KR100818490B1 - Apparatus for patterning coatings - Google Patents

Abstract

The present invention is a flat plate provided by the plate transfer apparatus to be transportable in the Z-axis direction, X-axis direction, Y-axis direction, and the θ axis direction relative to the plate surface; A coater which is provided to be transportable along the plate surface direction of the plate by a coater conveying device to apply a coating to the plate; A substrate disposed under the flat plate and having an unevenness formed of a protrusion and a groove; And a piezoelectric element using an electrical crimp sensitive method or a laser interferometer using an optical crimp sensitive method, wherein the flat plate is transferred so that the flat plate contacts the substrate, thereby transferring the coating of the flat plate to the protrusion of the substrate, The coating remaining on the plate or the coating of the protrusion of the substrate is transferred to a printed object to form a pattern, and when the plate and the substrate having the unevenness are in close proximity using the piezoelectric element or the laser interferometer or the When the plate and the substrate are in close proximity or when the substrate having the unevenness and the substrate are in close proximity, the pressure is 10 ^-2 to 10 ³ Mpa with respect to the entire surface to be compressed while aligning. A patterning device for coatings is provided. This method is simple in the process and enables fine patterning of coatings, preferably functional materials such as electronic materials, with high precision and highway uniformity.

Coating, pattern forming

Description

Patterning device for coatings {APPARATUS FOR PATTERNING COATINGS}

1 and 2 is a view showing a process of applying a coating on a flat blanket using a slot coater of the method according to an embodiment of the present invention,

3 and 4 are views showing a process of transferring a portion of the coating of the flat blanket to the substrate using the substrate in a method according to an embodiment of the present invention,

5 and 6 are views showing a process of transferring a patterned coating on a plated blanket to a printed object in a method according to one embodiment of the present invention;

7 is a view showing a first transfer device of a flat plate for moving the flat plate up and down (z-axis),

8 is a view showing a second conveying apparatus for a plate for moving the plate to the left and right (y axis), front and rear (x axis), and θ axis;

9 and 10 are diagrams schematically showing a coater and a coater conveying apparatus.

* Description of the symbols for the main parts of the drawings *

1: slot coater 2: flat blanket

3: flat plate blanket support part 4: substrate

4a: protrusion 4b: groove

4c: substrate support portion 5: printed body

5a: Printed body support part 6: Support part fixing frame

7, 7a, 7b, 7c, 7d: coating 21: first adjusting screw

22: moving support frame 23: second adjustment screw

24: third adjusting screw 25: stepping motor (stepping motor)

30: coater mounting frame 31: linear motor

The present invention relates to a method of patterning a coating. More specifically, the present invention is a conductive or optical characteristic used to configure a core circuit of an electronic device such as an electromagnetic recording, an image, and a circuit device requiring a precise pattern such as a semiconductor circuit or a color filter of a TFT-LCD or plasma display. The present invention relates to a method for finely patterning a functional material such as a material having a high uniformity at high precision and high speed.

As the size of electronic devices decreases, a high degree of integration is required for electronic components, and precision of several microns or less is required for the purpose of patterning electronic materials. Photolithography, which is now widely used, can provide such a high degree of precision.

In particular, in the TFT-LCD industry, the plasma display field, or the semiconductor field, which lead the display industry, photolithography is widely used as a method of fine patterning a functional material for forming a color filter or a semiconductor circuit.

However, photolithography has many problems. That is, photolithography must first form a photoresist layer on the electronic material layer to be patterned, selectively expose and then develop the photoresist layer, and then remove the photoresist layer after patterning the electronic material layer. The process is very complex because it must go through a process that must be done.

In addition, the production equipment is expensive and the size of the equipment is also very big problem. In addition, during the process, since the coating of the material is performed even on parts that are not necessary, there is a problem in that waste of material is greatly generated.

Furthermore, in order to ensure the fairness of the method, a photosensitive material reacting to light of short wavelength must be mixed with the electronic material, which has been an increase factor of the material cost, and also a deterioration factor of the conductive, electromagnetic or optical properties of the electronic material itself. It also became.

