KR100577586B1 - 와이어본딩 방법 - Google Patents

와이어본딩 방법 Download PDF

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KR100577586B1
KR100577586B1 KR1020040000473A KR20040000473A KR100577586B1 KR 100577586 B1 KR100577586 B1 KR 100577586B1 KR 1020040000473 A KR1020040000473 A KR 1020040000473A KR 20040000473 A KR20040000473 A KR 20040000473A KR 100577586 B1 KR100577586 B1 KR 100577586B1
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South Korea
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conductor
bump
bonding
wire
capillary
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KR1020040000473A
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KR20040074913A (ko
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미이다츠나리
와타나베히로시
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가부시키가이샤 신가와
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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
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    • E04B2/42—Walls having cavities between, as well as in, the elements; Walls of elements each consisting of two or more parts, kept in distance by means of spacers, at least one of the parts having cavities
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
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Abstract

범프상에 형성하는 경사면의 경사각도를 자유롭게 설정할 수 있는 와이어본딩 방법을 제공한다.
제 1 도체상에 1차 본딩을 행한 후, 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체 사이를 와이어본딩하는 방법에 있어서, 상기 제 2 도체상에 볼(4a)의 본딩을 행하여 범프(10)를 형성하고, 캐필러리(5)를 상승시킨 후, 캐필러리(5)를 상기 제 1 도체측과 반대 방향으로 비스듬히 하방으로 이동시켜 범프(10)의 상부에 경사면(12)을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프(10)에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프(10) 상부의 경사면(12)상에 상기 2차 본딩을 행한다.
회로기판, 다이, 패드, 와이어, 볼, 캐필러리, 범프, 홀, 경사면.

