JP5325812B2 - Method for manufacturing plasma display panel - Google Patents

Description

  The present invention relates to a sealing technique for a display device such as a plasma display panel.

Conventionally, a plasma display panel (PDP) has been widely used in the field of display devices, and recently, a high-quality and low-cost PDP with a large screen is required.
A cross-sectional view of the peripheral portion of the PDP according to the conventional structure is shown in FIG.
Currently, the PDP is mainly a three-electrode surface discharge type in which a front substrate 120 having a sustain electrode 126 and a scan electrode 125 formed on a glass substrate 121 and a rear substrate 110 having an address electrode 115 formed on the glass substrate 111 are bonded together. It has become. A discharge gas is sealed between the front substrate 120 and the back substrate 110. When a voltage is applied between the scan electrode 125 and the address electrode 115 to generate a discharge, the sealed discharge gas is turned into plasma, Ultraviolet rays are emitted. If the phosphor is arranged at a position where the emitted ultraviolet rays are irradiated, the phosphor is excited by the ultraviolet rays and visible light is emitted.

In general, a dielectric layer 122 is formed on the sustain electrode 126 and the scan electrode 125, and an MgO film 124 for protecting the dielectric layer 122 is further formed thereon.
When an AC voltage is applied to scan electrode 125 and sustain electrode 126 in order to maintain the discharge, cations generated by the plasma generation of the discharge gas are incident on scan electrode 125 and sustain electrode 126, but sustain electrode 126 and scan electrode 125 and the dielectric layer 122 on these electrodes are protected from cations by a protective film (MgO film) 124.
The front substrate 120 and the back substrate 110 are sealed with a sealing material (frit) 176 made of low-melting glass.
The PDP manufacturing process is roughly divided into a panel process and a module setting process, and the panel process is further divided into a front substrate process, a back substrate process, and a panel forming process. The front substrate process is a process of forming a display electrode including the scan electrode 125 and the sustain electrode 126, the dielectric layer 122, and a protective film 124 such as MgO on the glass substrate 121. The back substrate step is a step of forming an address electrode 115, a dielectric layer 114, a partition wall (rib) 113, a phosphor layer 112 and a sealing material for bonding the front substrate 120 and the rear substrate 110 on the glass substrate 111. It is. The paneling process includes alignment of the completed front substrate 120 and rear substrate 110, sealing by heating and melting a sealing material made of sealing glass, attachment of a chip tube, and cleaning of the panel by heating and vacuuming ( It is a step of performing hatching, aging), filling of the discharge gas, sealing of the tip tube (tip-off), and aging (withering) to discharge by applying an AC voltage and stabilize the discharge characteristics.

In the back substrate process, the phosphor layer 112 is baked, and then a seal layer (sealing material, frit) is formed. The method for forming the sealing material is as follows. (1) Making a sealing material paste, (2) Applying the sealing paste to the substrate, (3) Drying the paste, (4) Temporary firing, and proceeding to the paneling step through these steps (Non-patent Document 1).
Further, if the PDP is manufactured by the vacuum integrated apparatus of Japanese Patent No. 3830288, it is not necessary to expose the alkaline earth metal oxide protective film to the atmosphere, so that the PDP can be manufactured without impairing the characteristics of the protective film. . Further, as proposed in Japanese Patent Laid-Open No. 2002-075197, if a resin material is used for the sealing material 176, heating and cooling at the time of panel sealing are not required, so that the panel manufacturing time can be greatly shortened. At the same time, energy saving is possible.

Japanese Patent No. 3830288 JP 2002-075197 JP 2003-317634 A Republished WO2006 / 019032 JP 2006-324026 A

“Flat Panel Display Dictionary”, Industrial Research Council, December 25, 2001, P752-754, P868-P870

However, in the implementation of the above-described conventional technique using a resin as a sealing material, the impurity gas that permeates from the resin material and enters the panel, and the impurity gas that is released from the resin material into the panel at the time of sealing the panel, There is a problem that the discharge voltage is increased due to a gradual decrease in the purity of the discharge gas sealed in the inside ("Characteristics of each member and latest development example in PDP", Information Organization Co., Ltd., March 26, 2004). Sun, P40, P144). Further, there is a problem that the ultraviolet rays generated by the discharge inside the panel decompose the resin material as the sealing material.
Attempts have been made to degas the resin sealing material in advance to reduce the outgassing at the time of sealing, but as the outgassing of the sealing material is reduced, the adhesiveness of the sealing material tends to decrease. . It is necessary to establish a method that suppresses the outgas amount and has an adhesive strength that can withstand the bending of the glass substrate as a result of an increase in size ("Characteristics of each member in PDP and latest development examples", Information Organization Co., Ltd., 2004 March 26, P41, P42).
In addition, even in the current process using low-melting-point glass as a sealing material, a large amount of impure gas is released during sealing, and it is necessary to age for a long time before sealing when forming a panel. I need aging later. For this reason, the panel production throughput is limited, and a large amount of power is required.

