KR100577985B1 - Speed sensor for use of car - Google Patents

Speed sensor for use of car Download PDF

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Publication number
KR100577985B1
KR100577985B1 KR1020040032339A KR20040032339A KR100577985B1 KR 100577985 B1 KR100577985 B1 KR 100577985B1 KR 1020040032339 A KR1020040032339 A KR 1020040032339A KR 20040032339 A KR20040032339 A KR 20040032339A KR 100577985 B1 KR100577985 B1 KR 100577985B1
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South Korea
Prior art keywords
terminal
speed sensor
mold frame
upper housing
housing
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KR1020040032339A
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Korean (ko)
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KR20050107130A (en
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이서남
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이서남
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N21/00—Selective content distribution, e.g. interactive television or video on demand [VOD]
    • H04N21/40—Client devices specifically adapted for the reception of or interaction with content, e.g. set-top-box [STB]; Operations thereof
    • H04N21/41—Structure of client; Structure of client peripherals
    • H04N21/414—Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance
    • H04N21/41422—Specialised client platforms, e.g. receiver in car or embedded in a mobile appliance located in transportation means, e.g. personal vehicle
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
    • G11B33/126—Arrangements for providing electrical connections, e.g. connectors, cables, switches
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
    • G11B33/127—Mounting arrangements of constructional parts onto a chassis
    • G11B33/128—Mounting arrangements of constructional parts onto a chassis of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N21/00—Selective content distribution, e.g. interactive television or video on demand [VOD]
    • H04N21/40—Client devices specifically adapted for the reception of or interaction with content, e.g. set-top-box [STB]; Operations thereof
    • H04N21/41—Structure of client; Structure of client peripherals
    • H04N21/4104—Peripherals receiving signals from specially adapted client devices
    • H04N21/4135—Peripherals receiving signals from specially adapted client devices external recorder

Abstract

개시된 내용은 PCB등의 부품을 제거하여 부품의 단순화를 기하고,내부에 에폭시를 충진하며, 터미널이 몰드프레임과 하우징의 인서트 사출시에 일체로 사출가공가능하게 된 자동차용 스피드센서로서,Disclosed is a speed sensor for an automobile in which parts such as a PCB are removed to simplify the parts, an epoxy is filled in the inside, and a terminal is integrally injection-molded at the time of insert injection of a mold frame and a housing.

접속공간(112)를 형성한 상부 하우징(110)과, 상기 상부 하우징(110)에 일체로 인서트 사출하여 내측 접속공간(112)으로 터미널(122)이 내설되고, 그 하부에는 마그넷(140)이 내장됨과 아울러 상기 터미널(122)과 연결됨과 아울러 중간부에서 노출되는 접속단자(126)를 마련한 몰드 프레임(120)과, 상기 몰드 프레임(120)의 중간부 접속단자(126)에 용접되는 터미널(132)을 형성하며, 하단은 직각으로 꺾여진 홀아이씨(130)와, 상기 상부 하우징(110)에 오버몰딩으로 밀폐되며, 상기 몰드 프레임(120)의 나머지 하부를 내장함과 상기 상부 하우징(110)에 오버몰딩되는 하부 하우징(150)을 포함하며, 상기 몰드 프레임(120)내에 에폭시(150)를 충진하는 자동차용 스피드센서를 제공한다.The upper housing 110 having the connection space 112 formed therein and the insert 122 are integrally inserted into the upper housing 110 so that the terminal 122 is built into the inner connection space 112, and the magnet 140 is disposed at the lower portion thereof. A mold frame 120 having a built-in and connected to the terminal 122 and providing a connection terminal 126 exposed from the middle portion, and a terminal welded to the middle connection terminal 126 of the mold frame 120 ( 132, the lower end of which is sealed at right angles to the hole IC 130 and the upper housing 110 by overmolding, and embeds the remaining lower portion of the mold frame 120 and the upper housing 110. It includes a lower housing 150 that is overmolded in), and provides a speed sensor for an automobile filling the epoxy 150 in the mold frame 120.

트랜스미션,스피드센서, 홀아이씨.Transmission, speed sensor, Hall IC.

