JP4630920B2 - IC socket - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION

  The present invention relates to an IC holding structure or an IC heat dissipation structure attached to an IC socket.

Conventional technology

  As the above-mentioned IC presser structure, as shown in Japanese Patent Publication No. 3-68513, there is known a structure in which one end of a presser cover is rotatably attached to one end of a socket body, and a presser member is provided on the presser cover to be rotatable. ing.

  However, in the IC socket, the assembly of the cover and the pressing member covers the upper surface and the periphery of the IC package so as to hinder the heat dissipation effect, and the problem of the warp of the cover caused by this heat is promoted and the pressing effect is reduced. Also, it is necessary to prepare covers with different dimensions for changing the size of the holding member.

  These drawbacks can be effectively eliminated by the structure in which the pressing member is rotatably supported by the bridge between the pair of parallel extending arms according to the present invention.

  Further, as known in Japanese Patent No. 2656901, as a heat dissipation structure of an IC package in an IC socket, one end of a presser cover is rotatably attached to one end of a socket body, and heat is dissipated in an opening formed in a central portion of the presser cover. A member is fixedly attached, and a portion protruding inward from the opening is brought into contact with the upper surface of the IC package.

  However, in the above IC socket, one end of the heat radiating member comes into contact with the upper surface of the IC package in advance as the cover is rotated downward, and the IC package rises up, the resulting positional displacement, and further the external contact of the IC package. Or, there is a problem that either contact deformation occurs.

  Furthermore, the assembly of the presser cover and the heat radiating member covers the upper surface and the periphery of the IC package widely, hindering the heat dissipation effect, promotes the problem of cover warping caused by this heat, and the poor contact of the heat radiating member with the upper surface of the IC package Cause the heat dissipation effect to deteriorate. In addition, a cover with different dimensions must be prepared for changing the size of the heat dissipation member.

  These drawbacks can be effectively eliminated by the structure in which the heat radiation member is rotatably supported by the bridge between the pair of arms extending in parallel according to the present invention.

  In addition, as shown in Japanese Patent Publication No. 6-105630, an actuator that moves vertically up and down with respect to the socket body to provide an IC package positioning lever and a socket that opens and closes a contact is widely used. An IC socket capable of effectively functioning a pressing member or a heat radiating member is provided.

The present invention provides an IC socket in which a pressing member is provided on a socket body, and an external contact of an IC package mounted on the socket body is press-contacted with a contact provided on the socket body by the pressing member. A presser structure that pressurizes the upper surface of the pair of arms, the support member is rotatably supported by a free end of a pair of arms extending in parallel, and the base ends of the pair of arms are attached to the socket body. The pair of arms and the pressing member rotate downward to press the upper surface of the IC package to form a pressing state, and the same pair of arms and the pressing member rotate upward to support the IC. An IC socket having a structure for forming a presser release state with respect to the upper surface of the package, and further comprising a latch that engages with the upper surface of the presser member and holds the presser state by the presser member To provide the door.
The latch is operated to an engagement position and an engagement release position in conjunction with an actuator described later. Further, the latch is operated to the engagement position and the engagement release position by guide means for guiding the movement in and out.

  This presser structure secures a sufficient heat radiation space between the pair of arms, and effectively solves the problem of the warp of the cover caused by the heat and the presser failure caused by the warp.

  In addition, the pair of arms can be assembled with an interval suitable for IC sockets having different sizes, so that it can be used to support holding members having different sizes, which is economical.

  Further, the present invention includes an actuator provided on the upper portion of the socket body so as to be movable up and down, and the presser member is rotated upward when the actuator is lowered to form a presser release state, and is rotated downward when the actuator is lifted. An IC socket for forming a state is provided.

  In the present invention, the actuator is provided with a central opening for allowing the IC package to be mounted on the socket body, and the presser member is rotated upward through the central opening when the actuator is lowered, so that the presser is released. Provided is an IC socket which is formed and has a structure for opening an IC package mounting space.