In order to solve the above problems , the present invention provides a first substrate having a light emitting region in which a phosphor is disposed, a second substrate disposed to face the first substrate, the first, An inner first ring seal and an outer second ring seal, each disposed between the second substrates and surrounding each of the light emitting regions, wherein the first substrate and the second substrate are one, thus adhering to the second ring seal, said inner second ring seal is a plasma display panel manufacturing method for manufacturing a blocked PDP from the atmosphere, the said first ring seal first Before the second ring seal is cured, the buffer space between the first ring seal and the second ring seal is heated and surrounded by the first ring seal before the buffer space is cured. In a state where the temperature is higher than between, the first and second ring seals are cured, the first substrate and the second substrate are bonded, the space on the light emitting region, the buffer space, Is a method for manufacturing a plasma display panel.

The present invention adopts a double seal structure in order to reduce the permeation amount of impure gas permeating from the resin material as the sealing material and entering the panel. Furthermore, in order to reduce the amount of permeation, either or both of a spacer and a filler were added to the resin material to reduce the permeation area of the resin material and at the same time lengthen the impure gas permeation path. The spacer and filler protect the resin from ultraviolet rays generated by discharge.
In addition, the amount of sealing material on the inner periphery was reduced in order to reduce the amount of impure gas released from the resin material into the panel during panel sealing. In addition, in order to simplify the manufacturing process of the panel, the resin material having the same curing characteristics is used, and the double seal is sealed in one step.

In the present invention, the inner peripheral sealing material has a larger volume of spacers and fillers than the resin, and the spacer has an action of shielding ultraviolet rays and preventing deterioration of the sealing material, and an impurity gas that passes through the resin material of the sealing material. The impurity gas generated from the sealing material at the time of sealing can be minimized, and a decrease in the purity of the discharge gas can be prevented.
Since the inner periphery sealing material contains more spacers and fillers than the outer periphery sealing material, it is stronger against the pressing force than the outer periphery sealing material. Adhesive strength is stronger than sealing material.
As described above, the PDP of the present invention can obtain a more stable discharge characteristic than the conventional one (a rise in discharge voltage can be suppressed).
In addition, the aging process time can be shortened or the initial aging process can be eliminated.
Furthermore, since sealing resins having the same curing characteristics are used, sealing can be performed in a single process, and panel manufacturing costs can be reduced.
As a result, it is possible to produce a panel with no problem even if a resin material is used as the sealing material, and the panel cost can be reduced and energy can be saved.

Schematic perspective view showing an example of a part of a PDP Expanded cross section of PDP Enlarged sectional view of the PDP of the present invention Plan view of the PDP of the present invention Shows H ₂ O concentration versus time and double seals (spacers, no filler) in the PDP of the relationship between the H ₂ O concentration and time in the panel of the PDP using employing singlet seal It shows H ₂ O concentration versus time and double seals (spacers, filler present) in the PDP of the relationship between the H ₂ O concentration and time in the PDP panel with using the singlet seal The figure which shows the manufacturing process of PDP Diagram showing the configuration of the vacuum device Graph showing the relationship between acceleration time and discharge voltage Enlarged sectional view of the second substrate on which the protective film is formed Sectional view of the sealing chamber into which the first and second substrates are carried The figure for demonstrating the position where a 1st, 2nd adhesive member is apply | coated Expanded sectional view of the first substrate on which the first and second ring seals are formed Enlarged sectional view of PDP 1 before the first and second ring seals are cured

<PDP>
FIG. 1 shows an exploded perspective view of a part of a general three-electrode AC type PDP (plasma display panel). Reference numeral 1 denotes the PDP, and the PDP 1 includes a second substrate 20 and a plurality of discharge chambers formed between the first substrate 10 and the two substrates.
Striped display electrodes 27 (a pair of scan electrodes 25 and sustain electrodes 26) are formed on the inner surface of the second substrate 20 at predetermined intervals. The display electrode 27 includes a transparent electrode made of a transparent conductive material such as ITO and a bus electrode that is thinner than the transparent electrode and has a low impedance. A dielectric layer 22 is formed so as to cover the display electrode 27, and a protective film 24 is formed so as to cover the dielectric layer 22. The protective film 24 protects the dielectric layer 22 from cations generated by the plasma of the discharge gas, and is made of an alkaline earth metal oxide such as MgO or SrO.
On the other hand, on the inner side of the first substrate 10, stripe-shaped address electrodes 15 are formed at predetermined intervals in a direction orthogonal to the display electrodes 27 described above. The intersection of the display electrode 27 and the address electrode 15 is a PDP pixel. A dielectric layer 14 is formed so as to cover the address electrodes 15. In addition, partition walls (ribs) 13 are formed in parallel with the address electrodes on the upper surface of the dielectric layer 14 between the adjacent address electrodes 15. Further, phosphors 12 are disposed on the upper surface of the dielectric layer 14 and the side surfaces of the partition walls between the adjacent partition walls 13. The phosphor 12 emits red, edge, or blue fluorescence.

