KR20010104469A - Plasma display panel including a coated getter and Method for the same - Google Patents

Abstract

The present invention, the front substrate and the back substrate; Barrier ribs for maintaining a discharge distance between the front substrate and the rear substrate and preventing cross talk between cells; And a frit glass for sealing an outer circumferential portion of the front substrate and the rear substrate of the baby substrate, wherein the plasma display panel forms an image by gas discharge, further comprising a getter material applied between the barrier ribs and the fritted glass. A plasma display panel is provided. In addition, forming barrier ribs on the rear substrate; Applying fritted glass for encapsulating the substrate on an outer circumference of the rear substrate; Applying a getter material to a portion between the fritted glass and the partition walls; Sealing the rear substrate and the front substrate; Injecting hydrogen gas to reduce the getter material; and exhausting the hydrogen gas and injecting a discharge gas; and a method of manufacturing a plasma display panel.

Description

Plasma display panel coated with getter material and method of manufacturing the same {Plasma display panel including a coated getter and Method for the same}

The present invention relates to a plasma display panel, and more particularly, to an exhaust of a plasma display panel.

In general, a plasma display panel generates a gas discharge between electrodes when a direct current or an alternating voltage is applied to the electrodes. The plasma display panel is a flat panel display device that displays an image by emitting phosphors by radiation of ultraviolet rays.

FIG. 1A illustrates an exploded perspective view of a typical AC plasma display panel, FIG. 1B illustrates a partially exploded perspective view of FIG. 1A, and FIG. 1C illustrates a cross-sectional view of a plasma display panel in which an exhaust pipe is formed after the panel is sealed. will be.

1A and 1B, the plasma display panel 10 includes a transparent front substrate 11 and a back substrate 12 such as glass.

On the front substrate 11, a strip sustain electrode 13 and a bus electrode 14 are formed, and a dielectric layer 15 and a protective layer 16 are sequentially stacked thereon. The sustain electrode 13 includes a common electrode 13a and a scan electrode 13b.

A strip-shaped address electrode 23, a partition 17, and a phosphor layer 18 may be formed on the back substrate 12, and an insulating layer 25 may be formed on the address electrode 23. A fritted glass 19 is applied to the edge of the rear substrate 12 to seal the panel, and an exhaust hole 24 is formed therein for exhausting impurity gas and injecting discharge gas.

The substrates 11 and 12 having such a structure are sealed by heating and melting fritted glass applied to the outer circumferential portion of the rear substrate 12.

Referring to FIG. 1C, since the panel 10 is sealed, the space inside the panel is filled with impurity gas, and thus air is replaced with an appropriate discharge gas capable of exhausting such air and increasing discharge efficiency.

In such an exhaust process, impurity gas inside the panel is forcibly discharged and exhausted through the exhaust hole 24 communicated with the exhaust pipe 27.

However, since the width and height of the discharge space 20 inside the panel 10 form an area of tens to hundreds of micrometers (μm), that is, a narrow area substantially close to the capillary tube, a considerable time is required to achieve sufficient vacuum degree. Due to the delay of the exhaust time, the production process of the panel is greatly disturbed.

In addition, when a discharge gas is injected in a state in which air in the discharge space 20 of the panel 10 is not sufficiently exhausted, a large amount of gas such as moisture, oxygen, or hydrogen is present, so that the discharge starts when the discharge is started. The voltage rises, the discharge is inhibited, and there is no sufficient ultraviolet light. This decreases the number of ultraviolet rays that reach the phosphor, so that the brightness is lowered, the efficiency is lowered, and the panel itself may be impossible to turn on.

In addition, since the material of the phosphor layer 18, the partition 17, and the protective layer 16 exposed to the discharge space 20 in the panel 10 is made of a material that adsorbs or combines a large amount of gas, After the discharge gas is enclosed and manufactured, the lighting discharge is started, and a large amount of gas and other foreign substances are released from the inner wall thereof. As a result, the inside of the panel is contaminated again, and these impurity gases reduce the characteristics of the panel, that is, brightness and efficiency, and shorten the lifetime.

