KR100479912B1 - Absorption die of solder ball for bga package - Google Patents

Absorption die of solder ball for bga package Download PDF

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KR100479912B1
KR100479912B1 KR1019970041583A KR19970041583A KR100479912B1 KR 100479912 B1 KR100479912 B1 KR 100479912B1 KR 1019970041583 A KR1019970041583 A KR 1019970041583A KR 19970041583 A KR19970041583 A KR 19970041583A KR 100479912 B1 KR100479912 B1 KR 100479912B1
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solder ball
package
solder
adsorption
die
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KR1019970041583A
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Korean (ko)
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KR19990018407A (en
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안지수
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삼성테크윈 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

비지에이 패키지용 땜납볼 흡착다이가 개시된다. 이 비지에이 패키지용 땜납볼 흡착다이는 비지에이 패키지에서 반도체칩이 탑재되어 와이어본딩되는 인쇄회로기판의 일측면에 접착되는 복수개의 땜납볼을 흡착고정시키는 것으로, 복수개의 진공홀이 형성된 본체와, 상기 본체에 결합되며 상기 진공홀을 통하여 작용하는 진공압에 의해 땜납볼이 흡착고정되는 복수개의 땜납볼 수용홈이 형성된 것으로, 소정 범위 내에서 탄성변형하는 재질로 이루어진 흡착부재를 포함하여 이루어진다.Disclosed is a solder ball adsorption die for a busy package. The solder ball adsorption die for the BG package is to fix and fix a plurality of solder balls adhered to one side of a printed circuit board on which a semiconductor chip is mounted and wire-bonded in the BG package. A plurality of solder ball accommodating grooves are coupled to the main body and the solder ball is sucked and fixed by the vacuum pressure acting through the vacuum hole, and includes an adsorption member made of a material that elastically deforms within a predetermined range.

Description

비지에이(ＢＧＡ) 패키지용 땜납볼 흡착다이{Absorption die of solder ball for BGA package}Absorption die of solder ball for BGA package}

본 발명은 비지에이(BGA) 패키지용 땜납볼 흡착다이에 관한 것으로서, 상세하게는 비지에이 패키지의 제조과정에서 반도체칩이 탑재되며 와이어본딩되는 인쇄회로기판에 다수개의 땜납볼을 장착하기 위한 것으로, 복수개의 땜납볼을 안정적으로 흡착 고정할 수 있도록 개선된 비지에이 패키지용 땜납볼 흡착다이에 관한 것이다.The present invention relates to a solder ball adsorption die for a BGA package, and more particularly, to mount a plurality of solder balls on a printed circuit board on which a semiconductor chip is mounted and wire-bonded in the manufacturing process of the BGA package. The present invention relates to a solder ball adsorption die for a busi package that is improved to stably adsorb and fix a plurality of solder balls.

통상적으로 반도체 패키지는 구조나 기능에 따라 칩 온 리드(chip on lead, COL) 패키지, 리드 온 칩(lead on chip, LOC) 패키지, 비지에이(BGA) 패키지등 여러 가지 형태가 이용된다. 상술한 반도체 패키지 중 비지에이 패키지는 다른 패키지에 비해서 실장밀도가 증가된 것으로, 최근에 반도체칩이 고집적화됨에 따라 이용이 확산되고 있다. In general, various types of semiconductor packages may be used, such as a chip on lead (COL) package, a lead on chip (LOC) package, a BGA package, and the like. Among the above-mentioned semiconductor packages, the BG package has an increased mounting density compared to other packages, and as the semiconductor chips have been highly integrated in recent years, their use has been expanded.

도 1은 통상적인 비지에이(BGA) 패키지의 일예를 도시한 단면도이다. 1 is a cross-sectional view showing an example of a typical BGA package.