  The second substrate 20 and the first substrate 10 are bonded together, and a discharge chamber (discharge space) 91 is formed between the adjacent barrier ribs 13. A discharge gas such as a mixed gas of Ne and Xe is sealed inside the discharge chamber 91. A DC voltage is applied between the address electrode 15 and the scan electrode 25 to generate a counter discharge, and an AC voltage is applied between the scan electrode 25 and the sustain electrode 26 to generate a surface discharge. Then, the discharge gas sealed in the discharge chamber 91 is turned into plasma, and ultraviolet rays are emitted into the vacuum. The phosphor 12 is excited by the ultraviolet rays, and visible light is emitted from the second substrate 20.

A cross-sectional view of the peripheral edge of the PDP in this embodiment is shown in FIG.
The first substrate 10 includes a support substrate 11, the second substrate 20 includes a transparent substrate, and the electrodes 15 and 27, the partition wall 13, and the phosphor 12 include the support substrate 11 and the transparent substrate 21. The surface of the support substrate 11 and the transparent substrate 21 is exposed at a part of the outer peripheral portion (sealing region 18) around the light emission region 19. The transparent substrates 21 are attached to each other by an adhesive portion 45.
The phosphor 12 is disposed on the address electrode 15 via the dielectric layer 14. When a discharge gas is disposed between the barrier ribs 13 and a voltage is applied to the address electrode 15, the sustain electrode 26, and the scan electrode 25, A discharge gas plasma is formed at a desired position, the phosphor 12 emits light by the emitted ultraviolet light, and the emitted light is transmitted through the transparent substrate 21 and emitted to the outside.

First and second ring seals 47 and 48 and a getter material 89 are disposed on the surfaces of the sealing regions 18 of the second substrate 20 and the first substrate 10.
The first ring seal 47, the getter material 89, and the second ring seal 48 are arranged in this order from the second substrate 20 and the light emitting region 19 (region where the phosphor 12 emits light) inside the first substrate 10. It is surrounded by.
In the PDP 1 of the present invention, the first and second ring seals 47 and 48 have the first and second adhesive resins 41 and 42, respectively, and the first ring seal 47 is the first adhesive resin. 41, a first solid material 85 composed of either one or both of a filler 83 and a spacer 84 is dispersed, and the second ring seal is either a filler or a spacer in the second adhesive resin 42. A second solid 86 consisting of one or both is dispersed.
In general, when the resin content of a certain volume increases as the spacer and filler content increases, the proof stress against the pressing force in the direction of pressing the first and second substrates increases, and conversely when the resin content increases, The resistance to the peeling force that separates the second substrate is increased.

In the present invention, the volume ratio of the first solid material 85 to the first adhesive resin 41 is larger than the volume ratio of the second solid material to the second adhesive resin 42.
Therefore, in the first ring seal 47 and the second ring seal 48 having the same volume, the first ring seal 47 includes more spacers 84 and fillers 83 than the second ring seal 48, and conversely, Since the second ring seal 48 contains more resin than the first ring seal 47, the first ring seal 47 has higher resistance to pressing force, and the second ring seal 48 is separated. High resistance to force.

The first ring seal 47 is disposed inside the second ring seal 48, and the sealing resin is cured by containing a large amount of a solid material composed of either one or both of the spacer 84 and the filler 83. Occurrence of impurities generated in the emission region and gas permeation are suppressed.
In the present invention, the first and second ring seals 47 and 48 are spaced apart from each other, and a buffer space 90 is provided between the first ring seal 47 and the second ring seal 48. The buffer space 90 is configured such that the pressure is lower than the space above the light emitting region 19 surrounded by the first ring seal 47.
The first ring seal 47 has a large amount of spacers 84 and fillers 83 and suppresses the release of impurities and gas permeation that occur when the sealing resin is cured, but the space above the light emitting region 19 is more buffered. Therefore, the gas in the buffer space 90 does not diffuse in the first ring seal 47 and does not enter the space above the light emitting region 19.

Since the width W _{2 of} the second ring seal 48 is wider than the width W _{1 of} the first ring seal 47, the atmosphere that diffuses through the second ring seal 48 and enters the buffer space 90 is small, and the buffer space 90 The state in which the internal pressure is lower than the pressure of the space on the light emitting region 19 is maintained.
When the number of spacers 84 of the second ring seal 48 is larger than that of the first ring seal 47, the proof strength against the peeling force of the first and second substrates may be lowered. Therefore, the volume ratio of the first solid 85 to the first adhesive resin 41 is desirably larger than the volume ratio of the second solid 86 to the second adhesive resin 42.
Since the getter material 89 is disposed in the buffer space 90, a small amount of moisture that has entered from the atmosphere side can be absorbed.

