacturing method according to the prior art.

Figure 3 is a process chart for explaining the basic concept of the offset printing method according to the present invention.

4 is a block diagram of a printing apparatus using an offset printing method according to the present invention.

5 is a flow chart of a manufacturing method of an electronic device using an offset printing method according to the present invention.

6a and 6b is a process chart using a method of manufacturing an electronic device using an offset printing method according to the present invention.

Figure 7 is a graph showing the rheological properties and rheological properties of the conventional ink according to the metal powder content of the metal ink used in the present invention.

8A and 8B are graphs of characteristics of the ink used in the method of manufacturing an electronic device according to the present invention.

9a to 9c are schematic views of a printed circuit pattern applied to a method for manufacturing an electronic device using a offset printing method of a damp water method according to the present invention.

10 is an enlarged view of a printed circuit pattern designed in an electronic device manufacturing method using an offset printing method according to the present invention.

11 is a front view of an apparatus for aligning a printing disc with a cylinder in a method of manufacturing an electronic device using an offset printing method according to the present invention.

12 (a) to (d) is a view showing an auxiliary pattern used in the electronic device manufacturing method using the offset printing method according to the present invention.

Fig. 13 is a block diagram showing an offset printing machine of a water-free method.

14 is an enlarged view of an ink roller unit of an offset printing machine of a water-free method.

15A and 15B are enlarged views of a printing unit and an ink supply unit of the non-water-based offset printing machine.

Fig. 16 is a plan view of a part for fixing a printed object of the waterless type offset printing apparatus according to the present invention.

17 is a configuration diagram showing a cooling device of the offset printing apparatus of the water-free method according to the present invention.

Figure 18 (a) to (e) is a printed circuit pattern design drawing in an offset printing method applied to a water-free printing method.

<Explanation of symbols for the main parts of the drawings>

50: printed negative 52: pattern

54: hydrophilic material 56: ink

60: target substrate 70: cylinder

72,132: Blanket 80: Pressing roller

100: film negative 102: image

104: moisture 106: ink

110: printed disc 112: photosensitive material

112a: pattern portion 120: cylinder

123: water supply device 124: water storage container

125: wet water roller 126: ink supply device

127: ink storage container 128: ink roller

130: roll-shaped member 140: target substrate

142: printed circuit pattern 143: auxiliary pattern

The present invention relates to a method for manufacturing a multilayer electronic device, and more particularly, to a method for manufacturing a multilayer electronic device using an offset printing method, which can form a complicated microcircuit wiring at low cost by using an offset printing technique, which is one of printing methods. It is about.

Recently, the rapid development of industrial technology, especially information and communication field, including electronic devices, is focused on convenience of consumers, miniaturized, portable, and high-functionality, and multi-functional integration, multimedia, which is integrated with broadcasting, computer, and communication. have.

Modern electronic information and communication devices are subject to much more stringent conditions than in the past in terms of appearance, size / weight, performance, convenience, and price. Examples of such conditions include a combination of ultra-compact, ultra-lightweight, ultra-thin, ultra-low power consumption, and foldable, high-performance (ultra-high speed) for the user to carry around at all times. Fully functional but inexpensive.

In order to satisfy such conditions, the miniaturization, ultra-thinness, and use of flexible substrates must be preceded. Moreover, as consumer demand is diversified and segmented due to increased income and living standards, parts used in electronic devices are diversified in small quantities and shortened their life cycles.

For easier understanding, a method of forming a single layer printed circuit pattern by a conventional general process will be described with reference to FIGS. 1 and 2 as follows. 1 is a flowchart of a method for manufacturing an electronic device according to the prior art, and FIG. 2 is a process chart using the method for manufacturing an electronic device according to the prior art.

The electronic device manufacturing method according to the prior art, as shown in Figure 1 and 2,

The photosensitive material 12 is coated on the target substrate 10 on which the conductive layer 11 is formed (S11). Next, a photomask 15 in which an image of a printed circuit pattern is reversed is manufactured (S12), and the photomask 15 is disposed on the photosensitive material 12. When the photo mask 15 is disposed as described above, the photosensitive material 12 is irradiated with a light source L ₁ to expose an image of a printed circuit pattern (S13). At this time, the photosensitive material 12a of the portion not covered by the photo mask 15 is reacted with the light source L1 to be cured, and the photosensitive material 12b of the portion covered by the photo mask 15 is not cured. . Next, the photomask 15 is removed (S14), and the target substrate 10 on which the photosensitive material 12 is cured is removed while the uncured photosensitive material 12b is removed (S15).