이 비지에이 패키지는 반도체칩(11)과, 이 반도체칩(11)이 탑재되어 와이어본딩되는 것으로, 소정 패턴의 배선(12)이 형성된 인쇄회로기판(13) 및 외부로부터 전기적신호를 인쇄회로기판(12)에 형성된 배선에 전달하는 것으로, 인쇄회로기판(13)의 일측면에 접착된 땜납볼(14)을 포함하여 된다. 그리고, 통상적으로 반도체칩(11)과, 이 반도체칩(11)과 와이어본딩이 이루어진 인쇄회로기판(13)의 부위는 몰딩수지(15)로 몰딩되어 보호된다. The package is a semiconductor chip 11, the semiconductor chip 11 is mounted and wire-bonded, the printed circuit board 13 having a predetermined pattern of wiring 12 and the electrical signal from the outside printed circuit board It is transmitted to the wiring formed in (12), and includes the solder ball 14 bonded to one side of the printed circuit board (13). In general, portions of the semiconductor chip 11 and the printed circuit board 13 on which the semiconductor chip 11 is wire bonded are molded and protected by the molding resin 15.

도 2는 상술한 바와 같은 비지에이 패키지의 제조과정 중에서 종래의 비지에이 패키지용 땜납볼 흡착다이에 의해 인쇄회로기판에 땜납볼이 배치되는 상태를 도시한 단면도로서, 앞서 도시된 도면에서와 동일한 참조번호는 동일한 구성요소를 가르킨다. FIG. 2 is a cross-sectional view illustrating a state in which solder balls are disposed on a printed circuit board by a conventional BB package solder ball adsorption die during a manufacturing process of a BG package as described above. FIG. Numbers refer to the same component.

도면에 도시된 바와 같이, 인쇄회로기판(13)의 일측면에는 땜납마스크층(21)이 형성되어 있고, 이 땜납마스크층(21)에는 복수개의 땜납볼(14)이 접착되는 곳으로, 인쇄회로기판(13)에 형성된 배선(12)과 전기적으로 연결된 복수개의 땜납볼 안착부(22)가 마련된다. 그리고, 비지에이 패키지용 땜납볼 흡착다이(23)가 인쇄회로기판(13)의 상부에 위치하여 인쇄회로기판(13)에 마련된 땜납볼 안착부(22)에 땜납볼(14)을 각각 접착시키게 된다. 이를 상세히 설명하면, 통상적으로 비지에이 패키지용 땜납볼 흡착다이(23)에는 복수개의 땜납볼(14)이 각각 수용되는 땜납볼 수용홈(24)이 형성되고, 이 땜납볼 수용홈(24)에는 소정의 진공압이 작용하는 진공홀(25)이 연결되어 땜납볼 수용홈(24)에 수용된 땜납볼(14)을 흡착 고정시킨다. 그리고, 땜납볼 흡착다이(23)가 인쇄회로기판(13)에 상부에 위치하여 땜납볼 안착부(22)에 대하여 땜납볼 수용홈(24)에 흡착고정된 땜납볼(14)의 위치가 정렬되면, 진공홀(25)을 통하여 땜납볼(14)에 작용하는 진공압이 제거되어 땜납볼(14)이 땜납볼 안착부(22)에 각각 배치된다. 그리고, 땜납볼(14)에 소정의 온도를 가해지면 땜납볼(14)의 표피층이 융해되어 인쇄회로기판(13)에 형성된 땜납볼 안착부(22)에 접착된다.As shown in the figure, a solder mask layer 21 is formed on one side of the printed circuit board 13, where a plurality of solder balls 14 are bonded to the solder mask layer 21, A plurality of solder ball seating portions 22 electrically connected to the wiring 12 formed on the circuit board 13 are provided. Then, the solder ball adsorption die 23 for the busy package is positioned above the printed circuit board 13 to bond the solder balls 14 to the solder ball seating portions 22 provided on the printed circuit board 13. do. In detail, the solder ball adsorption die 23 for the BGA package generally includes a solder ball accommodating groove 24 in which a plurality of solder balls 14 are accommodated, and the solder ball accommodating groove 24 is formed in the solder ball accommodating die 23. A vacuum hole 25 to which a predetermined vacuum pressure acts is connected to suck and fix the solder ball 14 accommodated in the solder ball receiving groove 24. Then, the solder ball adsorption die 23 is positioned above the printed circuit board 13 so that the positions of the solder balls 14 adsorbed and fixed to the solder ball receiving grooves 24 with respect to the solder ball seating portions 22 are aligned. As a result, the vacuum pressure acting on the solder ball 14 through the vacuum hole 25 is removed, and the solder balls 14 are disposed on the solder ball seating portions 22, respectively. When the solder ball 14 is subjected to a predetermined temperature, the skin layer of the solder ball 14 is melted and adhered to the solder ball seating portion 22 formed on the printed circuit board 13.

