KR100568880B1 - Printed circuit board having combining structure by etching and the combining method - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board which forms a bonding structure by etching, and more particularly, in a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated. A guide bar produced by including and etching a portion joined with the second printed circuit region as part of the circuit; And a guide hole formed by drilling a portion of the second printed circuit region coupled to the guide bar generated in the first printed circuit region, and coupling the guide bar and the guide hole to the first printed circuit region. And a bonding structure is formed by etching joining the second printed circuit region.

Etching, bonding, printed circuit board, printed circuit area, guide bar, guide hole

Description

Printed circuit board which forms a bonding structure by etching, and its bonding method {PRINTED CIRCUIT BOARD HAVING COMBINING STRUCTURE BY ETCHING AND THE COMBINING METHOD}

1 is a view showing a raw material cutting process of a printed circuit board according to an embodiment of the present invention.

2 is a view showing a copper plating process of a printed circuit board according to an embodiment of the present invention.

3 is a view illustrating a circuit forming process of a printed circuit board according to an exemplary embodiment of the present invention.

4 is a view showing a multi-region fabrication process of a printed circuit board according to an embodiment of the present invention.

5 is a view showing a bonding sheet manufacturing process of a printed circuit board according to an embodiment of the present invention.

6 is a view illustrating a lamination process of a printed circuit board according to an exemplary embodiment of the present invention.

7 is a view showing a marking printing process of a printed circuit board according to an embodiment of the present invention.

8 is a view showing a surface treatment process of a printed circuit board according to an embodiment of the present invention.

9 is a flowchart illustrating a manufacturing process of a printed circuit board according to an exemplary embodiment of the present invention.

10 illustrates a completed printed circuit board according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: upper layer raw material 110: insulating layer

120: lower layer raw material 200: copper plating layer

210: hole 310, 320, 330: copper guide

401, 402: guide hole 501, 502: guide hole

601, 602: fastening structure 700: printing area

800: plating area

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a printed circuit board for forming a bonding structure by etching and a bonding method thereof.

In general, circuits used in most computers, such as a thin plate in which electrical components such as integrated circuits, resistors, or switches are soldered, are installed on a printed circuit board called a printed circuit board (PCB).

In other words, the PCB is an abbreviation of 'Printed Circuit Board' and is referred to as a printed circuit board (or an electronic circuit board), and means a circuit board on which electronic components are mounted and a wiring for connecting them to a circuit is formed. In fact, the circuit wiring on the PCB is designed using a computer and is completed through a precise manufacturing process that is similar to that of a semiconductor manufacturing process. In addition, PCBs used in high-precision products such as high-performance computers and electronic exchangers may be manufactured in multiple layers by crimping multiple layers of PCBs each having wiring formed thereon, such as building a high-rise building.

The order in which a normal printed circuit board is made is as follows. After attaching the copper foil to a thin substrate made of epoxy or bakelite resin, which is an insulator, a resist is printed on the circuit wiring which is desired to remain as the copper foil. Subsequently, the printed substrate is immersed in an etchant that can dissolve copper, and the non-resist-free portion melts. The resist is then removed to leave the copper foil in the desired form. In this case, a hole where parts should be inserted is drilled and blue lead resist is printed where lead is not allowed.

In general, all devices that operate with electrical energy or home appliances, such as a computer monitor, television, video, etc., are essentially provided with a printed circuit board installed so that a plurality of elements on one board constitute a desired electrical circuit. However, such a printed circuit board is typically used to be fixed to the case or frame of the product by a fastening means such as screws, it is relatively difficult to assemble the printed circuit board to the product, and the probability of failure in the assembly process In order to assemble and disassemble the printed circuit board, it was necessary to use a tool such as a driver, which causes inconvenience.

In addition, when the conventional fastening means are used in a printed circuit board, there is a problem that a double-sided board cannot be used. That is, in the case of using the double-sided board, since the fastening portion formed on one side affects the circuit area of the opposite side, it serves as a fatal disadvantage in using the double-sided board.

