KR100505891B1 - Glass holder and their adhesive method and forming method of hotmelt - Google Patents

Abstract

(Problem) Provides a glass holder, a bonding method, and a molding method of a hot melt that can realize a highly reliable adhesive portion without requiring a primer treatment on an adhesive surface such as glass, or a manufacturing residence period for curing an adhesive. .

(Resolution means) The 2nd holder piece 12 which pairs with the 1st holder piece 11 and the 1st holder piece 11, opposes the 1st holder piece 11 with the glass 30 in between. And an attachment structure (3, 3a, 8, 9) included in at least one side of the first and second holder pieces (11, 12) for attaching the first and second holder pieces (11, 12) to the other member. And 9a) and hot melt resin 7 attached to at least one side of the first and second holder pieces 11 and 12.

Description

GLASS HOLDER AND THEIR ADHESIVE METHOD AND FORMING METHOD OF HOTMELT}

The present invention relates to a glass holder for attaching a window glass to a window regulator of an automobile, an adhesive method for adhering glass and a component, and a method for forming a hot melt resin, which is an adhesive.

FIG. 11 is a perspective view illustrating a conventional glass holder 110 supporting a window glass 130 of a vehicle and a roller guide 112 constituting a lifting mechanism for lifting and lowering it. The window glass 130 is fixed to the glass holder 110, the glass holder 110 is attached to the roller guide 112 constituting the lifting mechanism using a bolt 140 or the like.

12 is a cross-sectional view taken along the line II-XIII of FIG. 11. The window glass 130 is bonded to the U-shaped portion 111 of the glass holder 110 by an adhesive 107 such as a urethane adhesive. An insert nut 109 is attached to the attachment portion 103 of the glass holder 110 as an attachment structure for attachment to the roller guide 112. Therefore, as shown in FIG. 11, it is possible to attach to the roller guide 112 using only the bolt 140.

According to the above structure, a urethane adhesive or the like is filled between the window glass and the glass holder to bond the window glass to the glass holder, and the glass holder can be attached to the lifting mechanism.

However, in the case of using the conventional glass holder described above, in order to strengthen the adhesion between the window glass and the glass holder, it is necessary to apply a primer treatment to the bonding surface of the window glass and the glass holder. Moreover, since about 24 hours are required until the urethane resin as an adhesive agent fully hardens, granulation operation could not be advanced during that time. Therefore, productivity has been reduced by the product staying in the manufacturing state.

In addition, the U-shaped portion of the glass holder needs to be fitted to the window glass properly so that the glass holder fitted to the window glass does not fall out due to its own weight until the adhesive is cured. In order to do this, it was necessary to manage the dimensional accuracy of the glass holder within a predetermined range, and to hold the glass holder for each thickness of the window glass.

In addition, in order to secure the predetermined adhesive strength, it was necessary to manage the storage method and the expiration date of the adhesive strength primer agent and the urethane adhesive. In addition, there has been a problem that productivity is lowered by requiring a large number of steps for forming and processing the glass holder in order to insert molding the metal nut into the glass holder.

In order to solve such a problem, the bonding method using the heat-expandable resin containing the heating element which generate | occur | produces by high frequency induction heating was proposed (Japanese Patent Laid-Open No. 6-206442). According to this method, the high-frequency induction heating is performed while the heat-expandable resin is disposed between the glass holder and the window glass. When a heat generating element such as a conductor generates heat by the high frequency induction heating, the heat-expandable resin is foamed and adhered by filling in the gap between the glass holder and the window glass. Since such an adhesive is heat-cured, it is not necessary to leave a manufactured product by hardening in a short time.

However, the heat-expandable resin has a problem in durability because the adhesive strength is not so large. That is, after the adhesion treatment, since the voids are arranged more than the adhesive composed entirely of the adhesive, there is a problem that the adhesive strength is lowered.

In order to solve the above problems, a wide range of adhesive resins have been developed, and several adhesive resins have been disclosed in which the adhesion time is short and the adhesion strength has been improved (for example, Japanese Patent Laid-Open No. 2002-188068, Korean Patent Application Laid-Open No. 2002-97445, Japanese Patent Laid-Open No. 2002-3805, and Japanese Patent Laid-Open No. 2001-39155.

However, the above-mentioned adhesive resin is still not enough in terms of reliability of the adhesive portion, and it has not yet been possible to eliminate the residence time after the pretreatment for the window glass or the adhesive treatment.

The present invention does not require a primer treatment for glass or a manufacturing residence period for curing an adhesive, and can realize a highly reliable adhesive portion, a glass holder for bonding glass and components, and an adhesive method for hot melt resin. It is an object to provide a molding method.

The glass holder of the present invention is a glass holder for fixing and supporting glass. The glass holder is paired with the first holder piece, the first holder piece, the second holder piece facing the first holder piece with the glass therebetween, and included on at least one side of the first and second holder pieces. And an attachment structure for attaching the first and second holder pieces to another member. In addition, the glass holder has a hot melt resin attached to at least one side of the first and second holder pieces in order to adhere the glass, the hot melt resin has a volume resistivity of 10 ^-2 to a resin having a melting point of 80 ℃ to 200 ℃ 1 to 30% by volume of a conductive material having a Ω · cm or less, and a dielectric loss tangent of at least 0.03 at a frequency of 40 MHz (claim 1).

