KR100509599B1 - Barrier for the plasma display panel and Method for the plasma display panel using the barrier - Google Patents

Abstract

The present invention provides a plasma display panel in which a gas discharge occurs according to a voltage applied to an electrode and excites a phosphor by ultraviolet radiation to form an image, wherein the plasma display panel includes a getter material capable of removing impurity gas. In addition, the present invention provides a partition of a plasma display panel for maintaining a discharge distance and preventing electro-optical cross talk between cells. In addition, forming a partition using a partition material including a getter material capable of removing impurity gas; Sealing the substrate on which the barrier is formed; Injecting hydrogen gas to reduce the getter material contained in the partition wall: and exhausting the hydrogen gas and injecting the discharge gas; manufacturing a plasma display panel for displaying an image using gas discharge To provide.

Description

Barrier for plasma display panel and method for manufacturing plasma display panel using the same {Barrier for the plasma display panel and Method for the plasma display panel using the barrier}

The present invention relates to a plasma display panel, and more particularly, to a partition of a plasma display panel.

In general, a plasma display panel is used to display an image using a gas discharge phenomenon, and has been spotlighted as a device that can replace a CRT because of its excellent display capability such as display capacity, brightness, contrast, afterimage, and viewing angle. . Such a plasma display device is a flat panel display element in which a gas discharge is generated between electrodes when a direct current or an alternating voltage applied to an electrode is applied, and an image is displayed by excitation and emission of phosphors due to the accompanying ultraviolet radiation.

FIG. 1A is an exploded perspective view of a typical AC plasma display panel, FIG. 1B is a partially exploded perspective view of FIG. 1A, and FIG. 1C illustrates a cross-sectional view of a plasma display panel in which an exhaust pipe is formed after the panel is sealed.

1A and 1B, the plasma display panel 10 includes a transparent front substrate 11 and a back substrate 12 such as glass.

On the front substrate 11, a strip-shaped sustain electrode 13 and a bus electrode 14 are formed, and a dielectric layer 15 and a protective film layer 16 are sequentially stacked thereon. The sustain electrode 13 includes a common electrode 13a and a scan electrode 13b.

On the back substrate 12, a strip-shaped address electrode 23, a partition 17, and a phosphor layer 18 are formed. A fritted glass 19 is applied to the edge of the rear substrate 12 to seal the panel, and an exhaust port 24 for exhausting impurity gas and injecting discharge gas is formed inside the rear substrate 12.

The substrates 11 and 12 having such a structure are sealed by heating and melting fritted glass applied to the outer circumferential portion of the rear substrate 12.

 Referring to FIG. 1C, since the panel 10 is sealed, the space inside the panel is filled with impurity gas, and thus air is replaced with an appropriate discharge gas to exhaust the air and increase the discharge efficiency.

In this exhaust process, impurity gas in the panel is forcibly discharged and exhausted through the exhaust port 24 communicated with the exhaust pipe 25.

However, since the width and height of the discharge space 20 inside the panel 10 form an area of several tens to hundreds of micrometers (μm), that is, a narrow area substantially close to the capillary tube, a considerable time is required to achieve a sufficient degree of vacuum. It is very difficult for the manufacturing process of panel due to the delay of exhaust time.

In addition, when the impurity gas is not sufficiently exhausted from the discharge space 20 of the panel 10, the gas discharge is inhibited due to the presence of impurity gas such as moisture, oxygen, or hydrogen, and thus, it is not possible to produce sufficient ultraviolet rays and to start discharge. The discharge initiation voltage required for is raised. That is, since the number of ultraviolet rays reaching the phosphor decreases, the luminance decreases, the efficiency deteriorates, and further, lighting of the panel may not be possible.