In particular, a material such as a resist used in the method must contain various photosensitive materials and coating auxiliary materials in order to ensure the fairness of the method, and thus has disadvantages of high cost and low storage stability. In addition, this method is known to require enormous time and cost to quantify the sensitivity of materials such as resists.

As a method for overcoming the photolithography method, roll printing is known, and this method is a conventional classical printing method dedicated to the transfer of the pattern of the electronic material, and the blanket wound on the roll This is done by rolling the substrate with the grooves filled with the material and the printed object in turn.

The roll printing method can omit the process of exposure, development, etc., does not need to add a photosensitive material to the material to be patterned, the process is simple and the size of the equipment can be significantly reduced.

However, roll printing technology was originally used as a printing method for publishing a magazine or a book with a small printing area, and there is a limit in applying it to forming a pattern of an electronic material on a large substrate.

First, the roll printing method is greatly influenced by the rolling speed or direction of the roll, the thickness of the electronic material to be patterned, and the pressure applied to the roll, and the pattern is transferred from the curved surface of the roll to the flat plate. When the distortion of the pattern occurs.

In addition, in order to uniformly coat the electronic material, many variables such as precision processing of the roll, thickness control of the blanket wound on the roll, and nozzle position and angle control when coating the electronic material should be considered.

Specifically, the high precision processing of the roll body used for the roll printing method is difficult, and it is difficult to uniformly attach the blanket to the roll due to the deformation resulting from the curvature of the roll body, and the uniform application of the coating liquid to the blanket is difficult. . Due to this, there are many restrictions on perfect pattern formation such as uncoated areas or residues.

In addition, the biggest disadvantage of the above method is the warpage of the roll caused by the load of the roll as the roll is enlarged. In addition, the gear wheels mounted on both sides of the rolls, which serve as wheels to roll, are worn or deformed due to the roll load, thereby maintaining a constant gap between the roll surface and the printed substrate. There is no problem. In addition, the method has a problem that takes a long time when applied to a large substrate.

Due to this problem, the roll printing method is not used much in the current technical process, and the photolithography method having the above-mentioned disadvantages is more used. Therefore, there is a need for the development of a patterning method of a functional material that can overcome the aforementioned problems.

As described above, in the prior art, there have been problems in fairness, cost, coating uniformity, precision, and speed control in fine patterning functional materials such as electronic materials.

Accordingly, it is an object of the present invention to provide a method of patterning functional materials which is simple in processing steps, relatively inexpensive, and which can ensure coating uniformity, high precision and high speed.

One embodiment of the present invention comprises the steps of: a) applying a coating to a plate; b) by bringing the coating applied to the plate into contact with the protrusion of the substrate having the unevenness formed by the protrusion and the groove, the portion of the coating of the plate that contacts the protrusion of the substrate from the plate to the protrusion of the substrate. Transferring; And c) transferring the coating material remaining on the plate or the coating of the protrusion of the substrate to the printed surface of the printed material so as to be transferred to the printed material.

Another embodiment of the present invention provides an electronic device manufacturing method for manufacturing an electronic device by fine-patterning the electronic material using the patterning method of the coating according to the present invention.

Another embodiment of the present invention is a flat plate provided to be transportable in the Z-axis direction, X-axis direction, Y-axis direction, and θ-axis direction relative to the plate surface by the plate transfer device; A coater which is provided to be transportable along the plate surface direction of the plate by a coater conveying device to apply a coating to the plate; And a substrate disposed below the plate and having a protrusion formed thereon, wherein the plate is transferred so that the plate contacts the substrate, thereby transferring the coating of the plate to the protrusion of the substrate, and then remaining on the plate. It provides a patterning device of the coating, characterized in that to form a pattern by transferring the coating of the water or the projection of the substrate to the printed object.

Hereinafter, the present invention will be described in detail.

The present invention relates to a method for patterning a coating, wherein the formation of a desired coating layer, the formation of a photoresist layer on the coating layer, the selective exposure of the photoresist layer, the patterning and patterning of the photoresist layer by the development of the photoresist layer Unlike the photolithography method which undergoes a complicated process such as selective etching of a coating layer using a photoresist layer and stripping of a photoresist layer, the process of the present invention is very simple.