The present invention has been made to solve the above problems, and to provide a plasma display panel and a method of manufacturing the same to quickly achieve the gas purity in the display panel by quickly and easily remove the impurities in the plasma display panel have.

FIG. 1A is an exploded perspective view of a typical AC plasma display panel, FIG. 1B is an exploded perspective view of a portion of FIG. 1A, and FIG. 1C is a cross-sectional view of a plasma display panel in which an exhaust pipe is formed after the panel is sealed.

2 is a cross-sectional view of a plasma display panel to which a getter material is applied as an embodiment according to the present invention.

3 and 4 illustrate another embodiment of the present invention, which is a cross-sectional view showing a back substrate, a phosphor layer, and a partition wall.

FIG. 5 is a perspective view illustrating a back substrate to which a getter material is applied in FIG. 2, and

FIG. 6 is a view illustrating a process in which a plasma display panel is inserted into a sealing chamber and sealed and exhausted according to an embodiment of the present invention.

<Brief Description of Major Codes in Drawings>

111.112 Substrate 113,123,114. electrode

115. Dielectric layer 117. Bulkhead

119. Frit Glass 120. Discharge Space

124. Exhaust hole 127. Exhaust pipe

126. Exhaust head 130. Getter material layer

200. Seal Room

230. Vacuum exhaust device 231. Hydrogen gas injection device

232. Discharge gas injection system

In one embodiment, a plasma display panel includes: a front substrate and a rear substrate; Barrier ribs for maintaining a discharge distance between the front substrate and the rear substrate and preventing cross talk between cells; And a fritted glass sealing the outer circumference of the front substrate and the rear panel of the baby substrate, wherein the plasma display panel forms an image by gas discharge, further comprising a getter material also trapped between the partition walls and the fritted glass. Equipped. Here, the getter material is any one selected from the group consisting of tungsten (W), titanium (Ti), zirconium (Zi), vananium (V), iron (Fe), aluminum (Al) and alloys thereof. It may be an oxide.

Plasma display panel having another feature of the present invention is a front substrate and a back substrate; Barrier ribs for maintaining a discharge distance between the front substrate and the rear substrate and preventing cross talk between cells; And a phosphor layer applied to the discharge space partitioned by the partition walls and containing a getter material.

In addition, a method of manufacturing a plasma display panel according to another aspect of the present invention comprises the steps of: forming partitions on the back substrate; Applying fritted glass for encapsulating the substrate on an outer circumference of the rear substrate; Applying a getter material to a portion between the fritted glass and the partition walls; Sealing the rear substrate and the front substrate; Injecting hydrogen gas to reduce the getter material: and exhausting the hydrogen gas and injecting a discharge gas.

Hereinafter, a plasma display panel and a method of manufacturing the plasma display panel according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of the plasma display panel.

Referring to the drawing, the sustain electrode 113 and the bus electrode 114 are formed on the front substrate 111, and the dielectric layer 115 and the protective layer 116 are sequentially stacked thereon.

On the back substrate 112, a strip-shaped address electrode 123 and an insulating layer or dielectric layer 125 are formed thereon. In this case, the insulating layer or the dielectric layer 125 may be omitted.

A partition wall 117 is formed on the dielectric layer 125 to maintain a discharge distance and prevent electro-optical crosstalk between cells, and a phosphor layer 118 is formed in a space partitioned by the partition wall.

A getter material layer 131 may be applied to a lower surface of the phosphor layer 118 as shown in FIG. 3, and a getter material 132 may be mixed in the phosphor layer as shown in FIG. 4.