Description

자동차용 스피드센서{Speed sensor for use of car}Speed sensor for use {Speed sensor for use of car}

도 1은 종래 자동차용 스피드센서의 단면도,1 is a cross-sectional view of a conventional automotive speed sensor,

도 2는 본 발명 자동차용 스피드센서의 사시도,2 is a perspective view of a speed sensor for a vehicle according to the present invention;

도 3은 본 발명 자동차용 스피드센서의 분해 사시도,3 is an exploded perspective view of a speed sensor for a vehicle according to the present invention;

도 4는 본 발명 자동차용 스피드센서의 실시예의 단면도이다.4 is a cross-sectional view of an embodiment of a speed sensor for automobile according to the present invention.

※도면의 주요 부분에 대한 부호의 설명※ Explanation of code for main part of drawing

110:상부 하우징, 112:접속공간, 120:몰드 프레임, 122:터미널,110: upper housing, 112: connection space, 120: mold frame, 122: terminal,

126:접속단자, 130:홀아이씨(hall IC), 140: 마그넷, 150:하부 하우징,126: connection terminal, 130: hall IC, 140: magnet, 150: lower housing,

160:에폭시,160: Epoxy,

본 발명은 자동차용 스피드센서에 관한 것으로 특히, 스피드센서내에 전원연결용으로 조립되던 PCB(회로기판)를 제거하여 부품수를 줄이고, 에폭시를 충진하여 수분침투를 방지한 자동차용 스피드센서에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a speed sensor for automobiles, and more particularly, to a speed sensor for automobiles in which the number of parts is reduced by removing a PCB (circuit board) assembled for power connection in the speed sensor and filled with epoxy to prevent moisture penetration. .

종래 알려진 자동차용 스피드센서가 첨부 도면 도 1에 도시되어 있다. 이 도면에 따르는 스피드센서는 상부 하우징과, 하부 하우징과, 상부 하우징 내에 몰딩 되는 터미널과, 상기 터미널과 결합되는 피씨비, 이 피씨비에 연결되는 홀아이씨, 마그넷으로 이루어지며, 이들은 상,하부하우징의 오버몰딩으로 그 내부에 내장되는 구조로 이루어진다. A conventional speed sensor for a vehicle is shown in FIG. 1. The speed sensor according to this drawing comprises an upper housing, a lower housing, a terminal molded into the upper housing, a PCB coupled to the terminal, a hole IC connected to the PCB, and a magnet. Molding is made of a structure embedded therein.

이러한 구조로 이루어진 종래 자동차용 스피드센서는 다음과 같은 몇가지 문제점이 있다.Conventional automotive speed sensor made of such a structure has some problems as follows.

첫째, 피씨비를 사이에 두고 상부에는 터미널을, 하부에는 홀아이씨를 납땜하므로 조립공정시 일일이 작업자들이 피씨비와 터미널에 형성된 여러군데의 납땜부를 납땜해야함에 따른 공정상의 조립구조가 복잡하고, 또 그로 인해 하우징의 크기를 줄일 수 없다는 단점이 있었고,First, soldering the terminal on the upper part and the hole IC on the lower side with the PCB in between, the assembly process of the process is complicated because the workers have to solder several solder parts formed on the PC and the terminal during the assembly process. The disadvantage was that the size of the housing could not be reduced,

둘째, PCB등의 불필요한 부품이 공간을 차지하거나, 터미널과 홀아이씨,마그넷등의 내부부품의 배치구조가 정렬된 배치구조를 갖지 않고 조립되는 점등의 단점도 있었다.Second, there was a disadvantage in that unnecessary parts such as PCB occupy space, or the assembly structure of the internal parts such as the terminal, the hole IC, the magnet, and the like are assembled without the alignment structure.