  With the above IC socket, the actuator can be moved up and down easily by the robot, and this actuator can be effectively operated on the presser member to exert its function appropriately, and the IC package can be socketed through the central opening of the actuator. The purpose of mounting on the main body can be achieved without hindrance.

Further, the present invention provides an IC socket having a heat radiating member that is in contact with the upper surface of an IC package mounted on the socket body to form a heat radiating state, wherein the heat radiating member is wound around the free ends of a pair of arms extending in parallel. The base end of the pair of arms is rotatably supported by the socket body, and the pair of arms and the heat dissipating member rotate downward to form the heat dissipating state. A latch that has a configuration in which the arm and the heat dissipating member rotate upward to form a heat dissipating release state, and further engages with the upper surface of the heat dissipating member to hold the contact state with the upper surface of the IC package by the heat dissipating member An IC socket comprising:
The latch is operated to an engagement position and an engagement release position in conjunction with an actuator described later. Further, the latch is operated to the engagement position and the engagement release position by guide means for guiding the movement in and out.

  This heat dissipation structure ensures a sufficient heat dissipation space between the pair of arms, and effectively solves the problem of the warp of the cover due to the heat and the press failure associated with the warp.

  In addition, the pair of arms can be assembled with an interval suitable for IC sockets having different sizes, which can be used to support heat radiating members having different sizes, which is economical.

  Further, the present invention includes an actuator provided on the upper portion of the socket body so as to be movable up and down, and the heat dissipating member is rotated upward when the actuator is lowered to form a heat release state for the IC package, and is rotated downward when the actuator is raised. An IC socket that provides the same heat dissipation state is provided.

  In the present invention, the actuator is provided with a central opening for allowing the IC package to be mounted on the socket body, and the heat dissipating member is turned upward through the central opening when the actuator is lowered to release the heat release state. Provided is an IC socket which is formed and has a structure for opening an IC package mounting space.

  With the above IC socket, the actuator can be operated up and down easily by the robot, and this actuator can be effectively operated on the heat radiating member so that its function can be exerted properly, and the IC package can be socketed through the central opening of the actuator. The purpose of mounting on the main body can be achieved without hindrance.

BEST MODE FOR CARRYING OUT THE INVENTION

  In FIG. 1 to FIG. 11, reference numeral 1 denotes a socket body made of an insulating material having a substantially rectangular shape in a plan view, 2 denotes an IC package, and the IC package 2 is mounted in an IC mounting space 3 formed at the center of the upper surface of the socket body 1. Then, the external contact 4 of the IC package 2 is brought into contact with the contact 5 held by the socket body 1.

  The IC package 2 has a large number of external contacts 4 on its bottom surface, and the external contacts 4 are formed of conductive balls, conductive foil, conductive protrusions, or the like.

  The other contact 5 is planted by being press-fitted into the bottom wall of the socket body 1 with an arrangement corresponding to the external contact 4, and has a contact piece 6 extending upward from the planted portion, and a bottom from the planted portion. And a terminal portion 7 projecting downward from the wall.

  The contact 5 is formed of an elongated conductive strip, and a contact piece 6 is formed at the upper part and a terminal part 7 is formed at the lower part.

  The contact piece 6 has a bent portion 8 that protrudes to one side, whereby it can bend elastically in the vertical direction and can be elastically bent sideways.

  An IC mounting base 9 for mounting the IC package 2 is provided in the IC mounting space 3, and the IC mounting base 9 is supported by a spring 10 so as to be vertically movable. Therefore, the IC mounting base 9 descends against the spring 10, rises due to the restoring force of the spring 10, and forms a standby state at a certain level.

  A plurality of through holes 11 corresponding to the contacts 5 and the external contacts 4 are provided in the IC mounting base 9, and the tips of the contacts 5, that is, the tips of the contact piece portions 6 are inserted into the through holes 11 from below. While the insertion depth is set so that the tip of the contact piece 6 does not protrude from the upper surface of the IC mounting base 9, the position is regulated by the inner wall of the through hole 11 to form an accurate correspondence state with the external contact 4.