Description

와이어본딩 방법{WIRE BONDING METHOD}
도 1은 본 발명의 1실시형태에 관계되는 와이어본딩 방법의 공정을 도시하는 공정도이다.
도 2는 도 1의 이어지는 공정을 도시하는 공정도이다.
도 3은 본 발명의 1실시형태에 관계되는 와이어본딩 방법을 사용하여 다이와 배선 사이가 와이어본딩된 상태의 다른 예를 도시하는 도면이다.
(부호의 설명)
1 회로기판 2 다이
2a 패드 3 배선
4 와이어 4a, 4b 볼
5 캐필러리 5a, 관통 구멍
5b 에지부 10 범프
11 홀 부분 12 경사면
본 발명은, 2개의 도체 사이를 와이어본딩하는 와이어본딩 방법에 관한 것이 다.
제 2 도체상에 범프를 형성한 후, 제 1 도체와 제 2 도체상의 범프 사이에 와이어를 접속하는 와이어본딩 방법으로서, 특허문헌 1 및 특허문헌 2를 들 수 있다.
(특허문헌 1)
일본 특개평 10-112471호 공보
(특허문헌 2)
일본 특개 2002-280410호 공보
특허문헌 1은, 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 그 웨지 본딩을 범프에 대해 제 1 도체와 반대측의 위치에서 행한 후, 제 1 도체상에 1차 본딩을 행하고, 이어서 범프에 대하여 제 1 도체측으로부터 와이어를 루핑하고 범프상에 2차 본딩을 행하고 있다.
특허문헌 2는, 제 2 도체상에 볼 본딩을 행하여 범프를 형성한 후, 캐필러리를 상방으로 이동시키고, 다음에 상기 캐필러리를 제 1 도체와 반대측의 위치에 이동시키고, 재차 상기 캐필러리를 하방으로 이동시켜 경사 웨지를 형성한 후, 제 1 도체상에 1차 본딩을 행하고, 이어서 상기 범프에 대하여 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사 웨지상에 2차 본딩을 행하고 있다.
특허문헌 1은, 특허문헌 2의 [0006]항에 기재되어 있는 바와 같은 문제점을 갖는다. 범프 형성후의 웨지 본딩과 와이어부의 접합이 이루어지고, 즉 곡면끼리 의 접합이 이루어져 접합 위치 어긋남을 일으킨 경우, 결과로서 와이어 구부러짐을 발생시켜, 이웃하는 와이어 사이에서 접촉이 발생한다. 또, 범프후의 웨지 본딩을 후방에 만곡 형상으로 형성함으로써 와이어 테일의 발생은 억제할 수 있지만, 와이어와 범프 접합에서 충분한 경사 및 평면을 확보할 수 없기 때문에, 범프와 와이어를 접합한 후에 발생하는 와이어와 회로기판과의 접촉, 와이어와 배선 사이의 접촉을 방지할 수 없다.
특허문헌 2는, 청구항 2 및 [0011]항에 기재되어 있는 바와 같이, 배선부상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 범프의 중심으로부터 제 1 도체측과 반대 방향으로 이동시키고, 그 후에 재차 캐필러리를 하방으로 밀어 내려 캐필러리 외벽면으로 경사 웨지를 범프상에 형성한다. 그리고, 경사 웨지상에 2차 본딩을 행하므로, 특허문헌 1에서와 같은 문제점은 생기지 않는다.
그러나, 특허문헌 2는, 캐필러리를 아래쪽으로 밀어 내려서 캐필러리의 외벽면으로 경사 웨지를 범프상에 형성하므로, 경사 웨지의 경사각도는, 캐필러리의 외벽면의 형상에 의해 결정된다. 그런데, 제 1 도체와 제 2 도체간의 거리가 짧을 경우에는, 와이어 루프의 아래로 쳐짐이 작으므로, 경사 웨지의 경사각도는 작아도 좋다. 그러나, 제 1 도체와 제 2 도체 사이의 거리가 긴 경우에는, 와이어 루프의 아래로 쳐짐은 크므로, 경사 웨지의 경사각도를 크게 할 필요가 있다. 이러한 경우, 특허문헌 2에서는 그것에 적합한 캐필러리로 변경할 필요가 있었다.
본 발명의 과제는, 범프상에 형성하는 경사면의 경사각도를 자유롭게 설정할 수 있는 와이어본딩 방법을 제공하는 것에 있다.
상기 과제를 해결하기 위한 본 발명의 청구항 1은, 제 1 도체상에 1차 본딩을 행한 후, 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체 사이를 와이어본딩하는 방법에 있어서, 상기 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 캐필러리를 상기 제 1 도체측과 반대 방향으로 비스듬히 하방으로 이동시켜 범프의 상부에 경사면을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사면상에 상기 2차 본딩을 행하는 것을 특징으로 한다.
상기 과제를 해결하기 위한 본 발명의 청구항 2는, 상기 청구항 1에 있어서, 상기 범프를 형성한 후에 캐필러리를 상승시키는 높이는, 범프 형성시에 상기 캐필러리의 관통 구멍에 솟아 오른 홀 부분의 높이 이내인 것을 특징으로 한다.
(발명의 실시형태)
