KR100516828B1 - 광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템 - Google Patents
광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템 Download PDFInfo
- Publication number
- KR100516828B1 KR100516828B1 KR10-2002-0044716A KR20020044716A KR100516828B1 KR 100516828 B1 KR100516828 B1 KR 100516828B1 KR 20020044716 A KR20020044716 A KR 20020044716A KR 100516828 B1 KR100516828 B1 KR 100516828B1
- Authority
- KR
- South Korea
- Prior art keywords
- image
- inspection
- substrate
- pattern
- acquisition step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Wire Bonding (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0044716A KR100516828B1 (ko) | 2002-07-29 | 2002-07-29 | 광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템 |
JP2003090441A JP4133509B2 (ja) | 2002-07-29 | 2003-03-28 | 光学的検査の誤った検出防止方法及びシステム |
CNB031225802A CN100456024C (zh) | 2002-07-29 | 2003-04-21 | 用于防止光学检查中错误检测的系统和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0044716A KR100516828B1 (ko) | 2002-07-29 | 2002-07-29 | 광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040011676A KR20040011676A (ko) | 2004-02-11 |
KR100516828B1 true KR100516828B1 (ko) | 2005-09-26 |
Family
ID=30439406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0044716A Expired - Fee Related KR100516828B1 (ko) | 2002-07-29 | 2002-07-29 | 광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4133509B2 (enrdf_load_stackoverflow) |
KR (1) | KR100516828B1 (enrdf_load_stackoverflow) |
CN (1) | CN100456024C (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102353697B (zh) * | 2011-08-31 | 2015-04-29 | 上海华虹宏力半导体制造有限公司 | 在线测评缺陷的方法 |
CN105865979B (zh) * | 2016-03-30 | 2019-03-12 | 南京邮电大学 | 一种测量微液滴电湿效应的装置与方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0876359A (ja) * | 1994-07-13 | 1996-03-22 | Kla Instr Corp | 自動フォトマスク検査装置及び方法 |
KR19980042720A (ko) * | 1996-11-27 | 1998-08-17 | 모리시타 요이찌 | 전자부품관찰장치 및 전자부품관찰방법 |
KR20000011616A (ko) * | 1998-07-10 | 2000-02-25 | 모리시타 요이찌 | 전자부품실장장치,인식장치및인식방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03160450A (ja) * | 1989-11-17 | 1991-07-10 | Fujitsu Ltd | マスクの欠陥検査方法 |
JPH04198742A (ja) * | 1990-11-28 | 1992-07-20 | Matsushita Electric Ind Co Ltd | 配線パターン検査装置 |
JP3189500B2 (ja) * | 1993-06-25 | 2001-07-16 | 松下電器産業株式会社 | 電子部品の外観検査装置および外観検査方法 |
JPH10221041A (ja) * | 1997-02-10 | 1998-08-21 | Toppan Printing Co Ltd | 欠陥検査方法 |
EP1003027B1 (en) * | 1997-06-17 | 2003-08-27 | Yuki Engineering System Co, Ltd. | Device for optical sheet wrapping inspection |
US6282309B1 (en) * | 1998-05-29 | 2001-08-28 | Kla-Tencor Corporation | Enhanced sensitivity automated photomask inspection system |
JP2001208693A (ja) * | 2000-01-26 | 2001-08-03 | Dainippon Printing Co Ltd | 板状ワークの検査方法及び装置 |
-
2002
- 2002-07-29 KR KR10-2002-0044716A patent/KR100516828B1/ko not_active Expired - Fee Related
-
2003
- 2003-03-28 JP JP2003090441A patent/JP4133509B2/ja not_active Expired - Fee Related
- 2003-04-21 CN CNB031225802A patent/CN100456024C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0876359A (ja) * | 1994-07-13 | 1996-03-22 | Kla Instr Corp | 自動フォトマスク検査装置及び方法 |
KR19980042720A (ko) * | 1996-11-27 | 1998-08-17 | 모리시타 요이찌 | 전자부품관찰장치 및 전자부품관찰방법 |
KR20000011616A (ko) * | 1998-07-10 | 2000-02-25 | 모리시타 요이찌 | 전자부품실장장치,인식장치및인식방법 |
Also Published As
Publication number | Publication date |
---|---|
JP4133509B2 (ja) | 2008-08-13 |
KR20040011676A (ko) | 2004-02-11 |
CN100456024C (zh) | 2009-01-28 |
CN1472528A (zh) | 2004-02-04 |
JP2004061491A (ja) | 2004-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3051279B2 (ja) | バンプ外観検査方法およびバンプ外観検査装置 | |
JP3092892B2 (ja) | 半導体チップの外観検査方法および装置 | |
KR101077080B1 (ko) | 인쇄회로기판의 광학 검사 장치 및 그 방법 | |
JP2009063576A (ja) | 自動光学検査装置及び方法 | |
CN100472204C (zh) | 布线图形检查装置 | |
JP2009063575A (ja) | 自動光学検査装置及び方法 | |
KR100737758B1 (ko) | 조명장치를 구비하는 자동 광학 검사 시스템 및 그의 검사 방법 | |
KR20080103403A (ko) | 패턴 검사 장치 및 패턴 검사 방법 | |
US6909798B1 (en) | Method of erasing repeated patterns and pattern defect inspection device | |
KR20070101669A (ko) | 마운팅 플레이트 어셈블리의 비전 검사장치 및 검사방법 | |
US8094926B2 (en) | Ultrafine pattern discrimination using transmitted/reflected workpiece images for use in lithography inspection system | |
KR100516828B1 (ko) | 광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템 | |
CN100538347C (zh) | 膜式或带式印制电路板的自动光学检测系统及处理方法 | |
KR20050044292A (ko) | 배선 패턴 검사 장치 및 방법 | |
KR20160105082A (ko) | 기판 검사 장치 및 그 검사 방법 | |
KR100673392B1 (ko) | 필름, 테이프 형태의 인쇄회로기판 외관 검사에서의 과검출방지를 위한 시스템 및 그 처리 방법 | |
US6545486B2 (en) | Solution and methodology for detecting surface damage on capacitive sensor integrated circuit | |
KR100661910B1 (ko) | 플렉시블 인쇄회로기판의 과검출을 방지하기 위한 광학적검사 시스템 및 그 방법 | |
KR100834113B1 (ko) | 자동 광학 검사 시스템 | |
JP2009122089A (ja) | プリント回路基板の光学検査装置及びその方法 | |
KR20050009867A (ko) | 인쇄회로기판의 광학 검사 시스템 및 그 방법 | |
KR100589978B1 (ko) | 다수의 광원을 이용하는 자동 광학 검사 시스템의 자동초점 조절 장치 및 그의 초점 조절 방법 | |
JP2004361329A (ja) | パターン検査方法および装置 | |
JPH0618240A (ja) | パターンのエッジライン推定方式及びパターン検査装置 | |
KR100675890B1 (ko) | 반도체 소자의 불량 검출 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20120918 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
FPAY | Annual fee payment |
Payment date: 20130906 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20150907 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
FPAY | Annual fee payment |
Payment date: 20160906 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
FPAY | Annual fee payment |
Payment date: 20170912 Year of fee payment: 13 |
|
PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20180916 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20180916 |
|
P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |