JPH0770648B2 - IC / Socket - Google Patents

Description

[Detailed Description of the Invention] [Outline] Regarding the structure of an IC socket that accommodates an IC package, an IC package mounting portion is provided for the purpose of labor saving in the operation of bringing a heat radiation fin into and out of contact with the IC package. A base provided with a contact whose flexible end comes into contact with an external connection terminal of an IC package mounted on the mounting portion, and a rotatable lid that overlaps with an upper surface of the base supported on one side of the base. A body and a fin for heat dissipation supported by the lid and swingable, and the fin has a contact surface that comes into contact with the upper surface of the IC package when the lid is overlaid on the base. Characterized in that locking means is provided between the base body and the lid body for locking the lid body in a state of being superposed on the base body, and the IC package has a thickness thereof. A pair of through-holes having different diameters and penetrating in the direction, The body constitutes characterized by a pair of pins the pair of through holes is fitted is formed by implanted.

[Industrial application field]

The present invention relates to a structure of an IC socket having a fin for heat dissipation that comes into contact with the upper surface of the IC package body, and in particular, the fin is provided on a lid body supported on one side of a base body for housing the IC package, and the lid body is provided. The present invention relates to an IC / socket structure in which fins are brought into contact with and separated from an IC / package mounted on a base body by opening / closing.

[Conventional technology]

Although a user needs to take appropriate heat dissipation measures even though fins for heat dissipation are required, it is necessary to temporarily attach removable fins to ICs and packages that do not have fins before shipping when checking the characteristics.

Conventionally, ICs and packages that are shipped without fins are
In general, a columnar protrusion for mounting fins is provided in the center of the upper surface of the package body, a fin having a hole that fits into the protrusion is mounted to check predetermined characteristics, and the fin is removed after completion of the check.

FIG. 7 is a block diagram of a conventional IC socket. In the figure, the IC package 1 has a plurality of external connection terminals (pads) formed on the peripheral edge of the lower surface of the main body, and a columnar protrusion 2 projects from the central portion of the upper surface of the main body. The IC socket 3 in which the IC package 1 is mounted at a fixed position by using the corner portion of the rectangular IC package 1 has a plurality of L-shaped contacts 5 each having one end facing each of the connecting terminals, and the insulating base body 4.
IC package 1 mounted on the base 4
Is fixed by a frame-shaped lid 6, and the IC package 1
A fin 7 provided with a fitting hole 8 for the protrusion 2 is mounted on the upper surface of the.

[Problems to be Solved by the Invention]

As explained above, conventional ICs with no fixed fins
The package 1 requires the troublesome work of attaching and removing the fins 7 when checking the characteristics, and
There is a problem that the columnar protrusion 2 increases the required volume during storage and packaging at the time of shipping.

Although the IC package 1 has the protrusions 2 for mounting the fins 7, the IC package not having the protrusions 2 is
Since it is necessary to fix the mounted fins 7 by some means so as not to shift the fins 7, mounting the fins 7 becomes more troublesome than the IC package 1 having the protrusions 2.

An object of the present invention is to eliminate the work required for attaching and detaching the fins, to save the labor of testing the IC package, and to reduce the accommodation volume of the IC package by eliminating the protrusion protruding from the IC package. That is.

[Means for Solving the Problems]

According to FIG. 1 showing the embodiment of the present invention,
Contact 14 whose flexible end contacts the package mounting part 13 and the external connection terminal of the IC / package 25 mounted on the mounting part 13.
A base body 12 provided with, a rotatable lid body 16 supported on one side of the base body 12 so as to overlap the upper surface of the base body 12, and a heat radiation fin 19 supported by the lid body 16 and swingable. The fin 19 has a contact surface 32 that comes into contact with the upper surface of the IC package 25 in a state where the lid body 16 is placed on the base body 12. The base body 12 has a pair of pins (one positioning means) 20 and 21. Through-holes (other positioning means) 29, 30 that fit pins 20, 21 in the carrier 26 in which the IC package 25 is mounted
This is achieved by the IC / socket 11 characterized in that a locking means (hook) 23 is provided between the lid body 12 and the lid body 16 so as to lock the lid body 16 in a state of being superposed on the base body 12. To be done.

