KR100465573B1 - Resin coating system for chip elements and method thereof - Google Patents

Abstract

The present invention relates to a chip device such as an inductor, and more particularly, to provide a resin coating system and a coating method for coating a resin on a work manufactured in a chip inductor winding machine. .

The present invention is to protect the wire wound on the material (coil), to maintain the shape (maintain characteristics) and to coat the resin for easy handling when mounting the substrate, the transportation of the molding film filled with the resin is composed of a metal belt It enables accurate pitch feeding by the feeder so that the material can be inserted in the correct position, ensuring uniformity of the shape of the material after coating and at the same time ensuring accuracy in material transportation.

Forming molds formed on the film for molding are formed directly in the equipment to reduce the process cost required for coating, and the resin curing process is remounted to correct the material position and outline shape after preliminarily curing the resin on the material. It consists of a reforming unit, two steps of curing the secondary coating after the correction operation, and ensures stability of the dimensions (height, width, length, and shape), bubbles and unformed that are easily introduced during the coating process. It is possible to produce high quality products by preventing problems of product defects.

Description

Resin coating system for chip elements and method

The present invention relates to a chip element such as an inductor, and more particularly, to a resin coating system for coating a resin on a work manufactured in a chip inductor winding machine and a coating method thereof. will be.

The chip inductor manufactures one chip in which a coil is wound around a chip in an inductor winding machine, which is then subjected to a separate resin coating, inspection, and taping process.

As described above, the chip is coated with a resin in a predetermined shape to protect / fix the coil to be wound to maintain the characteristics of the chip, and to secure the mounting of the mounter when inserted into the substrate.

The resin coating is usually hardened in a mold by dipping or filling the resin into a preformed mold, and inserting materials (chips) one by one into a mold filled with resin to cure the resin and then removing the material from the mold. The discharge method was used.

Conventionally, when a certain amount of resin is filled in the molding frame in which the molding film is conveyed in one direction by the conveying part by the water-filling filling part, the material supplying part pushes the raw materials one by one into the molding mold filled with resin and then is transferred to the resin curing part. In the resin hardening part, one side of the material that is in contact with the resin under heat or other curing conditions (UV irradiation in the case of UV resin) is coated and cured. After peeling from the mold, the material is collected and discharged to the discharge part.

However, in the past, special materials in which a molding mold was formed have been supplied to and used for molding films for filling and curing resins, so that not only the material coping force is lowered but also the cost increases.

In addition, since the conveying part for transporting the forming film to each line is configured to convey the film itself, the exact pitch conveyance is not achieved due to the inherent elasticity of the film. In addition, there is a problem that bubbles are generated or opened in the resin.

The separation of the coated material is performed by pressing both edges of the molding frame by using the material peeling part, and then pressing and releasing the material and forcibly discharging the material so that the edge of the resin is broken by the impact. I was hugging.

Accordingly, the present invention is to solve the conventional problems, in the coating of a resin to protect the wire (coil) wound on the material, and to maintain the shape (maintain characteristics) and handling when mounting the substrate, The resin-filled molding film can be conveyed accurately by the conveying part formed by the metal belt to ensure accurate transportation of molded products and materials, and to prevent the outer dimensions from being unstable when coating the material. It is to provide a resin coating system and a method thereof.

In addition, the forming mold formed on the film for forming is intended to reduce the cost required for coating by forming directly on the work line.

In addition, the resin coated on the material is a process of firstly coating the resin on the material, and a reforming process to secure stability of dimensions (height, width, length, shape) by correcting the interface or size of the material and the coated resin. (reforming unit) and the material that has undergone the reforming process is configured to secondary coating hardening to prevent the generation of bubbles inside.

In addition, the coated material in the mold of the film is heat-softened by a heater and then can be automatically separated by a configuration that presses the bottom of the mold to prevent the edges from breaking as conventional.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exemplary view showing a schematic configuration of a resin coating system according to the present invention,

Figure 2 is an exemplary view of the film supply and uneven molding according to the present invention,

3 is an exemplary view showing a film forming process in the conveying unit according to the present invention;

Figure 4 is an illustration showing that the forming mold is formed by the uneven forming portion according to the present invention,

5 is an exemplary view showing a configuration of a material supply unit according to the present invention;

6 is an exemplary view showing that the material supply unit supplies the material to the molding die,

7 is an exemplary view showing a process in which the material is rearranged in the reforming part after the primary resin is cured and the outer dimension is corrected.

8 is an exemplary view showing a configuration of a material peeling part according to the present invention;

9 is an exemplary view showing a process of treatment after using the molding film;

* Description of the symbols for the main parts of the drawings *

10: transfer part 12: mounting hole

20: film supply part 22: film for molding

24: molding mold 30: uneven molding

40: resin filling unit 42: resin

50: material supply unit 60: primary resin curing unit

70: reforming part 80: secondary resin hardening part

90: peeling material A: material

The present invention provides a method of coating a resin on a chip element in which wire rods of several tens of microns are wound around a chip core, the method comprising: mounting a molding film on an upper surface of a transfer part in which a plurality of mounting holes are formed in a longitudinal direction; Forming a molding mold in which a resin is filled in the molding film transported along the conveying part; Filling a predetermined amount of resin into the mold; Supplying a raw material to the upper surface of the resin filled in the mold; Coating the resin on one side by contacting the material supplied to the mold with the resin; Primarily soft curing the coated resin; Compensating the coating shape by adjusting the interface between the resin and the material first coated with a resin-coated material separate phase, heart; Completely curing the resin of the corrected material on the material; The resin coating method is characterized by the step of separating the coated material from the mold.