In addition, even when manufacturing a PCB having a multi-layer structure, the reliability problem at the soldering contact occurs in the process of assembling after fabricating the substrate of each layer, the problem with the existing coupling structure is revealed. On the other hand, when attempting to fabricate an intelligent power module (IPM) attached to a PDP, LCD, automobile, etc. as a PCB has a direct adverse effect on the main board due to the high temperature contact generated during the conventional substrate fastening process. Therefore, there is a problem in that the coupling structures of the conventional PCB act as various obstacles to effective PCB fabrication.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board and a joining method thereof, which form a joining structure by etching, after forming a guide bar by etching on a printed circuit board, and then joining it with the guide hole to provide an effective fastening means. .

In addition, the present invention provides a printed circuit board and its joining method, which form a joining structure by etching to form a guide hole on a printed circuit board and to form an effective fastening means by forming a guide bar in a portion to be joined with the printed circuit board. It aims to provide.

It is also an object of the present invention to provide a printed circuit board and a joining method thereof, which form a joining structure by etching which provides an effective fastening means by forming a boundary by etching on a printed circuit board.

In addition, the present invention provides a printed circuit board and a method of joining the printed circuit board which can implement single-sided and double-sided processing in one board by forming a guide hole on a printed circuit board, and forming and fastening a guide bar in a portion to be joined with the printed circuit board. It aims to provide.

It is also an object of the present invention to provide a printed circuit board and a method of joining the same, which can control the circuit matching degree within a 50 micro error range by providing an effective fastening means by etching on the printed circuit board.

Printed circuit board according to the present invention for achieving the above object; A multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated, wherein the part of the first printed circuit region, which is joined to the second printed circuit region, is formed by etching as a part of a circuit. Guide bar; And a guide hole formed by drilling a portion of the second printed circuit region coupled to the guide bar generated in the first printed circuit region, and coupling the guide bar and the guide hole to the first printed circuit region. And a bonding structure is formed by etching joining the second printed circuit region.

Printed circuit board according to the present invention for achieving the above object; A multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated, wherein the part of the first printed circuit region, which is joined to the second printed circuit region, is formed by etching as a part of a circuit. Embossed guide area; And an intaglio guide region generated by punching a portion of the second printed circuit region coupled with the embossed guide region generated in the first printed circuit region, wherein the indented guide region and the intaglio guide region are included. And to form a coupling structure by etching to join the first printed circuit region and the second printed circuit region.

Bonding method of a printed circuit board according to the present invention for achieving the above object; In a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated, the method of combining the first printed circuit region and the second printed circuit region, wherein the first printed circuit region comprises: Incorporating, as part of the circuit, the portion joining the printed circuit area to form a guide bar; Forming a guide hole by drilling a portion of the second printed circuit region that is coupled to the guide bar generated in the first printed circuit region; And coupling the first printed circuit area to the second printed circuit area by fastening the guide bar and the guide hole.

Bonding method of a printed circuit board according to the present invention for achieving the above object; In a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated, the method of combining the first printed circuit region and the second printed circuit region, wherein the first printed circuit region comprises: Incorporating, as part of the circuit, the portion joined with the printed circuit region to form an embossed guide region; Forming a negative guide region by perforating a portion of the second printed circuit region that is coupled to the guide bar generated in the first printed circuit region; And coupling the first printed circuit area and the second printed circuit area by fastening the embossed guide area and the intaglio guide area.

The present invention proposes an effective bonding method in a printed circuit board, and for this purpose, a portion to which a substrate is bonded is formed as part of a circuit when forming a printed circuit board. On the other hand, by forming the bonding portion as part of the circuit, during the etching process, the bonding portion forms a guide bar protruding with the circuit. In this case, a guide hole is formed at a position in contact with the guide bar on the opposite structure that is coupled to the substrate on which the guide bar is formed, and the printed circuit board is coupled by fastening the guide bar by the generated guide bar when the substrate is joined. Effective combination of

As another embodiment of the present invention, the guide bar and the substrate on which the guide holes are formed may be set to be opposite to each other. That is, when the circuit is formed, a portion to which the substrate is coupled may be formed as a guide hole. In addition, according to a modified embodiment of the present invention may be implemented to fasten the substrate by forming a protruding portion in the form of a guide line or a boundary, without generating in the form of a guide bar as described above.