According to the above configuration, the glass is sandwiched between a pair of holder pieces, and heated by heating means to melt the hot melt resin on both sides of the holder pieces. It can adhere by applying pressure. Since the glass holder is separated into two holder pieces, the thickness of the hot melt resin can be arbitrarily formed. Therefore, even if the thickness of the glass is changed, the same glass holder can be used to hold the glass.

Hot melt resin may be arrange | positioned only to the holder piece of any one side of a pair of holder piece, and may be arrange | positioned at both holder pieces. The first or second holder piece faces the glass in the following form. (a) The holder piece in which hot melt resin is not arrange | positioned functions as a member which touches one side surface of glass and restrains glass. Moreover, (b) the holder piece in which hot melt resin is arrange | positioned functions as a member which fixes a glass across hot melt resin. In order to fix glass firmly, it is preferable to arrange hot melt resin in both holder pieces. That is, it is preferable that both holder pieces have the function of said (b).

In the case of using a resin of a type of high frequency dielectric heating as the hot melt resin, only the hot melt resin is heated without heating the whole, so that it does not affect the glass or the like by heating. The glass holder is preferably made of a resin made of engineering plastic such as polybutylene terephthalate (PBT) or acryl butadiene styrene (ABS). The hot melt resin can be easily attached to the glass holder made of engineering plastic by two-color molding or the like to be integrated. Therefore, since the hot-melt resin is attached to the holder piece in a solid state, it is not necessary to consider the storage method and the expiration date of the adhesive.

In the adhesive treatment, the hot melt resin having the above-described configuration, when cooled and solidified after heating, can obtain the original adhesive strength. Therefore, the period of stay in the state in the middle of manufacturing can be eliminated and productivity can be improved. In addition, it is not necessary to pay attention to the dimensional accuracy of the glass holder so that the glass holder does not fall out due to its own weight until the adhesive (hot melt resin) is cured. In addition, there is no need for primer treatment on the glass. However, in order to obtain greater adhesive strength, the primer may be treated.

In the glass holder of the present invention, a convex portion having a predetermined height can be formed in the adhesive region of the holder piece to which the hot melt resin is attached (claim 2).

According to the said structure, the clearance of the height of a convex part arises between glass and a holder piece. When pressure is applied to both sides of the glass holder, the molten hot melt resin can be arranged in the gap without adjusting the stroke (indentation length by the pressure part) accompanying the pressure part. Thus, by taking the stroke too large, the glass and the holder piece can be brought into close contact with each other to eliminate the risk of eliminating all of the hot melt resin. The thickness of arbitrary adhesive agents can be formed by adjusting the thickness of hot melt resin as an adhesive agent by the height of the said convex part. By forming the said convex part in three places which are not located on the same straight line, the thickness of the hot-melt resin after the said adhesion can be obtained stably. As a result, the required adhesive strength can be easily ensured, and productivity can be improved by improving the production yield.

In addition, it is preferable that the hot-melt resin is provided with a concave portion that receives the convex portion at a corresponding position, and is attached so that the hot-melt resin is in contact with the entire adhesive region of the holder piece. For example, when hot-melt resin is affixed to a holder piece by two-color shaping | molding, the contact of a hot-melt resin and a holder piece is realized automatically between the said convex part and a recessed part, and also in the part of another area | region. This type of attachment is preferable because it increases the adhesion strength of the hot-melt resin to the adhesive region of the holder piece, and since two-color molding can be performed without difficulty. In addition, since the adhesive region of the holder piece is covered with the hot melt resin, it is easy to maintain a desirable surface state until the time point of the adhesive treatment of the hot melt resin. As a result, it becomes easy to ensure the improvement of the bonding strength of glass and a holder piece further.

In the glass holder of this invention, an attachment structure can be provided with the nut mounting recessed part which mounts a nut around the through hole of either side of the said 1st and 2nd holder piece (claim 3).

The nut mounting recess can easily be fixed by mounting a metal nut or the like. By screwing the bolt onto the nut, it becomes possible to attach the glass holder to the roller guide as in the prior art. Therefore, according to the above configuration, the insert molding step of integrating the nut into the glass holder can be omitted, and manufacturing cost can be reduced.

In addition, the hot-melt resin may be temporarily fixed to the holder piece or the connecting part by being geometrically engaged to the holder piece or the connecting part.

By temporarily fixing the hot melt resin as the adhesive before use thereof, it can be handled integrally with resin parts such as glass holders. Moreover, in the temporary fixing structure by undercut or protrusion, the said uneven | corrugated part is filled with hot melt resin after sticking. Therefore, the adhesion area can be increased by the uneven portion, and the adhesion strength can be increased.

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The bonding method of this invention is a method of bonding glass using a pair of holder pieces. At least one side of the pair of holder pieces contains 1 to 30% by volume of a conductive material having a volume resistivity of 10 ⁻² Ω · cm or less in a polyolefin resin having a melting point of 80 ° C. to 200 ° C., and a dielectric constant at a frequency of 40 MHz. A step of attaching a hot melt resin having a tangent of 0.03 or more, and applying pressure so that the glass is sandwiched between the pair of holder pieces with the hot melt resin interposed therebetween, heating the region containing the hot melt resin sandwiched with the glass. It is equipped with the process of doing.

By the above bonding method, it is possible to realize glass mounting having a large adhesive strength in a short time. According to this bonding method, it is not necessary to hold many glass holders corresponding to the thickness of the glass. In addition, there is no need to pay attention to the expiration date or the storage method of the adhesive. In addition, since the electric power can be turned on only at the required place, energy consumption can be saved. Moreover, it does not need a heating furnace etc. and has the advantage that it can implement in a small work space. In addition, it is easy to maintain a good working environment.

In the step of heating the region containing the hot melt resin in the bonding method, at least one of dielectric heating, rotary friction heating, vibration friction heating, ultrasonic heating, laser light heating, infrared heating, hot plate heating and hot air heating. May be heated.

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The molding method of the hot-melt resin of the present invention comprises 1 to 30% by volume of a conductive material having a volume resistivity of 10 ⁻² Ω · cm or less in a polyolefin resin having a melting point of 80 ° C. to 200 ° C., and a dielectric constant at a frequency of 40 MHz. It is a method of injection molding a hot melt resin having a tangent of 0.03 or more. The molding method includes a step of bringing a mold used for injection molding to 70 ° C. or lower, and a step of injecting the hot melt resin in a molten state into a mold held at 70 ° C. or lower, and cooling the molded part.

By the said molding method, hot melt resin can be shape | molded in arbitrary shape. Therefore, for example, insert molding or two-color molding can be performed on one side of the to-be-adhered body, such as the holder piece of the glass holder, and the handling property is improved. Moreover, since it can shape | mold in arbitrary shapes, it becomes possible to increase the adhesion area in the surface of a to-be-adhered body by forming a groove shape etc. In this case, for temporary attachment to the adherend, mechanical temporary fixation by, for example, an undercut, a locking projection, or the like becomes possible.

Embodiment of the Invention

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

(1) Structure of Glass Holder

1: is a perspective view which shows the glass holder 10 in embodiment of this invention, (a) the 1st holder piece 11 which comprises the glass holder 10, (b) the glass holder 10. As shown in FIG. The 2nd holder piece 12 which comprises) is shown. In addition, (c) has shown the nut 9 inserted into the 1st holder piece 11.

Resin 7 for dielectric heat bonding, which is a hot melt resin, described later, is attached to the adhesive wall portion 2 facing the glass 30 in the first and second holder pieces 11 and 12. Moreover, three convex parts 2a which protrude toward the glass 30 side are formed in three discretely on the adhesive wall part 2 of the 1st and 2nd holder pieces 11 and 12. As shown in FIG.

The resin 7 for dielectric heating bonding is attached to the adhesive wall part 2 of the 1st and 2nd holder pieces 11 and 12 by 2-color shaping | molding so that the said convex part 2a and the remaining wall surface may contact. . In the dielectric heat-adhesive resin 7, a recess is formed at a position corresponding to the convex portion 2a, and the convex portion 2a is received. Such recesses are automatically formed during two-color molding.

The glass holder part 4 which contacts the end surface of the glass 30 and receives the load of the glass 30 directly in the 1st holder piece 11 is formed. This glass receiving part 4 may be formed only in the 1st holder piece 11, and may be formed in both the 1st and 2nd holder pieces 11.12. Moreover, the engagement convex part 5a is attached to the 1st holder piece 11, and the said engagement convex is attached to the 2nd holder piece 12 so that the 1st and 2nd holder pieces 11 and 12 may engage with each other. The convex part accommodating part 5b which the part 5a engages is formed.

Moreover, the metal nut 9 which provided the female screw 9a is inserted in the nut mounting recessed part 8 of the attachment part 3 in the 1st holder piece 11. The female screw 9a is disposed so as to lie on the same axis as the through hole 3a formed in the attachment portion 3.

2 is a cross-sectional view of the glass 30 mounted on the glass holder 10. Adhesion wall portions of the first and second holder pieces 11 and 12 by the resin 7 for dielectric heating adhesion having a thickness equal to the height of the convex portions 2a of the first and second holder pieces 11 and 12 ( 2) and glass 30 are adhere | attached. The hot melted and solidified resin 7 for dielectric heating bonding strongly adheres the first and second holder pieces 11 and 12 to the glass 30. When attaching to the roller guide 14 of the elevating device 13, the bolt is inserted from the second holder piece 12 side and screwed into the female screw 9a of the nut 9 attached to the first holder piece 11. Combine.

FIG. 3: is a block diagram which shows the state which attached the glass 30 for side windows to the elevating mechanism 13. As shown in FIG. The glass holder 10 holding the glass 30 is attached to a roller guide 14 constituting a part of the elevating device 13. By using the glass holder 10, it is possible to attach the glass 30 to the elevating device 13 firmly and productively.

(2) Structure of connecting member

It is a figure which shows the coupling component in embodiment of this invention. In embodiment shown in FIG. 4, the room miller base member 21 which is a connection part is equipped with the hot melt resin 7 which functions as an adhesive agent. The hot melt resin 7 will be described in detail in "(3) Hot Melt Resin" described later.

The room miller base member 21 is provided with a coupler 22, a flexible arm 23, and an angle adjusting member 24, which are connecting means for connecting the room miller 25 to the room miller base member 21. . It is preferable to use engineering plastics, such as PBT and ABS mentioned above as a material which forms the said connection component.

By using the connection component provided with a hot-melt resin as mentioned above, the primer treatment with respect to the windshield 20 becomes unnecessary, and since the room mirror 25 can be attached in a short time, productivity can be improved. In addition, since the storage of the hot-melt resin, which is an adhesive, may be handled in the same manner as the resin, there is no need to limit the use time or the like, and to manage the time limit for satisfying this.

5 and 6 are diagrams showing the configuration of the door mirror in the embodiment of the present invention. In FIG. 5, (a) shows the door miller case 31, (b) shows the miller holder 32, and (c) shows the miller 33. In FIG.

In the embodiment shown in FIG. 5 and FIG. 6, the back surface 33b of the mirror 33 which is glass in the adhesion area | region 32a by the hot-melt resin 7 which the mirror holder 32 which is a connection part functions as an adhesive agent and It is glued. The miller surface exposed to the outside is the surface 33a of the miller. In addition, the mirror holder 32 is connected to the door mirror case 31 by the screw 35 which is a connection means. The screw 35 as the connecting means is attached to the mirror holder 32 as the connecting part. As for the connecting parts bonded to the miller by the hot melt resin, engineering plastics such as PBT and ABS can be used.

As described above, by using the connecting part with the hot melt resin, the primer processing for the glass miller is unnecessary as in the room miller described above, and the door miller can be attached in a short time, thereby improving productivity. In addition, since the storage of the hot-melt resin, which is an adhesive, may be handled in the same manner as the resin, there is no need to limit the use time or the like, and to manage the time limit for satisfying this.

FIG. 7: is a figure which shows the structure which affixes the lining 58 to the ceiling glass 51. FIG. The connecting part 52 is bonded to the ceiling glass 51, and the lining 58 is screwed by screwing the male screw 55 disposed on the lining 58 to the female screw 53, which is a connecting means of the connecting part 52. This is attached to the ceiling glass 51. In addition, the engaging portion 59 attached to the lining 58 is engaged with the engaging portion 61 attached to the ceiling glass 51.

FIG. 8A is a cross-sectional view illustrating the connection part 52. The connection part 52 is adhere | attached to the ceiling glass 51 by the hot melt resin 7 which functions as an adhesive agent. In addition, the female part 53 is formed in the connecting part 52 as a connecting means for connecting the lining 58. FIG. 8B shows a male screw 55 having a lining 58 connected to the connecting part 52 and a male screw portion 55a disposed in the recess 57 formed in the lining 58. have. Another component or the like may be inserted between the male screw 55 and the recess 57 of the lining 58. As for the connecting part bonded to the ceiling glass by the hot melt resin, engineering plastics such as PBT and ABS can be used as described above.

By using the connection parts provided with a hot-melt resin as mentioned above, since the primer treatment with respect to a ceiling glass becomes unnecessary, a lining can be attached in a short time, productivity can be improved. In addition, since the storage of the hot-melt resin, which is an adhesive, may be handled in the same manner as the resin, there is no need to limit the use time or the like, and to manage the time limit for satisfying this.

(3) hot melt resin

In the present embodiment, a resin for dielectric heat bonding is used as the hot melt resin. However, in the present invention, any resin can be used as long as it is a resin that is in a hardened state at the time of being melted by heating and then cooled at room temperature. However, the resin for dielectric heat bonding is very suitable for use in glass holders because of its ease of heating and good workability.

The resin for dielectric heat bonding used in the present invention contains 1 to 30% by volume of a conductive material having a volume resistivity of 10 ⁻² Ω · cm or less in a polyolefin resin having a melting point of 80 ° C. to 200 ° C., at a frequency of 40 MHz. The dielectric tangent is 0.03 or more, and is a resin composition for high frequency bonding comprising a resin as a main component. Moreover, it is preferable that it is a resin composition for high frequency adhesions whose dielectric loss tangent is 0.05 or more. The volume resistivity of the conductive material is 10 ⁻⁴ Ω · cm or less, and more preferably 5% by volume or more of the resin composition for high frequency bonding.

Examples of the conductive material used for the resin for dielectric heating bonding include iron, copper, silver, carbon fiber, carbon black, etc. having a volume resistivity of 10 ⁻² Ω · cm or less. Among these, iron-based conductors and carbon fibers are preferable from the viewpoint of the influence on the resin and economical efficiency. As volume resistivity, 10 ^-4 ohm * cm or less is preferable, and so-called iron, (alpha) iron, (beta) iron, (gamma) iron, carbon steel, etc. are not restrict | limited especially. As content, 1-30 volume% is needed, Preferably 5-25 volume% is required. In particular, at 7% by volume or more, the effect of heating the resin for dielectric heating adhesive by dielectric heating is significantly increased. If the conductive material is 1% by volume or less, it is not preferable because the heat generation amount is insufficient and a long time is required to rise to the temperature at which it can be bonded. Moreover, since adhesive force falls at 30 volume% or more, it is unpreferable. The shape may be powder, needle, pull or net, and the shape may be selected according to the shape of the bonding partner or the like. The powder form is preferable from a viewpoint which can respond to any shape. In the case of powder form, needle shape, and impression, it is often used to beat. Moreover, when it is a network, it is used by lamination | stacking and insert molding. In addition, in the case of winning and using, the heat generating element preferably has a size of 60 mesh passes. By lowering the volume resistivity by containing more than 1% by volume, in particular 5% by volume, of the conductive material, the reason is still unknown, but the dielectric power factor becomes large when the high frequency voltage is applied. You lose. When applying a high frequency voltage, a large dielectric loss coefficient causes a high heat generation rate, thereby increasing the temperature increase rate, and shortening the hot melt adhesive in a short time can realize process shortening.

