KR100503996B1 - Burn-in test socket apparatus - Google Patents

Abstract

A socket device 10 suitable for burn-in test of an IC element having a plurality of contacts on the bottom is provided with an adapter plate 22 and a cover frame 16 which are movably mounted on the base 12. Has The latch assembly 30 is pivotally mounted on the base 12 at each side thereof, and is connected to the cover frame so that each latch member moves downward toward the base against the bias of the spring member 20. 30a is pivoted away from the mounting surface of the socket to which the IC element is attached and detached. When the cover frame 16 returns to the normal state and the stop position, each latch member pivots toward the base member at a position present on the placement surface, engages with the IC element housed on the placement surface, and through the adapter element, the adapter plate. Force is applied, thereby lowering the adapter plate to expose the contact elements such that the contact element 14 and each contact of the IC element contacts. In a variant embodiment 10 ′, the heat dissipation assembly 40 is mounted to move with two opposing latch assemblies 30. Each heat dissipation assembly includes a head 42 that is movable between an internal position and an external position to allow the head to contact the IC element with a predetermined amount of spring force for optimal thermal coupling.

Description

Socket device for burn-in test {BURN-IN TEST SOCKET APPARATUS}

The present invention is a continuation-in-part of US application Ser. No. 08 / 668,663, filed June 25, 1996.

The present invention relates generally to integrated circuit (IC) devices, and more particularly to socket devices used to test such IC devices.

When performing a heat resistance test (called a burn-in test) of an IC element, the IC element is sequentially placed in a socket connected to a circuit board, and then the substrate is placed in a heating apparatus, and the test is performed by raising the temperature of the IC element to a predetermined level. It is common to perform and to determine whether the IC device meets the necessary specifications.

The prior art sockets used for this purpose include a base member formed of an electrically insulating material in which electrical contact elements are mounted for each lead of the IC element to be tested. The contact elements are arranged in a predetermined pattern with respect to the IC element mounting seat provided in the base, and have movable contacts configured to move in and out for electrical contact with each lead of the IC element. The cover member is typically movably mounted on the base and allows the contact element to move away from the IC element placement position when the cover member is in the open position to allow attachment or detachment of the IC element in the socket. It is structured. Also, when the cover member is moved to the closed position, the contact element is moved to the position in electrical contact with each lead of the IC element.

One type of socket in the prior art includes a cover member that is vertically movable, wherein when the cover member is pressed against the base, the cover member camms the extension of each spring and thus the contact between each contact element is IC. The IC element is attached to or detached from the socket by turning or reciprocating away from the lead of the element. When the cover member returns back to a position away from the base under the influence of the spring member, the portion that achieves contact in the contact element is moved to contact each lead of the IC element disposed in the socket. In general, this type of socket has certain limitations due to the very complex configuration of the contact elements required to achieve pivotal movement, including undesirable increases in inductance in the circuit, and interference occurring simultaneously with adjacent contacts. In addition, the structure is most suitable for use in an IC element having only a single row of lead wires on a predetermined side of the IC element.

Another type of socket in the prior art includes a cover member in which the cover is held in the closed position by a latch and pivotally mounted relative to the base. The lead wires of the IC elements arranged in the arrangement position of the base are contacted by each contact element cambed by the cover when the cover is in the closed position. However, this type of socket is not automated due to the rotational movement of the cover.

A very advantageous socket disclosed in US Pat. No. 5,470,247 is mounted such that the cover member moves vertically on the base, and the latch member connects the cover member and the base to each other. The latch member is movable towards the movable spring contact element mounted on the base and vice versa, depending on the position of the cover member. When the cover member is in the down pushed position and the latch member pivots away from the IC element placement position, the lead of the IC element is placed on each movable spring contact element. When the cover member moves vertically away from the base under the influence of the spring member, the latch member pivots in engagement with the upper surface of the lead member of the IC element and the lead member is biased with the movable spring contact element. The predetermined contact force is provided by moving downwards a predetermined distance against.