Subsequently, when the target substrate 10 is immersed in an etching solution and subjected to an etching process, the conductive layer at the portion where the photosensitive material is removed is removed, and the remaining conductive layer 11a forms a printed circuit pattern. Next, the photosensitive material 12a not removed is peeled off to complete the manufacture of the electronic device.

The photosensitive material 12 is classified into a thermosetting polymer or an ultraviolet curable polymer that is cured by heat according to a curing method. In order to secure high reliability, strong adhesive strength, high crystallization rate, and good printability are required. In order to control a more precise cell cap, it is desired that the spread degree at the time of pressurization, heating, and hardening of a board | substrate is uniform.

On the other hand, in order to manufacture a multi-layered electronic device, the above-described process is repeated on the completed electronic device to form a multi-layered wiring circuit.

In general, the manufacturing process of devices and components used in electronic information and communication devices will be described with reference to Tables 1 and 2, which are roughly classified into thin film processes, thick film processes, and bulk processes.

The above-described thin film process is a process using a combination of photo-lithography and etching process technology, and in the current state of the art, it is possible to form circuit wiring having a minimum circuit line width of 0.1 μm or less. The photo-lithography technique described above is a process that is advantageous for ultra-high integration since circuit wiring having a pattern of nanometer (nm) level is possible.

 In order to manufacture a multi-component device, the thin film process technology first deposits a single component, applies a photoresist film thereon, exposes a desired portion using a mask, and then etches it. The process of repeating the deposition process is repeated, adopting a multi-step process to fabricate the device.

Compared to the thin film process, the above-described thick film process is relatively simple and has high productivity, relatively low cost of required equipment and equipment, and the formation of a hybrid device in which a multi-component composition is formed and a mixed organic / inorganic material is relatively produced. It has an easy advantage. On the other hand, the thick film process or bulk process has a minimum line width of several tens of micrometers or more due to the technical limitations of these processes themselves. Therefore, by making use of these advantages, it is possible to fabricate devices stacked over hundreds of layers.

However, this method has a great difficulty in fabricating a hybrid component in which a multi-component composition is simultaneously formed or an organic / inorganic material is mixed. In addition, when a circuit wiring is formed on a two-dimensional plane, very high integration can be realized. However, three-dimensional high integration, in which heterogeneous component films are stacked up to hundreds or more layers, has a complicated process and a high production cost. Moreover, the thin film process requires too many intermediate processes compared with other processes, and the apparatus for this is complicated and expensive, which requires a large-scale facility investment for manufacturing new devices or components. On the other hand, the above-described thick film process can have a pattern width (stack width) of several μm in the lamination direction, but screen printing of about 100 μm or more in the planar direction is much larger than this. There is a restriction to implement only. In addition, a larger problem is that it is difficult to implement a three-dimensional circuit pattern of a complex structure. This requires a complex process such as via hole punching, electroding, alignment, stacking, curing or sintering, and laser cutting or dice sawing in order to construct a three-dimensional curved circuit. In addition, due to these restrictions, there are many restrictions in forming electronic devices having complex and fine printed circuit patterns.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art described above, by forming a complex and fine printed circuit pattern using an offset printing method, and forming an auxiliary pattern in a space between the printed circuit patterns. The present invention provides a method of manufacturing an electronic device using an offset printing method in which a shape of a pattern can be maintained or protected, and when a printed circuit pattern is stacked, a lower printed circuit pattern is not deformed and a three-dimensional complex printed circuit pattern is laminated. . In addition, it can be applied to manufacturing multi-component organic / inorganic hybrid devices, and can cope with the rapidly changing design environment of electronic devices due to the minimum investment of equipment. The present invention provides a method of manufacturing a laminated electronic device using an offset printing method capable of manufacturing an electronic device having a circuit pattern.

Method for manufacturing a multilayer electronic device using an offset printing according to the present invention for achieving the above object is a manufacturing method of a multilayer electronic device manufactured by printing a multi-dimensional printed circuit pattern on a substrate in a multi-layer, A first step of preparing a film having an image formed thereon, a second step of exposing the image to a photosensitive plate by using the film, and developing a photosensitive plate on which the image is exposed to form a pattern portion, and then the pattern portion is hydrophobized. A third step of manufacturing a printing disc by hydrophilizing other than the pattern portion, and mounting the printing disc on a printing press roller according to a lamination order, and in the state where the conductive ink is not covered with water other than the pattern portion so as to prevent conductive ink. And depositing the conductive ink on the substrate, and transferring the conductive ink to the substrate to form a printed circuit board.