In the first ring seal 47, the volume of the first solid material 85 is larger than the volume of the first adhesive resin 41. In the first ring seal 47, the volume of the first solid material 85 is desirably 60% or more as compared with the volume of the first adhesive resin 41.
When the content of the first solid material 85 is increased without changing the amount of the first adhesive resin 41 and the amount of the first solid material 85 is increased more than the amount of the first adhesive resin 41, the first The proof strength against the pressing force of the ring seal 47 is increased, and the increased amount of the spacer 84 and filler 83 to the first ring seal 47 can be reduced from the second solid material 86, and the second ring at that time Since the content rate of the second solid material 86 of the seal 48 becomes low, the proof strength against the peeling force of the second ring seal 48 becomes high.
In general, a resin is decomposed when irradiated with ultraviolet rays for a long time. The first solid spacer here has the effect of shielding the ultraviolet rays, and the first ring seal 47 contains the amount of the first solid 85 more than the amount of the first adhesive resin 41, ie The first ring seal 47 contains more than 50% of the first solid material 85, and when the first ring seal 47 is viewed from the light emitting region 19 side, the spacers 84 and the filler 83 and the spacer 84 overlap each other. Therefore, the ultraviolet rays generated from the light emitting region 19 are shielded by the spacer 84 included in the first ring seal 47, do not reach the second adhesive resin 42, and peel off the second adhesive resin 42. It does not reduce the yield strength against force and maintains the gas permeability.

  Further, when the amount of the first adhesive resin 41 is reduced without changing the amount of the first solid material 85 and the amount of the first solid material 85 is increased more than the amount of the first adhesive resin 41, the first In the sealing region 18 on the one substrate 10, the width in which the first ring seal 47 and the second ring seal 48 are arranged is constant. Therefore, the amount of the first adhesive resin 41 is reduced and the first ring seal 47. The width of the second ring seal 48 can be increased toward the inner circumferential direction by increasing the amount of the second adhesive resin 42 as much as the width of the second ring is reduced in the outer circumferential direction. Since the width of the second ring seal 48 is increased, it is difficult for gas to permeate from the atmosphere side to the buffer space 90.

In both cases described above, in the second ring seal 48, the amount of the second solid material 86 is made smaller than the amount of the second adhesive resin 42.
In the above example, the first and second adhesive resins 41 and 42 contain both the spacer 84 and the filler 83, but the second adhesive resin 42 contains only the filler 83, or Only the spacer 84 may be included. The second adhesive resin 42 may not contain the filler 83 and the spacer 84.
Since the width W ₂ of the second ring seal is larger than the width W ₁ of the first ring seal, impurities including moisture in the atmosphere do not easily reach the buffer space 90.

The spacer 84 is spherical, and here is an inorganic material, specifically, SiO ₂ , and the diameters are substantially equal. The spacer 84 is in direct contact with the surface of the second substrate 20 and the surface of the first substrate 10.
The filler is spherical and is added to maintain the adhesive strength of the adhesive resin 41 and prevent cohesive failure.
Here, the getter material 89 is powdered barium and absorbs H ₂ O, H ₂ , O ₂ , CO, CO ₂ , N _{2 and the} like.
The adhesive resin 41 is a resin that adheres to glass.
A top view of the peripheral edge of the PDP in the present embodiment is shown in FIG.

<Manufacturing process>
The panel manufacturing flow of this embodiment will be described with reference to FIG. The apparatus configuration is shown in FIG.
Reference numeral 5 in FIG. 8 is an example of a PDP manufacturing apparatus used in the method for manufacturing the PDP 1 of the present invention.
The PDP manufacturing apparatus 5 includes a coating chamber 52, a film forming chamber 63, a transfer chamber 53, and a sealing chamber 54.
The coating chamber 52 is connected to the transfer chamber 53, and the film forming chamber 63 is connected to the transfer chamber 53 via the buffer chamber 64.
A rear substrate preparation chamber 51 is connected to the coating chamber 52, and a front substrate preparation chamber 61 is connected to the film formation chamber 63 via a heating chamber 62.
The transfer chamber 53 is connected to a sealing chamber 54, and an extraction chamber 55 is connected to the sealing chamber 54.
An evacuation system (not shown) is connected to each of the chambers 51 to 55 and 61 to 64. When the evacuation system is operated, the interior of each of the chambers 51 to 55 and 61 to 64 can be made into a vacuum atmosphere. It is configured.

Display electrodes 27 are formed on the front substrate (second substrate 20). For the display electrode 27, a transparent electrode such as ITO or SnO ₂ is formed by sputtering or the like so as not to prevent light emission, and then patterning is performed. In addition, since only the transparent electrode has a large electric resistance, a metal electrode for reducing the electric resistance is formed as an auxiliary electrode by a printing method or a sputtering method (formation of a bus electrode). After the display electrode 27 is formed, a dielectric layer 22 having a thickness of 20 to 40 μm is formed by a printing method or the like and baked for the purpose of protecting the electrode and forming wall charges.

After the chambers 51 to 55 and 61 to 64 are in a vacuum atmosphere, the front substrate preparation chamber 61 is blocked from the other chambers 51 to 55 and 62 to 64, and the second dielectric layer 22 is formed on the surface. The substrate 20 (FIG. 10) is carried into the front substrate preparation chamber 61.
After carrying in, the vacuum exhaust system is operated to make the inside of the front substrate preparation chamber 61 into a vacuum atmosphere.
After evacuation, the front substrate preparation chamber 61 is connected to the heating chamber 62, and the second substrate 20 is transferred to the heating chamber 62. The second substrate 20 is heated in the heating chamber 62, heated to about 150 ° C. to 350 ° C. and then transferred to the film forming chamber 63.
A film forming apparatus (not shown) is disposed in the film forming chamber 63, and this film forming apparatus is operated to further protect the dielectric layer 22 and increase secondary electron emission efficiency. An oxide film of alkaline earth metal such as SrO (here, the protective film 24) is formed to 700 nm to 1200 nm by an electron beam evaporation method. After the protective film 24 having a predetermined thickness is formed, the second substrate 20 is transferred to the transfer chamber 53 via the buffer chamber 64 that brings the second substrate 20 to a temperature substantially equal to that of the first substrate 10. Be transported.

  Next, the process of the back substrate (first substrate 10) will be described. First, the address electrode 15 made of silver, Cr / Cu / Cr or aluminum is formed, and the dielectric layer 14 is formed to protect the address electrode 15. Thereafter, partition walls (ribs) 13 for increasing the light emitting area 19 and the light emitting area of the phosphor 12 are formed by a sandblast method or the like. In the sandblasting method, a glass paste as a material for the partition walls (ribs) 13 is applied to the first substrate 10 on which the dielectric layer 14 is formed, dried, patterned, and then sprayed with an abrasive such as alumina or glass beads at a high pressure. This is a method of creating a predetermined partition (rib) shape. After the partition walls (ribs) 13 are formed, the phosphor 12 is applied by screen printing, dried, and then fired at several hundred degrees.

The first substrate 10 is carried into the back substrate preparation chamber 51 in a state where the back substrate preparation chamber 51 is blocked from the other chambers 52 to 55 and 61 to 64.
The evacuation system is operated to make the back substrate preparation chamber 51 in a vacuum atmosphere.
The fired first substrate 10 is transferred to the rear substrate preparation chamber 51 of the panel manufacturing apparatus 5 (FIG. 8), and degassing from the phosphor 12 is performed.
After the evacuation, the rear substrate preparation chamber is connected to the coating chamber 52, and then the first substrate 10 after baking is transferred to the coating chamber 52 for coating the sealing material.
A coating device 92 is arranged in the coating chamber 52. Here, the coating device 92 includes an XY stage 65 on which the first substrate 10 is installed, first and second adhesive dispensers 71 and 73, and a getter material dispenser 72 (FIG. 12).

The XY stage 65 is disposed at the bottom in the coating chamber 52. The first substrate 10 is disposed on the XY stage 65 with the surface on which the address electrodes 15 and the dielectric layer 14 are formed facing upward.
When the first to third storage tanks 75 to 77 are connected to the first to third dispensers 71 to 73, when the first to third dispensers 71 to 73 discharge, One adhesive member 87, a getter material 89, and a paste-like second adhesive member 88 are supplied.
First to third storage tanks 75 to 77 are arranged outside the coating chamber 52. The first and third storage tanks 75 and 77 store pasty first and second adhesive members 87 and 88, and the second storage tank 76 stores getter material 89. .

The first and second adhesive members 87 and 88 have first and second adhesive resins 41 and 42, respectively. Among the first and second adhesive resins 41 and 42, the first, Second solids 85 and 86 are dispersed respectively.
The effects of the first and second adhesive resins 41 and 42, the filler 83, the spacer 84, and the getter material 89 will be described later.
The first to third dispensers 71 to 73 are arranged in this order from the inner side near the light emitting region 19 on one side of the sealing region 18 on the surface of the first substrate 10.

As shown in FIG. 4, the outer peripheral portion of the surface of the first substrate 10 has an annular shape, and first and second ring seals 47 and 48 including first and second adhesive members 87 and 88 and a getter material 89. Are arranged in an annular region 67.
Each dispenser 71-73 is located on one side of the first substrate 10, and the first and second adhesive members 87 are maintained while maintaining the order from the light emitting region 19 on the annular region 67 from that position. , 88 are discharged, the getter material 89 is discharged, and the XY stage 65 on which the first substrate 10 is arranged so as to move linearly relative to the first substrate 10 moves linearly. The two adhesive members 87 and 88 are formed in a strip shape without interruption.

FIG. 13 is a sectional view of the first substrate 10 in which the first and second adhesive members 87 and 88 are applied and the getter material 89 is disposed between the first adhesive member 87 and the second adhesive member 88. It is.
When each of the dispensers 71 to 73 arrives on the corner portion of the annular region 67 on the surface of the first substrate 10 while discharging, the order from the light emitting region 19 is maintained, and the dispenser 71 to 73 moves over the corner portion of the annular region 67. Then, the XY stage 65 rotates 90 degrees so as to rotate and move relative to the XY stage 65 on the other side perpendicular to the side where the ejection is started.
Even if each dispenser 71-73 is relatively rotating, if the first and second adhesive members 87, 88 are discharged, the first and second adhesive members 87, 88 are strip-shaped without interruption. Formed.
At this time, the order from the light emitting area 19 of each dispenser 71-73 is maintained also on other sides, and each dispenser 71-73 moves relative to the XY stage 65 while discharging, Even on this side, the first and second adhesive members 87 and 88 are formed in a band shape.