In addition, according to the present invention, by forming and combining the guide bar and the guide hole, both single-sided and double-sided processing can be implemented in one board. In addition, according to the conventional coupling method, the circuit matching degree was about ± 100 μm, but by using the coupling method according to the present invention, the control is possible within the range of ± 50 μm.

1 to 8, a method of forming a fastening structure according to the present invention in each process of manufacturing a printed circuit board will be described step by step. At this time, each drawing will be described by configuring a cross-sectional view and a plan view for better understanding.

Meanwhile, the process of manufacturing the printed circuit board, which will be described later, is performed by performing a circuit forming manufacturing process for a thick copper area and a manufacturing process for a multi area and a bond sheet area. After that, the process proceeds by combining and stacking the regions according to the present invention. At this time, as described above, according to the present invention, a guide bar is formed in the thick copper region, and guide holes are formed in the multi region and the bonding sheet region so that they can be easily coupled to each other.

Therefore, FIGS. 1 to 3 illustrate a manufacturing process for the thick copper region, and FIGS. 4 and 5 describe a manufacturing process for the multi region and the bonding sheet region. Next, a process of forming the entire printed circuit board by combining the respective regions in FIGS. 6 to 8 will be described.

1 is a view showing a raw material cutting process of a printed circuit board according to an embodiment of the present invention. Referring to the cross-sectional view of FIG. 1A and the plan view of FIG. 1B, a process of cutting the raw materials as necessary to generate a thick copper area of a printed circuit board is first performed. In FIG. 1A, it can be seen that the thick copper region is formed by separating the upper layer portion 100 and the lower layer portion 120 of the raw material by the insulator 110.

When the raw material cutting process as shown in FIG. 1 is completed, a drill operation and a copper plating process as shown in FIG. 2 are performed next. The hole 210 is formed by the drill operation, and the hole 210 may be used for fixing the substrate to a product. In addition, the copper plating layer 200 is formed outside the raw material by the copper plating process.

Next, a circuit forming process for the thick copper region is performed. At this time, as described above, by including a portion to which the substrate is coupled as a part of the circuit according to an embodiment of the present invention to form the coupled portion as a guide bar (guide bar). 3 is a diagram illustrating a circuit forming process of a printed circuit board according to an exemplary embodiment of the present invention. Referring to FIG. 3A, a circuit is formed in the copper plating layer 200 of the thick copper region, and the copper plating layer 200 remains only in the circuit part by exposing, developing, and corroding the copper plating layer 200 according to a general printed circuit board process. And the remaining parts are eroded away.

In this case, as described above, it can be seen that the guide bars 310, 320, and 330 made of copper are generated by constituting a part to which the substrate is coupled according to the exemplary embodiment of the present invention. In other words, rather than providing or attaching a separate fastening means as in the related art, in the present invention, the fastening means can be easily and precisely formed by including the fastening means in the circuit formation process.

Hereinafter, referring to FIGS. 4 and 5, a manufacturing process of a multi-region and a bonding sheet region which is combined with the above-described thick copper region will be described.

4 is a view illustrating a multi-region fabrication process of a printed circuit board according to an embodiment of the present invention. 4A and 4B, the same process as the fabrication process for the thick copper region of FIGS. 1 to 3 is performed to fabricate a printed circuit board for the double side or multi region. do. In this case, when the multi-region is manufactured, guide holes 401, 402, and 403 corresponding to the guide bar are formed in a portion in contact with the guide bar of the thick copper region according to the embodiment of the present invention as described above. To form.