Induction heating generates an eddy current or the like in a conductor to be heated by electromagnetic induction and generates heat by resistance. In contrast, dielectric heating uses internal frictional heat generated by polarization by applying a voltage to a nonconductor. Internal friction is measured as a dielectric loss tangent. Since the resistivity is very small and the dielectric tangent is very small at 0.0001 or less, it is not known until the dielectric tangent is mixed with a resin having a dielectric tangent of 0.01 to 0.03 (for example, a polyolefin resin) so that the dielectric tangent is at least 0.03.

The resin having a melting point of 80 ° C. to 200 ° C., for example, a polyolefin resin, which is used for the above dielectric heating adhesive resin, is particularly preferably composed mainly of these copolymers from the viewpoint of adhesiveness. In view of the adhesive strength at high temperature, the melting point is required to be 80 ° C or higher, preferably 90 ° C or higher, and it is not preferable because the melting point is 180 ° C or higher, particularly 200 ° C or higher, because it takes time until the adhesive melts. When adhering to glass, in order to improve the adhesiveness, it is preferable to contain a coupling agent having a silanol group and a reactive functional group introduced by the terminal or modification of the resin. γ aminopropyl triethoxy silane, β (3,4 epoxycyclohexyl) ethyl trimethoxy silane, γ glycidoxy propyl trimethoxy silane, γ methacryloxypropyl trimethoxy silane, N.β (aminoethyl) (gamma) aminopropyl trimethoxysilane is mentioned as an example.

As polyolefin resin, what consists of 1 or more types chosen from resin of copolymerization polypropylene system, copolymerization polyethylene system, ethylene and a propylene copolymer, ethylene propylene diene system, and ethylene- alpha olefin system is preferable. Moreover, in order to improve adhesiveness, it is preferable that 3-50 mol% of vinyl acetate, methyl methacrylate, ethylene acrylate, butyl acrylate, methacrylic acid, acrylic acid, methacrylate, etc. are copolymerized as a monomer component. Moreover, it is especially preferable that the monomer containing a carboxylic anhydride group, an epoxy group, a hydroxyl group, and an isocyanate group is copolymerized or graft-polymerized. Copolymerization of unsaturated carboxylic acid monomers and glycidyl methacrylates and graft modification of maleic anhydride are preferred. The introduction of this functional group improves the stabilization of the silanol compound and the adhesion of the reinforced thermoplastic resin.

The to-be-adhered body in which the said resin for dielectric heating adhesion is used is a material which comprises the main body of a glass holder or a connection member, for example, resin, especially an engineering plastic and glass. The material constituting the main body of the glass holder or the connecting member may be any of ceramics, metal and the like, in addition to the above resins, and is not particularly limited. As resin, it can be a to-be-adhered body also in both a thermosetting resin and a thermoplastic resin. In the case of using the above dielectric heating adhesive resin, since only the dielectric heating adhesive resin is selectively heated, a thermoplastic resin having a melting point of 200 ° C. or lower may be used as the adherend. It is preferable to introduce a functional group into the polyolefin resin by the adhesive to increase the adhesive strength.

In the resin for dielectric heat bonding, the conductive material is melt kneaded in a resin having a melting point of 80 ° C. to 200 ° C., for example, a polyolefin-based resin in advance by an extruder, a kneader or a roller, or after the resin is molded into a sheet to be laminated or It is provided by sandwich molding or injection molding by inserting a reticulated heating element into a mold. There is no particular restriction on the type of extruder, kneader or roller used, or the kneading conditions.

Moreover, you may add a commercial additive, a hydrolysis agent, and a pigment to resin for dielectric heat bonding. As a heat stabilizer, a hindered phenol type, a thioether type, a phosphite type, etc., and these combination are mentioned. Examples of the weathering agent include carbon black, benzophenone, triazole type, and hindered amine type. Moreover, carbodiimide, bisoxazoline, an epoxy, an isocyanate compound is mentioned as a hydrolysis agent. Moreover, as a pigment, the commercial heat resistant pigment of polyolefin resin is used.

(4) Bonding method

Next, the procedure to adhere | attach glass is demonstrated.

First, the engagement convex part 5a of the 1st holder piece 11 and the convex part accommodating part 5b of the 2nd holder piece 12 are engaged. Next, the glass 30 is arrange | positioned so that it may fit between both holder pieces 11 and 12. At this time, the nut 9 may or may not be inserted into the nut mounting recess 8. In the state where the glass 30 is sandwiched between the holder pieces 11 and 12, the resin 7 for dielectric heating adhesion is heated by high frequency dielectric heating. At this time, it is laminated as "1st holder piece / resin for dielectric heating adhesion / glass / resin for dielectric heating adhesion / 2nd holder piece".

In the high frequency dielectric heating, the high frequency voltage is applied to the upper electrode and the lower electrode from the high frequency oscillator while the first and second holder pieces 11 and 12 are pressed in the direction close to the glass 30 to generate dielectric heat. As time passes, the temperature of the dielectric-heat-adhesive resin 7 rises and reaches and exceeds the melting point, thereby flowing and adhering. The dielectric heat-adhesive resin 7 is easily melted or pressed by the pressing force because it is in a molten state or in a state close thereto, and is externally excluded as the gap is narrowed. However, since the convex part 2a is arrange | positioned at both holder pieces 11 and 12, when the front-end | tip of the convex part 2a contacts glass 30, both holder pieces 11 and 12 and glass will be more than that. (30) does not come close. Therefore, the resin 7 for dielectric heat adhesion corresponding to the height of the convex part 2a is arrange | positioned between the holder pieces 11 and 12 and the glass 30, and can contribute to adhesion | attachment.