In addition, the method of manufacturing a multilayer electronic device using the offset printing method according to the present invention uses a non-conductive ink between the patterns to protect the printed circuit pattern formed in the process of laminating another printed circuit pattern on the first printed circuit pattern. It may include the process of transferring to form an auxiliary pattern. The method may further include heat treating the substrate on which the printed circuit pattern is formed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BACKGROUND OF THE INVENTION The method for manufacturing a laminated electronic device according to the present invention is used in many industrial products mainly on a printed material which is difficult to print with a general convex plate or a concave plate by using an offset printing method, which is an example of lithographic pressing. Moreover, it is possible to print fine and complicated shapes compared to the general printing method of the offset printing method, which is suitable for the printing method of the electronic device field.

3 is a process chart for explaining the basic concept of the offset printing method according to the present invention, Figure 4 is a block diagram of a printing apparatus using the offset printing method according to the present invention, the pattern 52 on the printing disc 50 The hydrophilic material containing water is hardly buryed (ie, hydrophobized) on the part forming the portion, and the portion 53 between the patterns is treated so as to bury the hydrophilic material 54 including water (ie, hydrophilized). do. Next, when the hydrophilic material 54 including water is applied to the printing disc 50, and the oil ink 56 is injected into the printing disc 50, water and oil are repelled only to the pattern 52. Ink 56 will be buried. When ink 56 is deposited on the pattern 52 as described above, the target substrate 60 is disposed on the upper side of the printing original plate 50, and then contacted with the printing original plate 50 so that the ink 56 of the pattern 52 is formed. It is to be transferred to the target substrate (60). Next, the target substrate 60 is dried to complete offset printing.

The above-described offset printing method does not transfer the ink 56 deposited on the pattern 52 directly to the target substrate 60, and as shown in FIG. 4, a cylinder to which an elastic rubber blanket 72 is attached ( 70) and the transfer to the target substrate 60 may be performed continuously.

In addition, a pressure roller 80 is installed below the cylinder 70 to maintain a constant contact pressure between the rubber blanket 72 and the target substrate 60 according to the thickness of the target substrate 60.

5 is a flowchart illustrating a manufacturing method of an electronic device using an offset printing method according to the present invention, and FIGS. 6A and 6B are flowcharts illustrating a manufacturing method of an electronic device using an offset printing method according to the present invention.

In the method of manufacturing an electronic device using the offset printing method according to the present invention, as shown in FIGS. 5 and 6, a shape of a printed circuit pattern to be formed in the electronic device using a dedicated program is a two-dimensional pattern image. Designed as (102), the reverse image 103 of the printed circuit pattern is printed on the film disc 100 (S22), the film disc 100 on which the reverse image 103 is printed UV in the dark atmosphere The photoreceptor is exposed to the printing disc 110 coated with the photosensitive material 112 on the surface for 1 minute and 30 seconds (S23). At this time, the photosensitive material 112b below the reversed image 103 is not cured, and the photosensitive material 112a which is located in the space between the reversed images 103 and exposed to UV is cured.

Next, when the film original plate 100 is removed and the printing original plate 110 is immersed in the mixed solution of the photosensitive liquid and distilled water, the photosensitive material of the uncured portion of the photosensitive material 112 of the printing original plate 110, that is, the reverse phase pattern 112b is removed and is formed on the printing disc 110 in the form of a pattern portion corresponding to the pattern image 102 formed on the film disc (S24). At this time, since the shape of the pattern portion can be removed when the amount of the photosensitive liquid is large, the mixing ratio with water is well adjusted. In addition, the photosensitive material 112b of the undesired portion may be hardened when not exposed to ultraviolet rays, so that the photosensitive material 112 of the printing disc 110 may not appear in the same pattern portion as the image 102 of the film disc 100. Be careful not to be exposed to ultraviolet rays.

Meanwhile, in order to manufacture an electronic device having three-dimensional printed circuit patterns formed three-dimensionally, another printing circuit pattern printing disc for printing another printed circuit pattern is manufactured using the same method as described above.