  The IC package 2 is placed on the upper surface of the mounting base 9 while being guided by the ruler members 12 provided at the corners of the IC mounting base 9, thereby accurately connecting the tip portions of the contacts 5 and the external contacts 4. Oppose to.

  As shown in FIGS. 2 to 4 and FIGS. 6 to 8, when the IC package 4 placed on the upper surface of the mounting base 9 is pressed downward, the IC mounting base 9 is lowered together with the package 4.

  As a result, the tip of the contact 5 is abutted against the external contact 4, and as the IC package 2 and the IC mounting base 9 are lowered, a compressive force is applied to the contact piece 6, which resists elasticity and laterally. The tip of the contact piece 6 is elastically pressurized and brought into contact with the external contact 4 by the restoring force of the contact piece 6.

  As means for inviting and holding the pressure contact, a plurality of latches 13 engaged with the upper surfaces of the two opposite sides or the four sides of the IC package 2 and the latches 13 are operated to the engagement position and the engagement release position. And an actuator 14.

  The actuator 14 is mounted on the upper portion of the socket body 1 so as to be movable up and down, and has a central opening 15 corresponding to the IC mounting space 3 at the center thereof.

  In other words, as shown in FIGS. 1 and 5, the actuator 14 is formed by a frame-shaped member having a central opening 15, and the actuator 14 is elastically held by a spring 16 interposed between the socket body 1 and the actuator 14.

  For example, each corner portion of the frame-shaped member forming the actuator 14 is held by the spring 16. The actuator 14 descends vertically against the spring 16 and rises vertically by the restoring force of the spring.

  The latch 13 operates in the engaged position and the disengaged position in conjunction with the vertical movement of the actuator 14, and in this engaged position, the holding member 22 or the heat radiating member 23, the IC package 2, and the IC mounting base 9 described later. A pressing force is applied to each of the springs 10 and each of them is lowered against the spring 10.

  As a specific example, the latch 13 is arranged inside the frame wall of the frame-shaped member serving as the actuator 14, and the outer end of the latch 13 is rotatably supported on the frame wall of the actuator 14 by the connecting shaft 17, and the inner end Is supported by a slider 18 shown in FIGS.

  As an example of this free support structure, a pin 20 is provided through the inner end of the latch 13, and both ends of the pin 20 protrude from the side surface of the latch 13 to form the slider 18. The slider 18 is slid into a cam hole 21 provided in the socket body 1.

  The slider 18 and the cam hole 21 form guide means for guiding the movement of the inner end of the latch 13 inward and outward. The slider 18 can be provided on the socket body 1 side, and the cam hole 21 can be provided on the latch 13 side.

  As shown in FIGS. 4 and 8, when the actuator 14 is raised, the outer end of the latch 13 is pulled up by the connecting shaft 17 along with this, and at the same time, the inner end of the latch 13 is connected to the slider 18 and the cam hole. 21 is guided to 21 and pivots downward while moving into the IC mounting space 3, whereby the locking claw 19 is superimposed on the upper surface of the IC package 2, and the upper edge of the presser member 22 or the heat radiating member 23 described later. While engaging, the three parties 22, 2, 9 or 23, 2, 9 are pushed down against the spring 10, and the contact between the contact 5 and the external contact 4 is obtained.

  As shown in FIGS. 12 and 13, the pressing member 22 is supported by a shaft 26 so as to be rotatable and bridged between free ends of a pair of arms 24 and 25 extending in parallel at the center thereof. The base end portions of 24 and 25 are rotatably supported on one end of the socket body 1 by a shaft 27. The arms 24 and 25 are biased downward by a spring 31 in the downward rotation direction.

  Further, as shown in FIGS. 5 to 8, the heat radiating member 23 is rotatably supported by a shaft 26 between free ends of a pair of arms 24 and 25 extending in parallel, and the base of the arms 24 and 25 is supported. An end is rotatably supported on one end of the socket body 1 by a shaft 27. The arms 24 and 25 are urged downward by a spring 31 in the downward rotation direction.

