JP4647458B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to an electrical component socket that accommodates electrical components such as semiconductor devices (hereinafter referred to as “IC packages”).

  Conventionally, as this type of “socket for electrical parts”, for example, there is one described in Patent Document 1. In the column of the solution of the abstract of this document 1, “Socket main body provided with a mounting portion on which an IC package is placed and a vertically movable state in a state of being biased upward with respect to the socket main body are arranged. An electric socket comprising: a socket cover provided; and a latch member which is disposed so as to be openable and closable in conjunction with the vertical movement of the socket cover and holds the IC package placed on the placement portion in a closed state. In the component socket, an opening / closing pressing mechanism for the latch member that opens and closes the latch member as the socket cover is returned to the raised position while the socket cover is pushed into the lowered position. It is provided. "

Also, paragraph number [0037] of Patent Document 1 is provided with “a latch member and an arm member that can be opened and closed in conjunction with the vertical movement of the socket cover, and the left and right arm members in FIG. 11, the heat sink is in contact with the IC package placed on the placement portion when the arm member is closed as shown in FIG. It becomes a heat radiator that dissipates to the outside air, and is described as "..."
JP 2004-327264 A.

  However, in such a conventional one, since the heat sink and the latch member are provided at different positions (different sides of the four sides around the socket body), the electrical component ( IC package) could not be increased.

  For this reason, it is conceivable to attach the heat sink to the latch member, but the heat sink movement is unstable. There is a problem that it takes a long time.

  Therefore, the present invention can secure the holding force of the electric component (IC package) by the latch member, stabilize the movement of the heat sink, prevent the heat sink from hitting the tip of the contact pin when the heat sink is closed, and when the heat sink is opened. It is an object of the present invention to provide a socket for an electrical component that suppresses the bounce of a heat sink.

  In order to achieve such an object, the invention according to claim 1 is directed to a socket main body that accommodates an electric component, a latch member that holds the electric component accommodated in the socket main body, and a heat dissipation that abuts on the electric component. In the electrical component socket having a heat sink, the latch member is rotatably provided via a latch shaft, and the heat sink is located at substantially the same position as the latch member and separately from the latch member. It is characterized by being a socket for electric parts provided so as to be rotatable.

  According to a second aspect of the present invention, in addition to the configuration of the first aspect, the latch shaft is provided in the socket body so as to be movable up and down, and when the electric member is pressed by the latch member, The latch shaft is configured to be lowered.

  According to a third aspect of the invention, in addition to the configuration of the second aspect, a lever member is rotatably provided on the socket body via a lever shaft, and the latch shaft is inserted into the lever member. When the lever member is rotated in the closing direction, the upper edge of the elongated hole comes into contact with the latch shaft and presses the latch shaft downward, While the latch member is lowered, the lever member is provided with the heat sink.

  According to a fourth aspect of the present invention, in addition to the configuration according to the third aspect, the time when the heat sink contacts the electric component from the time when the latch member is moved in the closing direction to contact the electric component. It is characterized by delaying.

  According to a fifth aspect of the invention, in addition to the configuration of the third aspect, an operation member is disposed on the socket body so as to be movable up and down, and the latch member and the lever member are moved by the vertical movement of the operation member. It is configured to be rotated.

  According to the first aspect of the present invention, the latch member is rotatably provided via the latch shaft, and the heat sink is rotatably provided at substantially the same position as the latch member separately from the latch member. Therefore, unlike the conventional case, it is not necessary to provide the heat sink and the latch member in different positions (different sides among the four sides of the socket body), so that the latch member can be provided on the four sides. It is possible to secure the pressing force of the electrical component (IC package).

  Since the heat sink is provided separately from the latch member so that it can rotate freely, it can be rotated simply, stabilizing the heat sink movement and preventing the heat sink from hitting the tip of the contact pin when the heat sink is closed. Moreover, the bounding of the heat sink when the heat sink is opened can be suppressed.

  According to the second aspect of the present invention, the latch shaft is provided so as to be movable up and down on the socket body, and when the electric component is pressed by the latch member, the latch shaft is lowered. If a heat sink is attached to the latch member, it is difficult to control the movement of the heat sink with relatively heavy weight (high inertial force) because the movement of the latch member is complicated, but the heat sink is latched as in the present invention. By disposing the member independently so as to be rotatable, it becomes easy to control the movement of the heat sink, and it is possible to prevent the heat sink from hitting the tip of the contact pin and the heat sink from bouncing greatly.

  According to the invention described in claim 3, since the heat sink is provided on the lever member that presses and lowers the latch shaft downward, the lever member is provided rotatably on the socket body via the lever shaft. Therefore, since only the rotary motion is performed, the motion control is simple. Thus, the movement of the heat sink can be controlled, and the heat sink can be prevented from hitting the tip of the contact pin and the heat sink from bouncing greatly.

  According to the fourth aspect of the present invention, since the time when the heat sink contacts the electrical component is delayed from the time when the latch member contacts the electrical component, the electrical component is pressed and positioned by the latch member, and then the heat sink is connected to the electrical component. By contacting the heat sink, the electrical component can be set at a predetermined position as compared with the case where the heat sink first contacts.

  According to the fifth aspect of the present invention, the operation member is disposed on the socket body so as to be movable up and down, and the latch member and the lever member are rotated by the vertical movement of the operation member. By simply moving the member up and down, the latch member and the lever member can be rotated. By rotating the lever member, the heat sink can be rotated and the latch member can be lowered. It is possible to make a simple movement by simply moving the operating member up and down.

  Embodiments of the present invention will be described below.

  1 to 19 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. An IC package 12 that is an “electrical component” is accommodated in the IC socket 11, and the IC package 12, the wiring board 14, Are electrically connected via the IC socket 11 so that the performance test of the IC package 12 is performed.

  As shown in FIG. 19, this IC package 12 is a so-called LGA (Land Grid Array) type, and a large number of terminals 12a are arranged on the lower surface of a rectangular package body 12b.

  On the other hand, the IC socket 11 roughly has a synthetic resin socket body 13 mounted on the wiring board 14, and the socket body 13 has contact pins 15 that are in contact with the terminals 12 b of the IC package 12. Is provided, and a latch member 17 and a heat sink 18 for holding the accommodated IC package 12 are rotatably provided, and an operation member 19 for rotating the latch member 17 and the heat sink 18 is freely movable up and down. It is arranged.

  Specifically, the socket body 13 includes a substantially frame-shaped base member 20, a pin plate 21 disposed inside the frame shape of the base member 20 and provided with a plurality of contact pins 15, and the pin plate 21 And a support plate 22 for holding down.

  The base member 20 is made of synthetic resin and is formed in a rectangular frame shape as shown in FIG. 10, and an insertion hole 20a through which the mounting screw 24 is inserted is formed at the center of each side. A placement portion 20b on which the pin plate 21 is placed is formed.

  Further, the pin plate 21 is made of synthetic resin, and as shown in FIG. 11, four pieces, a pin plate mounting portion 21b project outwardly around the rectangular plate body 21a, and the plate body 21a. A press-fitting hole 21c into which a large number of contact pins 15 are press-fitted is formed. Further, in the pin plate mounting portion 21b, an insertion hole 21d through which the mounting screw 24 is inserted is formed at a position corresponding to the insertion hole 20a of the base member 20. A peripheral portion 21 e of the pin plate 21 including the pin plate attachment portion 21 b is placed on the placement portion 20 b of the base member 20.