[Action]

According to the above-mentioned means, the fin can be opened / closed by opening / closing the lid.
It comes close to the package. Therefore, the conventional cumbersomeness of handling the fins separately from the operation of housing (fixing) the IC package in the IC socket is eliminated, and the labor of testing the IC package can be saved.

〔Example〕

An IC / socket according to an embodiment of the present invention will be described below with reference to the drawings.

1 (a) and (b) are side views of an IC / socket according to an embodiment of the present invention, and FIG. 2 is a plan view (a) and a bottom view (b) of the socket base body shown in FIG. Figure 3 shows the IC shown in Figure 1.
An enlarged cross-sectional view of the package mounting portion, and FIG. 4 is a plan view of an IC package with a carrier housed in the IC socket shown in FIG.

In FIG. 1, the IC socket 11 is an insulating substrate 12 in which a plurality of contacts 14 are planted in an IC package mounting portion 13.
An insulating lid 16 which is supported by a shaft 15 provided on one side (right side) of the base body 12 and is rotatable, and a fin 19 which is swingable supported by a shaft 18 provided in a central portion of the lid 16, Package 25 (Carrier
26) in a fixed position, a pair of pins (one positioning means) 20, 21 planted in the base 12 and the base 16 and the cover 16 when the cover 16 is closed so as to overlap the base 12. It comprises a hook (locking means) 23 supported on the base 12 by a shaft 22 for locking the and.

The base 12 and the lid 16 are formed by molding plastic, and the lid 16 is provided with a rectangular through hole 17 facing the IC / package 25 mounted on the mounting portion 13 of the base 12, and the center of the through hole 17 is shown. The diameter of the through hole 31 of the lid body 16 mixed with the shaft 18 that traverses in the thickness direction of the paper is a size that allows the shaft 18 to pass through with a margin,
As a result, the fins 19 are properly loosened and
It is supported by the lid body 16 via 18.

External connection terminals (pads) are formed on the peripheral edge of the bottom surface.
The IC package 25 is mounted on the mounting portion 13 while being mounted on the carrier 26. However, as shown in FIG. 4, the plate carrier 26 made of ceramic or the like is provided in the recess 27 for housing the IC package 25. The corners fit loosely into the corners of the IC / package 25, and multiple rectangular through holes 28 are opened in the recess 27 to expose the external connection terminals formed on the bottom surface of the IC / package 25. Through holes 29, 30 are formed on one diagonal of the carrier 26 so that a pair of pins 20, 21 having different diameters can be fitted therein without loosening.

The IC / socket 11 configured in this way is shown in FIG.
When the lid 16 is opened and the IC / package 25 is mounted on the mounting portion 13 of the substrate 12 together with the carrier 26, the pins 20 and 2 are
1 fits into the through holes 29,30
25 is positioned.

In the IC / socket of the present invention, the heat radiation fin 19 is pressed against the IC / package 25 to radiate heat.However, if the IC / package 25 is not correctly positioned, the IC / package 25 will be pressed when the heat radiation fin 19 is pressed. Unnecessary stress may be added. The positioning means of the embodiment of the present invention eliminates such troublesome positioning.

Now, when the lid 16 is closed so that the lid 16 overlaps the substrate 12, the hook 23 urged by a coil spring (not shown)
As shown in FIG. 1 (B), the tip of the fin locks the tip of the lid body 16 and the lower end surface (contact surface) of the fin 19 from which the plurality of heat dissipation plates 31 project upward. 32 presses the upper surface of the IC / package 25, and the external connection terminals formed on the lower surface of the IC / package 25 come into contact with the opposing contacts 14 with an appropriate contact force.

2 and 3, at the center of the upper surface of the base 12 that supports the pair of shafts 15 and 22, there is provided a base plate 34 that can be moved up and down by the repulsive force of the coil spring 33 housed in the base 12. ,
The contacts 14 arranged on four sides of the base plate 34 integrally have a protruding end 14b protruding upward from one end of the U-shaped intermediate portion 14a and a hanging lower end 14c penetrating the base 12.

The base plate 34 is provided with a pair of hanging pieces 35 for preventing removal, and the tip of the hanging piece 35 penetrating the base body 12 is adapted to engage with the lower surface of the base body 12, and the hanging lower end 14c of the contact 14 depending from the base body 12. Is
Two types that hang down from the tip of the U-shaped intermediate portion 14a and those that hang down from the middle of the U-shaped intermediate portion 14a are alternately arranged, so that the hanging lower end 14c hangs down in a staggered manner.