본 발명은 상기와 같은 종래 스피드 센서가 갖는 문제점을 개선하여 단지 연결기능만을 갖는 PCB등의 부품을 제거하여 부품의 단순화를 기하고,내부에 에폭시를 충진하므로서 수분의 침투를 방지함과 아울러 터미널이 몰드프레임과 하우징의 인서트 사출시에 일체로 사출가공가능하게 된 자동차용 스피드센서를 제공하는 데에 그 목적이 있다.The present invention improves the problems of the conventional speed sensor as described above to simplify the components by removing components such as PCB having only a connection function, and prevents the penetration of moisture by filling the epoxy inside the terminal It is an object of the present invention to provide a speed sensor for automobiles which is integrally injection-molded at the time of insert injection of a mold frame and a housing.

상기한 본 발명의 목적을 달성하기 위한 자동차용 스피드센서는,An automobile speed sensor for achieving the above object of the present invention,

상부 하우징과, 상기 상부 하우징에 일체로 인서트 사출되어 마그넷과 에폭시를 충진하며, 터미널을 형성하여 직각으로 꺾인 터미널단자를 형성하고, 중간부에도 접속단자를 마련한 몰드 프레임과, 상기 몰드 프레임의 중간부 접속단자에 용접되는 터미널을 형성하며, 하단은 직각으로 꺾여져 그 끝에 홀아이씨가 자리한 전원공급부재와, 상기 상부 하우징에 오버몰딩 밀폐되며, 상기 몰드 프레임의 나머지 하부를 내장하는 하부 하우징을 포함하는 자동차용 스피드센서로서 달성된다.A mold frame in which the upper housing and the insert housing are integrally inserted into the upper housing to fill the magnet and epoxy, and form a terminal to form a terminal terminal bent at a right angle, and a connection terminal in the middle portion, and an intermediate portion of the mold frame A terminal welded to the connection terminal, the lower end of which is bent at a right angle and includes a power supply member having a hole IC at the end thereof, an overmolded hermetic seal in the upper housing, and a lower housing including the remaining lower portion of the mold frame. It is achieved as a speed sensor for automobiles.

상기한 본 발명 자동차용 스피드센서의 상기 몰드 프레임은 접속단자와 전원공급부재 상단의 터미널이 직접납땜됨이 바람직하며, Preferably, the mold frame of the vehicle speed sensor of the present invention is directly soldered with a connection terminal and a terminal on an upper end of a power supply member.

상기한 본 발명의 트랜스미션 스피드센서의 상기 몰드 프레임의 상부는 직각으로 꺾인 상부 터미널이 인출/형성되고, 중간부는 일측으로 에폭시 충진공간을 마련함과 아울러 반대면에는 터미널 접속단자를 형성하고, 하부는 마그넷 내장공간을 형성함이 바람직하다.The upper part of the mold frame of the transmission speed sensor of the present invention is drawn out / formed at a right angle, the middle part provides an epoxy filling space on one side, and forms a terminal connection terminal on the opposite side, and the lower part of the magnet It is preferable to form a built-in space.

이하 본 발명의 바람직한 실시예를 첨부 도면에 따라 구체적으로 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

첨부 도면중 도 1은 종래 트랜스미션 스피드센서의 단면도이고, 도 2는 본 발명 트랜스미션 스피드센서의 사시도이고, 도 3은 본 발명 트랜스미션 스피드센서의 분해사시도이며, 도 4는 본 발명 트랜스미션 스피드센서의 단면도이다.1 is a cross-sectional view of a conventional transmission speed sensor, Figure 2 is a perspective view of the transmission speed sensor of the present invention, Figure 3 is an exploded perspective view of the transmission speed sensor of the present invention, Figure 4 is a cross-sectional view of the transmission speed sensor of the present invention. .

상기한 도면들에 따르는 본 발명 자동차용 스피드센서는 크게 상부 하우징(110)과,몰드 프레임(120)과, 홀아이씨(130)와, 마그넷(140)과, 하부 하우징(150)으로 이루어진다. The speed sensor for a vehicle of the present invention according to the above drawings is composed of an upper housing 110, a mold frame 120, a hole IC 130, a magnet 140, and a lower housing 150.