  Further, the support plate 22 is made of metal and has a substantially rectangular frame shape as shown in FIGS. 12 and 13, and a support plate mounting portion 22 a placed on the pin plate mounting portion 21 b of the pin plate 21 is provided. A female screw portion that is formed and into which a mounting screw 24 inserted from the base member 20 side (wiring board 14 side) is screwed into a position corresponding to the insertion hole 21d of the pin plate 21 of the support plate mounting portion 22a. 22b is formed (see FIG. 4 etc.). The support plate 22 is formed with a total of eight insertion holes 22c through which screws (not shown) for attachment to the base member 20 are inserted.

  Furthermore, as shown in FIG. 14, the contact pin 15 is formed into an elongated shape by punching a plate material having conductivity and elasticity, and a press-fit portion 15a to be press-fitted into the press-fit hole 21c of the pin plate 21 is formed. A stopper portion 15b is formed on the upper side of the press-fit portion 15a so as to contact the upper surface of the pin plate 21 and prevent downward movement, and a curved spring portion 15c is formed on the upper side of the stopper portion 15b. Yes. Further, a contact portion 15d that contacts the terminal 12a of the IC package 12 is formed above the spring portion 15c, and the contact portion 15d is inserted into the insertion hole 28a of the floating plate 28. The floating plate 28 is disposed so as to be movable up and down and is urged upward by a spring (not shown).

  Further, as shown in FIG. 4 and the like, a lead portion 15e is extended below the press-fit portion 15a of the contact pin 15, and the lead portion 15e is inserted into the insertion hole 29a of the locate board 29. The portion 15e is soldered to a wiring board (not shown). The locate board 29 is arranged to be movable up and down by the arrangement pin 30. When the lead portion 15e is attached to the wiring board, the locate board 29 is arranged at the lowered position, and after the attachment, the locate board 29 is arranged at the raised position. Yes.

  On the other hand, the latch member 17 is provided on the four sides of the base member 20 and is rotatably provided via the latch shaft 33 as shown in FIGS. 4 to 7, and the heat sink 18 is connected to the latch member 17. It is rotatably provided at substantially the same position.

  The latch shaft 33 is guided by a groove 20c (see FIG. 10) along the vertical direction of the base member 20 of the socket body 13 so as to be vertically movable and rotatable. It is comprised so that it can move toward.

  As shown in FIG. 15, the latch member 17 is formed to have a predetermined width H so that a certain width of the IC package 12 can be held, and the cross-section is bent at a substantially right angle as shown in FIG. The shape is shown. The latch member 17 has a pressing portion 17a for pressing the IC package 12 on one end side, and a latch shaft 33 on a base portion 17b formed on the other end side. The latch member 17 is biased in the opening direction by a spring (first biasing means) (not shown), and the latch shaft 33 is biased upward by another spring 34 (second biasing means). ing.

  The latch member 17 is configured to be opened and closed by an operation member 19 described later.

  The socket body 13 has a pair of lever members 35 on two opposite sides of the four sides around the IC package 12 accommodation range, and another pair of lever members on the other two opposite sides. 36 are rotatably provided via a lever shaft 37, respectively.

  As shown in FIG. 16, the pair of lever members 35 are connected to opposing walls 35a, 35a facing each other via an intermediate wall 35b, and a latch shaft 33 is inserted into each of the opposing walls 35a. When the lever member 35 is rotated in the closing direction, the upper edge portion 35d of the long hole 35c comes into contact with the latch shaft 33 and presses the latch shaft 33 downward. Then, the latch member 17 is configured to be lowered.

  Further, as shown in FIG. 17, the other pair of lever members 36 has an opposing wall 36a and an intermediate wall 36, as in the case of the lever member 35, and a long hole 36c is formed in the opposing wall 36a. The upper edge portion 36d of the long hole 36c abuts on the latching shaft 33 and presses the latching shaft 33 downward.

  Further, extension pieces 36e are extended from the opposing walls 36a to the lever members 36, and the heat sink 18 is attached to the extension pieces 36e.