In addition, the present invention in coating the resin on the chip element (Chip element) in which wire rods of several tens of microns are wound on the chip core, as shown in Figure 1 is formed in the longitudinal direction at regular intervals in which the mounting holes are circumferentially The conveying part 10, the film supply part 20 for conveying and supplying the forming film 22 to the upper surface of the conveying part 10, and the forming mold 24 of the film seated in the mounting hole 12 of the conveying part 10 Resin filling portion 40 for filling a predetermined amount of resin 42 in the forming mold 24 of the film 22 for molding to be transported together with the uneven forming portion (30: 30a, 30b) to be formed, Parts feeder (Parts feeder) and check whether there is any abnormality of the supplied material (disruption and inversion), and then insert the material (A) one by one on the upper surface of the resin 42 filled in the molding mold (24) Pressurizing the upper surface portion of the material supply portion 50, the nose to coat the resin 42 is wrapped on the surface in contact with the resin 42 Primary resin hardening unit 60 for curing the resin 42 to a soft hardness, the outer surface of the resin and the interface between the primary coated resin by separate phases, hearts (70a, 70b) to adjust the coating position and shape After reforming 70 (reforming) to compensate for, the second resin curing unit 80 to completely coat the cured reformed material, softening the molding die 24 so that the coated material can be easily separated The resin coating system comprising a material peeling unit 90 for separating the coated material from the molding film and a collecting container 95 for collecting the separated material has its characteristics.

In addition, in the above-described configuration, the molding film 22 in which the material is separated from the mold 24 is transported by a separate transportation means 100 for transporting them as shown in FIG. It is characterized in that it comprises a configuration for cutting to a small size and discard).

And the conveying part 10 is formed with a mounting hole 12 for transporting the forming film 22 is composed of a metal belt such as stainless steel as shown in Figure 3 the exact pitch transfer and the outer dimensions when coating the material after filling the resin Is preventing the instability.

As shown in FIG. 4, the uneven mold part 30 is formed of upper and lower molds 30a and 30b having mutually opposing structures so that the upper and lower molds 30 are closed once to perform the opening operation. The film 22 for a resin is comprised so that the shaping | molding die 24 for resin filling seated in the mounting hole 12 of the conveyance part 10 may be formed.

As illustrated in FIG. 8, the material peeling unit 90 is installed at an inverting unit in which the conveying unit 10 is reversed and returned. The material peeling unit 90 softens and heats the heater 92 to soften the mold 24. The pusher 94 is provided with a pusher 94 driven by an air cylinder 93 to separate the material A from the molding die 24, which is inverted and returned along the transfer part 10. Is pushed out to separate the coated material A in the mold 24 when the mold 24 is turned over.

Referring to the operational effects of the present invention configured as described above are as follows.

As shown in FIG. 2, the forming film 22, which is continuously released from the film roll 21, is removed from the film roll 21 by air cleaning to remove foreign substances and then adsorbed onto the upper surface of the conveying unit 10. In this case, the forming film 22 may move in a state in which the molding film 22 is in intimate contact with the upper surface of the transfer unit 10 by a heater installed in the film supply unit 20.

As shown in FIG. 4, when these pass through the uneven forming part 30, the forming film 22, which is simply formed in a band shape, is a pressing surface whose inner surface is pressed by the uneven forming part 30, that is, for forming. A portion of the film 22 is pushed into the mounting hole 12 of the conveying part 10 to form a forming mold 24 having a concave shape inwardly, and the forming mold 24 is a mounting hole 12 of the metal belt. It can be moved integrally while being fitted in the.

When the molding mold 24 transported together with the conveying part 10 reaches the resin filling portion 40, the resin filling portion 40 transfers a certain amount of resin 42 to the forming mold 24 of the molding film 22. It is filled.

As shown in FIGS. 5 and 6, the resin-filled mold 24 receives and feeds the coiled material A in turn by the index of the chip inductor winding machine and is inserted one by one.

The material supply unit 50 is an index type. When the material A is supplied from the part feeder, the F / R reversal is first checked, and if there is a defective product, the discharger is discharged. Insert and remove uninserted material after insert. This process is performed in the index table as shown in FIG. 5. The material A seated on the forming mold 24 by the material supply unit 50 is formed in the primary resin hardening unit 60 as shown in FIG. When pressurized by using, the material A seated on the mold 24 is buried into the resin 42, and the resin 42 wraps around the lower side of the material and a part of the outer circumferential surface thereof. The wound coil is fixed.