When each of the dispensers 71 to 73 repeats the relative linear movement on the side of the surface of the first substrate 10 and the relative rotational movement of the corner portions, the dispensers 71 to 73 return to the positions where the ejection is started.
When the first and second adhesive members 87 and 88 are formed, the start point and the end point of the band made up of the first and second adhesive members 87 and 88 come into contact with each other, and the first and second adhesive members 87 and 88 are brought into contact with each other. A band consisting of surrounds the annular region 67 without interruption.
The getter material 89 is disposed between the ring-shaped first and second adhesive members 87 and 88.
Here, the width of the discharge hole of the first adhesive dispenser 71 is narrower than the width of the discharge hole of the second adhesive dispenser 73, and the first ring seal 47 formed on the first substrate 10. The width W ₁ is narrower than the width W _{2 of} the second ring seal 48.
The height of the getter material 89 is formed to be lower than the ring-shaped first and second adhesive members 87 and 88.

  In the above example, the first and second adhesive members 87 and 88 and the getter material 89 are applied to the surface of the first substrate 10, but may be applied to the surface of the second substrate 20. Moreover, although the coating device 92 moved the 1st board | substrate 10 with respect to each dispenser 71-73, you may move each dispenser 71-73 with respect to the 1st board | substrate 10, A ring-shaped sealing member composed of the first and second adhesive members 87 and 88 and the getter material 89 is formed and attached to the sealing region 18 on the surface of the first substrate 10 or the surface of the second substrate 20. May be attached.

Next, the panel forming process will be described.
The sealing device 70 has a sealing chamber 54, a gas introduction system 56 and an evacuation system 31 are connected to the sealing chamber 54, and a holding device 34 is provided in the ceiling portion inside the sealing chamber 54. (FIG. 11).
The holding device 34 is connected to a holding device power supply 33, and when the holding device power supply 33 is energized by the holding device power supply 33, the second substrate 20 is held here and the second substrate 20 is held inside the sealing chamber 54. The substrate 20 is configured to move.
The sealing device 70 has a heating device 39. The heating device 39 has a ring shape and is substantially the same as the size of the buffer space 90. The substrate stage 35 is smaller than the ring-shaped heating device 39 and is disposed in the ring of the heating device 39, and the surface of the substrate stage 35 and the surface of the heating device 39 are flush with each other.
A heating power source 40 is connected to the heating device 39, and the heating device 39 is configured to release heat when the heating power source 40 is energized.

An ultraviolet irradiation device 36 is provided above the substrate stage 35 in the sealing chamber 54. The ultraviolet irradiation device 36 has a lamp (not shown). The lamp is connected to a lamp power source 37, and is configured such that when the ultraviolet ray irradiation device 36 is energized by the lamp power source 37, ultraviolet rays are emitted from the lamp.
Here, the adhesive resins 41 and 42 are ultraviolet curable resins that are cured when irradiated with ultraviolet rays, for example, epoxy acrylate.
The vacuum exhaust system 31 is operated so that the buffer chamber 64 and the sealing chamber 54 are in a vacuum atmosphere, and the second substrate 20 on which the MgO film is formed while the vacuum atmosphere is maintained is transferred from the buffer chamber 64 to the transfer chamber 53. Then, the substrate 20 is conveyed to the sealing chamber 54 and held by the holding device 34 with the surface on which the protective film 24 is formed facing down.

Next, the first substrate 10 is sealed from the coating chamber 52, which has been made a vacuum atmosphere by a transfer device (not shown), through the transfer chamber 53, and the sealing chamber 54 is maintained in a vacuum atmosphere by the vacuum exhaust system 31. It is transported to the landing chamber 54, placed on the substrate stage 35 with the surface on which the ring-shaped first and second adhesive members 87, 88 are formed facing upward, and the buffer space 90 is placed on the ring-shaped heating device 39. It arrange | positions so that the 1st board | substrate 10 located directly below may come. At this time, the first substrate 10 positioned directly below the light emitting region 19 is not in contact with the heating device 39, and the first substrate 10 positioned directly below the buffer space 90 is in contact with the ring-shaped heating device 39. Yes.
The holding device 34 is operated to move the second substrate 20 relative to the first substrate 10 here. Ring-shaped first and second adhesive members 87 and 88 formed on the outer peripheral portion of the first substrate 10 and the surface of the second substrate 20 with the sustain electrode 26 and the scan electrode 25 orthogonal to the address electrode 15. Face the outer periphery of the. The second substrate 20 and the first substrate 10 are provided with alignment marks (not shown), and the alignment on the first and second substrates 10 and 20 is performed by a CCD camera installed on the atmosphere side of the vacuum chamber. The mark is read and the first and second substrates 10 and 20 are aligned. Thereafter, a discharge gas is introduced and pressure sealing is performed.