In addition, fritted glass 119 is coated on the edge periphery of the back substrate 112 as a low melting glass by dispensing, etc., for sealing the panel 100, and a getter material 130 is introduced into the fritted glass 119. Is applied. In addition, an exhaust hole 24 is formed at one side edge of the rear substrate 112 for exhaust of impurity gas and injection of discharge gas. In addition, an exhaust pipe 127 such as a glass tube is sealed to the outside of the rear substrate 112 so as to communicate with the inside of the panel through the exhaust port 124. Here, the fritted glass and the getter material may be formed at the edge of the front substrate 11.

The getter material is a subsequent process used to reduce the exhaust time by adsorbing impurity gas such as moisture or carbon or nitrogen in the exhaust process after sealing the panel, and includes tungsten (W), titanium (Ti), and zirconium (Zi). ), An oxide powder containing vanadium (V), iron (Fe), aluminum (Al) or an alloy thereof as a component. The getter material may also have a gettering effect in the exhaust gas by reducing and reacting a getter material such as tungsten oxide (WO3) by performing an exhaust process using a gas mixed with hydrogen (H2) after sealing the panel. Done. In addition, when the lighting discharge is started after the encapsulation of the panel, a large amount of impurity gas adsorbed or bonded to the porous phosphor layer 18 or the protective layer 16 is released, which can be absorbed and removed.

5 is a perspective view and a partially enlarged view showing a back substrate to which a getter material is applied.

Referring to FIG. 5, fritted glass 119 is coated on the peripheral edge of the back substrate 112 on which the partition wall 117 and the phosphor layer 118 are formed as low melting glass, and the frittglass 119 and the partition wall 117 are formed. The getter material 130 is applied in between.

The method of applying the getter material may be used without limitation as long as it can be applied in the form of a thin film in a range that does not affect the injection of exhaust gas and discharge gas as a subsequent process, and for example, may be applied by a dispensing method. Can be. The dispensing method is a method of dispensing and forming a getter material by using a needle or the like connected to a dispenser device.

The plasma display panel 100 having such a structure is assembled with a process of sealing, exhaust, and discharge gas injection, which will be described below.

First, the front substrate 11 and the rear substrate 12 are fixed in a pressurized state by a clip or a restraining jig (not shown) in a state aligned to face each other.

Next, the plasma display panel 100 is moved to the sealing chamber to perform sealing exhaust and discharge gas injection. That is, since the fritted glass 119 uses low melting point glass, the fritted glass 119 melts when heated in a sealing chamber or the like at a predetermined temperature below the melting point of the glass used as the material of the substrates 111 and 112. The substrates 111 and 112 are fused to each other by the pressing force of the restraining jig.

Here, the sealing chamber can be used without limitation as long as it is a device that can be commonly used in the art, and by installing a vacuum pump device or a gas injection device, it is possible to vacuum or inject the gas, if necessary, vacuum and Apart from or along with the gas injection, it is possible to carry out vacuumization and gas injection inside the panel through the exhaust pipe of the panel.

FIG. 6 is a diagram illustrating the sealing and evacuation process of the plasma display panel inserted into the sealing chamber.

Referring to FIG. 6, the sealing chamber 200 is a space in which airtightness is maintained, and a predetermined heater 201 for heating the panel assembly is installed, and a vacuum exhaust device is provided through pipes 211 and 212 and valves 221, 222, 223, 224, 225 and 226. And a hydrogen gas injection device 231 and a discharge gas injection device 232.

The panel 100 inserted into the sealing chamber 200 is connected to the exhaust pipe 127 and the exhaust head 126 to seal, exhaust and inject gas.

Referring to the sealing, exhaust and gas injection process as an example according to the present invention according to such a device as follows.

The inside of the sealing chamber 200 is heated by the heater 201 so as to maintain a predetermined temperature for exhausting, for example, 300 ° C. or higher, and operates the vacuum exhaust device 230 by adjusting the valves 221, 222, 223 and 224 to operate the vacuum pump ( (Not shown) to discharge impurities from the interior of the sealing chamber 200 and the panel assembly. Here, the first valve 221, the second valve 222, and the fourth valve 224 are in an open state, and the third valve 223 is closed.

