KR100575424B1 - 금속화된 기판 물질의 제조 방법 - Google Patents

금속화된 기판 물질의 제조 방법 Download PDF

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Publication number
KR100575424B1
KR100575424B1 KR1020007011488A KR20007011488A KR100575424B1 KR 100575424 B1 KR100575424 B1 KR 100575424B1 KR 1020007011488 A KR1020007011488 A KR 1020007011488A KR 20007011488 A KR20007011488 A KR 20007011488A KR 100575424 B1 KR100575424 B1 KR 100575424B1
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KR
South Korea
Prior art keywords
metal layer
nickel
layer
glow discharge
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020007011488A
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English (en)
Korean (ko)
Other versions
KR20010042755A (ko
Inventor
마이어하인리히
슐츠랄프
하인츠롤란트
클루스만에카르트
Original Assignee
아토테크 도이칠란드 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아토테크 도이칠란드 게엠베하 filed Critical 아토테크 도이칠란드 게엠베하
Publication of KR20010042755A publication Critical patent/KR20010042755A/ko
Application granted granted Critical
Publication of KR100575424B1 publication Critical patent/KR100575424B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Vapour Deposition (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
KR1020007011488A 1998-04-20 1999-04-15 금속화된 기판 물질의 제조 방법 Expired - Fee Related KR100575424B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19817388.1 1998-04-20
DE19817388A DE19817388A1 (de) 1998-04-20 1998-04-20 Verfahren zum Herstellen von metallisierten Substratmaterialien

Publications (2)

Publication Number Publication Date
KR20010042755A KR20010042755A (ko) 2001-05-25
KR100575424B1 true KR100575424B1 (ko) 2006-05-03

Family

ID=7865060

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007011488A Expired - Fee Related KR100575424B1 (ko) 1998-04-20 1999-04-15 금속화된 기판 물질의 제조 방법

Country Status (8)

Country Link
US (1) US6706201B1 (enExample)
EP (1) EP1080247B1 (enExample)
JP (1) JP2000073170A (enExample)
KR (1) KR100575424B1 (enExample)
AT (1) ATE242820T1 (enExample)
DE (2) DE19817388A1 (enExample)
TW (1) TW427105B (enExample)
WO (1) WO1999054525A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368168A (ja) * 2001-06-13 2002-12-20 Hitachi Ltd 半導体装置用複合部材、それを用いた絶縁型半導体装置、又は非絶縁型半導体装置
DE102004011567A1 (de) * 2004-03-02 2005-09-22 Ist - Ionen Strahl Technologie Gmbh Haftfester Verbund und Verfahren zur Herstellung
US20070237977A1 (en) * 2006-04-07 2007-10-11 United States Of America As Represented By The Administrator Of The National Aeronautics And Spac Thin Metal Film System To Include Flexible Substrate And Method Of Making Same
US8178120B2 (en) * 2008-06-20 2012-05-15 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
US8753561B2 (en) * 2008-06-20 2014-06-17 Baxter International Inc. Methods for processing substrates comprising metallic nanoparticles
US8277826B2 (en) 2008-06-25 2012-10-02 Baxter International Inc. Methods for making antimicrobial resins
US20090324738A1 (en) * 2008-06-30 2009-12-31 Baxter International Inc. Methods for making antimicrobial coatings
US20100227052A1 (en) * 2009-03-09 2010-09-09 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
JP6466110B2 (ja) * 2014-09-09 2019-02-06 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
DE102017115407B3 (de) * 2017-07-10 2018-12-20 Epcos Ag Herstellungsverfahren für ein MEMS-Bauteil mit Partikelfilter
EP4547652A1 (en) * 2022-07-26 2025-05-07 The Regents of University of California Highly selective catalyst composition for the oxidation of alkenes to epoxides

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4990363A (en) * 1987-12-22 1991-02-05 Schering Aktiengesellschaft Method of producing very adhesive metallic structures on fluorine polymers and thermoplastic synthetic materials

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294059A (en) * 1963-04-15 1966-12-27 Charles R Barnes Deposition of nickel films on the interior surface of polytetrafluoroethylene tubing
DE3510982A1 (de) * 1985-03-22 1986-09-25 Schering AG, Berlin und Bergkamen, 1000 Berlin Herstellung metallischer strukturen auf nichtleitern
DE3512196A1 (de) * 1985-04-03 1986-10-16 Hartmann & Braun Ag, 6000 Frankfurt Verfahren zum aufbringen duenner schichten auf einem substrat
DE3806587A1 (de) * 1988-02-26 1989-09-07 Schering Ag Verfahren zur herstellung fest haftender metallischer strukturen auf polyimid
GB9405518D0 (en) * 1994-03-21 1994-05-04 Mupor Ltd Porous metal composite body
DE4438791C2 (de) * 1994-10-18 1996-09-05 Atotech Deutschland Gmbh Mit metallisierten Polyimidoberflächen versehenes Substrat
AU3800395A (en) * 1994-10-18 1996-05-06 Atotech Deutschland Gmbh Process for separating metal coatings

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4990363A (en) * 1987-12-22 1991-02-05 Schering Aktiengesellschaft Method of producing very adhesive metallic structures on fluorine polymers and thermoplastic synthetic materials

Also Published As

Publication number Publication date
WO1999054525A2 (de) 1999-10-28
DE19817388A1 (de) 1999-10-28
US6706201B1 (en) 2004-03-16
JP2000073170A (ja) 2000-03-07
EP1080247A2 (de) 2001-03-07
TW427105B (en) 2001-03-21
DE59905933D1 (de) 2003-07-17
WO1999054525A3 (de) 1999-12-16
KR20010042755A (ko) 2001-05-25
ATE242820T1 (de) 2003-06-15
EP1080247B1 (de) 2003-06-11

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