Therefore, it is preferable to arrange | position so that at least 3 convex part 2a may not be formed in a straight line. However, it is not indispensable to have three or more convex parts 2a, and it is only necessary to be able to maintain the space | interval between both holder pieces 11 and 12 and the glass 30 without difficulty. For example, one convex part may be sufficient as long as it has a flat part which has predetermined area or more.

Cut off the high frequency voltage in the bonded state and cool by air cooling or air. The resin for dielectric heating bonding of the present invention is bonded above the melting point, and the bonded assembly is used below the melting point of the resin for dielectric heating bonding.

When a high frequency voltage is applied to the dielectric heat-adhesive resin, only the dielectric heat-adhesive resin is heated by high-frequency dielectric heating, so that the entire adherend does not need to be treated in the heating furnace, and thus is particularly effective for large adherends. Do. Moreover, since only the resin for dielectric heating low adhesion can be selectively heated, it is also effective for assembling when a part of the to-be-adhered body contains a low heat resistance part.

Although only the high frequency dielectric heating method has been described as the heating method, the present invention is not limited to the high frequency dielectric heating method. For example, induction heating, rotational friction heating, vibration friction heating, ultrasonic heating, laser light heating, and infrared heating ( Heating by hot wire heating), hot plate heating and hot air heating

(5) Forming Hot Melt Resin

The conventional hot melt resin was formed into a sheet shape by discharging the hot melt resin in a molten state to a belt conveyor made of stainless steel by an extruder, passing it through a water bath and cooling it. That is, the shape of the conventional hot melt resin was limited to the sheet shape. Since the hot-melt resin in the present invention has a melting point of 80 ° C to 200 ° C, it does not adhere to the mold when the molten hot melt resin is extruded while the mold temperature is heated to 70 ° C or lower. Therefore, it is not necessary to perform anti-sticking treatment on the inner surface of the mold, and the hot melt resin of arbitrary shape can be formed.

As a result, for example, as shown in Fig. 9, temporary fixing to the adhesive wall portion 2 of the hot melt resin 7 by undercutting or temporary fixing to the connecting parts 21, 32 and 52 becomes possible. In addition, as shown in Fig. 10, temporary fixing to the adhesive wall portion 2 of the hot melt resin 7 by protrusions or temporary fixing to the connecting parts 21, 32 and 52 can be made.

By temporarily fixing the hot melt resin as an adhesive before use thereof, it can be handled integrally with resin parts such as glass holders. As shown in Figs. 9 and 10, in the temporary fixing structure by undercut or protrusion, after the adhesion, the uneven portion is filled with hot melt resin. Therefore, the adhesion area can be increased by the uneven portion, and the adhesion strength can be increased.

(Example)

Subsequently, the adhesive strength will be described in detail using Examples.

(a) Preparation of Adhesive Pellets: As shown in Table 1, a polyolefin-based hot melt adhesive having a dielectric loss tangent of 0.027 and a conductive powder were premixed. About melting | fusing point of resin, PO-1 is 105 degreeC, PO-2 is 120 degreeC, and all are in the range of 80 degreeC-200 degreeC. The conductive material is contained in the range of 1 to 30% by volume. Thereafter, the preliminary mixture was supplied to a hopper of a twin-screw compressor PCM30 ° (manufactured by CHIP STEEL CO., LTD.) Whose temperature was adjusted from 170 to 180 ° C to 180 ° C from the hopper side, and the screw was rotated. Melt mixing at several 60 rpm. Thereafter, the obtained strands were cooled in a water bath and then cut to obtain pellets of a hot melt adhesive containing a conductive material.

(b) Test piece molding: The adhesive pellet was put into the injection molding machine in which the barrel was temperature-controlled from the hopper side to 180 ° C-200 ° C-200 ° C. And it injected by the test piece mold temperature-controlled at 40 degreeC, and obtained the adhesive plate of 100x100x1mm, and 100x100x3mm. This adhesive plate is a hot melt resin before being attached to both holder pieces 11 and 12 shown in FIG.

Also, pellets of 30% by weight glass fiber reinforced modified polybutylene terephthalate (EMC430 manufactured by Dongyang Spinning Co., Ltd.) dried at 140 ° C. for 3 hours were heated at 250 ° C. to 260 ° C. to 260 ° C. from the hopper side. It was put in a hopper of the molding machine to form a type 1 tensile test piece described in ASTMD 638.

(c) Adhesive strength: The tensile test piece obtained in (b) was cut at the center in the longitudinal direction. This corresponds to the holder piece before a hot melt resin adheres. The adhesive piece cut | disconnected at 12.7x25.4x1mm was superimposed on this linear part 12.7x25.4mm by the 100x100x1mm adhesive plate obtained by (b). This wrap member, ie, the holder piece equivalent, was set in a straight line on both sides of a glass plate of 33 × 100 × 3 mm. This was heated for 1 minute with a high frequency dielectric heating apparatus (made by Pearl Industries, Ltd.) in the state which was pressurized by 2 kgf with the 20 mø air cylinder, and it cooled by air for 1 minute, and used as the test piece for adhesive strength evaluation. This state corresponds to a state where the glass is sandwiched between the two holder pieces. However, in the glass holder of FIGS. 1 and 2, the gripping portion is located on the same side with respect to the bonding portion, but here it is positioned so as to sandwich the bonding portion for the tensile shear test.