본 발명의 1실시형태에 관계되는 와이어본딩 방법을 도 1 및 도 2에 의해 설명한다. 도 2(b)는 본 발명의 1실시형태에 관계되는 와이어본딩 방법을 사용하여 다이와 배선 사이에 와이어본딩한 상태의 1예를 도시한다. 세라믹 기판이나 프린트 기판 등의 기판 또는 리드 프레임 등으로 이루어지는 회로기판(1)상에는, 패드(2a)가 형성된 다이(2)가 마운트되어 있다. 또 회로기판(1)에는 배선(3)이 형성되어 있다. 배선(3)상에는 범프(10)가 형성되어 있고, 패드(2a)와 범프(10) 사이에는 와이어(4)가 접속되어 있다. 5는 와이어(4)가 삽입통과된 캐필러리를 도시 한다.
다음에 도 2(b)에 도시하는 와이어본딩은 다음 공정에 의해 행해진다. 우선, 도 1(a)에 도시하는 바와 같이, 캐필러리(5)의 관통 구멍(5a)에 삽입통과된 와이어(4)의 선단에 도시하지 않은 전기 토치에 의해 볼(4a)을 형성한다. 다음에 도 1(b)에 도시하는 바와 같이, 캐필러리(5)를 하강시켜 배선(3)상에 볼 본딩을 행한다. 이것에 의해, 볼(4a)의 일부는 관통 구멍(5a)내에 솟아 오르고, 범프(10)상에 홀 부분(11)이 형성된다. 이어서 도 1(c)에 도시하는 바와 같이, 캐필러리(5)의 하단의 에지부(5b)가 홀 부분(11)의 높이 이내에 위치하도록 캐필러리(5)를 상승시킨다.
다음에 도 1(d)에 도시하는 바와 같이, 캐필러리(5)를 패드(2a)측(도 2(b) 참조)과 반대 방향으로 비스듬히 하방으로 이동시킨 후, 캐필러리(5)를 상승시켜서 와이어(4)를 절단한다. 이것에 의해, 범프(10)상에 캐필러리(5)의 에지부(5b)에 의해 경사면(12)이 형성된다. 이 경사면(12)의 경사각도(θ)는, 캐필러리(5)를 비스듬히 하방으로 이동시키는 경사각도에 의해 자유롭게 설정할 수 있다. 또 캐필러리(5)의 에지부(5b)에서 홀 부분(11)을 비스듬히 하방으로 누르므로, 면적이 커서 평탄한 경사면(12)이 형성된다.
다음에 도 1(e)에 도시하는 바와 같이, 와이어(4)의 선단에 전기 토치에 의해 볼(4b)을 형성시킨다. 이어서 도 2(a)에 도시하는 바와 같이, 캐필러리(5)를 다이(2)의 패드(2a)상에 위치시키고 1차 본딩을 행한다. 다음에 도 2(b)에 도시하는 바와 같이, 와이어(4)의 루핑을 행하고, 와이어(4)를 범프(10)의 경사면(12)의 상부에 위치시키고, 와이어(4)를 경사면(12)에 2차 본딩을 행하고, 와이어(4)를 절단한다.
도 3은 본 발명의 1실시형태에 관계되는 와이어본딩 방법을 사용하여 다이와 배선 사이에 와이어본딩한 상태의 다른 예를 도시한다. 상기 실시형태에서는, 배선(3)상에 범프(10)를 형성하고, 패드(2a)상에 1차 본딩을 행하고, 범프(10)상의 경사면(12)에 2차 본딩을 행했다. 도 3의 경우는, 패드(2a)상에 도 1(a) 내지 도 1(e)의 공정에서 범프(10)를 형성하고, 범프(10)상의 경사면(12)을 배선(3)측의 반대측에 형성했다. 그리고, 도 2(a) 및 도 2(b)의 공정에서 배선(3)상에 1차 본딩을 행하고, 범프(10)상의 경사면(12)에 2차 본딩을 행하고 와이어(4)를 절단했다. 즉, 도 1 및 도 2의 경우는, 패드(2a)가 제 1 도체가 되고, 배선(3)이 제 2 도체가 된다. 도 3의 경우는, 배선(3)이 제 1 도체가 되고, 패드(2a)가 제 2 도체가 된다.
본 발명은, 제 1 도체상에 1차 본딩을 행한 후, 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체간을 와이어본딩하는 방법에 있어서, 상기 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 캐필러리를 상기 제 1 도체측과 반대 방향에서 비스듬히 하방으로 이동시켜 범프의 상부에 경사면을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사면상에 상기 2차 본딩을 행하므로, 범프상에 형성하는 경사면의 경사각도를 자유롭게 설정 할 수 있다.

Claims (2)

  1. 제 1 도체상에 1차 본딩을 행한 후 제 2 도체상에 2차 본딩을 행하고, 상기 제 1 도체와 상기 제 2 도체 사이를 와이어 본딩하는 방법에 있어서,
    상기 제 2 도체상에 볼 본딩을 행하여 범프를 형성하고, 캐필러리를 상승시킨 후, 캐필러리를 상기 제 1 도체측과 반대 방향으로 비스듬히 하방으로 이동시켜 범프의 상부에 경사면을 형성시키고, 그 후 상기 1차 본딩을 행하고, 다음에 상기 범프에 대해 상기 제 1 도체측으로부터 와이어를 루핑하고 상기 범프 상부의 경사면상에 상기 2차 본딩을 행하고,
    이 때, 상기 범프를 형성한 후에 캐필러리를 상승시키는 높이는, 범프 형성시에 상기 캐필러리의 관통 구멍에 솟아 오른 홀 부분의 높이 이내인 것을 특징으로 하는 와이어본딩 방법.
  2. 삭제
KR1020040000473A 2003-02-17 2004-01-06 와이어본딩 방법 KR100577586B1 (ko)

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