Furthermore, even if a predetermined discharge gas is injected in the discharge gas injection step, the phosphor layer 18, the partition wall 17, and the protective layer layer 16 exposed to the discharge space 20 may adsorb a large amount of impurity gas. Alternatively, since it is made of a material to be bonded, when the lighting discharge is started after fabrication after fabrication of the panel, a large amount of impure gas and the like adsorbed on the inner wall is released, resulting in contamination of the inside of the panel again. Therefore, due to such impurities, the characteristics of the panel, i.e., brightness and efficiency, are lowered, and the lifetime of the plasma display panel is shortened.

The present invention has been made to solve the above problems, and to provide a plasma display panel and a method of manufacturing the same to quickly achieve the gas purity in the display panel by quickly and easily remove the impurities in the plasma display panel have.

According to one embodiment of the present invention, in the plasma display panel in which a gas discharge occurs according to a voltage applied to an electrode and excite a phosphor by radiation of ultraviolet rays, an impurity gas can be removed. It is formed by including a getter material, and provides a partition of the plasma display panel to maintain the discharge distance and to prevent the electro-optic crosstalk between the cells. Here, the getter material may be formed on a surface thereof, and the getter material may include tungsten (W), titanium (Ti), zirconium (Zi), vananium (V), iron (Fe), aluminum (Al), and the like. It may be an oxide containing any one selected from the group consisting of alloys.

In another embodiment of the present invention, the partition wall of the plasma display panel includes: a first partition layer formed of a glass material mainly containing lead; A second barrier layer formed of a getter material is provided on the surface of the first barrier layer.

In one embodiment according to another aspect of the present invention, forming a partition using a partition material including a getter material capable of removing impurity gas; Sealing the substrate on which the barrier is formed; Injecting hydrogen gas to reduce the getter material contained in the partition wall: and exhausting the hydrogen gas and injecting the discharge gas; manufacturing a plasma display panel for displaying an image using gas discharge To provide. The barrier rib may include a first barrier layer formed of a lead-based glass material and a second barrier layer formed of a getter material on the surface of the first barrier layer.

Hereinafter, a partition of a plasma display panel and a method of manufacturing the plasma display panel will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of the plasma display panel. Here, the same reference numerals as in the above-described drawings indicate the same components having the same function.

Referring to FIG. 2, a sustain electrode 13 and a bus electrode 14 are formed on the front substrate 11, and a dielectric layer 15 and a protective layer 16 are sequentially stacked thereon.

On the back substrate 12, a strip-shaped address electrode 23 is formed. Although not shown, a dielectric layer (not shown) may be formed on the surface of the back substrate 12 on which the address electrode 23 is formed.

A partition wall 117 is formed between the address electrodes 23 to maintain a discharge distance and prevent electro-optical cross talk between cells.

The partition wall 117 constitutes one feature of the present invention. As an example, a method of manufacturing by sand blasting will be described with reference to FIGS. 3A to 3E.

Referring to FIG. 3A, after the barrier material paste is applied to the substrate 12 on which the address electrode 23 is formed, the barrier layer paste 117a is formed by stacking the barrier material paste on the entire surface with a predetermined thickness.

The paste of partition material uses what mixed the 1st material and the 2nd material as a getter material as a partition material normally used in the field of this invention.

The first material is not limited as long as it can be employed in the field of the present invention. For example, lead glass series, that is, glass powder containing lead (Pb) as a main component may be used.

The getter material is an oxide based on tungsten (W), titanium (Ti), zirconium (Zi), vananium (V), iron (Fe), aluminum (Al) or an alloy thereof, and the powder is used as the second material. It is used as. Here, the second material is used to adsorb impurity gas such as moisture, carbon or nitrogen in the exhaust process after sealing the panel to reduce the exhaust time, etc., thus adsorbing the impurity gas inside the panel. The content can be freely varied so as to be present on the surface of the partition wall. In addition, as described later, after the sealing of the panel, the gas is mixed with hydrogen (H ₂ ) to perform the exhaust process to reduce the getter material such as tungsten oxide (WO ₃ ) to enable the gettering action in the exhaust gas. do. Furthermore, when the lighting discharge is started after the encapsulation of the panel, a large amount of impurity gas adsorbed or bonded to the porous phosphor layer 18 or the protective layer 16 may be released and may be absorbed and removed.