As IC devices become ever denser, the number of electrical input / output connections required for the device increases. In order to accommodate a significant increase in such electrical connections, certain IC devices are arranged with dense contact arrays on the bottom surface of the device instead of the usual leads drawn out from the side of the device.

SUMMARY OF THE INVENTION An object of the present invention is to provide a burn-in test socket for use in the above-described IC device provided with a compact array of contacts on the bottom surface. Another object of the present invention is to provide a burn-in test socket which overcomes the above-mentioned limitations of the prior art. And another object is to load or unload the IC element, which can accurately arrange the contact element of the contact point and the socket on the surface of the IC element, contact the contact with a predetermined contact force, and thermally couple the IC element during the test. It is to provide a socket provided with a heat dissipation member that does not affect.

According to the invention, the adapter plate is movably mounted on the base and is spring biased toward the upper position in one direction away from the base. A plurality of elongated contact elements are mounted to the base, each having a contact portion at the free end received in each hole extending through the bottom wall portion of the adapter plate. A cover frame forming an opening or window is mounted on the base and against the spring biased upper at-rest position and spring bias, away from the base. Can be moved vertically between the lower positions operated close to the base. The adapter plate disposed in the window of the cover frame is formed with an IC element guide surface to guide the IC element disposed on the adapter plate to the IC element placement surface on the adapter plate. Each latch member is mounted on the base at each side for rotational movement and connected to the cover so that the cover frame is lowered from the first position present on the IC element placement surface of the adapter plate when the cover member is in the upper position. When in the operating position, the IC element is moved to a second position pivoting away from the placement surface such that the IC element is disposed or loaded on the placement surface or removed or unloaded from the placement surface. The latch member is provided with a force applying surface, and when the latch member is on the placement surface, the force application surface is spaced from the placement surface of the adapter plate, the separation distance of which is placed on the placement surface and with each latch member. Smaller than the thickness of the edge of the IC element to be aligned. When the IC element is placed on the placement surface of the adapter plate and the cover frame is returned to the stationary top position, the latch member transmits a force through the IC element to push the adapter plate downward and thereby is arranged on the bottom of the IC element. The contact comes into contact with the free end of each elongated contact element projecting out of a hole in the bottom at a lower position of the adapter plate. Each heat sink member has two opposing positions, between the operating position present on the adapter plate when the latch member is in the first position and the loading and non-loading position deviating from the adapter plate when the latch member is in the second position. The beam is mounted to move with each latch member. The heat dissipation member is effectively connected to a link that controls the movement of the latch member to provide a suitable opening for accessing the IC element when in the loaded and unloaded position. The heat dissipation member is movably mounted to an end of the leg that is pivotally mounted between a spring biased outer position and an inner position against the spring bias. The IC element mounted in the socket is coupled by the heat dissipation member, and biases the heat dissipation member toward the internal position for optimal thermal coupling with a predetermined spring force.

The socket 10 made in accordance with the present invention comprises a base of a predetermined shape, such as a square formed of a suitable plastic molding material, wherein the electrical contact element 14 mounted on the base has an angle of the IC element mounted in the test socket. Electrically connected with the contact position or contact. The contact element 14 thus protrudes through the base and is connected to a conventional circuit board (not shown) used as burn-in test equipment.

The cover frame 16 formed of a suitable plastic molding material has an opening or window 16a in the center which provides a space for the movable latch member to be described later and a space in which the IC element can be stored in or detached from the socket, Mounted on the base. The cover frame 16 consists of a bore 16b and a counterbore 16c (see FIGS. 1, 3, and 4) at each corner, and a surface 16d forming a stop surface therebetween. . The screw 18 is received in the base 12 through each bore 16b and through a bore 12a aligned to the base, and a splined nut 18b inherent in the counterbore 12b. It is fixed moderately. The annular groove 16e on the lower surface of the cover frame 16 surrounding each bore 16b and the annular groove 12c on the upper surface of the base 12 surrounding each bore 12a are each Of the compression spring 20 for biasing the cover frame upward away from the base 12 in the vertical direction so that the movement of the cover frame is restricted by the engagement of the head 18c of the screw 18 and the stop face 16d. Form a location.