In this way, the surface in contact with the resin 42 is coated with the resin 42 and then moved while being cured to a certain soft hardness (the extent that the resin filled in the mold can maintain a fluid gel state), and the primary resin The material coated by the hardening part 60 is readjusted by the upper and lower molds 70a and 70b of the reforming part 70 to readjust the primary coating state (height, width, length, shape) of the resin on the material. do.

In this way, the reformed material is again coated under UV curing conditions in the secondary resin hardening part 80 so that the resin is more tightly coated on the material.

As such, the material completely coated by the secondary resin hardening part 80 is inverted again and the conveying part 10 moves in a direction opposite to the direction of travel so far and reaches the material peeling part 90. 24) is softened by heating.

When the mold 24 softened by the heater reaches the lower side of the pusher 93 driven by the air cylinder 94 as shown in FIG. 8, the pusher 93 compresses the upper side of the mold 24. As it is pressed, the inner surface of the molding die 24 is turned outward to the outside, and the molded material is released as the mold 24 is turned over, and all are collected in the collecting part 95.

When the molding film 22 having the separated material is moved along the guide rollers and the separate transportation means 100 for transporting them as shown in FIG. 9, the shredder 102 cuts them into small sizes and discards them 104. Are collected and disposed of.

According to the above configuration and action, the present invention, in the coating of the outer peripheral surface of the coil winding material with a resin consisting of a conveying portion for conveying together with the molding frame filled with the resin of the steel belt of the dimensions through accurate pitch feed Stability can be achieved.

At this time, the metal belt (steel belt) of the transfer part maintains the heat at the time of molding the mold as it is to maintain a constant temperature at room temperature or more when filling the resin, the material is inserted in a state in which the resin is somewhat flexible. Therefore, all the problems of bubbles or unformed that may occur when inserting the material are solved.

In addition, by discharging the material formed by the molding die in a manner of pushing the mold to the pusher in the heat softened state, there is no damage to the product, such as breakage of the edge portion due to peeling resin as in the prior art to increase the productivity It can contribute greatly.

In the present invention, the process of pressure-coating the resin on the material is carried out in one or two steps, and the stability of the dimensions (height, width, length, shape) is corrected by correcting the interface and size of the material and the coated resin therebetween. By additionally performing a reforming process to ensure that the dimensions and shape of the product after coating is kept uniform and stable, it is possible to optimize the production management to produce products with good quality.

Claims (6)

In coating a resin on a chip element in which wire rods of several tens of microns are wound around the chip core, Mounting a molding film on an upper surface of a transfer part in which a plurality of mounting holes are formed in a longitudinal direction; Forming a molding mold in which a resin is filled in the molding film transported along the conveying part; Filling a predetermined amount of resin into the mold; Supplying a raw material to the upper surface of the resin filled in the mold; Coating the resin on one side by contacting the material supplied to the mold with the resin; Primarily soft curing the coated resin; Compensating the coating shape by adjusting the interface between the resin and the material first coated with a resin-coated material separate phase, heart; Completely curing the resin of the corrected material on the material; Chip device resin coating method comprising the step of separating the coated material from the mold. In coating a resin on a chip element in which wire rods of several tens of microns are wound around the chip core, Mounting holes are formed in the longitudinal direction at regular intervals, the transport part 10 circumferentially circumferentially, the film supply part 20 for supplying and supplying the molding film 22 to the upper surface of the transport part 10, and the molding film 22. Uneven molding portion (30: 30a, 30b) to form a mold 24, the resin filling part 40 to fill the resin 42 in the mold 24, the upper surface of the filled resin 42 Material supply unit 50 for supplying the material (A) one by one, the material supply unit 50 for pressing the upper surface portion of the material (A) to coat the surface in contact with the resin 42, the coated resin 42 Reforming (70) to adjust the interface between the primary resin cured portion 60, the upper and lower molds (70a, 70b) to cure a fixed soft hardness to the interface between the primary coated resin and the material ( reforming), the secondary resin curing unit 80 to completely coat the cured resin of the reformed material, the molding so that the coated material can be easily separated 24, chip elements resin coating system, characterized in that it comprises a receptacle (95) to collect the separated material and the material separation section 90 for separating the material from which the softened state. The method of claim 2, wherein the forming film 22 is separated from the material is transported by a separate transport means 100 for transporting them and comprises a configuration for cutting and discarding to a small size by the shredder (102) Chip element resin coating system. 3. The chip element resin coating system according to claim 2, wherein the transfer part (10) is made of a metal belt such as stainless steel. The method of claim 2, wherein the uneven forming portion 30 is composed of upper and lower molds (30a, 30b) having a structure opposed to each other to form the mold 24 in the forming film 22 Chip element resin coating system characterized in that. According to claim 2, wherein the material peeling unit 90 is installed in the inverting portion in which the conveying unit 10 is reversed and returned, the heater 92 for heating and softening the mold 24, the material (A) is separated Chip element resin coating system, characterized in that consisting of a pusher (94) driven by an air cylinder (93) to be able to.