하지만, 상술한 바와 같이 종래의 비지에이 패키지용 땜납볼 흡착다이에서는 땜납볼 수용홈(24)이 형성된 부위의 재질이 유연하지 않기 때문에, 땜납볼 수용홈(24)에 수용되어 흡착고정된 땜납볼(14)과 진공압을 제공하는 진공홀(25)의 접촉부위에서 누수되는 부분이 발생하여 땜납볼(14)을 적절하게 흡착 고정시킬 수 없게 된다. 이로 인해, 땜납볼 수용홈(24)에 수용된 땜납볼(14)을 인쇄회로기판(13)에 배치시 정렬상태가 좋지 않게 된다는 문제점이 있다. 또한, 땜납볼 수용홈(24)에 수용된 땜납볼(14)이 불안정하게 작용하는 진공압으로 인해 흡착된 상태에서 회전하는 경우가 발생하는데, 이때 땜납볼(14)에는 정전기가 발생하게 되어 인쇄회로기판(13)에 배치시 상호 작용하는 정전기에 의해 땜납볼(14)이 함께 결합되는 문제점이 발생하여 땜납볼 접착공정이 제대로 이루어지지 않게 된다. However, as described above, since the material of the portion where the solder ball receiving groove 24 is formed is not flexible in the conventional solder ball adsorption die for the BGP package, the solder ball accommodated and fixed in the solder ball receiving groove 24 is fixed. A leaking part occurs at the contact portion between the 14 and the vacuum hole 25 providing the vacuum pressure, so that the solder ball 14 cannot be properly fixed and fixed. For this reason, when the solder ball 14 accommodated in the solder ball receiving groove 24 is disposed on the printed circuit board 13, there is a problem in that the alignment state becomes poor. In addition, when the solder ball 14 accommodated in the solder ball receiving groove 24 rotates in an adsorbed state due to the unstable vacuum pressure, the solder ball 14 generates static electricity in the printed circuit. When the solder ball 14 is coupled together by static electricity interacting when disposed on the substrate 13, the solder ball bonding process is not properly performed.

본 발명은 상기와 같은 문제점을 감안하여 창출된 것으로서, 비지에이 패키지의 제조과정에서 인쇄회로기판에 땜납볼을 접착시 이용되는 것으로, 땜납볼을 안정적으로 흡착 고정시키며 정전기가 발생하지 않도록 개선된 비지에이 패키지용 땜납볼 흡착다이를 제공하는데 그 목적이 있다.The present invention has been made in view of the above problems, and is used when the solder ball is bonded to a printed circuit board in the manufacturing process of the BG package. The busy ball is stably adsorbed and fixed to prevent the generation of static electricity. The purpose is to provide a solder ball adsorption die for this package.

상기와 같은 목적을 달성하기 위해 본 발명인 비지에이 패키지용 땜납볼 흡착다이는 비지에이 패키지용 땜납볼을 흡착고정시키는 것으로, 복수개의 진공홀이 형성된 본체와, 상기 본체에 결합되며 상기 진공홀을 통하여 작용하는 진공압에 의해 땜납볼이 흡착고정되는 복수개의 땜납볼 수용홈이 형성된 것으로, 소정 범위 내에서 탄성변형하는 재질로 이루어진 흡착부재를 포함하여 된 것을 특징으로 한다.In order to achieve the above object, the BGA package solder ball adsorption die of the present invention is to fix and fix a BGA package solder ball, and includes a main body having a plurality of vacuum holes formed therein, and coupled to the main body through the vacuum hole. A plurality of solder ball accommodating grooves in which the solder ball is sucked and fixed by the working vacuum pressure is formed, and is characterized by including an adsorption member made of a material that elastically deforms within a predetermined range.