The adapter plate 22 is also mounted to move vertically on the base 12 in the opening 16a of the frame member 16. A bore 22a (see FIG. 7) which is formed to penetrate the plate 22 at the central point of each side is a splined nut 24a that is also received through the aligned bore 12d and accommodated in the counterbore 12e. To accommodate each screw 24 that is properly secured. The head 24b is engaged with the bottom wall 22b of the adapter plate to limit the upward movement of the adapter plate 22. The adapter plate 22 is biased upwards against the head 24b of the screw 24 by a compression spring 26 extending between the adapter plate 22 and the base 12. At each corner an annular groove 22c formed at the bottom of the adapter plate 22 and an aligned annular groove 12f formed at the top of the base 12 provide a spring position of each spring 26.

The adapter plate 22 is preferably provided with a guide block 22f of crossing guide surfaces 22d and 22e inclined at each corner on the top surface. Thus, when the IC element is placed on the adapter plate 22, it will be correctly guided to the IC element placement surface 22k. A hole array 22g that matches the array of contacts on the bottom of the IC element to be housed in the test socket is formed to penetrate through the bottom wall portion 22b of the adapter plate, and at a taper 22h on the bottom of the plate. It is preferable to be formed of an extended lead (see Figs. 3 and 4).

The elongated contact element 14, shown separately in Figs. 9 and 10, is formed of a suitable electrically conductive material with good mechanical spring properties, and includes a lower pin portion 14a, which is accommodated in a hole in a circuit board (not shown), and an anchor portion. (anchor) 14b, an elongated spring portion 14c, and a distal free contact portion 14d extending upwardly from the tab portion 14e, wherein the tab portion is selectively provided with each hole (in the adapter plate 22). 22g) is provided to limit the proper sliding action of the contact portion 14d. The pin portion and anchor portions 14a and 14b are received in respective holes 12g formed through the base 12, and are in place by an insulated retainer 28 having corresponding aligned slots 28a. The bottom surface 28b of the retainer 28 between each slot 28a is engaged with the anchor portion 14b to form a stop surface to prevent the contact element from dislocating upward. As mentioned above, the contact at the outer end 14d of the contact element is received in the top part of the adapter plate shown in Figs. Not higher, preferably slightly lower.

Preferably, the latch assembly 30 is disposed on each side of the socket 10, depending on the particular contact array of the IC device to be tested, but may be omitted on two opposite sides if desired. However, in the preferred embodiment, the latch mechanism 30 is provided on each of four sides of the socket 10 as shown in FIG. Each latch mechanism 30 has a latch member 30a overmolded on the bend 30b and an arm 30c on a shaft journaled shaft 32 at the pillar portion 12k of the base 12. It consists of an overall U-shaped lever that extends to the pivotally attached distal end 30d. Each member of the pair of link members 34 has one end 34a rotatably mounted on each pin 36 fixedly connected to the cover frame 16. Each other end 34b of the link member 34 is rotatably connected to the end 30d of each arm 30c via the shaft 38 at a position spaced apart from the shaft 32. This type of latch assembly is described in US Pat. No. 5,470,247, the contents of which are incorporated herein by reference.

Referring to FIG. 5, when the cover frame 16 is lowered to a position close to the base 12 as shown in the figure, the movement of the cover frame is transmitted through the link member 34 to the latch assembly, so that the adapter The arm 30c of each latch assembly is pivoted with respect to the shaft 32 to guide the latch member 30a in an open state by the force application surface 30e pivoting away from the plate and the base. In this position, the IC element 2 can be easily inserted or loaded into the socket, as shown by arrow 3 in FIG. 5, prior to the test, and can be easily removed or unloaded from the socket after the test is completed. The inclined guide surfaces 22d and 22e guide the IC element to the correct position on the adapter plate serving as the IC element placement surface 22K.

