KR100511650B1 - 전자간섭실드를구비한전자기기및그제조방법 - Google Patents
전자간섭실드를구비한전자기기및그제조방법 Download PDFInfo
- Publication number
- KR100511650B1 KR100511650B1 KR10-1998-0028541A KR19980028541A KR100511650B1 KR 100511650 B1 KR100511650 B1 KR 100511650B1 KR 19980028541 A KR19980028541 A KR 19980028541A KR 100511650 B1 KR100511650 B1 KR 100511650B1
- Authority
- KR
- South Korea
- Prior art keywords
- shield
- spring
- hole
- adjacent
- circuit board
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 3
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- BNPSSFBOAGDEEL-UHFFFAOYSA-N albuterol sulfate Chemical compound OS(O)(=O)=O.CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1.CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1 BNPSSFBOAGDEEL-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/34—PCB in box or housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
Claims (10)
- 제1의 폭을 가진 제1 부분(30) 및 보다 작은 제2의 폭을 가진 제2 부분(32)을 가지는 스프링(26)을 준비하는 단계,상기 제2 부분을 인쇄회로기판(34)의 관통공(36)내에 삽입하는 단계,상기 인쇄회로기판을 제1 전도실드(22)에 인접하여 위치시키는 단계,상기 제1 부분을 상기 제1 실드와 상기 인쇄회로기판 사이에 압축하는 단계,상기 제1 실드에 대향하는 상기 인쇄회로기판에 인접하여 제2 전도실드(56)를 위치시키는 단계, 및상기 스프링의 상기 제2 부분을 상기 제2 실드에 대하여 바이어스 하는 단계를 포함하는 것을 특징으로 하는 전자기기(10) 조립방법.
- 제1항에서,상기 스프링을 상기 제1 실드로부터 연장되는 포스트(20)를 둘러싸도록 위치시키는 단계를 포함하는 것을 특징으로 하는 전자기기 조립방법.
- 제1항 또는 제2항에서,상기 스프링의 상기 제1 부분을 상기 인쇄회로기판에 전기적으로 연결시키는 단계를 포함하는 것을 특징으로 하는 전자기기 조립방법.
- 제1항 또는 제2항에서,상기 스프링의 상기 제1 부분을 제1의 힘으로 압축하고, 상기 스프링의 상기 제2 부분을 보다 약한 제2의 힘으로 압축하는 단계를 포함하여, 상기 제1 부분이 상기 기판에 대하여 바이어스 되는 것을 특징으로 하는 전자기기 조립방법.
- 하우징(12, 14),상기 하우징내에 홀(36)이 형성된 회로 어셈블리(34),상기 회로 어셈블리의 제1 면상의 홀에 인접하여 상기 하우징내에 위치된 제1 실드(22),상기 회로 어셈블리의 반대 쪽 제2 면상의 홀에 인접하여 상기 하우징내에 위치된 제2 실드(56), 및상기 회로 어셈블리와 상기 제1 실드 사이에 압축된 제1 부분(30) 및 상기 홀을 관통하여 상기 제2 실드에 대하여 바이어스된 제2 부분(32)을 가지는 스프링(26)을 포함하는 것을 특징으로 하는 전자기기(10).
- 제5항에서,상기 스프링은 코일스프링인 것을 특징으로 하는 전자기기.
- 제5항 또는 제6항에서,상기 제1 부분은 중간부에 인접하여 숄더(42)를 형성하고, 이로써 상기 숄더는 상기 회로에 대하여 지지되는 반면, 상기 중간부는 상기 홀을 통과하는 것을 특징으로 하는 전자기기.
- 제5항 내지 제6항에서,상기 하우징에 연결되고, 상기 홀 및 상기 스프링의 최소한 일부를 통과하는 포스트(20)를 포함하는 것을 특징으로 하는 전자기기.
- 제5항 또는 제6항에서,상기 홀은 선택된 직경을 가지고, 상기 제2 부분에 인접하는 상기 제1 부분의 숄더부(42)의 직경은 상기 선택된 직경 보다 큰 것을 특징으로 하는 전자기기.