That is, as one embodiment of the present invention, after coating a coating on a plate, a shape of a coating pattern is formed directly and simply by using a substrate having irregularities, and the patterned coating is transferred to a printed object. Patterning of the coating in the printed object can be achieved by a process to.

On the other hand, the present invention is characterized by using a flat plate in the coating process, unlike the conventional roll printing method. When the plate is larger than the roll, the increase of the load can be reduced. Therefore, when the plate is used, the problem caused by the load of the roll that occurs when the roll is used, that is, the deformation of the gear wheel acting as the wheel of the roll or the roll Etc. problems can be prevented.

In addition, since the flat plate is more easily processed than the roll, and there is no problem such as a change in curvature of the roll, when the blanket rubber is attached, it can be more uniformly and firmly attached. It can apply | coat uniformly.

In addition, since the roll printing method uses a method of rolling a roll to pattern the coating, the coating is more likely to be transferred to the corners or sides of the protrusions as well as to the surface of the protrusions of the substrate having the unevenness. There is a problem that the precision of the pattern of the coating to be transferred to the inferior.

However, in the case of using a flat plate, the flat plate can be pressed in the vertical direction to the substrate having unevenness, and the flat plate or the substrate having the unevenness can be pressed in the vertical direction to the printed object, so that the coating is more precisely compared to the roll printing method. Water can be patterned.

In addition, when the plate is used, the coating is patterned by pressing at a time, so that the coating can be patterned more quickly than the roll printing method of rolling a roll.

In the patterning step of a functional material such as an electronic material, the simplification, high precision, and high speed of the process are very important factors that influence the productivity of the electronic device. Nevertheless, there is no known method of patterning a coating using a plate.

The following describes the method of the present invention with reference to the accompanying drawings. However, the embodiment of the drawings is intended to illustrate the present invention, whereby the scope of the present invention is not limited.

According to one embodiment of the present invention, the method of the present invention comprises the steps of: a) applying a coating to a plate; b) by bringing the coating applied to the plate into contact with the protrusion of the substrate having the unevenness formed by the protrusion and the groove, the portion of the coating of the plate that contacts the protrusion of the substrate from the plate to the protrusion of the substrate. Transferring; And c) transferring the coating material remaining on the plate to the printed surface by contacting the printed surface of the printed object. This embodiment is illustrated in Figures 1-6.

In the above embodiment, as shown in FIG. 1, the flat plates 2 and 3 are composed of a flat plate blanket 2 and a flat plate blanket support 3 capable of supporting the flat plate blanket 2. Can be.

The flat blanket 2 and the flat blanket support 3 can be attached by vacuum, whereby the flat blanket 2 can be firmly fixed to the flat blanket support 3.

The flat blanket 2 may be composed of a soft silicone rubber first layer to which the coating 7a is applied, and a second layer of rigid PET material in contact with the flat blanket support 3. In addition, the plate blanket support 3 may be made of a hard and less wear-resistant material such as stainless steel. The flat plate blanket 2 is a flat plate blanket support 3 by a wafer fixing vacuum suction device which pulls the flat plate blanket 2 to the flat plate blanket support 3 side through a hole formed in the flat plate blanket support 3. It can be fixed to.

The flat plates 2, 3 composed of the flat blanket 2 and the flat blanket support 3 are connected to the flat conveying apparatus composed of the first conveying apparatus and the second conveying apparatus, as shown in Figs. It is possible to precisely move the position in the vertical direction (Z axis; see FIG. 7), left and right (y axis; see FIG. 8), front and rear (x axis; see FIG. 8), and rotation (θ axis; see FIG. 8). .

As shown in FIG. 7 showing the first conveying apparatus of the flat plate, a threaded line is machined in a direction parallel to the bottom surface of the moving support frame 22 having a hypohedral surface and the first adjusting screw 21 on the threaded line. After adjusting the rotation of the first adjustment screw 21, the flat plate blanket 2 coupled to the platen blanket support 3 is moved up and down (Z axis) along the comb surface of the movable support frame 22 You can move it. As an example, when the first adjusting screw 21 is rotated to be inserted into the thread line, the plate blanket support 3 to which the plate blanket 2 is coupled is pushed by the comb surface of the moving support frame 22 and the substrate 4. Is moved in the direction of approach. As described above, the flat plates 2 and 3 can be moved in the direction (up-down direction) to gradually approach and space the substrate 4 by using the first transfer device of the flat plate. Here, one first adjusting screw 21 is provided, but the number of the first adjusting screw 21 is not limited to one.

As can be seen in FIG. 8, which shows the second conveying apparatus of the flat plate, a precision screw thread is machined on the side surface of the flat blanket support 3, and the second adjusting screw 23 and the third adjusting screw 24 are screwed to the screw line. After adjusting the rotation of the second and third adjustment screw (23, 24), the flat plate blanket support 2 to which the flat blanket (2) is coupled to the left and right (y axis) and front and rear (x axis) You can move it to. The θ-axis movement (rotation) of the plates 2 and 3 may be performed by relatively adjusting the second adjusting screw 23 and the third adjusting screw 24 of the plate blanket support 3. Here, four second adjusting screws 23 and three third adjusting screws 24 are provided, respectively, but the number of second and third adjusting screws 23 and 24 is not limited thereto.

In addition, the flat plate transfer device composed of the first and second transfer device is coupled to at least one of the first adjustment screw 21, the second adjustment screw 23, and the third adjustment screw 24, the first adjustment screw And a stepping motor 25 for rotating at least one of the second adjusting screw 23 and the third adjusting screw 24. By driving the stepping motor 25 and rotating the adjustment screws 21, 23 and 24, the flat plates 2 and 3 can be finely positioned. Alternatively, the adjustment screws 21, 23, and 24 may be manually rotated. The flat plate transfer device having the first and second transfer devices is not limited as shown in the drawings.

In addition, the plate transfer apparatus capable of positioning the plate (2, 3) consisting of the plate blanket (2) and the plate blanket support 3, the left and right transfer means for transferring the plate (2, 3) to the left and right; It may be composed of a shanghai conveying means for conveying the flat plate (2,3) up and down.

The left and right conveying means may be composed of a mounting frame on which the flat plates 2 and 3 are mounted and a linear motor which is coupled to the mounting frame to move the mounting frame to the left and right. Alternatively, the left and right transfer means may be drive arms.

Shanghai transport means may be composed of a motor for generating power for moving the mounting frame on which the flat plate (2,3) is mounted up and down, and a gear for transmitting the power of the motor to the mounting frame. That is, the flat plate (2,3) can be transferred up and down through the gear system. Alternatively, the Shanghai transport means is a motor for generating power for moving the mounting frames on which the plates 2 and 3 are mounted up and down, and a piston connected to the mounting frame and movable in the cylinder by the power of the motor. Can be configured. That is, the flat plates 2 and 3 can be conveyed up and down by a piston method using pressure. Alternatively, the Shanghai vehicle may be a driving arm.

On the other hand, since the flat blanket 2 is attached flat to the flat blanket support 3, it is possible to prevent the bending of the flat blanket 2 as compared with the case where the blanket is attached to the roll.

As the material of the flat blanket 2, it is preferable to use a material having a lower adsorption force on the coating than the material of the substrate 4 or the printed object 5 having the unevennesses 4a and 4b. In addition, it is preferable that the flat blanket 2 has a release property and a restoring force to some extent when a pressure is applied. For example, when glass is used for the board | substrate 4 and the to-be-printed body 5 which have unevenness | corrugation 4a, 4b, the flat blanket 2 can use a silicone rubber. Typical examples of silicone rubbers include polydimethylsiloxane, and elastomers that make energy-saving systems by deforming external forces such as polyurethane and restoring after a certain time. Can be used to form both flat blankets. As an example, a flat blanket can be obtained by mixing PDMS stock solution with a curing agent and curing on a surface plate. At this time, a spin or slit type coater may be used to obtain a constant thickness. After curing, the blanket is suitable to have a hardness of Rockwell C-scale 20 ~ 69, the hardness can be adjusted by changing the tightness of the polymer chain to be cured and the addition amount when polyurethane is added to PDMS.