Referring to FIG. 3B, the photoresist 101 is applied to the laminated portion 117a of the partition material paste, and the exposure is performed while the exposure mask 103 is covered thereon.

The light transmitting part 103a and the light shielding part 103b are formed in the mask 103. Here, the transmissive portion 103a of the mask 103 is disposed at a position corresponding to the position where the partition wall is to be formed as a subsequent step. When the exposure is performed, the portion of the photoresist 101 that receives the light is cured while the other portion is not cured. Among the materials which can be used as the photoresist, it is preferable to use a dry film resist (DFR).

Referring to FIG. 3C, a sandblasting process is performed on the barrier material paste stacking portion 117a including the photoresist pattern 101b cured by exposure and the unresisted photoresist pattern 101a. The sandblasting process is performed by high pressure spraying abrasive particles such as sand to remove unnecessary parts.

The abrasive particles 105 are shielded in the cured photoresist pattern 101b and wear out while colliding with the uncured photoresist pattern 101a.

Referring to FIG. 3D, the photocured photoresist pattern 101b remains on the partition wall 117 formed by the sandblasting process, and thus is removed. The removal method may be various, for example, can be removed by the peeling process. In the peeling process, when a basic stripping solution is passed through an acidic DFR by using a stripping apparatus, the photocured photoresist is stripped by an acidic acid neutralization reaction, thereby removing it.

As shown in FIG. 3E, when the substrate 12 on which the partition wall 117 is formed passes through the firing process, the partition wall 310 having a predetermined stripe type is formed.

Thus, as a process of forming a partition using a paste as a partition material in which the first material and the second material are mixed, the sand blasting process described above with reference to FIGS. 3A to 3E is merely exemplified as an example. Any method commonly used in the art may be used without limitation. In addition, the process of forming the partition wall using the partition material paste in which the first material and the second material are mixed may be used without limitation as long as it uses a method commonly used in the technical field of the present invention, such as a printing method, in addition to the sand blasting process. Can be.

Referring to FIG. 2, a phosphor layer 18 is formed on the back substrate 12 having the partition wall, and frit glass 19 is applied at the edge thereof by a dispensing method, etc., to seal the panel. A gas exhaust port 24 is formed for exhausting the gas, injecting the discharge gas, and the like. The fritted glass may be formed at the edge of the front substrate 11.

An exhaust pipe 25 such as a glass tube is sealed to the outside of the rear substrate 12 so as to communicate with the inside of the panel through the exhaust port 24.

In addition, the front substrate 11 and the rear substrate 12 are fixed in a pressurized state by a clip or a restraining jig (not shown) in a state of being aligned to face each other.

Such a panel assembly is moved to the sealing chamber and sealing exhaust and discharge gas are injected. That is, since fritted glass uses a low melting point glass, when fritted glass is heated inside a sealing chamber or the like at a predetermined temperature below the melting point of the glass used as the material of the substrates 11 and 12, the fritted glass melts and the pressing force of the restraining jig is used. The substrates 11 and 12 are sealed by mutual fusion.

And, the sealing chamber can be used without limitation as long as it is a device that can be commonly used in the art, by installing a vacuum pump device or a gas injection device, it is possible to vacuum or inject gas as needed, vacuum and gas Apart from or in conjunction with the injection, it is possible to carry out the vacuuming and the gas injection inside the panel through the exhaust pipe of the panel.

4 is a view illustrating a sealing and evacuation process of the plasma display panel inserted into the sealing chamber. Here, the same reference numerals as the drawings shown above indicate the same member having the same function.

Referring to FIG. 4, the sealing chamber 200 is a space in which airtightness is maintained, and a predetermined heater 201 for heating the panel assembly is installed, and a vacuum exhaust device is provided through pipes 211 and 212 and valves 221, 222, 223, 224, 225, and 226. And a hydrogen gas injection device 231 and a discharge gas injection device 232.

