KR100479855B1 - 볼그리드어레이 패키지용 액상 에폭시 수지 조성물 - Google Patents
볼그리드어레이 패키지용 액상 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR100479855B1 KR100479855B1 KR10-2001-0087477A KR20010087477A KR100479855B1 KR 100479855 B1 KR100479855 B1 KR 100479855B1 KR 20010087477 A KR20010087477 A KR 20010087477A KR 100479855 B1 KR100479855 B1 KR 100479855B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- formula
- weight
- resin composition
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
- C08K5/1539—Cyclic anhydrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Abstract
Description
구 성 성 분 | 실시예 1 | 실시예2 | 실시예3 | 비교예1 | 비교예2 | 비교예3 | 비교예4 | ||
에폭시수지 | 1)나프탈렌계 에폭시 수지 | 7.0 | 7.0 | 9.0 | - | 7.0 | 7.0 | 7.0 | |
2)아민계 에폭시 수지 | 4.0 | 4.0 | 2.0 | - | 4.0 | - | - | ||
3)비스페놀계 에폭시 수지 | - | - | - | 11.0 | - | 4.0 | 4.0 | ||
경화제 | 4)트리알킬테트라하이드로프탈산 무수물 | 9.0 | 7.0 | 9.0 | 9.0 | 4.0 | 9.0 | 4.0 | |
5)메틸테트라하이드로프탈산 무수물 | 4.0 | 6.0 | 4.0 | 4.0 | 9.0 | 4.0 | 9.0 | ||
1-벤질-2-메틸이미다졸 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | ||
6)폴리디메틸실록산 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | ||
무기충전제 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | ||
γ-글리시톡시프로필트리메톡시실란 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | ||
카본블랙 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | ||
합계 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | ||
물성평가결과 | 점도(cps, 25℃) | 29,000 | 27,000 | 37,000 | 20,000 | 25,000 | 30,000 | 27,000 | |
유리전이온도 Tg(℃) | 155 | 159 | 154 | 117 | 159 | 139 | 144 | ||
열팽창계수 α(㎛/m,℃) | 21 | 21 | 21 | 21 | 21 | 21 | 21 | ||
굴곡강도(kgf/mm2) | 15 | 16 | 15 | 15 | 15 | 15 | 14 | ||
흡수율(%) | 0.6 | 0.7 | 0.5 | 0.6 | 1.0 | 0.7 | 0.9 | ||
경화후 평활도 | 워페이지(㎛) | 70 | 63 | 68 | 117 | 110 | 120 | 117 | |
프리콘시험결과 | 박리발생수/시료수 | 0/30 | 0/30 | 0/30 | 0/30 | 20/30 | 0/30 | 14/30 | |
열충격시험결과 | 박리발생수/시료수 | 0/30 | 0/30 | 0/30 | 30/30 | 0/30 | 6/30 | 16/30 |
Claims (5)
- (a) 하기 화학식 1로 표현되는 나프탈렌계 에폭시 수지;(b) 하기 화학식 2로 표현되는 아민계 에폭시 수지;(c) 하기 화학식 3으로 표현되는 트리알킬테트라하이드로프탈산 무수물;(d) 하기 화학식 4로 표현되는 메틸테트라하이드로프탈산 무수물;(e) 하기 화학식 5로 표현되는 이미다졸계 촉매; 및(f) 무기충전제를 포함하며,상기 트리알킬테트라하이드로프탈산 무수물:메틸테트라하이드로프탈산 무수물의 혼합비가 중량비로 50:50 내지 70:30의 범위인 볼그리드어레이 패키지용 액상 에폭시 수지 조성물.[화학식 1][화학식 2][화학식 3](상기 화학식에서, R1, R2 및 R3는 각각 알킬기 또는 알케닐기이며, R1+R2+R3=C6H15를 만족함)[화학식 4][화학식 5](상기 화학식에서, R1, R2 및 R3는 각각 독립적으로 수소원자, 메틸기, 에틸기, 페닐기, 시아노에틸기 또는 벤질기임).
- 제 1항에 있어서,상기 나프탈렌계 에폭시 수지와 상기 아민계 에폭시 수지의 함량의 합이 (9)~(15)중량%이고, 상기 트리알킬테트라하이드로프탈산 무수물과 상기 메틸테트라하이드로프탈산 무수물의 함량의 합이 (10)~(15)중량%이며, 상기 이미다졸계 촉매의 함량이 (0.1)~(0.5)중량%이고, 상기 무기충전제의 함량이 70~80중량%인 것을 특징으로 하는 조성물.
- 제 1항 또는 제 2항에 있어서,상기 나프탈렌계 에폭시 수지:아민계 에폭시 수지의 혼합비가 중량비로 60:40 내지 90:10의 범위에 드는 것을 특징으로 하는 조성물.