  Preferably, the pressing member 22 and the heat radiating member 23 are supported by a shaft 26 so as to be freely movable. For example, both ends of the shaft 26 are loosely engaged with holes 28 provided at the free ends of the arms 24 and 25 so that the pressing member 22 or the heat radiating member 23 can freely move within the range allowed by the holes 28. As shown in FIGS. 1 to 4, the actuator 14 is provided at the top of the socket body 1 so as to be movable up and down, and the presser member 22 is rotated upward when the actuator 14 is lowered to form a presser release state. When it is lifted, it is turned downward to form a presser state.

  Similarly, the heat dissipating member 23 is rotated upward when the actuator 14 is lowered to form a heat releasing state with respect to the IC package 2, and is rotated downward when the actuator 14 is lifted to form the heat dissipating state.

  As described above, the actuator 14 has the central opening 15 for allowing the IC package 2 to be mounted in the IC mounting space 3 of the socket body 1. The pressing member 22 shown in FIGS. When the door 14 is lowered, it is turned upward through the central opening 15 to form the presser release state, and the mounting space 3 of the IC package 2 is opened.

  Similarly, the heat dissipating member 23 shown in FIGS. 5 to 8 is rotated upward through the central opening 15 when the actuator 14 is lowered to form the heat dissipating state and to open the mounting space 3 of the IC package 2.

  As described above, in conjunction with the vertical movement of the actuator 14, the arms 24 and 25 rotate up and down around the shaft 27, and at the same time, the presser member 22 or the heat dissipation member 23 rotate up and down.

  As means for linking the actuator 14 and the arms 24, 25, for example, a pressure receiving portion 29 is provided so as to project from the base ends of the arms 24, 25, and the pressure receiving portion 29 corresponding to the pressure receiving portion 29 is provided on the frame wall of the other actuator 14. 3 and 7, when the frame wall of the actuator 14 is pushed down by the robot or fingers and lowered, the pressure unit 30 pushes down the pressure receiving unit 29, thereby 2, As shown in FIG. 6, the arms 24 and 25 are turned upward together with the presser member 22 and the heat radiating member 23 against the spring 31 to form a substantially upright state. The rotation angles of the arms 24 and 25 are set to approximately 90 degrees.

  The arms 24 and 25 have their outer surfaces in the vicinity of the shaft support part abutting against the inner surface of the central opening 15 of the actuator 14, that is, the inner surface of the frame wall forming the central opening, and are prevented from rotating, thereby maintaining the upright state. As a result, the IC mounting space 3 is almost completely opened, and the IC package 2 can be easily attached and detached in the vertical direction.

  3, 4, 7, and 8, when the pressing force applied to the frame wall of the actuator 14 by the robot or fingers is released, the actuator 14 is automatically raised by the spring 16, The non-arms 24 and 25 are rotated downward together with the holding member 22 and the heat radiating member 23 by the tensile force and the own weight of the spring 31, and the holding member 22 or the heat radiating member 23 overlaps the upper surface of the IC package 2.

  On the other hand, the outer end of the latch 13 is pulled upward in conjunction with the raising of the actuator 14, and the latching claw 19 provided at the inner end of the latch 13 is rotated downward while protruding into the IC mounting space 3. The holding member 22 engages with the upper surface edge of the holding member 22 or the upper surface edge of the heat radiating member 23, and the holding member 22 or the heat radiating member 23 and the IC package 2 as the locking claw 19 rotates downward. A pressing force is applied to the IC mounting base 9 and the IC mounting base 9 is lowered against the spring 10. As a result, pressure contact between the external contact 4 and the contact 5 is obtained.

  1 to 8 exemplify the case where one holding member 22 and one heat radiating member 23 are provided, but FIGS. 9 to 11 include two holding members 22 and two heat radiating members 23. An IC socket is illustrated. In this case, two pairs of the arms 24, 25 are used, and the base ends of the pair of arms 24, 25 are rotatably supported on one end of the socket body 1 by the shaft 27, and the other pair of arms 24, 25 are supported. The base end of 25 is rotatably supported on the other end of the socket main body 1 by the shaft 27, and the pair of pressing members 22 or the heat radiating member 23 are bridged and supported between the free ends of each pair of arms 24 and 25, respectively.