  As shown in FIG. 2 and the like, the heat sink 18 includes a heat dissipating part 18a formed in a plurality of pieces and a contact part 18b that abuts on the IC package 12 to dissipate heat. The heat sink 18 is attached to the lever member 36 via a shaft 39, and springs 40 and 41 are provided between the extension piece 36c and the heat sink 18 in the state shown in FIG.

  The lever member 36 is rotated so as to lower the latch member 17. However, the time when the IC package 12 is pressed with the heat sink 18 is delayed from the time when the IC package 12 is pressed with the latch member 17. As described above, the shape of the elongated hole 36c, the amount of rotation of the lever member 36, and the like are set.

  Further, a substantially oval plate-shaped link member that is rotatably connected to each of the latch shaft 33 and a lever shaft 37 as a “fixed portion” and restricts the rising position of the latch shaft 33. 44 is provided.

  On the other hand, the operation member 19 has a frame shape and is arranged to be movable up and down with respect to the socket main body 13, and the latch member 17 and the lever members 35 and 36 are rotated by the vertical movement of the operation member 19. It is configured.

  Specifically, the operation member 19 is guided in a vertical direction by a guide post 46 protruding upward from the base member 20 and is arranged to be movable up and down, and is urged upward by a spring 47. It is stopped at a predetermined ascending position.

  As shown in FIGS. 4 and 5, etc., the operating member 19 is formed with a latch pressing portion 19a that presses the pressed portion 17c of the latch member 17, and when the operating member 19 is raised, The pressing portion 17c is pressed by the latch pressing portion 19a and is rotated in the direction in which the latch member 17 is closed, and when the pressing portion 17c is lowered, the pressing force on the latch member 17 is released and the latch member 17 is opened. Is rotated.

  Further, as shown in FIGS. 8 and 9, etc., the operation member 19 is formed with a lever pressing portion 19b for pressing the pressed portions 35f, 36f of the lever members 35, 36, and the operation member 19 is raised. As a result, the pressed parts 35f and 36f are pressed by the lever pressing part 19b, and the lever members 35 and 36 are rotated in the closing direction. The pressing force is released, and the lever members 35 and 36 are rotated in the opening direction.

  Next, how to use the IC socket 11 will be described.

  In order to accommodate the IC package 12 in the IC socket 11, first, the operation member 19 is pushed downward against the urging force of the spring 47. Then, the pressing of the lever members 35, 36 against the pressed portions 35f, 36f by the lever pressing portion 19b of the operating member 19 is released, and the lever members 35, 36 are rotated in the opening direction by the biasing force of the spring. .

  As a result, the heat sink 18 attached to the lever member 36 is opened as shown in FIGS. 2 and 5 and retracted from the locus of accommodation / removal of the IC package 12.

  When the lever member 35 is opened, the latch member 17 is raised and then rotated in the opening direction as shown in FIG. The operation of the other lever member 36 is the same as that of the lever member 35, and the description thereof will be omitted.

  That is, when the lever member 35 is opened from the state shown in FIG. 18A to the state shown in FIG. 18B, the pressing by the upper edge 35d of the long hole 35c of the lever member 35 against the latch shaft 33 is released. The latch shaft 33 is raised by the urging force of the spring 34, and the lever member 35 is translated upward.

  When the operating member 19 is further lowered from this state, the lever member 35 is further rotated and opened as shown in FIGS. 18C to 18D. In this case, since the link member 44 is provided between the latch shaft 33 and the lever shaft 37, the link member 44 is rotated to the position shown in FIG. As a result, the upward movement of the latch shaft 33 is restricted, and as shown in FIGS. 18C and 18D, when the lever member 35 is further rotated, the upper edge 35d of the elongated hole 35c of the lever member 35 is Therefore, it is separated from the latch shaft 33.

  Accordingly, the inner peripheral edge portion of the long hole 35c does not slide on the latch shaft 33 by being separated as described above, so that the wear of the latch shaft 33 can be prevented.