That is, the manufacturing process of the multi-area is subjected to processes such as raw material cutting, drill process, copper plating, exposure, development, corrosion, external processing, and the like. In this case, a guide hole may be generated in the multi-region to be coupled to the guide bar in a portion in contact with the guide bar of the thick copper region.

5 is a view showing a bonding sheet manufacturing process of a printed circuit board according to an embodiment of the present invention. Referring to FIG. 5, similar to the multi-region of FIG. 4, guide holes 501 and 502 may be coupled to a guide bar of the thick-copper region in contact with the guide bar of the thick copper region. 503). At this time, the manufacturing process of the bonding sheet region is subjected to the process of raw material cutting and drilling process.

On the other hand, the substrate formed by the guide bar and the guide hole according to the present invention by the process of Figures 1 to 5 are easily coupled to each other using the guide bar and the guide hole as a fastening tool.

6 is a view illustrating a lamination process of a printed circuit board according to an exemplary embodiment of the present invention. Referring to FIG. 6A, the bonding sheet region and the multi region are sequentially joined to a specific position of the thick copper region. At this time, the coupling between the regions can be easily performed by the guide bar and the guide hole formed in accordance with an embodiment of the present invention. That is, the guide bar formed in the thick copper region and the guide hole formed in the joining sheet region and the multi region may be combined to form the fastening structures 601, 602, and 603 to be easily joined and stacked with each other.

The combined structure as described above undergoes a process as shown in FIGS. 7 and 8 to form a final printed circuit board.

7 is a view showing a marking printing process of a printed circuit board according to an embodiment of the present invention. Referring to FIG. 7A, a solder mask and a marking printing process are performed on the bonded printed circuit board as shown in FIG. 6. In this case, a printed area 700 is included on the surface of the printed circuit board. Then, the surface treatment process of FIG. 8 is performed. In this case, the surface treatment process is a surface treatment with a material such as gold plating and OSP, HASL, WHITE TIN. By doing so, the plating region 800 is formed in the region of the printed circuit board in which the printed region 700 of FIG. 7 is not included.

Finally, the final PCB substrate is produced through a general PCB machining process such as instrument hole machining and external machining (eg Sawing, laser, press, router, drill, etc.).

Meanwhile, although the guide bar is formed in the thick copper region and the guide hole is formed in the multi region and the bonding sheet region, the guide hole is formed in the thick copper region according to another embodiment of the present invention. And it may be implemented by a method of fastening by forming a guide bar in the bonding sheet region.

In addition, in the above, the fastening method is implemented as a guide bar and a guide hole. However, according to a modified embodiment of the present invention, the coupling part may be formed by forming a boundary around the outer periphery of the substrate, rather than forming the guide bar. have. For example, a groove or a boundary bar of the tracer may be formed at four corners of the portion in which the multi-region and the bonding sheet region are stacked among the thick copper regions, and may be mutually coupled as described above. That is, according to the embodiment of the present invention, even when the binding site is formed in any shape, the parts to be joined are formed by mutually embossing and engraving each other, so that easy coupling is possible.

9 is a flowchart illustrating a manufacturing process of a printed circuit board according to an exemplary embodiment of the present invention. Referring to FIG. 9, as described above, a drill operation and a copper plating process (step 901) are performed on a thick copper region.

Then, according to the present invention, the circuit is configured (step 902) including a portion where the thick copper region and the multi region are coupled to each other. In this case, when the printed circuit board is etched according to a general PCB process (ie, exposure, development, corrosion), only the circuit part and the coupling part remain and are corroded. Accordingly, the combined portion is left in the form of a guide bar as described above (step 903).

Meanwhile, in step 904, a circuit is formed by forming guide holes in the multi-region that is combined with the thick copper region. In addition, a guide hole is formed in the same bonding portion in the bonding sheet region for bonding the thick copper region and the multi region (step 905).

Finally, by fastening the guide bar and the guide hole (step 906), the thick copper region, the multi region, and the bonding sheet region can be effectively joined.