  As the actuator 14 moves up and down, the pair of arms 24 and 25 are turned up and down by being pushed down or released by the frame walls on the opposite sides of the actuator 14. The structure of each pair of arms and the interlocking structure of the actuator 14 are as described above.

  14 and 15, when the arms 24 and 25 are rotated downward to cause the pressing member 22 or the heat radiation member 23 to act on the IC package 2, the free ends of the arms 24 and 25 rotated downward are locked by the lock lever 32. An example is shown in which the holding state by the pressing member 22 or the heat releasing state by the heat radiating member 23 is held by engaging with the socket body 1.

  The lock lever 32 is pivotally supported on the arms 24 and 25 or pivotally supported on the socket body 1 and is urged in the engaging direction by a spring, so that the arms 24 and 25 are moved to the spring 34. When locked down, the locking state by the lock lever 32 is automatically formed.

  The lock lever 32 presses the pressure receiving portion 33 when the actuator 14 described above is lowered to release the locking. As a result, the arms 24 and 25 rotate upward according to the elasticity of the spring 34 to open the IC mounting space 3.

  14 and 15, the arms 24 and 25 and the pressing member 22 or the heat radiating member 23 can also be configured to rotate up and down through the central opening 15 of the actuator 14.

  5 to 9 illustrate the case where the heat radiating member 23 is provided on the pressing member 22. In other words, the case where both the pressing member 22 and the heat radiating member 23 are attached to the socket body 1 via the arms 24 and 25 so as to be vertically rotatable is illustrated. Each corner portion of the heat radiating member 23 is integrally assembled to each corner portion of the holding member 22 by a screw 35, and the spring 36 wound around the screw 35 is elastically held so as to press the heat radiating member 23 against the holding member 22. The heat radiating member 23 is movable against the spring 36 in a direction away from the presser member 22.

  The pressing member 22 has a central opening 37, and the heat radiating member 23 has a heat receiving land portion 38 protruding from the central opening 37 through the central opening 37 in pressure contact with the central portion of the upper surface of the IC package 2. .

  As shown in FIG. 8, when the arms 24 and 25 are rotated downward, as shown in FIGS. 2 to 4, the pressing member 22 is rotated downward and presses the peripheral edge of the upper surface of the IC package 2 downward. At the same time, the heat receiving land portion 38 of the heat radiating member 23 comes into pressure contact with the central portion of the upper surface where the IC chip of the IC package 2 is embedded.

  That is, the latch 13 engages with the upper edge of the pressing member 22 and presses the pressing member 22 downward by the restoring force of the spring 16, so that the pressing member 22 comes into pressure contact with the upper edge of the IC package 2. At the same time, the heat receiving land portion 38 of the heat radiating member 23 comes into pressure contact with the center of the upper surface of the IC package 2 by the spring 36. At this time, the heat radiating member 23 is moved upward while compressing the spring 36, and the pressure contact force on the upper surface of the IC package 2 is increased by the restoring force of the spring 36.

  Next, FIGS. 16 and 17 illustrate the case where the arms 24 and 25 that support the presser member 22 or the heat radiating member 23 and the actuator 14 are connected to each other via a link 39.

  As shown in the figure, the arms 24 and 25 are rotatably supported on the socket body 1 via the shaft 27, and the rear ends of the arms 24 and 25 protruding from the shaft 27 are connected to one end of the link 39 via the shaft 40. The other end of the link 39 is loosely engaged with a long hole 42 provided in the frame wall of the actuator 14 by a shaft 41.

  As shown in FIG. 16, when the actuator 14 is raised, the shaft 39 is pulled upward by the lower end of the long hole 42, and the link 39 is pulled upward via the shaft 41, and the arm 24 is associated therewith. 25, the rear ends of the arms 24, 25 are pulled upward, and as a result, the free ends of the arms 24, 25 and the holding member 22 or the heat radiating member 23 are rotated downward with the shaft 27 as a fulcrum, and are in pressure contact with the upper surface of the IC package 2. To do.