This evaluation test piece was left in a laboratory controlled at 23 ° C. and 50% RH (Relative Humidity) for at least 5 hours. A test piece made of EMC 430 bonded to both ends of a glass plate was set on a chuck of a universal testing machine type UTMI (Orientic Co., Ltd.) equipped with a thermostat controlled at 50 ° C, and a deformation rate of 5 mm / min. The bonding strength at 50 ° C. was measured by tensile shear.

(d) Dielectric properties: 8 x 8 mm test pieces cut out from an adhesive plate having a thickness of 3 mm obtained in (b) between conductor terminals having a terminal area (Ds) of 5 cm2 connected to a high frequency power supply circuit (manufactured by Pearl Industries, Ltd.). Was set. Given the high frequency charge Q at a frequency of 40 MHz, the capacitance Cs and the dielectric tangent tan δ were measured from the voltage difference V between the terminals. The dielectric constant (ε _o ) was determined from the following formula (1) with the dielectric constant epsilon _o in the vacuum being 8.85 × 10 ⁻¹⁴ F / cm.

ε and tanδ = Cs × Ds / (ε o and S) ... … … (One)

Inventive Examples 1-12: (The dielectric loss tangent or composition of the adhesive is within the above recommended range.)

The high frequency adhesive plate was shape | molded after compounding the premix of the compounding ratio shown in Table 1 as mentioned above.

Inventive Example No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8 No.10 No.11 No.12 Compounding (volume%) PO-1 97.5 95 92 92 92 92 - 97.5 95 92 97.5 PO-2 - - - - - - 92 - - - - Fe100 (Conductive Material) 2.5 5 8 - - - 8 2.5 5 8 2.5 Fe200 (Conductive Material) - - - 8 - - - - - - - Cu100 (Conductive Material) - - - - 8 - - - - - - CF (Conductive Material) - - - - - 8 - - - - - Oscillation time (minutes) One One One One One One One 5 5 5 20 Genetic Tangent 0.032 0.055 0.24 0.26 0.22 0.19 0.31 0.032 0.055 0.24 0.24 Dielectric loss factor (cm ^-1 ) 1.9 3 72 76 48 40 71 1.9 3 72 1.9 Adhesive strength (MPa) 1.1 3.1 4.6 4.1 3.9 5.5 5.1 1.9 6 4.5 6.8

  PO-1: Silane-Modified G197 (Polyolefin Type, Cleha Elastomer Co., Ltd.) Melting Point 105 ° C

  PO-2: Silane-Modified G1019 (Polyolefin-Based, Kleha Elastomer Co., Ltd.) Melting Point 120 ° C

  Fe100: ASC100 (iron powder, Heganes Co., Ltd.) Average particle size 100 microns, volume resistivity 1.4

× 10 ^-5 Ωcm

  Fe200: KIP3100 (Iron powder, Cheunggi Steel Co., Ltd.) Average particle size 200 micron, volume resistivity 1.6

× 10 ^-6 Ωcm

  Cu100: CE-6 (Copper powder, Futian Metal Powder Co., Ltd.) Average particle size 100 micron, volume

Resistivity 1.7 × 10 ^-6 Ωcm

CF: HTA (Carbon Fiber, Dong Bang Rayon Co., Ltd.) 3 mm length, volume resistivity 1.5 × 10 ^-3 Ω · cm

The dielectric loss tangent and the dielectric loss coefficient of the plate were measured. In addition, using the glass and glass fiber reinforced modified polybutylene terephthalate resin molded article (EMC430) as an adherend, high frequency dielectric bonding was performed over 1 minute or 5 minutes of the high frequency heating time, and the adhesive strength thereof was measured.

Comparative Examples 1 to 4: (Dielectric tangent or composition of the adhesive other than the above recommended range)

The adhesive strength was measured with respect to the plate which compounded and preformed the compounding ratio shown in Table 2 similarly to the example of this invention.

Comparative example No.1 No.2 No.3 No.4 Compounding (volume%)  PO-1 100 100 99.5 99.5  PO-2 - - - -  Fe100 - - 0.5 35  Fe200 - - - -  Cu100 - - - -  CF - - - -  Oscillation time (minutes) One 20 20 One  Genetic Tangent 0.027 0.027 0.027 0.16 Dielectric loss factor (cm ^-1 ) 1.4 1.4 1.6 55  Adhesive strength (MPa) 0 0 0 0.2

For some, adhesiveness was evaluated by changing the oscillation time, which is a high frequency heating time.

In addition, since the holder piece is separated from the holding structure of the glass holder, even if the thickness of the glass is changed, it can be bonded by applying pressure. Moreover, since the thickness of the resin for dielectric heating bonding can be arbitrarily adjusted by the height of the convex part formed in the holder piece, it becomes possible to ensure the optimum thickness of an adhesive easily. Therefore, high adhesive strength can be ensured regardless of the fluctuation of the thickness of glass. In addition, there is no need for dimensional control of the glass holder or storage management of the adhesive.