Therefore, when the carrier 26 on which the IC / package 25 is mounted is mounted on the IC / package mounting portion 13, the lid 16 is stacked on the base 12, and the contact surface 32 of the fin 19 presses the IC / package 25, The IC package 25 is sandwiched between the fin 19 and the base plate 34, and the protruding end 14b of the contact 14 inserted into the through hole 28 of the carrier 26 has a U-shaped intermediate portion 14a.
Due to the pressure generated by the elastic deformation of, the external connection terminals of the IC / package 25 come into contact with each other.

In FIG. 2, protrusions 36 with which the lower surface of the carrier 26 abuts are provided at the four corners of the base plate 34, and through holes 37 with seats formed at four positions of the substrate 12 are provided when the substrate 12 is fixed at predetermined positions. Used.

FIG. 5 is a plan view of an IC / socket base body according to another embodiment of the present invention, and FIG. 6 is an enlarged bottom view of an IC / package mounted on the base body shown in FIG.

In FIG. 5, a base 41 corresponding to the base 12 is provided with a vertically movable base plate 34 in the central portion, and a plurality of contacts are provided on each side.
A pair of pins 42 and 43 having different diameters are planted on the base plate 34 on which 14 is arranged for positioning the mounted IC / package.

In FIG. 6, each contact 14 when mounted on the base 41
IC with external connection terminal (pad) 46 that contacts
The package 45 is provided with a pair of through holes 47 and 48 into which the pair of pins 42 and 43 fit without loosening.

The base body 41 and the IC package 45 are mounted on the base body 41 without using the carrier (26), so that the contact 14 and the external connection terminal 46 are aligned with each other without deviation due to the carrier. It becomes accurate by not including it, and is particularly useful when applied to the IC package 45 in which the external connection terminals 46 are formed with high density.

〔The invention's effect〕

As described above, in the IC socket according to the present invention, the fin for heat dissipation comes into contact with the IC package by the operation of the lid that houses the IC package, and the fin is removed by the operation of the lid that takes out the IC package. Since it is away from the IC, the conventional troublesome work of handling the fins separately from the operation of accommodating the IC package in the IC socket is eliminated, and the effect of saving labor for the IC package test work is remarkable.

[Brief description of drawings]

1 is an IC / socket according to one embodiment of the present invention, FIG. 2 is a socket base body shown in FIG. 1, FIG. 3 is an IC / package mounting portion shown in FIG. 1, and FIG. 4 is FIG. 5 shows an IC package with a carrier, FIG. 5 shows a socket base according to another embodiment of the present invention, FIG. 6 shows an IC package mounted on the base shown in FIG. 5, and FIG. 7 shows a conventional IC socket. It is a basic configuration diagram. In the figure, 11 is an IC / socket, 12, 41 is a base, 13 is an IC / package mounting portion, 14 is a contact, 16 is a lid, 17 is a through hole of the lid, 19 is a fin, 20, 21, 42. , 43 are IC / package positioning pins (one of the positioning means), 23 are hooks (locking means), 25 and 45 are IC / packages, and 29 and 30 are IC / package positioning through holes (the other of the positioning means). ), 32 is the contact surface of the fin, and 47, 48 are the through holes of the IC / package.

Claims (2)

[Claims] 1. An IC / package mounting portion (13) and a contact (14) whose flexible end contacts an external connection terminal of the IC / package (25, 45) mounted on the mounting portion (13). A base body (12, 41), a lid body (16) supported on one side of the base body (12, 41) and overlapping with an upper surface of the base body (12, 41) and rotatable, and the lid body (12). 16) is provided with a fin (19) for heat dissipation supported by and swingable, and the fin (19) is provided with the lid body (16) on the base body (12, 41). A contact surface (32) for contacting the upper surface of the package (25, 45) is provided, and the lid body (1) is provided between the base body (12, 41) and the lid body (16).
An IC / socket characterized by comprising a locking means (23) for locking 6) on the base body (12, 41) in a stacked state. 2. The IC package (45) is provided with a pair of through holes (47, 48) penetrating in the thickness direction thereof and having different diameters, and the base (41) is provided with the pair of through holes (47, 48). The IC socket according to claim 1, wherein a pair of pins (42, 43) into which the (47, 48) are fitted are planted.