  Further, as the operating member 19 is lowered, the pressing force against the latch member 17 by the latch pressing portion 19a of the operating member 19 is also released at the positions shown in FIGS. 18C and 18D. The latch member 17 is rotated in the opening direction by the urging force.

  As a result, the latch member 17 is opened as shown in FIGS. 2 and 5 and the like, and retracted from the locus of accommodation / removal of the IC package 12.

  In this state, the IC package 12 conveyed by the automatic machine is accommodated in a predetermined position of the floating plate 28.

  Thereafter, when the downward pressing force of the operating member 19 is released, the operating member 19 is raised by the urging force of the spring 47 or the like, so that the latch member 17 of the operating member 19 is pushed by the latch pressing portion 19a. It is rotated in the closing direction against the urging force.

  At the same time, the lever member 36 is also rotated in the order of (d), (c), (b), and (a) in FIG. 18 in the direction in which the lever member 36 is pressed and closed by the lever pressing portion 19b of the operation member 19. . In FIG. 18, when rotated to (b), the upper edge portion 36b of the long hole 36a of the lever member 36 comes into contact with the latch shaft 33, and further, the lever member 36 is rotated, The latch shaft 33 is pushed onto the upper edge portion 36 b and is lowered against the urging force of the spring 34.

  At this time, the latch shaft 33 is lowered along the groove portion 20c formed in the socket body 13 along the vertical direction, so that the latch member 17 is moved from the state shown in FIG. When the IC package 12 is translated downward in the same posture until the state shown in FIG. 6 is pressed, the upper surface of the IC package 12 is pressed and prevented from being lifted.

  In this state, the contact portion 15d of the contact pin 15 is brought into contact with and electrically connected to the terminal 12a of the IC package 12 at a predetermined pressure, and a burn-in test or the like is performed.

  In such a case, the latch member 17 is rotatably provided via the latch shaft 33, and the heat sink 18 is rotatably provided at substantially the same position as the latch member 17. Thus, since it is not necessary to provide the heat sink 18 and the latch member 17 at different positions (different sides among the four sides of the socket body 13), the latch member 17 can be provided on the four sides. The pressing force of the IC package 12 can be increased.

  Further, the latch shaft 33 is provided on the socket body 13 so as to be movable up and down, and when the IC package 12 is pressed, the latch shaft 33 is configured to be lowered. Therefore, when the heat sink 18 is attached to the latch member 17, the latch Since the movement of the member 17 is complicated, it is difficult to control the movement of the heat sink 18 which is relatively heavy (inertial force is large). However, by arranging the heat sink 18 so as to be rotatable independently of the latch member 17 as in the present invention, the movement of the heat sink 18 can only be a simple rotational movement. Therefore, it is possible to prevent the heat sink 18 from hitting the tip of the contact pin 15 and the heat sink 18 from bouncing greatly.

  Further, since the heat sink 18 is provided in the lever member 36 that presses and lowers the latch shaft 33 downward, the lever member 36 is provided rotatably on the socket body 13 via the lever shaft 37 and rotates. Since only exercise is performed, control of movement is simple. As a result, the movement of the heat sink 18 can be easily controlled, and the heat sink 18 can be prevented from hitting the tip of the contact pin 15 and the heat sink 18 bouncing greatly. Moreover, since the lever member 36 is also used for mounting the heat sink 18, the heat sink 18 can be disposed without increasing the number of components.

  Furthermore, since the time when the heat sink 18 contacts the IC package 12 is delayed from the time when the latch member 17 contacts the IC package 12, after the IC package 12 is pressed and positioned by the latch member 17, the heat sink 18 is moved to the IC package 12. By contacting the IC package 12, the IC package 12 can be set at a predetermined position as compared with the case where the heat sink 18 contacts first.

  Further, the operation member 19 is disposed in the socket body 13 so as to be movable up and down, and the latch member 17 and the lever members 35 and 36 are rotated by the vertical movement of the operation member 19. The latch member 17 and the lever members 35 and 36 can be rotated only by moving the lever up and down. By rotating the lever members 35 and 36, the heat sink 18 can be rotated and the latch member 17 can be rotated. Can be lowered, and complicated movement of each part can be performed by a simple operation of moving the operation member 19 up and down.