  17, when the actuator 14 is lowered against the spring 16, the shaft 39 is pushed down by the upper end of the long hole 42, while the link 39 is pushed down through the shaft 41. As a result, the arms 24, The free end side 25 and the pressing member 22 or the heat radiating member 23 are rotated against the spring 31 with the shaft 41 as a fulcrum, and are raised through the central opening 15 of the actuator 14 to open the IC package mounting space 3.

  As described above, in the conventional IC socket, the assembly of the cover and the holding member or the heat radiating member covers the upper surface and the periphery of the IC package so as to hinder the heat radiation effect, and the problem of the warp of the cover caused by this heat is promoted. Reduce effect. Also, a cover with different dimensions must be prepared for changing the size of the holding member or the heat radiating member.

  These disadvantages can be effectively eliminated by the structure in which the pressing member or the heat radiating member is rotatably supported by the bridge between the pair of parallel extending arms according to the present invention.

  That is, a sufficient heat radiation space is secured between the pair of arms, and the problem of the warp of the cover due to the heat, the presser failure due to the warp or the heat radiation failure is effectively solved.

  In addition, the pair of arms can be assembled with an interval suitable for IC sockets of different sizes, so that it can be used to support holding members or heat dissipation members of different sizes, which is economical.

  Further, as known in Japanese Patent No. 2656901, as a heat dissipation structure of an IC package in an IC socket, one end of a presser cover is rotatably attached to one end of a socket body, and heat is dissipated in an opening formed in a central portion of the presser cover. A member is fixedly attached, and a portion protruding inward from the opening is brought into contact with the upper surface of the IC package.

  However, in the above IC socket, one end of the heat radiating member comes into contact with the upper surface of the IC package in advance as the cover is rotated downward, and the IC package rises up, the resulting positional displacement, and further the external contact of the IC package. Or, there is a problem that either contact deformation occurs.

  This disadvantage can be effectively eliminated by the structure in which the heat radiating member is rotatably supported by the bridge between the pair of parallel extending arms according to the present invention.

  As described above, as disclosed in Japanese Patent Publication No. 6-105630, an actuator that moves vertically up and down with respect to the socket body to provide an IC package positioning lever and a socket that opens and closes a contact is widely used. While holding the IC package properly through the central opening of the actuator in cooperation with the vertically moving actuator, the holding member and the heat radiating member can effectively achieve the holding purpose and the heat radiating purpose.

The top view of IC socket provided with the pressing member. Sectional drawing of IC socket which shows the open state of a pressing member. Sectional drawing which shows the state before the press which the holding member rotated below, and was piled up on the upper surface of IC package, and the state just before engagement of a latch. Sectional drawing of IC socket which shows the state which the latch engaged with the pressing member and the pressing member pressed the IC package. The top view of IC socket provided with the pressing member and the heat radiating member. Sectional view of IC socket showing open state of presser member and heat dissipation member Sectional drawing which shows the state in which the holding member and the heat radiating member were rotated below, and were piled up on the upper surface of IC package, and the state just before engagement of a latch. Sectional drawing of IC socket which shows the state which the latch engaged with the assembly of the pressing member and the heat radiating member, and the heat radiating member and the pressing member pressed the IC package. The top view of IC socket which shows the example which provided a pair of pressing member or a heat radiating member. Sectional drawing of IC socket which shows the open state of the pressing member or heat radiating member in the said FIG. FIG. 11 is a cross-sectional view of an IC socket showing a presser state in FIG. 10. The perspective view which shows the arm structure which supports a pressing member or a heat radiating member. Sectional drawing of the axial support part of the pressing member or heat radiating member in the said arm structure. The side view which shows an example of the lock structure of the said arm. The side view which shows the other examples of the lock structure of the said arm. It is sectional drawing which shows the other example of the interlocking structure of the said arm and actuator, and shows the downward rotation state of an arm. It is sectional drawing which shows the upward rotation state of the arm in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Socket body 2 IC package 3 IC mounting space 4 IC external contact 5 Contact 6 Contact contact piece part 7 Contact terminal part 8 Contact bending part 9 IC mounting base 10 IC mounting base support spring 11 IC mounting base through-hole 12 IC mounting base ruler Member 13 Latch 14 Actuator 15 Center opening 16 Actuator support spring 17 Latch connecting shaft 18 Slider 19 Locking claw 20 Pin 21 Cam hole 22 Presser member 23 Heat dissipation member 24 Arm 25 Arm 26 Shaft (For holding member and heat dissipation member rotation)
27 axes (for arm rotation)
28 Long hole 29 Arm pressure receiving portion 30 Pressurizing portion 31 Spring 32 Lock lever 33 Lock lever pressure receiving portion 34 Opening spring 35 Screw 36 Spring 37 Central opening 38 Heat receiving land portion 39 Link 40 Shaft 41 Shaft 42 Long hole