상부하우징(110)은 대략 ㄱ자형으로 꺾어진 측면/일측으로 커넥터 접속용 접속공간(112)을 형성하고, 그 하부 역시 타측으로 수평/연장되며, 고정공(124)을 형성함과 아울러 부싱(도면부호 생략)을 개재시켜 전체 센서를 고정할 때 이 고정공(124)를 통하여 고정되게 하고, 그 저부는 내측으로 후술하는 바와 같은 몰드 프레임이 일체로 연결되어 있다. The upper housing 110 forms a connection space 112 for connecting the connector to the side / one side of which is bent in a substantially L-shape, and the lower portion thereof is also horizontally / extended to the other side, and forms a fixing hole 124 and a bushing (drawings). When the entire sensor is fixed through the fixing hole 124, the mold frame as described later is integrally connected to the bottom thereof.

이 몰드 프레임(120)은 그 상단 일부가 상기 상부 하우징(110)의 저부에 매입된 상태로 인서트 사출된 것으로 나머지 일부는 하부로 노출/연장된 구조로서 상술한 터미널(122)과 연결되는 소정의 접속라인이 매입/형성되어 있고 그 중 일부는 중간부 일측에서 노출상태로 접속단자(126)를 형성하며, 이 접속단자(126)의 반대면에는 수분침투 방지용 에폭시(160)가 주로 많이 충진되는 공간(121)을 이루며, 그 하단에는 마그넷(140)이 안착되는 공간(123)을 이루며, 그 하부에는 상기 몰드 프레임(120)의 중간부 접속단자(126)에 용접되는 터미널(132)이 연장/형성되고 하단이 직각으로 꺾여진 홀아이씨(130)가 삽장된다.The mold frame 120 is insert-extruded with a portion of the upper end embedded in the bottom of the upper housing 110, and a portion of the mold frame 120 is exposed / extended downward, and is connected to the terminal 122 described above. The connection line is embedded / formed, and some of them form the connection terminal 126 in an exposed state at one side of the middle part, and the opposite surface of the connection terminal 126 is mainly filled with epoxy 160 for preventing moisture penetration. A space 121 is formed, and at the bottom thereof, a space 123 in which the magnet 140 is seated is formed, and a terminal 132 welded to the middle connection terminal 126 of the mold frame 120 extends below. Hole IC 130 is formed and bent at a right angle to the bottom is inserted.

한편, 상기 상부 하우징(110)과 하부하우징(150)은 링형 와셔(151)가 개재된 상태에서 오버몰딩으로 일체화된다.Meanwhile, the upper housing 110 and the lower housing 150 are integrated by overmolding in a state where the ring washer 151 is interposed therebetween.

즉, 본 발명은 상부하우징(110)의 저부로 노출된 몰드 프레임(120)의 접속단자(126)에 홀아이씨(130)의 터미널(132)를 용접/고정하고, 마그넷(140) ,에폭시(160)를 그 중간부 타측에 장착한 뒤 하부하우징(150)을 오버몰딩하여 일체화한다. That is, in the present invention, the terminal 132 of the hole IC 130 is welded / fixed to the connection terminal 126 of the mold frame 120 exposed to the bottom of the upper housing 110, and the magnet 140 and the epoxy ( 160 is mounted on the other side of the middle portion, and the lower housing 150 is overmolded to integrate the 160.

이 상태에서 자동차 트랜스미션에 조립설치되어 트랜스미션의 스피드를 센싱 하게 된다.In this state, the vehicle is assembled and installed on the transmission to sense the speed of the transmission.

이상 설명한 바와같이 본 발명 자동차용 스피드센서는 단지 연결기능만을 갖는 PCB등의 부품을 제거하여 부품의 단순화를 기한 효과를 가지며, As described above, the speed sensor for automobiles of the present invention has a time limit effect of simplifying components by removing components such as a PCB having only a connection function.

특히, 내부에 에폭시를 충진하므로서 수분의 침투를 방지하기도 하며,In particular, by filling the epoxy inside to prevent the penetration of moisture,

또한, 터미널이 몰드프레임과 하우징의 인서트 사출시에 일체로 사출가공 되어 접속단자와 홀아이씨의 연결이 그대로 용접 연결이 가능하게 되어 스피드센서의 조립공정이 간단/신속화 되는 효과를 얻기도 한다. In addition, the terminal is integrally injection-molded at the time of insert injection of the mold frame and the housing, so that the connection between the connection terminal and the hole IC can be welded as it is, thus simplifying and speeding up the assembly process of the speed sensor.