As mentioned above, although embodiment of this invention was described, since said embodiment is only an illustration to the last, the scope of the present invention is not limited to said embodiment. For example, the hot melt resin is not limited to the resin for dielectric heat bonding, but may be other hot melt resin. The scope of the invention is indicated by the description of the claims, and includes all modifications within the meaning and range equivalent to the description of the claims.

By using the glass holder, the bonding method and the molding method of the hot melt resin of the present invention, it does not require the primer treatment of the adhesive surface between the glass and the holder or the connecting part or the manufacturing stay period for curing the adhesive, and the high reliability. Can be realized. Therefore, it is possible to form an attachment structure related to adhesion with glass, having high productivity and firm durability.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows the glass holder in embodiment of this invention, (a) is a perspective view of one holder piece, (b) is a partial cross-sectional perspective view of the other holder piece, (c) is a perspective view of a nut.

2 is a cross-sectional view of a state in which the glass is mounted on the glass holder of FIG.

3 is a front view showing a state where the glass holder with glass is attached to the roller guide of the elevating mechanism;

4 is a view showing a room mirror base member which is a connecting part in an embodiment of the present invention.

It is a figure which shows the door mirror using the mirror holder which is a connection part in embodiment of this invention, (a) is a miller case, (b) is a miller holder, (c) is a figure which shows a miller

6 is a cross-sectional view of FIG.

It is a figure which shows the ceiling glass in which the connection component in embodiment of this invention is used.

(A) is a figure which shows the connection part adhere | attached on the ceiling glass which is the connection part in embodiment of this invention, (b) is the figure which shows the other parts connected to the connection means of the said connection part.

9 is a view showing a temporary fixed form of the hot melt resin of an embodiment of the present invention.

10 is a view showing another temporary fixed form of the hot melt resin of an embodiment of the present invention.

11 is a perspective view illustrating a conventional glass holder

12 is a cross-sectional view of a state in which the glass is mounted on the glass holder of FIG.

Explanation of symbols on the main parts of the drawings

2-Adhesive Wall (Adhesive Area) 2a-Convex

3-Attachment 3a-Through Hole

4-glass receiving part 5a-engaging convex part

5b-Convex Retaining Section 7-Hot Melt Resin

8-nut mounting recess 9-nut

9a-Female thread 10-Glass holder

11-One holder piece (1st holder piece) 12-Other holder piece (2nd holder piece)

13-lifting mechanism 14-roller guide

20-Windshield 21-Room Miller Base

22-Coupler 23-Flexible Arm

24-Angle adjuster 25-Room miller

30-Glass 31-Door Miller Case

32-Miller holder 32a-adhesive area

33-Miller 33a-Surface

33b-Back 35-Screws

51-ceiling glass 52-Connecting parts

55-male thread 55a-male thread

58-lining 59-catch

61-fitting

Claims (15)

Glass holder for fixing and supporting glass, With the first holder piece, A second holder piece paired with the first holder piece and opposed to the first holder piece with the glass therebetween; An attachment structure included on at least one side of the first and second holder pieces, for attaching the first and second holder pieces to another member; Hot melt resin attached to at least one side of the first and second holder pieces for adhering the glass, The hot melt resin contains 1 to 30% by volume of a conductive material having a volume resistivity of 10 ⁻² Ω · cm or less in a resin having a melting point of 80 ° C. to 200 ° C., and a glass holder having a dielectric loss tangent of 0.03 or more at a frequency of 40 MHz. . The method according to claim 1, And a convex portion having a predetermined height is formed in an adhesive region of the holder piece to which the hot melt resin is attached. The method according to claim 1 or 2, The attachment structure includes a nut mounting recess for mounting a nut around a through hole on either side of the first and second holder pieces. The method according to claim 1 or 2, And the hot-melt resin is temporarily fixed to the holder piece by engaging the shape with the holder piece. The method according to claim 3, The hot-melt resin is temporarily fixed to the holder piece by engaging the shape with the holder piece. delete delete delete delete delete As a method of bonding glass using a pair of holder pieces, At least one side of the pair of holder pieces contains 1 to 30 vol% of a conductive material having a volume resistivity of 10 ⁻² Ω · cm or less in a polyolefin resin having a melting point of 80 ° C. to 200 ° C. at a frequency of 40 MHz. Attaching a hot melt resin having a dielectric loss tangent of 0.03 or more; And a step of applying pressure such that the glass is sandwiched between the pair of holder pieces in a state where the hot melt resin is interposed, and heating a region containing the hot melt resin sandwiched with the glass. The method according to claim 11, In the step of heating the region containing the hot melt resin, the bonding method of heating by at least one of dielectric heating, rotary friction heating, vibration friction heating, ultrasonic heating, laser light heating, infrared heating, hot plate heating and hot air heating. delete delete A polyolefin resin having a melting point of 80 ° C. to 200 ° C. contains 1 to 30% by volume of a conductive material having a volume resistivity of 10 ⁻² Ω · cm or less, and injection molding a hot melt resin having a dielectric loss tangent of 0.03 or more at a frequency of 40 MHz. As a method, The process of making the mold used for injection molding into 70 degrees C or less, And a step of injecting the hot melt resin in a molten state into a mold maintained at 70 ° C. or lower, cooling the mold, and molding the same.