Claims (9)

An IC socket in which a pressing member is provided on the socket body, and an external contact of the IC package mounted on the socket body is brought into pressure contact with a contact provided on the socket body by the pressing member. It has a presser foot structure that pressurizes, and supports the presser member to the free ends of a pair of arms that extend in parallel, so that it can be pivotally supported, and the base ends of the pair of arms can be pivoted to the socket body. The pair of arms and the pressing member rotate downward to press the upper surface of the IC package to form a pressing state, and the pair of arms and the pressing member rotate upward to rotate the upper surface of the IC package. And a latch for engaging the upper surface of the presser member and holding the presser state by the presser member. C socket. An actuator provided on the upper part of the socket main body so as to be movable up and down, and configured to operate the latch to the engaging position in conjunction with the raising of the actuator and to the engagement releasing position in conjunction with the lowering of the actuator. The IC socket according to claim 1, further comprising: 2. A guide means for guiding the movement of the latch in and out, wherein the latch is moved in and out by the guide means and is operated to the engagement position and the engagement release position. The IC socket as described. An actuator is provided on the upper portion of the socket body so as to be movable up and down, the actuator has a central opening for allowing the IC package to be mounted on the socket body, and the pair of arms and the holding member are provided on the actuator body. When the actuator is lowered, it is turned upward through the central opening to form the presser release state, and the IC package mounting space is released. When the actuator is raised, the actuator is turned downward to form the presser state. The IC socket according to claim 1. 2. The IC socket according to claim 1, wherein a central opening is provided in the pressing member, and a heat radiating member is provided through the central opening to come into contact with the central portion of the upper surface of the IC package. In an IC socket having a heat radiating member that contacts a top surface of an IC package mounted on the socket body to form a heat radiating state, the heat radiating member is rotatably bridged to the free ends of a pair of arms extending in parallel. The pair of arms and the base end of the pair of arms are rotatably supported by the socket body, the pair of arms and the heat dissipating member rotate downward to form the heat dissipation state, and the same pair of arms and heat dissipate. The member has a configuration in which the member rotates upward to form a heat release cancellation state, and further includes a latch that engages with the upper surface of the heat dissipation member and maintains the contact state of the heat dissipation member with the upper surface of the IC package. IC socket. An actuator provided on the upper part of the socket main body so as to be movable up and down, and configured to operate the latch to the engaging position in conjunction with the raising of the actuator and to the engagement releasing position in conjunction with the lowering of the actuator. 7. The IC socket according to claim 6, further comprising: 7. The apparatus according to claim 6, further comprising guide means for guiding the movement of the latch inward and outward, wherein the latch is moved to the engagement position and the disengagement position while being moved inward and outward by the guide means. The IC socket as described. An actuator is provided on the upper portion of the socket body so as to be movable up and down, the actuator has a central opening for allowing the IC package to be mounted on the socket body, and the pair of arms and the heat radiating member are provided on the actuator body. When the actuator is lowered, it is rotated upward through the central opening to form the heat dissipation release state, and the mounting space for the IC package is opened. When the actuator is raised, the actuator is turned downward to form the heat dissipation state. The IC socket according to claim 6.

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