As the cover frame 16 attempts to return from the stationary state to the normal state under the influence of the spring member 20, the movement of the cover frame is transmitted to the latch assembly through the link member, so that each latch member The latch member 30a is pivoted toward the base and the adapter plate 22 so that is on the IC element placement surface 22k. In this position, when there is no IC element, the force application surface 30e of each latch member is spaced apart from the top surface of the bottom wall 22b of the adapter plate, the separation distance of which is to be received on the placement surface and aligned with each latch member. If the IC element 2 is placed on the placement surface 22k and is smaller than the height of the outer edge 4 of the surface, the force application surface 30e transmits a force through the IC element 2, thereby providing an adapter plate 22. Is moved downwards towards the base 12 with respect to the bias of the spring member 26, thereby exposing the contact at the distal end of each elongated contact element 14. Thus, each contact on the bottom surface of the IC element 2 moves accordingly to come into contact with the contact portion of each contact element 14 with a predetermined amount of contact force.

Therefore, the high accuracy required to use the small target contact is required by the adapter plate, which precisely positions the IC element on the upper surface through the contact and guide surface of each contact element of the socket through the contact hole of the bottom wall of the adapter plate. You can get it.

11 to 14, in a modified embodiment of the present invention, a heat radiating member is provided for arranging a thermal coupling relationship with the IC element to be tested. In the embodiment shown, the two heat dissipation assemblies 40 provided are interconnected with two opposing latch assemblies 30 and each move. Each heat dissipation assembly 40 consists of a pair of legs 40a having first and second ends 40b and 40c, respectively (see FIGS. 13 and 14). At the end 40b there are first and second bores which receive shafts 36 and 38 to which the link members 34 are also mounted. As a result, the position of the leg 40a is fixed relative to the link member 34 and thus can move with the link member. Each heat dissipation head 42 is bent at the second end 40c of the leg 40a and extends laterally by the pin 44 received through the slot 40d of the arm 40a. It is mounted between compression springs 46 disposed on each side between the spring position tab portion 40e and the heat dissipation head 42. The heat dissipation head 42 exemplarily has an inner position against the bias of the compression spring 46 shown in FIGS. 13 and 14 and each end bent inwards in cooperation with each finger 42a of the heat dissipation head 42. It is movable between the outer position (indicated by the dashed line in FIG. 13) determined by the stop tab 40f formed from 40c.

In the rest position as shown in FIGS. 11 to 13, each heat dissipation assembly 40 is disposed with a heat dissipation head 42 placed on the mounting surface 22k of the adapter plate 22, and the heat dissipation head 42 is a socket. It is configured to engage the IC element housed in, and is biased little by little from the external head position to the inside to be biased against the top surface of the IC element with optimal thermal coupling. The surface portion 42b configured to join the die portion of the IC device package is preferably surface treated to a very smooth surface, similar to 16 microinches rms, to enhance thermal coupling with the IC device. The pin / slot and spring arrangements allow the head to move between internal and external positions as well as alter the angular orientation to be adjacent to the top surface of the IC element with a predetermined spring force. Except for the retainer plate 36a used to support the shaft 36 in the cover frame 16, the remaining portion of the socket 10 'is the same as the embodiment of Figs. 1 to 10 and will not be described further. .

As described in the embodiment of FIGS. 1-10, when the cover frame 16 acts downward, its movement is transmitted to the latch assembly 30 through the link member 34 to force the latch member 30a. Each latch assembly is pivoted relative to the shaft 32 so that the application surface pivots away from the base and adapter plate and each heat dissipation assembly pivots away from the adapter plate to the position shown in FIG. 14. By mounting the ends 40b of the legs 40a on the shafts 36, 38, the heat dissipation assembly can be effectively moved upon extension of the link member 34, allowing the legs to rotate at a greater angle than the latch assembly, As a result, the heat dissipation head 42 will not penetrate into the IC element loading / unloading window formed by the latch assembly to a detectable degree.

Although the heat dissipation assembly is shown with two opposing latch assemblies and not shown with two other opposing latch assemblies, it is possible to mount a separate assembly from each latch assembly if desired, within the scope of the present invention.