또한 본 발명인 비지에이 패키지용 땜납볼 흡착다이는 비지에이 패키지용 땜납볼을 흡착고정시키는 것으로, 소정의 진공압이 작용하는 진공홀과, 상기 진공홀에 연결되어 형성되며 상기 땜납볼의 형상에 대응하여 소정 깊이로 형성된 복수개의 땜납볼 수용홈이 마련된 본체와, 상기 땜납볼 수용홈의 저면에 설치되어 상기 진공홀을 통하여 작용하는 진공압에 의해 상기 땜납볼이 흡착고정되는 것으로, 소정의 범위내에서 탄성 변형하는 재질로 이루어진 흡착부재를 포함하여 된 것을 특징으로 한다. In addition, the present invention solder ball adsorption die for the BG package is to absorb and fix the BG package solder ball, and is formed in connection with the vacuum hole to which a predetermined vacuum pressure is applied, and connected to the vacuum hole to correspond to the shape of the solder ball. The solder ball is attracted and fixed by a main body provided with a plurality of solder ball receiving grooves formed to a predetermined depth and a vacuum pressure acting through the vacuum hole provided on the bottom surface of the solder ball receiving groove. It characterized in that it comprises an adsorption member made of a material that elastically deforms.

이하 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명에 따른 비지에이 패키지용 땜납볼 흡착다이는, 통상적인 비지에이 패키지의 제조과정 중 반도체칩이 탑재되어 와이어본딩되는 인쇄회로기판의 일측면에 복수개의 땜납볼을 접착시키기 위한 장치에서 복수개의 땜납볼을 흡착고정시켜서 인쇄회로기판 상에 형성된 접착위치로 배치시키는 것이다. The solder ball adsorption die for a BG package according to the present invention is a plurality of solder balls in a device for bonding a plurality of solder balls to one side of a printed circuit board on which a semiconductor chip is mounted and wire bonded during a typical BG package manufacturing process. The solder balls are attracted and fixed to be placed in the bonding position formed on the printed circuit board.

도 3은 통상적인 비지에이 패키지의 제조과정 중에서 본 발명의 일 실시예에 따른 비지에이 패키지용 땜납볼 흡착다이(30)에 의해 인쇄회로기판(31)에 땜납볼(32)이 배치되는 상태를 도시한 단면도이다.3 illustrates a state in which solder balls 32 are disposed on a printed circuit board 31 by a solder ball adsorption die 30 for a BG package in accordance with an embodiment of the present invention. It is sectional drawing.

도면을 참조하면, 본 발명에 따른 비지에이 패키지용 땜납볼 흡착다이(30)는, 복수개의 진공홀(33)이 형성된 본체(34)와, 이 본체(34)에 결합되는 흡착부재(35)를 포함하여 이루어진다. 여기서, 본 발명의 특징에 따른 흡착부재(35)는 소정 범위내에서 탄성 변형하는 재질로 이루어진 것으로, 진공홀(33)을 통하여 작용하는 진공압에 의해 땜납볼(32)이 흡착고정되는 복수개의 땜납볼 수용홈(36)이 형성된다. 여기서, 땜납볼(32)이 흡착부재(35)에 형성된 땜납볼 수용홈(35)에 삽입된 후 진공홀(33)을 통하여 작용하는 진공압에 의해 흡착될 때, 땜납볼 수용홈(36)의 저면에 연결되어 형성된 진공홀(33)과 땜납볼(32)의 외주면이 밀착되게 되어 흡착력이 향상된다. 그리고, 상술한 흡착부재(35)는 소정 범위내에서 탄성 변형하는 예컨대, 고무 등이 이용될 수 있다.Referring to the drawings, the solder ball adsorption die 30 for the BG package according to the present invention includes a main body 34 having a plurality of vacuum holes 33 formed therein, and an adsorption member 35 coupled to the main body 34. It is made, including. Here, the suction member 35 according to the characteristics of the present invention is made of a material that elastically deforms within a predetermined range, and the plurality of solder balls 32 are fixed by suction by the vacuum pressure acting through the vacuum hole 33. Solder ball receiving groove 36 is formed. Here, when the solder ball 32 is inserted into the solder ball receiving groove 35 formed in the adsorption member 35 and then adsorbed by the vacuum pressure acting through the vacuum hole 33, the solder ball receiving groove 36 The vacuum hole 33 and the outer circumferential surface of the solder ball 32 are formed to be in close contact with the bottom surface of the contact is improved adhesion. In addition, the above-mentioned adsorption member 35 may be used, for example, rubber or the like to elastically deform within a predetermined range.