When the printing disc manufacturing step S21 configured as described above is completed, the printing disc 110 having the pattern part 112a is fixed to the cylinder 120. At this time, the printing disk 110 is aligned to position the fixed to the correct position of the cylinder (120). It is fixed and mounted in sequence in the same position of the cylinder 120, the printing disc 110 for the formation of different patterns, respectively. As such, by accurately mounting the printing disc 110 on the cylinder 120, multi-layer printing is possible at the exact position on the target substrate 140 on which the tomographic pattern is printed, thereby enabling the production of a complicated stacked type device. do.

Next, the cylinder 120 is rotated, and the water 104 is buried in portions 112b other than the pattern 112a of the printing disc 110, and water and oil are used to repel the pattern 112a. By performing the ink transition step 25 to bury the oil-based conductive ink 106.

In addition, the printing original plate 110 to which the ink 106 corresponding to the shape of the pattern 112a is transferred is a first pattern for transferring the pattern 142 to the target substrate 140 by the rotation of the cylinder 120. The transfer step (S26) is performed. To this end, a water supply device 123 and an ink supply device 126 for supplying water and ink are sequentially installed at positions in contact with the rotation direction of the printing disc 110. The water supply device 123 is a water storage container 124 for storing the water 104, a plurality of wet rollers in contact with the water 104 and the printing disc 110 of the water storage container 124. And the ink supply device 126 includes an ink storage container 127 for storing ink 06, an ink 106 of the ink storage container 127, and the printing disc 110. And a plurality of ink rollers 128 in contact with.

The offset printing apparatus configured as described above next supplies the moisture 104 to the printing disc 110 using the wet roller 125 and supplies the ink 106 to the printing disc using the ink roller 128. When supplied to 110, the ink 106 is buried only in the portion where the pattern portion 112a is formed due to the repulsion principle of water and oil. Next, the ink 106 buried in the pattern portion 112a of the printing disc 110 by the rotation of the cylinder 120 is transferred to the rubber blanket 132 mounted on the roll-shaped member 130, and the rubber blanket 132 The ink 106 transferred to) is transferred to the target substrate 140 passing between the cylinder 120 and the pressure roller 80 to form the printed circuit pattern 142 of the electronic device.

Meanwhile, after the formation of the printed circuit pattern 142 is completed on the rubber blanket 132, another circuit pattern is formed on the printed circuit pattern 142 of the electronic device to stack the printed circuit pattern in three dimensions. In this case, in order to prevent deformation during the printing process, an auxiliary pattern forming step (S27) of forming an auxiliary pattern 143 in the space between the printed circuit pattern 142 and the printed circuit pattern 142 is performed.

In this case, the dummy printing disc used when the auxiliary pattern 143 is formed may include a separate auxiliary pattern printing disc having an auxiliary pattern part corresponding to the space between the pattern parts 112a of the printing disc 110. The auxiliary pattern 143 is formed by transferring the non-conductive ink by offset printing. Next, heat treatment of each ink transferred to the target substrate 140 to remove foreign substances and plastic processing is performed (S28).

An electronic device in which a circuit pattern is formed through the above steps is repeatedly stacked on the target substrate 140 by repeating the above steps.

The object substrate 140 may be a substrate of any kind, such as plastic, glass, ceramic, or metal, it is also possible to use a substrate in the form of a roll (roll). In the embodiment of the present invention, the target substrate 140 is a mixture of alumina and glass for LTCC, the sintering temperature is 850 ℃, the dielectric constant is 10,852, 5.1852, green sheet having a thickness of 250㎛ After cutting, use Excto knife, a special tool for cutting green sheet, to cut into 80mm × 50mm size.

On the other hand, the conductive ink 106 used in the formation of the pattern 142 is distinguished from the non-conductive ink used in the formation of the auxiliary pattern 143, which is a conductive metal (Ag) powder and a photosensitive mixture ( For example, UV-FA 90 medium) is prepared by mixing about 55wt% in each weight ratio. In addition, the nonconductive ink is prepared by mixing ferrite powder, which is a kind of ceramic, and a photosensitive mixture (for example, UV-FA 90 media) at a weight ratio of about 55 wt%.

Figure 7 is a graph showing the rheological properties (rheological) and the rheological properties of the conventional ink according to the metal powder content of the metal ink used in the present invention.

Meanwhile, UV-FA 90 media, which is an example of the photosensitive mixture, is used to lighten or gloss the ink used in printing, and includes coloring pigments such as titanium bag and calcium carbonate.