In view of the above, it will be appreciated that the various objects of the present invention are achieved and other advantageous results are achieved.

As various modifications may be made in the above structure without departing from the scope of the present invention, everything included in the above description or shown in the accompanying drawings is to be understood as illustrative and not intended to be limiting.

The present invention provides a socket for burn-in test applications used in IC devices having a plurality of contacts densely arranged on a surface.

1 is a plan view of a socket made in accordance with the present invention.

FIG. 2 is a front view of the socket shown in FIG. 1, the left half of which is taken along line 2-2 of FIG.

3 is a cross-sectional view taken along the line 3-3 in FIG.

4 is a cross-sectional view taken along the line 4-4 in FIG.

Fig. 5 is a sectional view similar to the left part of Fig. 2, showing a latch member pivoting away from the IC element arrangement surface and an IC disposed in the socket;

FIG. 6 is a view similar to FIG. 5, showing an IC element disposed in the socket and a latch member positioned on the placement surface to apply downward force to the edge of the IC element; FIG.

7 is a plan view of an adapter plate used for the socket shown in FIG.

8 is a cross-sectional view of the adapter plate shown in FIG.

9 is a side elevational view of one of the elongated contact elements used in the socket shown in FIG.

10 is a front view of the contact element shown in FIG. 9;

FIG. 11 is a plan view of a variant embodiment of the present invention similar to FIG. 1. FIG.

12 is a cross-sectional view taken along the line 12-12 in FIG.

13 is an elevational view of a latch assembly and heat dissipation assembly having a latch member and a heat dissipation member in a predetermined position on the adapter plate.

FIG. 14 is a view similar to FIG. 13 showing the latch member and heat dissipation member removed from the adapter plate.

<Description of the symbols for the main parts of the drawings>

10: socket

12: base

14: contact element

16: cover frame

16C: Counter Bore

18B: Splined Nuts

22: adapter plate

28: retainer

30C: Cancer

32, 38: shaft

Claims (11)