그리고, 도 4는 본 발명에 따른 비지에이 패키지용 땜납볼 흡착다이의 다른 실시예를 도시한 단면도이다. 4 is a cross-sectional view showing another embodiment of a solder ball adsorption die for a busy package according to the present invention.

이 비지에이 패키지용 땜납볼 흡착다이(40)는 도 3에 도시된 비지에이 패키지용 땜납볼 흡착다이(30)와 마찬가지로 본체(41)와, 흡착부재(42)를 포함하여 이루어지지만, 흡착부재(42)에 형성된 땜납볼 수용홈(43)이 변형된 형태이다. 이를 상세하게 설명하면, 도면에 도시된 바와 같이 흡착부재(42)에 형성된 땜납볼 수용홈(43)에서 본체(41)에 형성된 진공홀(44)과 연결되며, 땜납볼(45)이 흡착되는 저면이 볼록하게 소정 곡률로 형성된다. 상술한 바와 같이 땜납볼 수용홈(43)의 저면을 볼록하게 소정 곡률로 형성함으로써, 땜납볼(45)을 땜납볼 수용홈(43)에 흡착고정시 흡착력이 향상된다. 또한, 땜납볼(45)에 작용하는 진공압에 제거될 때, 땜납볼 수용홈(43)으로부터 땜납볼(45)의 분리가 용이하게 이루어진다.The solder ball adsorption die 40 for the busy package includes the main body 41 and the adsorption member 42 similarly to the solder ball adsorption die 30 for the busy package. The solder ball receiving groove 43 formed in the 42 is deformed. In detail, as shown in the drawing, the solder ball receiving groove 43 formed in the adsorption member 42 is connected to the vacuum hole 44 formed in the main body 41, and the solder ball 45 is adsorbed. The bottom face is formed convexly with a predetermined curvature. As described above, the bottom surface of the solder ball receiving groove 43 is formed convexly to a predetermined curvature, so that the adsorption force is improved when the solder ball 45 is fixed to the solder ball receiving groove 43. Further, when removed by the vacuum pressure acting on the solder ball 45, the solder ball 45 can be easily separated from the solder ball receiving groove 43.

그리고, 도 5는 본 발명에 따른 비지에이 패키지용 땜납볼 흡착다이의 다른 실시예를 도시한 것이다. 5 shows another embodiment of a solder ball adsorption die for a busy package according to the present invention.

도면에 도시된 바와 같이, 이 비지에이 패키지용 땜납볼 흡착다이(50)는 소정의 진공압이 작용하는 진공홀(51)과, 이 진공홀(51)에 연결되며 땜납볼(52)의 형상에 대응하여 소정 깊이로 형성된 복수개의 땜납볼 수용홈(53)이 마련된 본체(54)와, 땜납볼 수용홈(53)의 저면에 설치된 흡착부재(55)를 포함하여 이루어진다. 이 흡착부재(55)는 진공홀(51)을 통하여 작용하는 진공압에 의해 땜납볼(52)이 흡착고정되는 것으로, 소정의 범위내에서 탄성 변형하는 재질인 예컨대, 고무 등으로 형성될 수 있다. As shown in the figure, the solder ball adsorption die 50 for the busy package includes a vacuum hole 51 to which a predetermined vacuum pressure is applied, and a shape of the solder ball 52 connected to the vacuum hole 51. The main body 54 is provided with a plurality of solder ball accommodating grooves 53 formed at a predetermined depth, and an adsorption member 55 provided on the bottom surface of the solder ball accommodating groove 53. The adsorption member 55 is fixed to the solder ball 52 by the vacuum pressure acting through the vacuum hole 51, it may be formed of a material that is elastically deformed within a predetermined range, for example, rubber or the like. .