The panel assembly inserted into the sealing chamber 200 is connected to the exhaust pipe 25 and the exhaust head 26 to seal, exhaust and gas injection.

Referring to the sealing, exhaust and gas injection process as an example according to the present invention according to such a device as follows.

The inside of the sealing chamber 200 is heated by the heater 201 so as to maintain a predetermined temperature for exhausting, for example, 300 ° C. or higher, and operates the vacuum exhaust device 230 by adjusting the valves 221, 222, 223 and 224 to operate the vacuum pump ( (Not shown) to discharge impurities from the interior of the sealing chamber 200 and the panel assembly. Here, the first valve 221, the second valve 222, and the fourth valve 224 are in an open state, and the third valve 223 is closed.

Then, the sealing glass is raised to a sealing temperature, that is, a high temperature of 400 ° C to 450 ° C or higher using the heater 201 to melt the fritted glass 19. When the fritted glass 19 is melted, the substrates 11 and 12 are sealed by being fused by a pressing force such as a clip. At this time, when the fritted glass 19 is melted and fused, it becomes slightly thinner than its initial thickness so that the partition wall 117 may be in close contact with the inner surfaces of the opposing substrates 11 and 12.

After a predetermined time, exhaust of the interior of the sealing chamber 200 and the panel assembly is stopped, and a gas in which hydrogen (H ₂ ) gas or hydrogen (H ₂ ) is mixed is injected into the panel assembly. Injecting hydrogen gas or gas containing hydrogen is for activating a getter material such as tungsten oxide (W0 ₃ ) contained in the partition wall, and using tungsten oxide using hydrogen (H ₂ ) or a gas containing hydrogen in exhaust gas. By reducing the getter material such as to facilitate the gettering action. Here, the hydrogen gas injection device 231 is operated while the first valve 221, the third valve 223, and the fifth valve 225 are opened. The injection pressure at this time is a pressure necessary for the reduction reaction, for example, 10 to 760 Torr.

After the hydrogen gas or the like injected into the panel assembly reaches a predetermined pressure, the inside of the panel assembly is exhausted again. The injection and exhaust of hydrogen gas can be repeated several times as necessary, preferably at least two times.

Then, after cooling until the temperature of the sealing chamber 200 reaches the room temperature region, the discharge gas is injected into the panel assembly at about 100 to 700 Torr. Here, the sixth valve 226, the third valve 223, and the first valve 221 are opened.

After a predetermined discharge gas is injected into the panel assembly, encapsulation is performed. The encapsulation is performed by melting and compressing an exhaust pipe 26 made of glass or the like by using a plasma burner or a heat transfer device.

As described above, in the plasma display panel according to the present invention, a partition wall is formed by using a partition material paste in which a first material as a known partition material and a second material as a getter material are mixed, and a gas mixed with hydrogen after sealing the panel. It is described that the gettering action by performing a reduction process of the getter material by performing the exhaust process using, but the present invention is not limited thereto.

5 shows another embodiment of a plasma display panel according to the present invention. Here, the same reference numerals as in the above-described drawings refer to the same components having the same function.

Referring to FIG. 5, basically the same as that of FIG. 4, but a second barrier layer made of a getter material or a material containing a getter material is formed on the first barrier layer and the first barrier layer. .

The partition wall will be described in more detail as follows.

The first partition wall layer 227a is formed on the substrate 12 on which the address electrode 23 is formed.

The partition material of the first partition wall layer 227a is, for example, a partition glass material commonly used in the field of the present invention, for example, glass powder containing lead glass series, that is, lead (Pb) as a main component. As the process of forming the partition wall using the partition material, the sand blasting process described with reference to FIGS. 3A to 3E may be used. In addition, the sand blasting process described above with reference to FIGS. 3A to 3E may be used. Can be used without limitation

When the first barrier rib layer 227a is formed, the second barrier rib layer 227b is formed thereon using a getter material or a material containing the barrier rib layer 227a.