- 삭제
- 제 1항 또는 제 2항에 있어서, 상기 조성물의 점도가 25℃에서 25,000~45,000cps인 것을 특징으로 하는 조성물.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0087477A KR100479855B1 (ko) | 2001-12-28 | 2001-12-28 | 볼그리드어레이 패키지용 액상 에폭시 수지 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0087477A KR100479855B1 (ko) | 2001-12-28 | 2001-12-28 | 볼그리드어레이 패키지용 액상 에폭시 수지 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030057104A KR20030057104A (ko) | 2003-07-04 |
KR100479855B1 true KR100479855B1 (ko) | 2005-03-30 |
Family
ID=32215225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0087477A KR100479855B1 (ko) | 2001-12-28 | 2001-12-28 | 볼그리드어레이 패키지용 액상 에폭시 수지 조성물 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100479855B1 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11302507A (ja) * | 1998-02-17 | 1999-11-02 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用中間基材および繊維強化複合材料 |
JP2000198831A (ja) * | 1998-12-28 | 2000-07-18 | Nagase Chiba Kk | エポキシ樹脂組成物およびそれを用いてlsiを封止する方法 |
US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
JP2001072831A (ja) * | 1999-09-06 | 2001-03-21 | Shin Etsu Chem Co Ltd | 半導体封止用液状エポキシ樹脂組成物 |
JP2001226455A (ja) * | 2000-02-14 | 2001-08-21 | Toshiba Chem Corp | 液状封止用樹脂組成物 |
-
2001
- 2001-12-28 KR KR10-2001-0087477A patent/KR100479855B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
JPH11302507A (ja) * | 1998-02-17 | 1999-11-02 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用中間基材および繊維強化複合材料 |
JP2000198831A (ja) * | 1998-12-28 | 2000-07-18 | Nagase Chiba Kk | エポキシ樹脂組成物およびそれを用いてlsiを封止する方法 |
JP2001072831A (ja) * | 1999-09-06 | 2001-03-21 | Shin Etsu Chem Co Ltd | 半導体封止用液状エポキシ樹脂組成物 |
JP2001226455A (ja) * | 2000-02-14 | 2001-08-21 | Toshiba Chem Corp | 液状封止用樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
KR20030057104A (ko) | 2003-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5298548A (en) | Epoxy resin composition and semiconductor devices encapsulated therewith | |
EP2746287B1 (en) | Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device including the quaternary phosphonium salt and semiconductor device encapsulated with the epoxy resin composition | |
JPH0216118A (ja) | エポキシ樹脂組成物及び半導体装置 | |
US6117953A (en) | Liquid epoxy resin composition for ball grid array package | |
KR100673767B1 (ko) | 반도체 소자 언더필용 에폭시 수지 조성물 | |
KR100529256B1 (ko) | 반도체 봉지용 액상 에폭시 수지 조성물 | |
KR100479855B1 (ko) | 볼그리드어레이 패키지용 액상 에폭시 수지 조성물 | |
KR100540913B1 (ko) | 액상 에폭시 수지 조성물 | |
KR100585945B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100540914B1 (ko) | 반도체 언더필용 에폭시 수지 조성물 | |
KR100479856B1 (ko) | 캐비티 다운형 볼그리드어레이 패키지용 액상 에폭시 수지조성물 | |
KR100462143B1 (ko) | 반도체소자 봉지용 저응력화 변성 실리콘 에폭시 수지의 제조방 법 및 이를 함유하는 반도체소자 봉지용 수지 조성물 | |
KR101234848B1 (ko) | 반도체 소자 밀봉용 액상 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
KR100990807B1 (ko) | 반도체 칩 부착용 접착제 조성물 및 이를 이용한 반도체소자 | |
KR101845134B1 (ko) | 포스포늄계 화합물, 이를 포함하는 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 장치 | |
KR100479858B1 (ko) | 반도체 소자 밀봉용 액상 에폭시 수지 조성물 | |
KR100529258B1 (ko) | 반도체 봉지재용 에폭시 수지 조성물 | |
KR100479859B1 (ko) | 반도체 소자 밀봉용 액상 에폭시 수지 조성물 | |
JPH04337316A (ja) | エポキシ樹脂組成物 | |
KR100611463B1 (ko) | 반도체 소자 밀봉용 액상 에폭시 수지 조성물 | |
KR100504604B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
JP3159428B2 (ja) | 液状封止樹脂 | |
KR100529257B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100671136B1 (ko) | 재작업이 가능한 고신뢰성 반도체 소자 언더필용 액상에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
JPH0750365A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130104 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20131217 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20141223 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20160218 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180220 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20190304 Year of fee payment: 15 |
|
FPAY | Annual fee payment |
Payment date: 20200214 Year of fee payment: 16 |