상술한 바와 같은 본 발명에 따른 비지에이 패키지용 땜납볼 흡착다이는, 진공홀을 통하여 작용하는 진공압에 의해 땜납볼이 흡착고정되는 부위를 소정 범위 내에서 탄성변형하는 재질로 형성시킴으로써, 땜납볼에 대한 흡착력이 향상되어 땜납볼의 회전 등이 발생하지 않게 된다. 따라서, 비지에이 패키지 제조과정 중 본 발명에 따른 비지에이 패키지용 땜납볼 흡착다이를 이용하여 인쇄회로기판에 복수개의 땜납볼을 배치시킬 때 정확한 정렬이 이루어진다. The solder ball adsorption die for a BG package according to the present invention as described above is formed by a material that elastically deforms within a predetermined range in which a solder ball is adsorbed and fixed by a vacuum pressure acting through a vacuum hole. Adsorption force to the is improved, so that the rotation of the solder ball does not occur. Therefore, when the plurality of solder balls are placed on the printed circuit board by using the solder ball adsorption die for the BGA package according to the present invention during the BGA package manufacturing process, accurate alignment is made.

도 1은 통상적인 비지에이 패키지의 일예를 도시한 단면도, 1 is a cross-sectional view showing an example of a typical BG package;

도 2는 종래의 비지에이 패키지용 땜납볼 흡착다이에 의해 인쇄회로기판에 땜납볼이 배치되는 상태를 도시한 단면도,2 is a cross-sectional view showing a state where solder balls are arranged on a printed circuit board by a conventional solder ball adsorption die for a BG package;

도 3은 본 발명의 일 실시예에 따른 비지에이 패키지용 땜납볼 흡착다이에 의해 인쇄회로기판에 땜납볼이 배치되는 상태를 도시한 단면도,3 is a cross-sectional view illustrating a state where solder balls are disposed on a printed circuit board by a solder ball adsorption die for a BG package according to an embodiment of the present invention;

도 4는 본 발명의 다른 실시예에 따른 비지에이 패키지용 땜납볼 흡착다이를 도시한 단면도,4 is a cross-sectional view showing a solder ball adsorption die for a BG package according to another embodiment of the present invention;

그리고, 도 5는 본 발명의 다른 실시예에 따른 비지에이 패키지용 땜납볼 흡착다이를 도시한 단면도이다.5 is a cross-sectional view illustrating a solder ball adsorption die for a BG package according to another embodiment of the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

11.반도체칩 12.배선11.Semiconductor Chip 12.Wiring

13,31.인쇄회로기판 14,32,45,52.땜납볼Printed Circuit Boards 14, 32, 45, 52 Solder Balls

15.몰딩수지 21.땜납마스크층15. Molding resin 21. Solder mask layer

22.땜납볼 안착부 22. Solder Ball Seat

23,30,40,50.비지에이 패키지용 땜납볼 흡착다이. 23, 30, 40, 50. Solder ball adsorption dies for busy package.

24,36,43,53.땜납볼 수용홈 25,33,44,51.진공홀Solder ball receiving groove 25, 33, 44, 51 Vacuum hole

34,41,54.본체 35,42,55.흡착부재34, 41, 54 Body 35, 42, 55 Absorbing member

Claims (5)