Since the flat blanket support 3 has a small increase in its own load as compared with the case of using a roll when it is enlarged, its durability is higher than that of the roll method. In addition, when the flat blanket support 3 is manufactured by thinly fabricating it using a material such as stainless steel or an inorganic material such as marble or a material that is hardly deformed by gravity or its own load, the flat blanket support 3 The durability of (3) can be further improved. This is because the inorganic material such as marble or ceramic hardly exhibits deformation in metal or polymer material.

The method of the present invention comprises the step of coating a coating 7 on the flat blanket 2. The coating 7 of the coater 1 may be coated on a flat blanket 2 to form a coating 7a of the type shown in FIG. 2.

In the present invention, a coater for applying the coating 7 to the flat blanket 2 is preferably a capillary coater or a slit coater capable of maintaining a high coating uniformity. It is also possible to use a coating means known in the art without being limited thereto. The coater 1 may apply the coating 7 to the flat blanket 2 while being transported by the coater feeder. As an example of the coater conveying apparatus, as shown in FIGS. 9 and 10, a linear motor for moving the mounting frame 30 on which the coater 1 is mounted and the mounting frame 30 on which the coater 1 is mounted left and right. 31. Or by a drive arm.

Subsequently, as shown in FIG. 3, the coating 7a of the flat plate blanket 2 is pressed onto the protrusions 4a of the unevennesses 4a and 4b of the substrate 4, and as shown in FIG. 4. By separating these pressing surfaces, a portion of the coating of the flat blanket 2 which is in contact with the protruding portion 4a of the unevenness 4a, 4b is formed of the substrate 4 from the flat blanket 2. It is transferred to the protrusion 4a.

Subsequently, as shown in FIG. 5, the plated blanket 2 on which the coating 7c remains is pressed onto the printed material 5, and the coated material 7c formed on the plated blanket 2 is printed. After transferring to 5), as shown in FIG. 6, when these compressed surfaces are separated, a coating 7d pattern is formed on the printed object 5.

When pressing the substrate 4 having the platen blanket 2 and the unevennesses 4a and 4b, and when pressing the platen blanket 2 and the printed object 5, the pressing surfaces are perpendicular to the pressing surface. It is preferable to compress by the. Thus, the accuracy of the pattern of the coating formed when pressed in the vertical direction can be further improved.

In the above embodiment, the substrate 4 and the printed object 5 having the unevennesses 4a and 4b can be used regardless of the material as long as the adsorption force to the coating is higher than that of the flat blanket 2.

However, for effective ink transfer, the flat blanket 2 having releasability must be able to be pressed, so that the substrate 4 having the unevennesses 4a and 4b is made of silicon such as aluminum or stainless steel, or glass such as glass. It is preferred to consist of compounds. The substrate 4 is usually engraved with a pattern having a depth of 0.1 ~ 100um, the finer the pattern, the more precise the pattern can be obtained. It is preferable that the ratio of the width and depth of the pattern is 5: 1 to 0.01: 1, and the larger the aspect ratio of the pattern is, the more difficult the machining is and the greater the risk of breakage during printing.

In addition, the printed material may be both a material having a hard surface such as glass and a material having a surface that can be bent as a polymer polymer such as polyethylene, polypropylene, polyvinyl, and the like. For example, flexible plastic materials, such as polyester and PET used for e-paper or a flexible display; Or a rigid plastic material of polyurethane material or epoxy material used for a PCB substrate or the like; Or glass may be used, but is not limited thereto.

In the present invention, the substrate 4 and the printed object 5 having the unevenness 4a and 4b may be disposed on the substrate support portion 4c and the printed object support portion 5a having the unevenness, respectively. The substrate 4 and the printed object 5 having 4a and 4b may be attached to their support portions 4c and 5a by vacuum.

The substrate 4 and the printed object 5 having the unevennesses 4a and 4b can be mounted on the support fixing frame 6 disposed at positions necessary for the process by their support portions 4c and 5a, respectively, The position of can be fine-adjusted up, down, left, right, front and back, and rotation respectively.