The getter material uses an oxide based on tungsten (W), titanium (Ti), zirconium (Zi), vananium (V), iron (Fe), aluminum (Al) or an alloy thereof, and the method of forming the getter material is As long as the second barrier layer 227b may be applied to and formed on the first barrier layer 227a, the present invention may be used without limitation.

A barrier material made of a getter material is printed one to two times on the substrate 12 on which the first barrier rib layer 227a of a predetermined shape is formed. That is, a through-hole is formed on the screen (not shown) so that the getter material is applied to the surface of the first partition layer 227a, and the printed part is printed, dried for a predetermined time, and then subjected to the firing process, and then the second partition layer 227b is formed.

After the first barrier layer 227a and the second barrier layer 227b are formed, as described with reference to FIGS. 2 and 4, the phosphor layer 18 is formed, and the sealing, exhaust and discharge gas are injected. Then, the plasma display panel is manufactured by encapsulating.

As such, when the first barrier layer 227a is formed by using the normal barrier material and the second barrier layer 227b made of a getter material is formed thereon, the impurity gas existing in the discharge space 20 There is an advantage that the area of the getter material layer in contact can be further enlarged to perform gettering more efficiently. Here, the phosphor layer 18 is formed on the first barrier layer 227a, but since the phosphor layer 18 is porous, impurity gas can pass through the phosphor layer 18, and thus the second Impurity gas can be removed by the partition layer 227b.

According to the plasma display panel according to the present invention, in the exhaust process after sealing the panel, adsorbed impurity gas such as moisture, carbon or nitrogen is reduced to reduce the exhaust time, and the exhaust process is performed using a gas mixed with hydrogen after sealing the panel. By performing the reduction reaction of the getter material, the gettering function in the exhaust is possible, and it is possible to remove a large amount of impurity gas emitted from the panel's lighting discharge and the double phosphor layer or the protective layer, and maintains a high degree of vacuum. Plasma display panel can be manufactured, the brightness thereof can be improved, the service life of the product can be extended, and the productivity can be improved.

1A, 1B, and 1C illustrate a typical plasma display panel.

2 is a cross-sectional view of a plasma display panel having a partition wall as an embodiment according to the present invention.

3A to 3E illustrate a method of manufacturing a partition of a plasma display panel as an example according to the present invention.

4 is a view illustrating a sealing and exhausting process by inserting a plasma display panel into a sealing chamber, and

5 is a cross-sectional view illustrating a plasma display panel in which a partition wall is formed as another embodiment according to the present invention.

<Brief Description of Major Codes in Drawings>

11.12 Substrates 13, 23. Electrodes

15. Dielectric layer 117. Bulkhead

19. Frit glass 20. Discharge space

24. Exhaust port 25. Exhaust pipe

26. Exhaust head 200. Sealing chamber

230. Vacuum exhaust device 231. Hydrogen gas injection device

232. Discharge gas injection system

Claims (6)

In a plasma display panel in which a gas discharge is generated in accordance with a voltage applied to an electrode, and a phosphor is excited by radiation of ultraviolet rays to form an image. A first partition wall layer formed of a lead-based glass material; And a second barrier layer formed of a getter material on a surface of the first barrier layer. delete The method of claim 1, The getter material is an oxide having any one selected from the group consisting of tungsten (W), titanium (Ti), zirconium (Zi), vananium (V), iron (Fe), aluminum (Al) and alloys thereof. A partition of the plasma display panel, characterized in that. delete Forming a partition using a partition material including a getter material capable of removing impurity gas; Sealing the substrate on which the barrier is formed; Injecting hydrogen gas to reduce the getter material contained in the partition: And Exhausting the hydrogen gas and injecting a discharge gas; and displaying an image using gas discharge. The method of claim 5 The partition wall, A first partition wall layer formed of a lead-based glass material, And a second partition wall layer formed of a getter material on a surface of the first partition wall layer.