10 is a view showing a completed printed circuit board according to an embodiment of the present invention. Referring to FIG. 10, it can be seen that the multi-region is effectively coupled to the thick copper region according to the embodiment of the present invention. At this time, the portion to which the multi-region is coupled can be effectively fastened by being coupled by the guide bar and the guide hole according to the present invention without a separate fastening means such as screws or soldering.

DETAILED DESCRIPTION Hereinafter, a detailed description of a preferred embodiment of the present invention will be described with reference to the accompanying drawings. In the following description, detailed descriptions of well-known functions or configurations will be omitted when it is determined that the detailed descriptions of the known functions or configurations may unnecessarily obscure the subject matter of the present invention.

According to the present invention, by configuring each region in the form of a guide bar and a guide hole in a printed circuit board made of a multi-layer structure there is an advantage that can be solved the disadvantages caused by other existing fastening means. In addition, by including the guide bar to be used as a fastening means according to the present invention in a part of the process of the printed circuit board, the process is simplified, there is an advantage that can provide a more effective coupling means.

In addition, according to the present invention by forming and combining the guide bar and the guide hole has the advantage that it is possible to implement both single-sided and double-sided processing in one board. In addition, according to the conventional coupling method, the circuit matching degree was about ± 100 μm, but by using the coupling method according to the present invention, there is an advantage that the control is possible within the range of ± 50 μm.

Claims (12)

In a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region are laminated, A guide bar generated by including and etching a portion of the first printed circuit region to be joined with the second printed circuit region as part of a circuit; And And a guide hole generated by drilling a portion of the second printed circuit region coupled to the guide bar generated in the first printed circuit region. And a coupling structure formed by etching the first bar and the second printed circuit region by coupling the guide bar and the guide hole. 2. The printed circuit board of claim 1, wherein the first printed circuit region is a thick copper region, and the second printed circuit region is a multi region. 2. The printed circuit board of claim 1, wherein the first printed circuit region is a multi region and the second printed circuit region is a thick copper region. In a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region are laminated, An embossed guide region generated by etching a portion of the first printed circuit region to be joined with the second printed circuit region as part of a circuit; And And an intaglio guide region generated by drilling a portion of the second printed circuit region coupled with the relief guide region generated in the first printed circuit region. And a joining structure formed by etching the first guide circuit region and the second printed circuit region by joining the relief guide region and the intaglio guide region. 5. The printed circuit board of claim 4, wherein said first printed circuit region is a thick copper region and said second printed circuit region is a multi region. 5. The printed circuit board of claim 4, wherein said first printed circuit region is a multi region and said second printed circuit region is a thick copper region. In a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated, the method of combining the first printed circuit region and the second printed circuit region, Forming a guide bar by etching a portion of the first printed circuit area to be joined to the second printed circuit area as a part of a circuit; Forming a guide hole by drilling a portion of the second printed circuit region that is coupled to the guide bar generated in the first printed circuit region; And Coupling the first printed circuit region to the second printed circuit region by fastening the guide bar and the guide hole to join the guide bar and the guide hole. 8. The method of claim 7, wherein the first printed circuit region is a thick copper region and the second printed circuit region is a multi region. 8. The method of claim 7, wherein the first printed circuit region is a multi region and the second printed circuit region is a thick copper region. In a multilayer printed circuit board comprising a first printed circuit region and a second printed circuit region laminated, the method of combining the first printed circuit region and the second printed circuit region, Including a portion of the first printed circuit region that is coupled with the second printed circuit region as a part of a circuit to be etched to form an embossed guide region; Forming a negative guide region by perforating a portion of the second printed circuit region that is coupled to the guide bar generated in the first printed circuit region; And And coupling the first printed circuit region and the second printed circuit region by coupling the embossed guide region and the intaglio guide region to each other. 11. The method of claim 10, wherein the first printed circuit region is a thick copper region and the second printed circuit region is a multi region. 11. The method of claim 10, wherein the first printed circuit region is a multi region and the second printed circuit region is a thick copper region.

Images