A gas introduction system 56 is connected to the sealing chamber 54, and discharge is performed to a predetermined pressure in the sealing chamber 54 by the gas introduction system 56 while the inside of the sealing chamber 54 is maintained in a vacuum atmosphere by the vacuum exhaust system 31. A gas is introduced to form a discharge atmosphere.
The holding device 34 is operated and the second substrate 20 is brought close to the first substrate 10 while maintaining the aligned state, and the first and second adhesive members 87 and 88 are moved to the second substrate. Stop in contact with 20 sealing regions.
The heating power source 40 is energized to raise the temperature of the heating device 39, the outer peripheral portion of the first substrate 10 in contact with the ring-shaped heating device 39 is heated, and the space directly above the light emitting region 19 is not heated. The buffer space 90 is heated by conduction. In a state where the second substrate 20 is not pressed against the first substrate 10, the buffer space 90 is not separated from other spaces, and the temperature difference between the temperature of the buffer space 90 and the space on the light emitting region 19 is different. When large, the gas in the heated buffer space 90 moves out of the buffer space 90 through a gap formed between the first and second adhesive members 87 and 88 and the second substrate 20 in contact therewith. The gas density in the buffer space 90 is smaller than the gas density in the space above the light emitting region 19.

  While the temperature difference between the temperature of the buffer space 90 and the space on the light emitting region 19 is large, the holding device 34 is operated to press the second substrate 20 against the first substrate 10, and the first and second adhesive members The first substrate 10 and the second substrate 20 are bonded by 87 and 88, and the lamp power source 37 is energized while being pressed to irradiate ultraviolet rays from the lamp of the ultraviolet irradiation device 36 toward the adhesive resins 41 and 42. Ultraviolet rays are irradiated until the first and second adhesive members 87 and 88 are cured. FIG. 14 is a cross-sectional view of the first substrate 10 disposed on the substrate stage 35 and the second substrate 20 pressed by the holding device 34.

When the ring-shaped first and second adhesive members 87 and 88 are cured, they become first and second ring seals 47 and 48, respectively.
The first and second ring seals 47 and 48 are bonded to the second substrate 20 and the outer periphery of the first substrate 10 without any gaps to separate the spaces, The buffer space 90 is separated by the first ring seal 47, and the atmosphere side space and the buffer space 90 are separated by the second ring seal 48.
When the temperature of the buffer space 90 is lowered, the gas density in the buffer space 90 is smaller than the gas density in the space on the light emitting region 19, so the pressure in the buffer space 90 is higher than the pressure in the space on the light emitting region 19. The gas is easy to permeate from the space above the light emitting region 19 to the buffer space 90, but the gas hardly permeates from the buffer space 90 to the space above the light emitting region 19.

In the above example, the ring-shaped heating device 39 is brought into contact with the first substrate 10 immediately below where the buffer space 90 is formed and the buffer space 90 is heated by heat conduction. However, infrared rays are irradiated toward the buffer space 90. Then, the light emitting region 19 may be irradiated with infrared rays, and a temperature difference between the light emitting region 19 and the buffer region 90 may be given.
Here, UV curable resin is used for the first and second adhesive members 87 and 88. However, when thermosetting resin is used, the temperature of the buffer space 90 is raised to a desired temperature by the ring-shaped heating device 39. Before the first and second adhesive members 87 and 88 are cured, the gas density in the buffer space 90 is made smaller than the gas density in the space above the light emitting region 19 and the first substrate 10 and the first adhesive member are heated. Sealing with the second substrate 20 is performed.

The particle diameter of the spacer 84 is the sum of the distance from the surface of the second substrate 20 to the surface of the protective film 24 and the distance from the surface of the first substrate 10 to the surface of the partition wall 13. When the surface and the surface of the first substrate 10 are bonded together via the sealing portion and the spacer 84 comes into contact with the surface of the second substrate 20 and the surface of the first substrate 10, the surface of the second substrate 20 and the surface of the first substrate 10 are The distance of the surface of the substrate 10 is the diameter of the spacer 84.
When the spacer 84 is floating in the adhesive resins 41 and 42, the spacer 84 moves in the adhesive resins 41 and 42 and comes into contact with the surface of the second substrate 20 and the surface of the first substrate 10. . The second substrate 20 and the first substrate 10 stop, and the distance between the surface of the second substrate 20 and the surface of the first substrate 10 is the diameter of the spacer 84. The spacer 84 is not crushed when pressed, and the first ring seal 47 and the second ring seal 48 can be separated by a desired distance.
When the adhesive resins 41 and 42 are overheated, impurities are generated, but when they are cured, they are heated uniformly from the inside, so that they are not overheated, and the amount of impurities generated is small.