비지에이(BGA) 패키지용 땜납볼을 흡착고정시키는 것으로, 복수개의 진공홀이 형성된 본체; 및A main body having a plurality of vacuum holes formed thereon by fixing and fixing a solder ball for a BGA package; And 상기 본체에 결합되고, 상기 진공홀을 통하여 작용하는 진공압에 의해 땜납볼이 밀착되어서 흡착고정되는 저면을 구비하는 복수개의 땜납볼 수용홈 형성된 것으로, 소정 범위 내에서 탄성변형하는 재질로 이루어진 흡착부재;를 포함하여 된 것을 특징으로 하는 비지에이 패키지용 땜납볼 흡착다이.The suction member is coupled to the main body, formed with a plurality of solder ball receiving grooves having a bottom surface in which the solder ball is in close contact and fixed by the vacuum pressure acting through the vacuum hole, the suction member made of a material that elastically deforms within a predetermined range Solder ball adsorption die for a busy package, characterized in that it comprises a. 제1항에 있어서,The method of claim 1, 상기 흡착부재에 형성된 상기 땜납볼 수용홈의 저면은 볼록하게 소정 곡률로 형성된 것을 특징으로 하는 비지에이 패키지용 땜납볼 흡착다이. A bottom surface of the solder ball receiving groove formed in the suction member is convexly formed with a predetermined curvature, solder ball adsorption die for a busy package. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2, 상기 흡착부재는 소정 범위내에서 탄성변형하는 고무로 성형된 것을 특징으로 하는 비지에이 패키지용 땜납볼 흡착다이.The adsorption member is a solder ball adsorption die for a busy package, characterized in that molded in a rubber that elastically deforms within a predetermined range. 비지에이(BGA) 패키지용 땜납볼을 흡착고정시키는 것으로, 소정의 진공압이 작용하는 진공홀과, 상기 진공홀에 연결되어 형성되며 상기 땜납볼의 형상에 대응하여 소정 깊이로 형성된 복수개의 땜납볼 수용홈이 마련된 본체; 및A plurality of solder balls are formed by adsorbing and fixing a solder ball for a BGA package and having a predetermined depth to correspond to the shape of the solder balls, which are formed in connection with the vacuum hole under a predetermined vacuum pressure. A main body provided with a receiving groove; And 상기 땜납볼 수용홈의 저면에 설치되어 상기 진공홀을 통하여 작용하는 진공압에 의해 상기 땜납볼이 흡착고정되는 것으로, 소정의 범위내에서 탄성변형하는 재질로 이루어진 흡착부재;를 포함하여 된 것을 특징으로 하는 비지에이 패키지용 땜납볼 흡착다이. And a suction member installed on a bottom surface of the solder ball receiving groove and fixed to the solder ball by a vacuum pressure acting through the vacuum hole, the suction member being made of a material that elastically deforms within a predetermined range. Solder ball adsorption die for busy package. 제4항에 있어서,The method of claim 4, wherein 상기 흡착부재는 소정 범위내에서 탄성변형하는 고무로 성형된 것을 특징으로 하는 비지에이 패키지용 땜납볼 흡착다이.The adsorption member is a solder ball adsorption die for a busy package, characterized in that molded in a rubber that elastically deforms within a predetermined range.
KR1019970041583A 1997-08-27 1997-08-27 Absorption die of solder ball for bga package KR100479912B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278831A (en) * 1989-04-20 1990-11-15 Fujitsu Ltd Formation of solder bump
JPH07153766A (en) * 1993-10-06 1995-06-16 Nippon Steel Corp Method and apparatus for jointing ball-shaped bump
JPH08288288A (en) * 1995-04-13 1996-11-01 Nippon Telegr & Teleph Corp <Ntt> Bump holding device for transfer
KR19990006556A (en) * 1997-06-02 1999-01-25 가네코 히사시 Solder ball arranging device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278831A (en) * 1989-04-20 1990-11-15 Fujitsu Ltd Formation of solder bump
JPH07153766A (en) * 1993-10-06 1995-06-16 Nippon Steel Corp Method and apparatus for jointing ball-shaped bump
JPH08288288A (en) * 1995-04-13 1996-11-01 Nippon Telegr & Teleph Corp <Ntt> Bump holding device for transfer
KR19990006556A (en) * 1997-06-02 1999-01-25 가네코 히사시 Solder ball arranging device

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