  In the above-described embodiment, the present invention is applied to the IC socket 11 as the “socket for electrical parts”. However, the present invention is not limited to this and can be applied to other devices.

It is a perspective view which shows the state which closed the heat sink of the IC socket which concerns on embodiment of this invention. It is a perspective view which shows the state which opened the heat sink of the IC socket which concerns on the embodiment. It is a top view which shows the IC socket which concerns on the embodiment, It is a figure which shows the state which the upper half opened the heat sink, and the lower half closed the heat sink. It is sectional drawing which follows the AA line of FIG. 3 which concerns on the same embodiment. It is sectional drawing which follows the BB line of FIG. 3 which concerns on the embodiment. It is sectional drawing which shows the state which closed the latch member etc. which concern on the embodiment. It is sectional drawing which shows the state which opened the latch member etc. which concern on the embodiment. It is a half sectional view showing the state where the heat sink of the IC socket concerning the embodiment is closed. It is a half sectional view showing the state where the heat sink of the IC socket concerning the embodiment is opened. It is a perspective view of the base member concerning the embodiment. It is a figure which shows the pin plate which concerns on the embodiment, (a) is a top view, (b) is a front view. It is a perspective view of the support plate which concerns on the same embodiment. It is the front view which cut the half of the support plate which concerns on the embodiment. It is a figure which shows the contact pin which concerns on the embodiment, (a) is a front view, (b) is a side view. It is a perspective view which shows the latch member which concerns on the same embodiment. It is a perspective view which shows the lever member which concerns on the same embodiment. It is a perspective view which shows the other lever member which concerns on the same embodiment. It is a figure which shows the motion of the lever member and latch member which concern on the embodiment. It is a figure which shows the IC package which concerns on the embodiment, (a) is a half sectional view which shows the state which opened the heat sink.

Explanation of symbols

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a terminal
12b Package body
13 Socket body
15 Contact pin
15d contact area
17 Latch member
17a Pressing part
17c Pressed part
18 heat sink
19 Operation parts
19a Latch pressing part
19b Lever pressing part
20 Base material
20b Mounting part
21 pin plate
21a Plate body
21b Pin plate attachment
21e Edge
22 Support plate
22a Support plate attachment
28 Floating plate
33 Latch shaft
34 Spring (second biasing means)
35, 36 Lever member
35c, 36c long hole
35d, 36d upper edge
35f, 36f Pressed part
37 Lever shaft
44 Link member

Claims (5)

In a socket for an electrical component, comprising: a socket body that houses an electrical component; a latch member that holds the electrical component housed in the socket body; and a heat sink that contacts the electrical component and radiates heat.
The latch member is rotatably provided via a latch shaft, and the heat sink is rotatably provided separately from the latch member at substantially the same position as the latch member. Socket for electrical parts.   The latch shaft is provided on the socket main body so as to be movable up and down, and is configured so that the latch shaft can be lowered when the electric member is pressed by the latch member. The socket for electrical components according to 1. A lever member is provided in the socket body so as to be rotatable via a lever shaft, and an elongated hole into which the latch shaft is inserted is provided in the lever member, and the lever member is rotated in a closing direction. Sometimes, the upper edge of the elongated hole abuts on the latching shaft and presses the latching shaft downward to lower the latch member,
The socket for an electrical component according to claim 2, wherein the heat sink is provided on the lever member.   4. The electrical component socket according to claim 3, wherein the time when the heat sink contacts the electrical component is delayed from the time when the latch member is moved in the closing direction to contact the electrical component. The operation member is disposed in the socket main body so as to be movable up and down, and the latch member and the lever member are rotated by the vertical movement of the operation member. Socket for electrical parts.

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