- 제5항 또는 제6항에서,상기 홀에 인접하고 상기 제1 부분의 최소한 일부와 일치되는 전도랜드(40)를 포함하여, 상기 제1 부분이 상기 랜드에 전기적으로 연결되는 것을 특징으로 하는 전자기기.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/895,937 | 1997-07-17 | ||
US08/895,937 US6058024A (en) | 1997-07-17 | 1997-07-17 | Electronic instrument with electromagnetic interference shield and method of manufacturing |
US8/895,937 | 1997-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990013872A KR19990013872A (ko) | 1999-02-25 |
KR100511650B1 true KR100511650B1 (ko) | 2005-11-14 |
Family
ID=25405325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-1998-0028541A KR100511650B1 (ko) | 1997-07-17 | 1998-07-15 | 전자간섭실드를구비한전자기기및그제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6058024A (ko) |
EP (1) | EP0892594B1 (ko) |
JP (1) | JP3402448B2 (ko) |
KR (1) | KR100511650B1 (ko) |
CN (1) | CN1127734C (ko) |
DE (1) | DE69818168T2 (ko) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW486238U (en) * | 1996-08-18 | 2002-05-01 | Helmut Kahl | Shielding cap |
KR100310854B1 (ko) * | 1999-06-09 | 2001-11-02 | 윤종용 | 휴대용 복합 무선단말기의 엘씨디 모듈 고정구조 |
JP2001085859A (ja) * | 1999-09-14 | 2001-03-30 | Westwood:Kk | 電子機器の筐体構造 |
DE10013116B4 (de) * | 2000-03-17 | 2008-01-03 | Aeg Niederspannungstechnik Gmbh & Co Kg | Vorrichtung zur lagerichtigen Befestigung einer Leiterplatte |
US6243274B1 (en) * | 2000-04-20 | 2001-06-05 | Redcom Laboratories, Inc. | Shields for electronic components with ready access to shielded components |
NL1015059C2 (nl) * | 2000-04-28 | 2001-10-30 | Fci S Hertogenbosch B V | Kabelconnector en kit voor het in elkaar zetten daarvan. |
JP2001320181A (ja) | 2000-05-09 | 2001-11-16 | Sony Computer Entertainment Inc | 電子機器 |
US6445588B1 (en) * | 2001-01-02 | 2002-09-03 | Motorola, Inc. | Apparatus and method for securing a printed circuit board to a base plate |
TW514327U (en) * | 2001-06-06 | 2002-12-11 | Hon Hai Prec Ind Co Ltd | Photoelectric signal converter |
US7245497B2 (en) * | 2005-05-17 | 2007-07-17 | Itt Manufacturing Enterprises, Inc. | Modular electronics enclosure |
DE102005043880B4 (de) * | 2005-09-14 | 2014-10-02 | Continental Automotive Gmbh | Befestigungssystem für Leiterplatten |
JP4844883B2 (ja) * | 2006-07-20 | 2011-12-28 | 日本電気株式会社 | 電子機器及びプリント基板のgnd接続方法 |
DE102006034923A1 (de) * | 2006-07-28 | 2008-01-31 | Jungheinrich Ag | Gehäuse für eine Steuerung |
US7733659B2 (en) * | 2006-08-18 | 2010-06-08 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
US9237685B2 (en) | 2006-08-18 | 2016-01-12 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
JP4759482B2 (ja) * | 2006-09-21 | 2011-08-31 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器の製造方法及び電子機器 |
JP2008192800A (ja) * | 2007-02-05 | 2008-08-21 | Teac Corp | 電子機器 |
CN201138899Y (zh) * | 2007-12-12 | 2008-10-22 | 鸿富锦精密工业(深圳)有限公司 | 电子装置壳体 |
JP5268032B2 (ja) * | 2009-07-22 | 2013-08-21 | カシオ計算機株式会社 | ユニット装置 |
JP2012001105A (ja) * | 2010-06-17 | 2012-01-05 | Denso Corp | 車載用電子制御ユニット装置 |
JP2012124317A (ja) * | 2010-12-08 | 2012-06-28 | Nifco Inc | 接地固定具 |
CN102548341A (zh) * | 2010-12-10 | 2012-07-04 | 旭丽电子(广州)有限公司 | 散热壳体结构 |