8A and 8B are graphs of characteristics of the ink used in the method of manufacturing an electronic device according to the present invention, and show shear rate, shear stress, and viscosity of ink according to the weight of powders. It is a graph measured by a rheometer, and is a graph compared with a general offset printing ink. Referring to the graph described above, when the weight content of the powder is 55wt%, the performance characteristics of the ink exhibit a similar behavior to that of the general ink. The graph described above shows how the powders are dispersed in the media ink after mixing as an EDS analysis. The above-described metal ink removes organic matters through the exothermic process of the inks prepared by applying heat to 1000 ° C.

Example 1

9A to 9C are schematic diagrams of circuit patterns applied to an electronic device manufacturing method using the offset printing method according to the present invention, and FIG. 10 is a design of an electronic device manufacturing method using the offset printing method according to the present invention. The circuit pattern is enlarged.

In the method of manufacturing an electronic device using the offset printing method according to the present invention, as shown in FIGS. 9 and 10, a portion of the device pattern is represented as positive, and the remaining portion is represented as a negative form.

11 is a front view of an apparatus for aligning a printing disc with a cylinder in an electronic device manufacturing method using an offset printing method according to the present invention.

12A to 12D illustrate auxiliary patterns used in an electronic device manufacturing method using an offset printing method according to the present invention, and FIG. 12A illustrates a metal (positive) region as a positive region. (Ag) ink is printed, and FIG. 12B is a dummy area for protecting the area (A) of FIG. 12 before the ceramic ink of FIG. 12C is printed. (negative). FIG. 12C is a pattern for protecting the pattern of the positive region shown in FIG. 12A and printing a ceramic ink for maintaining an insulating state with the pattern to be stacked thereon. Represented by

Like the above method, FIG. 12D is designed to protect the pattern of FIGS. 12A and 12C and to protect the next positive area to be printed. This is to ensure that the shape of the first printed device is not deformed while the devices are stacked by repeated printing.

The pattern image of the designed electronic device is output as a film, and the output film is attached to the printing disc and is exposed to the UV photosensitive device for about 80 seconds. As described above, when a printed disc is produced, it is mounted on a cylinder. At this time, by aligning the position of the printing disc serves to accurately print on the printed object. In addition, it is possible to fix the accuracy of the position of the printing disc during the repeated printing by making the replacement position constant when replacing the printing disc during the repeated printing.

Next, when water is supplied to the printing disc using a damp roller, and ink is supplied to the printing disc using a planetary roller, ink is deposited only on the part where the element pattern appears due to the repulsion principle of water and oil. Will get water. Next, the pattern of the printing disc is transferred to the rubber blanket by the rotation of the cylinder, and the ink transferred to the rubber blanket is transferred to the target substrate passing between the cylinder and the pressure roller.

Example 2

FIG. 13 is a configuration diagram illustrating a non-water-based offset printing machine, FIG. 14 is an enlarged view of the ink roller unit of the non-water-based offset printing machine, and FIGS. 15A and 15B are a printing of the non-water-based offset printing machine. An enlarged view of the portion and ink supply portion.

The offset printing apparatus 200 according to the present invention is divided into an ink supply unit A, a printing unit B, and a product discharge unit C for supplying ink, as shown in FIGS. 13 to 15B.

The ink supply unit A includes an ink stacking container 211 in which ink is stored and an ink supply lever 214 for supplying ink in the ink stacking container 211, and the ink supply lever 214 supplies ink. The amount of ink supplied by the adjustment cylinder 212 is adjusted to an appropriate amount. On the other hand, the ink supplied from the ink supply lever 214 is mixed in a uniform thickness and composition through the mixing device 218, and then supplied to the ink frame 216.

The printing unit (B) has a printing body frame (228) consisting of a printing unit frame (228) is equipped with a pressure cylinder (221) for pressurizing the substrate to be put on one side, the pressure cylinder (221) is eccentric It is connected to the cam 222 and is connected to the eccentric shaft 224 of the blanket 225.

The product discharge unit C includes a work bed 230 for printing a substrate. The working bed 230 includes a working plate 232 for transferring the substrate, a gear unit 234 and an LM guide 236 for transferring the working plate 232. In addition, a pressure adjusting bolt 227 for adjusting the pressure of the roller in contact with the blanket 224 is provided on the printing unit frame 228.

Meanwhile, Tavern 240, which is not described, is a drying apparatus 240 for drying printed ink, and Tavern 250 is a substrate supply unit 250, which includes a loading arm 252, a coating machine 254, and a substrate to be printed. 256). In addition, the offset printing apparatus 200 is provided with a drive motor 206 on one side, the drive gear 201 and the driven gear 204 connected to the drive motor 206 and for controlling the transfer speed of the printed object. And a transfer gear 208.