Then, the sealing glass is heated to a sealing temperature, that is, a high temperature of 400 ° C to 450 ° C or higher by using the heater 201 to melt the fritted glass 19. When the fritted glass 19 is melted, the substrates 11 and 12 are fused and sealed by pressing force such as a clip. At this time, when the fritted glass 19 is melted and fused, it becomes slightly thinner than its initial thickness so that the partition wall 117 may be in close contact with the inner surfaces of the opposing substrates 11 and 12.

After a predetermined time, exhaust of the interior of the sealing chamber 200 and the panel assembly is stopped, and hydrogen (H 2) gas or a gas containing hydrogen (H 2) is injected into the panel assembly. Injecting hydrogen gas or gas containing hydrogen is for activating a getter material such as tungsten oxide (W03) applied to the edge of the back substrate 112, mixed with the phosphor, or applied to the lower surface of the phosphor. It is for facilitating the gettering action by reducing the getter material using hydrogen (H 2) or a gas containing hydrogen. Here, the hydrogen gas injection device 231 is operated while the first valve 221, the third valve 223, and the fifth valve 225 are opened. At this time, the injection pressure is a pressure necessary for the reduction reaction, for example, 10 to 760 Torr.

After the hydrogen gas or the like injected into the panel 100 reaches a predetermined pressure, the inside of the panel is exhausted again. Injection and exhaust of hydrogen gas can be repeated several times as needed, and it is preferable to carry out 2 or more times.

Next, after cooling the temperature of the sealing chamber 200 to reach the room temperature region, the discharge gas is injected into the panel 100 at about 100 to 700 Torr. Here, the sixth valve 226, the third valve 223, and the first valve 221 are opened.

After a predetermined discharge gas is injected into the panel 100, a sealing operation is performed. The encapsulation is performed by melting and compressing an exhaust pipe 26 made of glass or the like by using a plasma burner or a heat transfer device.

According to the plasma display panel according to the present invention, in the exhaust process after sealing the panel, adsorbed impurity gas such as moisture, carbon or nitrogen is reduced to reduce the exhaust time, and the exhaust process is performed using a gas mixed with hydrogen after sealing the panel. By performing the reduction reaction of the getter material, it is possible to remove a large amount of impurity gas emitted from the lighting discharge of the panel and the double layer phosphor layer or the protective layer. Therefore, it is possible to maintain a sufficient degree of vacuum so that a high quality plasma display panel can be manufactured, its brightness can be improved, its service life can be extended, and its productivity can be improved.

Claims (4)

Front and back substrates; Barrier ribs for maintaining a discharge distance between the front substrate and the rear substrate and preventing cross talk between cells; In the plasma display panel comprising a frit glass for sealing the outer peripheral portion of the front substrate and the rear substrate of the baby substrate, forming an image by gas discharge, And a getter material applied between the barrier ribs and the fritted glass. The method of claim 1, The getter material is an oxide having any one selected from the group consisting of tungsten (W), titanium (Ti), zirconium (Zi), vananium (V), iron (Fe), aluminum (Al) and alloys thereof. Plasma display panel, characterized in that. Front and back substrates; Barrier ribs for maintaining a discharge distance between the front substrate and the rear substrate and preventing cross talk between cells; In the plasma display panel comprising a phosphor layer applied to the discharge space partitioned by the partition walls, And a getter material is applied to the lower surface of the phosphor layer or the getter material is contained in the phosphor layer. Forming barrier ribs on the rear substrate; Applying fritted glass for encapsulating the substrate on an outer circumference of the rear substrate; Applying a getter material to a portion between the fritted glass and the partition walls; Sealing the rear substrate and the front substrate; Injecting hydrogen gas to reduce the getter material: and Exhausting the hydrogen gas and injecting a discharge gas.