US8780004B1 (en) * | 2012-01-31 | 2014-07-15 | Western Digital Technologies, Inc. | Dual configuration enclosure with optional shielding |
JP5976467B2 (ja) * | 2012-09-07 | 2016-08-23 | 矢崎総業株式会社 | シールド接続構造 |
KR101966256B1 (ko) * | 2012-09-14 | 2019-04-05 | 삼성전자주식회사 | 휴대용 단말기의 하우징 결합 구조 |
DE102018113409A1 (de) | 2018-06-06 | 2019-12-12 | Sma Solar Technology Ag | Elektrisches oder elektronisches Gerät umfassend ein Gehäuse mit zwei untereinander elektromagnetisch abgeschirmten Bereichen |
CN110244092B (zh) * | 2019-07-18 | 2024-03-15 | 扬州市玉宇电器有限公司 | 一种组合式屏蔽筒 |
DE102019133958A1 (de) * | 2019-12-11 | 2021-06-17 | Valeo Siemens Eautomotive Germany Gmbh | Wechselrichtereinrichtung, Antriebseinrichtung für ein elektrisch antreibbares Fahrzeug und Fahrzeug |
JP2024064719A (ja) * | 2022-10-28 | 2024-05-14 | 株式会社アドヴィックス | 液圧制御装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717990A (en) * | 1986-05-30 | 1988-01-05 | Motorola, Inc. | Double-shielded housing for RF circuitry |
US5206796A (en) * | 1991-03-11 | 1993-04-27 | John Fluke Mfg. Co. Inc. | Electronic instrument with emi/esd shielding system |
JPH08202843A (ja) * | 1995-01-23 | 1996-08-09 | Fujitsu Ltd | アース用ばねの固定構造 |
JPH09102975A (ja) * | 1995-10-03 | 1997-04-15 | Kokusai Electric Co Ltd | カード形無線受信機 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0745982A (ja) * | 1993-07-28 | 1995-02-14 | Toshiba Corp | シールドケースとプリント配線板との接続構造 |
US5519169A (en) * | 1994-03-23 | 1996-05-21 | Dell Usa, L.P. | EMI grounding cap structure for use in mounting a printed circuit board on a plated housing boss |
DE29521180U1 (de) * | 1995-08-24 | 1996-10-17 | Siemens Nixdorf Informationssysteme AG, 33106 Paderborn | Vorrichtung zur Masseverbindung einer Flachbaugruppe |
-
1997
- 1997-07-17 US US08/895,937 patent/US6058024A/en not_active Expired - Fee Related
-
1998
- 1998-07-08 DE DE69818168T patent/DE69818168T2/de not_active Expired - Fee Related
- 1998-07-08 EP EP98305451A patent/EP0892594B1/en not_active Expired - Lifetime
- 1998-07-13 JP JP19747998A patent/JP3402448B2/ja not_active Expired - Fee Related
- 1998-07-15 KR KR10-1998-0028541A patent/KR100511650B1/ko not_active IP Right Cessation
- 1998-07-17 CN CN98116090A patent/CN1127734C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717990A (en) * | 1986-05-30 | 1988-01-05 | Motorola, Inc. | Double-shielded housing for RF circuitry |
US5206796A (en) * | 1991-03-11 | 1993-04-27 | John Fluke Mfg. Co. Inc. | Electronic instrument with emi/esd shielding system |
JPH08202843A (ja) * | 1995-01-23 | 1996-08-09 | Fujitsu Ltd | アース用ばねの固定構造 |
JPH09102975A (ja) * | 1995-10-03 | 1997-04-15 | Kokusai Electric Co Ltd | カード形無線受信機 |
Also Published As
Publication number | Publication date |
---|---|
CN1127734C (zh) | 2003-11-12 |
CN1206199A (zh) | 1999-01-27 |
JP3402448B2 (ja) | 2003-05-06 |
JPH1187985A (ja) | 1999-03-30 |
DE69818168T2 (de) | 2004-07-15 |
DE69818168D1 (de) | 2003-10-23 |
EP0892594A3 (en) | 1999-05-26 |
EP0892594B1 (en) | 2003-09-17 |
EP0892594A2 (en) | 1999-01-20 |
KR19990013872A (ko) | 1999-02-25 |
US6058024A (en) | 2000-05-02 |
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