Here, the substrate 4 and the printed object 5 having the unevennesses 4a and 4b use the same principle as the position adjustment of the above-described flat plates 2 and 3, that is, the flat plate conveying apparatus shown in Figs. Position can be adjusted. The substrate 4 and the printed object 5 having the unevennesses 4a and 4b can be moved in all directions in the x-axis, the y-axis, the z-axis, and the θ-axis like the flat plates 2 and 3 described above. The substrate 4 and the printed object 5 having the 4a and 4b can be independently adjusted according to the variable values (x-axis, y-axis, z-axis, and θ-axis).

The supporting part fixing frame 6 supports the substrate 4 and the printed object 5 having the unevennesses 4a and 4b from the lower side. The supporting part fixing frame 6 also has the x-axis, y-axis, z-axis, And since the position movement in all directions of (theta) axis is possible, it is convenient when the board | substrate 4 which has unevenness 4a, 4b, and the to-be-printed body 5 are going to move the same movement distance simultaneously.

In addition, the substrate 4 and the printed object 5 having the unevennesses 4a and 4b can be transferred using a conveying apparatus including a conveyor apparatus and a driving arm. That is, the substrate 4 having the unevennesses 4a and 4b and the printed object 5 are transferred to the supporting part fixing frame 6 by using a conveyor device, and then the substrate having the unevennesses 4a and 4b using the driving arm. (4) and the printed object (5) is seated on the support fixing frame (6), and then the substrate 4 and the printed object (5) having the unevenness (4a, 4b) by the vacuum suction device to the support fixing frame (6) Can be fixed on top

5 and 6, the coating 7c of the flat plates 2 and 3 is transferred to the printed material 5, but the coating 7b of the protrusion 4a of the substrate 4 is transferred to the printed material ( 5) can be transferred.

According to another embodiment of the present invention, the method of the present invention comprises the steps of: a) applying a coating to a plate, b) contacting the coating of the plate with the protrusions of the substrate having irregularities consisting of protrusions and grooves. Transferring a portion of the coating of the plate contacting the protrusion of the substrate from the plate to the protrusion of the substrate, and c) bringing the coating of the protrusion of the substrate into contact with the printed surface of the printed object. Through the step of transferring to the printed matter, it is also possible to form a coating pattern on the printed object.

In this embodiment, except that the position of the plate and the position of the substrate having the unevenness are changed so that the substrate having the unevenness can directly transfer the pattern of the coating onto the printed object, the above-described illustrated in FIGS. The same content as described for the state of implementation applies.

However, at this time, it is preferable that the material of the substrate having the unevenness is smaller than the material of the printed material. For example, the substrate having irregularities is preferably made of a metal such as aluminum, stainless steel, or a silicon compound such as glass. Substrates having concavities and convexities made of such materials can facilitate the transfer of coatings to the printed object by increasing the surface energy after the surface treatment or by lowering the surface energy after the surface treatment of the printed material.

The coating material to which the method of the present invention can be applied is not particularly limited, but a metal solution for wiring, which can be used to form an optical ink, an electronic circuit, etc., which can form a color filter for a TFT-LCD, and a conductive material All solutions in liquid form, such as pastes, functional resins such as resists, adhesives and adhesives requiring precise patterning, can be used. However, the coatings preferably do not react with the flat blanket, especially the blanket made of silicon. Optimized devices to which the present invention can be applied include color filter process for liquid crystal display (LCD), thin film transistor (TFT) circuit process for LCD, plasma display panel (PDP) filter process, PDP top and bottom electrode process, PDP Examples include bulkhead fabrication apparatus, catalytic fine patterning apparatus for electrochemical deposition, lithography apparatus for semiconductors, selective hydrophilic and hydrophobic treatment apparatus, and selective coating apparatus of sealants in flexible displays or E-paper. Can be mentioned.

In the present invention, the pattern of the coating 7d transferred to the printed material 5 may be fixed to the printed material 15 through a drying step. Drying can be done in a convection oven, hot plate or UV exposure machine, and other drying methods known in the art can be used. However, it is not limited to these methods. The pattern of the coating may be solidified by the drying process to withstand external physical and chemical changes.