The PDP is obtained through the above steps, and the sealed and sealed PDP is transported from the sealing chamber 54 to the extraction chamber 55 evacuated, and the atmosphere is introduced into the extraction chamber 55. Can be taken out.
In addition, since the film formation process has a faster tact time than the panel forming process, the apparatus configuration shown in FIG. The throughput can be doubled at a lower cost. Furthermore, according to the apparatus configuration capable of handling a plurality of resin sealing portions and alignment portions corresponding to different substrate sizes, it is possible to simultaneously produce 42 inch panels on the one hand and 50 inch panels on the other hand. Become.

<Example>
The width W ₁ of the first ring seal 47 was 2 mm and the thickness was 150 μm. The width of the second ring seal 48 was 4 mm, and the thickness was 150 μm. Further, a getter material 89 is installed between the first ring seal 47 and the second ring seal 48. The installation conditions of the first and second ring seals 47 and 48 are shown in Table 1, and the results of predicting the H ₂ O concentration in the discharge gas after 87600 hours (10 years) from the H ₂ O permeation amount under each condition are shown. It shows in FIG.5 and FIG.6.

The value of moisture permeability used was a typical value of UV curable resin (12 g / m ² · 24 Hr). (Specifically, the value of technical data of Nagase ChemteX Corporation UV RESIN T-470 / UR 7134 was converted. Test conditions were JIS Z 0208: 60 ° C./90% test piece thickness 0.1 mm). The examination result about the effect of a double ring seal is shown in FIG. Condition 1 in Table 1 uses the second ring seal 48 shown in FIG. 4 as the sealing material in the configuration shown in FIG. The second ring seal 48 has a width of 4 mm and a height of 150 μm. Condition 2 is a double ring seal obtained by adding a first ring seal 47 having a ring seal width of 2 mm to the second ring seal 48 having a ring seal width of 4 mm in Condition 1. Comparing the H ₂ O concentration in the discharge gas after 87600 hours of condition 1 and condition 2, condition 2 is about 1/200 of condition 1. The examination result about the effect of the spacer 84 and the filler 83 and the double ring seal is shown in FIG. As shown in Table 1, the condition 3 is that the amount of the spacer 84 and filler 83 contained in the first ring seal 47 is larger than that of the first adhesive resin 41, and the spacer 84 and filler 83 contained in the first ring seal 47. Is due to the double ring seal that is larger than the amount of the spacer 84 and filler 83 contained in the second ring seal 48 (the H ₂ O concentration is predicted except for the effect of the getter material 89 in the configuration of FIG. 3). did). Compared with condition 1, the H ₂ O concentration in the discharge gas after 87600 hours is about 1/8000. It shows that the effect of the present invention can be obtained without using the getter material 89.

  Table 2 shows the conditions for creating the PDP created by the method according to the present invention.

Further, FIG. 9 shows the result of the acceleration test of the discharge voltage. MgO was deposited to 800 nm, and 66.5 KPa of a discharge gas composed of Ne-4% Xe was introduced. (Ne-4% Xe indicates that the mixed gas contains 4% Xe when the total mixed gas of Ne and Xe is 100%.) An aging test of the PDP according to the present invention was performed. The discharge start voltage Vf and the discharge sustain voltage Vs were measured. An acceleration test for 1800 hours was performed in an atmosphere of 70 ° C. and 85% humidity, and it was confirmed that neither the discharge start voltage Vf nor the discharge sustain voltage Vs was changed.
The double ring seal disclosed in the present invention is an effective method in order to reduce the emission gas at the time of sealing from the ultraviolet curable resin, reduce the permeation of water from the outside, and stabilize the discharge.
Although the above-mentioned filler used one type with the same size, you may use 2 to 3 types from which a size differs.

  Manufacture of PDPs using MgO including atmospheric processes as a protective film in addition to the PDP manufacturing process using an integrated vacuum processing system. Further, it can be used for sealing methods such as FED (Field Emission Display), SED (Surface-Condition Electron-Emitter Display) and organic EL.

1 …… PDP
DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate 18 ... Sealing area | region 19 ... Light emission area 20 ... 2nd board | substrate 41 ... 1st adhesive resin
42 …… Second adhesive resin 47 …… First ring seal 48 …… Second ring seal 83 …… Filler
84 …… Spacer
87 …… First adhesive member 88 …… Second adhesive member 90 …… Buffer space

Claims (1)

A first substrate having a light emitting region in which a phosphor is disposed;
A second substrate disposed opposite the first substrate;
An inner first ring seal and an outer second ring seal disposed between the first and second substrates, each surrounding the light emitting region;
Wherein said second substrate and said first substrate first, thus adhering to the second ring seal, a plasma display panel manufacturing for producing the second plasma display panel inside the ring seal is cut off from the atmosphere of A method,
Before the first ring seal and the second ring seal are cured, the buffer space between the first ring seal and the second ring seal is heated, and the buffer space is cured. In a state where the temperature is higher than the space surrounded by the first ring seal, the first and second ring seals are cured, the first substrate and the second substrate are bonded, and the light emitting region is And the buffer space,
A method for manufacturing a plasma display panel that is airtight.

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