Claims (3)

삭제delete 삭제delete 자동차용 스피드센서에 있어서,In the speed sensor for automobiles, 접속공간(112)를 형성한 상부 하우징(110);An upper housing 110 in which a connection space 112 is formed; 상기 상부 하우징(110)에 일체로 인서트 사출하여 내측 접속공간(112)으로 터미널(122)이 내설되고, 그 하부에는 마그넷(140)이 내장됨과 아울러 에폭시(160)로 충진되고, 상기 터미널(122)과 연결됨과 아울러 중간부에서 노출되는 접속단자(126)를 마련한 몰드 프레임(120); The insert 122 is integrally inserted into the upper housing 110, and the terminal 122 is embedded in the inner connection space 112, and a magnet 140 is embedded in the lower portion thereof and filled with epoxy 160. A mold frame 120 which is connected to the bottom surface and has a connection terminal 126 exposed from the middle portion; 상기 몰드 프레임(120)의 접속단자(126)와 홀아이씨(130) 상단의 터미널(132)이 용접되며, 하단이 직각으로 꺾여진 홀아이씨(130);The connection terminal 126 of the mold frame 120 and the terminal 132 of the upper end of the hole IC 130 are welded, and the lower end of the hole IC 130 is bent at a right angle; 상기 상부 하우징(110)에 오버몰딩으로 밀폐되며, 상기 몰드 프레임(120)의 나머지 하부를 내장함과 상기 상부 하우징(110)에 오버몰딩되는 하부 하우징(150)을 포함하는 자동차용 스피드센서.The speed sensor for an automobile, which is hermetically sealed to the upper housing 110, includes a lower housing 150 embedded in the lower part of the mold frame 120 and overmolded on the upper housing 110.
KR1020040032339A 2004-05-07 2004-05-07 Speed sensor for use of car KR100577985B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
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KR100980786B1 (en) 2008-10-06 2010-09-10 콘티넨탈 오토모티브 일렉트로닉스 유한회사 Speed sensor for automobile
KR100987301B1 (en) 2008-10-27 2010-10-13 주식회사 일진글로벌 Method for manufacturing a wheel speed sensor
KR101334851B1 (en) 2011-08-19 2013-12-05 주식회사 유라테크 Speed sensor
CN105807079A (en) * 2016-04-20 2016-07-27 宁波中车时代传感技术有限公司 Speed sensor assembly of motor for high-speed vehicle and manufacturing method of speed sensor assembly
KR101672038B1 (en) * 2015-08-21 2016-11-02 주식회사 현대케피코 sensor structure for measuring speed of rotatory body

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KR100643317B1 (en) * 2005-06-23 2006-11-10 삼성전기주식회사 Sensor fixing device for vehicle
KR100681694B1 (en) * 2006-02-08 2007-02-09 한국하니웰 주식회사 Sensor for detecting speed
KR101386774B1 (en) * 2012-10-29 2014-04-21 대성전기공업 주식회사 Magnetic sensor for vehicle
KR102629367B1 (en) * 2021-12-27 2024-01-24 주식회사 현대케피코 Magnetic sensor for vehicle

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100980786B1 (en) 2008-10-06 2010-09-10 콘티넨탈 오토모티브 일렉트로닉스 유한회사 Speed sensor for automobile
KR100987301B1 (en) 2008-10-27 2010-10-13 주식회사 일진글로벌 Method for manufacturing a wheel speed sensor
KR101334851B1 (en) 2011-08-19 2013-12-05 주식회사 유라테크 Speed sensor
KR101672038B1 (en) * 2015-08-21 2016-11-02 주식회사 현대케피코 sensor structure for measuring speed of rotatory body
CN105807079A (en) * 2016-04-20 2016-07-27 宁波中车时代传感技术有限公司 Speed sensor assembly of motor for high-speed vehicle and manufacturing method of speed sensor assembly

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