A socket device configured to be used to burn-in an IC device having a plurality of contacts on a surface, Bass, An adapter plate movably mounted on the base, biased away from the base toward the top position by a spring member, and formed with a plurality of contact element receiving holes penetrating in the IC placement surface; At least one latch assembly mounted on the base and having a latch member movable between a first position existing on the adapter plate and a second position deviating from the adapter plate; An actuator for moving the at least one latch assembly between the first and second positions; At least one heat dissipation assembly that is movable from an operating position existing on the adapter plate and an IC loading / unloading position away from the adapter plate and movable with the at least one latch assembly; A contact portion mounted to the base and having a pin portion extending through the base for connection to a circuit board, and a contact portion received at an end of each contact element receiving hole of the adapter plate, the end of the contact portion being connected to the adapter plate; A plurality of contact elements arranged to be positioned directly below an upper surface of the adapter plate when in a top position, When the latch member is in the first position without the IC element, the IC element is spaced apart from the adapter plate at a distance less than the thickness of the portion of the IC element to be aligned with the latch member when the IC element is on the placement surface, and the IC element Is received on the placement surface and the latch member is moved to the first position, the adapter plate is pushed downward against the bias of the spring member to expose the contact of the contact element such that the contact is in contact with the contact of the IC element. And engage at least one heat dissipation assembly with the IC element. The socket arrangement of claim 1 wherein the base has four sides, and the latch assembly and the heat dissipation assembly are mounted on the base on at least two sides. The arm assembly of claim 1, wherein each latch assembly includes a U-shaped lever having a bent portion and a pair of arms extending from the bent portion to each distal end, wherein the latch member is pivotally mounted to the bent portion and the base. Disposed on a free distal end of the pair of link members, each of the pair of link members having first and second ends, one end of each link member being rotatably connected to each arm at a position spaced from a pivotally mounted position, The other end of each link member is rotatably connected to an actuator movably mounted on a base between an upper position and a lower position, wherein in the first position the latch member is connected to the adapter when the actuator is in the upper position. Is present on the plate and in the second position the latch member is adapted to the adapter plug when the actuator is in the lower position. Either way, each heat dissipation assembly includes a pair of legs having first and second ends, one end of each leg attached to each link member and moving in the extension of each link, the other end of each leg Is connected to a heat dissipation member, wherein the heat dissipation member is disposed above the adapter plate at the first position of the latch member and deviates from the adapter plate at the second position of the latch member. 4. The actuator of claim 3, wherein the actuator comprises a cover, the cover forms a frame defining an opening therethrough, and the cover is mounted to move vertically towards the base and vice versa, and away from the base. And a cover spring member mounted on the base for pressing the cover. 4. The heat dissipation member according to claim 3, wherein the heat dissipation member is movably attached between an inner position and an outer position at the other end of each leg, and the heat dissipation member is biased to an outer position by a spring member so that the latch member is in the first position. And the heat dissipation member, when in engagement with the IC element disposed on the placement surface, is biased towards the inner position by a predetermined spring force for optimal thermal coupling with the IC element. 4. The socket arrangement of claim 3 wherein one end of each leg of the heat dissipation assembly is attached to a first end and a second end of each link. 2. The socket arrangement as set forth in claim 1, further comprising a guide surface mounted to the socket to guide an IC element to a predetermined position on the adapter plate. 8. The socket device of claim 7, wherein the guide surface is integrally formed on the adapter plate. The cover frame and the cover frame mounted on the base so as to be movable in the direction toward the base and vice versa between the base and the first stop position away from the base and the second operating position adjacent to the base. In the socket device comprising a spring means for biasing in one position direction, A latch member having a force applying surface, said latch member being pivotally mounted on said base and connected to said cover frame by a link, said applying force when said cover frame is in said first stop position; A latch assembly movable between a first closed position in which a face rests on the base and a second open position in which the force applying surface pivots away from the base when the cover frame is in the second operating position; The latch is movable from an operating position existing on the adapter plate when the latch member is in the first position and an IC element loading / unloading position deviated from the adapter plate when the latch member is in the second position, the latch A heat dissipation assembly attached to the assembly and movable with a link connecting the latch member and the cover frame; Mounted on the base so as to be movable toward and away from the base, receiving a force in a direction away from the base by a spring means mounted to the base, and having an IC element placement surface formed thereon; An adapter plate having a plurality of contact receiving holes penetrated in a predetermined pattern aligned; A plurality of elongated contact elements each having a portion fixed to the base and a free end portion received in each contact hole of the adapter plate, the adapter plate having a free end portion of the contact element as the adapter plate moves towards the base; And the force application surface of the latch member is aligned with the placement surface when in the closed position, and the cover frame is spaced apart from the adapter plate at a distance less than the thickness of the edge portion of the IC element when there is no IC element. The IC element is placed on the bottom surface of the adapter plate when in the second operating position, and the latch member causes the IC to return when the cover frame returns to the first stop position and the latch member moves to the closed position. Play the adapter by forcing on the edge of the device By the end of each contact element with a downward movement of the socket device to be combined with the respective contact areas of an IC element arranged on the side of the IC element arranged. A base, an IC element placement surface, a cover frame movably mounted vertically on the base between the first stop position away from the base and a second operating position adjacent to the base and the cover frame to the first position A socket device comprising a spring means for sinking, A latch member having a force application surface, the latch member mounted on the base and connected to the cover frame by at least one link, and applying the force when the cover frame is in the first stop position. A latch assembly movable between a first closed position in which a face is disposed above the base and a second open position in which the force applying surface pivots away from the base member when the cover frame is in the second operating position; ; A socket device including a heat dissipation assembly that is movable from an operating position existing on the IC element placement surface and an IC element loading / unloading position off the IC element placement surface, and attached to the latch assembly and movable with the latch assembly; . 11. The socket arrangement of claim 10 wherein the link has first and second ends, and wherein the heat dissipation assembly is connected to the first and second ends of the link and moves effectively when extending the link.