In the method of the present invention, the substrate having the plate and the unevenness, or the substrate and the printed body having the plate and the unevenness, is pressed at a uniform pressure (10 ^-2 to 10 ³ Mpa) with respect to the entire surface to be pressed. desirable. When the substrate is pressed with excessive pressure when the substrate having the unevenness is pressed, the flat plate may come into contact with the bottom of the uneven substrate. The resolution of the pressure setting should be 1/1000 or more of the minimum possible pressure, and when the plate and the substrate having unevenness are close to each other, or when the plate and the substrate are close to each other, or when the substrate having the unevenness and the substrate is close to each other, It is desirable to pressurize while aligning with pressure.

In this case, a pattern of a uniform and highly accurate coating may be formed on the printed object. In the present invention, in order to compress the pressing surfaces at a uniform pressure with respect to the entire surface, an electrical or optical pressing response method may be used.

A piezoelectric element (PZT) or quartz crystal (PZT) may be used as an electrical method. For example, a piezoelectric element may be mounted on at least two, preferably at least three, of the plate blanket support, thereby having a plate blanket and irregularities. Alternatively, the pressure may be electrically converted when the platen blanket and the printed object are compressed to uniformly adjust the pressure.

In addition, a laser interferometer may be used as an optical method, for example, by installing a laser interferometer at at least two, preferably at least three, portions of the plate blanket support, so that the substrate having the platen blanket and the unevenness may be accessed. When approaching or when the platen blanket and the printed object are approaching, their approaching distance can be adjusted to the nanometer level. The laser interferometer basically detects the distance between the platen blanket and the substrate having irregularities or the distance between the platen blanket and the printed object within several tens of nm using a moire pattern, and has a period used for interference. The smaller the difference between gratings, the greater the detection accuracy.

By using such a method, in the method of the present invention, a flat plate can be used to form a pattern of the coating uniformly and precisely even in a large area. The piezoelectric element or laser interferometer described above has not been used in the art, but since it has been generally used in industrial processes in other technical fields, these techniques can be exclusively applied to the method of the present invention.

According to the method of the present invention, the coating, preferably the functional material, can be transferred directly to the printed object using a flat plate, which makes the process very simple, relatively inexpensive, and allows fine patterning of high precision and highway coatings. It is possible. By applying such a method to a patterning process of a functional material such as an electronic material, the productivity of the electronic device can be greatly improved.

Claims (5)

A flat plate provided to be transported in the Z-axis direction, the X-axis direction, the Y-axis direction, and the θ-axis direction with respect to the plate surface by the plate transfer device; A coater which is provided to be transportable along the plate surface direction of the plate by a coater conveying device to apply a coating to the plate; A substrate disposed under the flat plate and having an unevenness formed of a protrusion and a groove; And A piezoelectric element using an electrical crimp sensitive method or a laser interferometer using an optical crimp sensitive method, Transfer the plate so that the plate is in contact with the substrate to transfer the coating of the plate to the protrusions of the substrate, and then transfer the coating remaining on the plate or the coating of the protrusion of the substrate to the printed object. Forming, When the piezoelectric element or the laser interferometer is used, when the plate and the substrate having the unevenness are close to each other, or when the plate and the printed object are close to each other, or when the substrate having the unevenness and the printed object are close to each other, freeze. The patterning device of the coating, characterized in that to be made at a pressure of 10 ^-2 ~ 10 ³ Mpa with respect to the entire surface being pressed while aligning. The method according to claim 1, The plate feed device A first conveying apparatus having a moving support frame for guiding the movement of the flat plate and a first adjusting screw installed on the moving supporting frame to adjust the movement of the flat plate in the z-axis direction with respect to the plate surface of the flat plate; And A second conveying apparatus installed on the plate and having a second adjusting screw and a third adjusting screw for adjusting the movement of the plate in the X-axis direction, Y-axis direction, and θ-axis direction along the plate surface direction of the plate; Patterning device of the coating comprising a. The patterning apparatus of claim 2, wherein the flat plate feeding apparatus further comprises a stepping motor connected to at least one of the first adjusting screw, the second adjusting screw, and the third adjusting screw. The method according to claim 1, The coater transfer device is A coater mounting frame to which the coater is mounted; And The patterning device of the coating comprising a linear motor for moving the mounting frame on which the coater is mounted left and right. The patterning apparatus of claim 1, further comprising a support part fixing frame configured to support the substrate and the printed object from below.

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