Example 2 of the present invention configured as described above does not use moisture unlike Example 1, and uses a non-waterproof plate that is different from the original printing component of Example 1. The non-water-based printing described above has advantages in that the printout is superior to the water-based printing and that various materials can be used as the printed object. In addition, since the printed object is fixed to the printing table and there is no shaking due to mechanical vibration, a pattern of a fine circuit line width is realized.

16 and a plan view of a portion fixing the printed object of the non-water-based offset printing apparatus according to the present invention, Figure 17 is a configuration diagram showing a cooling apparatus of the non-water-based offset printing apparatus according to the present invention, In the non-water-based offset printing apparatus 300 according to the present invention, a substrate supply valve 312 and a substrate discharge valve 314 are provided on the main frame 310 to control the supply and discharge of the substrate. In addition, the main frame 310 is provided with a work table 320 including a fixing plate 322 for mounting a substrate.

The above-described offset printing apparatus 300 of the waterless method operates the substrate supply valve 312 and the substrate discharge valve 314 to fix or discharge a printed object such as a substrate on the work table 320. On the other hand, the printed object mounted on the work table 320 moves while rotating in the circumferential direction by a driving unit (not shown). In addition, the work table 320 is provided with a correction means 330 including a setting pin 335 for correcting the position of the printed object to be mounted.

Since the ink used in the above water-free method has a property of being hardened by heat, a cooling device under the work table 320 to prevent hardening caused by friction generated by heat generated by mechanical operation and mechanical friction. 340 is installed to flow the coolant.

18A to 18E are diagrams of device patterns in an offset printing method applied to a water-free printing method. In the aforementioned water-free method, a dummy for protecting a portion where the metal (Ag) ink is printed is shown. The auxiliary pattern of the region is shown in Fig. 18A. In addition, a positive region constituting the magnetic portion is designed as shown in FIG. 18B, and a portion that becomes a printed circuit pattern of the electronic element is expressed as negative, as shown in FIG. 18C. Next, as shown in FIGS. 18D and 18E, the magnetic part of the dummy area is printed to protect the pattern and the auxiliary pattern and to insulate the pattern stacked thereon.

As described above, the manufacturing method of the multilayer electronic device using the offset printing method according to the present invention has been described with reference to the illustrated drawings. However, the present invention is not limited to the embodiments and drawings described above, and is seen within the claims. Various modifications and variations can be made by those skilled in the art to which the invention pertains.

 The multilayer electronic device manufacturing method using the offset printing method according to the present invention configured as described above can easily form a complex and fine circuit pattern using the offset printing method. In addition, since the auxiliary pattern is formed in the space between the finely formed pattern and the pattern to support the pattern, deformation of the pattern is prevented, and thus, even when a three-dimensional complex electronic device is manufactured by stacking another pattern, Since the deformation of the pattern is prevented, it is possible to stack the pattern more easily.

In addition, the electronic device manufacturing method using the offset printing method according to the present invention can cope with the rapidly changing design environment of the electronic field due to the low equipment investment cost required to change the pattern of the electronic device, the production process is simple, low cost As a result, it is possible to form a complex microcircuit pattern, thereby reducing the production cost.

Claims (3)

A method of manufacturing a multilayer electronic device manufactured by printing a multi-dimensional printed circuit pattern on a substrate in multiple layers, A first step of preparing a film on which an image of a two-dimensional printed circuit pattern is formed; A second step of exposing the image to a photosensitive plate using the film; Developing a photosensitive plate on which the image is exposed to form a patterned part, and then performing a hydrophobization treatment on the patterned part and producing a printed disc by hydrophilizing other than the patterned part; The printed disc is mounted on a printing machine roller according to the stacking order, and the conductive ink is applied to the pattern portion in a state in which water is applied to the pattern portion so that the conductive ink is not covered with water other than the pattern portion, and then the conductive ink is transferred to a substrate to form a printed circuit board. Method of manufacturing a multilayer electronic device using an offset printing comprising a fourth step. The method of claim 1, further comprising forming a subpattern by transferring non-conductive ink between the patterns to protect the printed circuit pattern formed in the process of stacking another printed circuit pattern on the first printed circuit pattern. A method of manufacturing a laminated electronic device using offset printing. The method of manufacturing a multilayer electronic device using offset printing according to claim 1 or 2, further comprising heat-treating the substrate on which the printed circuit pattern is formed.

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