JPH0684975A - Method for assembling semiconductor chip - Google Patents

Abstract

PURPOSE:To improve wettability and to supply a stable film thickness by transferring an adhesive layer or a paste layer formed on a film to a lead frame, and fixing a semiconductor chip by the adhesive layer or the paste layer. CONSTITUTION:A gap 8 through which a synthetic resin film 7 is passed is provided in a vessel 6 in which an adhesive or paste is charged, and a layer 4 of predetermined thickness is transferred to the passed film 7. After the film 7 coated with the layer 4 is conveyed to a lead frame 3, a collet 14 is pressed by a suitable load to transfer the layer 4 to a bed on the frame 3. A predetermined semiconductor chip 5 is fixed to the transferred layer 4. Thus, excellent wettability fitted with the chip can be obtained in a predetermined film thickness. Further, various types of components to be fixed can be handled by designing the shape of the collet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling a semiconductor device, in which the semiconductor device is mounted on a film with an adhesive.

[0002]

2. Description of the Related Art Recently, as a process of assembling a semiconductor device having a high degree of integration, a method of mounting a semiconductor device on a synthetic resin film has been adopted instead of a method using a lead frame. To mount a semiconductor device,
A method using an adhesive or paste having an appropriate viscosity is also used, which will be described with reference to FIGS. 1 to 8.

A so-called potting method is also used as a method for mounting a semiconductor element on a lead frame, which will be described with reference to FIGS. 1 and 2. The semiconductor element 5 is brought into contact with the adhesive layer 4 or the paste layer 4 dropped onto the lead frame 3 by using the one-point nozzle 1 or the multi-point nozzle 2, and is pressed by an appropriate load to fix them. As the adherend, a ceramic substrate or the like can be applied in addition to the semiconductor element 5. Further, a cross-sectional view of an example in which the adhesive layer 4 having an appropriate viscosity is dropped from the one-point nozzle 1 onto the semiconductor element 5 is shown in FIG.
Or a cross-sectional view of an example from the multipoint nozzle 2 is shown in FIG.

Further, FIG. 5 is a sectional view in which the state of FIG. 3 is pressed by an appropriate load, and FIG. 6 is a sectional view in which the state of FIG. 4 is pressed by an appropriate load.

FIGS. 7 and 8 show the voids 6 generated in the adhesive layer 4 or the paste layer 4 and the adhesive layer or paste layer 4 protruding from the side surface of the semiconductor element 4. is there.

[0006]

Since the shape of the adhesive layer 4 and the paste layer 4 after dropping using the one-point nozzle 1 is circular, even if the semiconductor element 5 is pressed with a constant load Does not get wet. On the other hand, when the multi-point nozzle 2 is used, the surface and corners of the adherend are well wetted by changing the nozzle arrangement state, but the dropped adhesive layer 4 or paste layer 4
Since the air in the gap is taken in and spread, air bubbles remain more frequently than when the single-point nozzle 1 is used.

As the size of the semiconductor element substrate, which is the object to be adhered, increases, the amount of adhesive or paste discharged increases. Therefore, the thickness of the adhesive layer 4 or the paste layer 4 increases or the thickness of the adhesive layer 4 increases. It becomes uniform. In order to avoid this difficulty, it is necessary to find conditions for wettability and thickness for each dimension of the semiconductor element substrate.

The present invention has been made under such circumstances, and it is an object of the present invention to improve wettability and supply a stable film thickness.

[0009]

[Means for Solving the Problems] A step of applying an adhesive layer or a paste layer to a film with a constant thickness, and a step of pressing from the opposite side of the coated surface of the film to contact the adhesive layer or the paste layer. The method of assembling a semiconductor device according to the present invention is characterized in that it includes a step of transferring a fixed material and a step of fixing a semiconductor element to the adhesive layer or paste layer of the transferred adhered material.

[0010]

In the method of the present invention, after the adhesive layer or paste layer applied to the film is transferred to the adherend such as a lead frame, the semiconductor element is fixed by the adhesive layer or paste layer. To transfer the adhesive layer or paste layer to the adherend, pass a synthetic resin film through the gap provided in the container containing the adhesive layer or paste layer, and set the desired width and thickness. After assembling the adhesive layer or the paste layer on the film, the collet is lowered from the side opposite to the coated surface to transfer only the adhesive layer or the paste layer from the film to the adherend. Adopted for equipment. This forms an adhesive layer or paste layer with a certain thickness on the adherend,
Moreover, good wettability is maintained.

Therefore, by designing the collet according to the shape of the adhered material that is being used more and more, it is possible to cope with the assembly process of many kinds.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to FIGS. FIG. 9 is a top view of an apparatus used in the method of assembling a semiconductor device according to the present invention, and FIG.
Side view in the direction of FIG. 11, FIG. 11 is a side view in the direction A of FIG. 9, and FIG.
Is a perspective view for clarifying the main part of the whole, FIGS. 13 and 14 are sectional views showing a pressed state by the collet, and FIG. 15 is a sectional view after assembly. The semiconductor element assembling method of the present invention in which the die bonding process is performed by the collet does not use the conventional so-called potting method, but mounts the semiconductor element on the lead frame using the device shown in the perspective view of FIG. To do. That is, the container 6 filled with the adhesive layer or the paste layer 4 is provided with a gap 8 through which the synthetic resin film 7 can pass, as shown in FIG. A method of transferring the strike layer 4 to a constant thickness is adopted.

In transferring the adhesive layer or the paste layer 4, as shown in FIGS. 11 and 12, a pair of rollers 9 is installed in the container 6 so that the film 7 can be transferred. As will be apparent from FIG. 5, the adhesive layer or the paste layer 4 flowing from the container 6 moves along the transport direction of the film 7. To this end, an adhesive layer or paste layer 4
Is adjusted to a predetermined viscosity.

Before and after the explanation, the container 6 is provided with a chamber 10 for accommodating the adhesive layer or the paste layer 4, as shown in FIG. The agent layer or the paste layer 4 flows into the gap 8 through one of the rollers 9 and is conveyed together with the film 7. Then, as shown in FIG. 11, a stopper 13 provided with a micrometer 12 is installed in the gap 8 corresponding to the end of the container 6 to adjust the amount of the adhesive layer 4 or the paste layer 4.

As a result, the adhesive layer or paste layer 4 flowing out from the wall 11 travels along the outer peripheral portion of the roller 9,
Transfer to the film 7 held between the rollers 9.

On the other hand, the pair of rollers 9 arranged to enable the transfer of the film 7 can be selected such that the side closer to the room 10 is fixed and the corresponding lower side is rotatable, which is not shown. For example, it is rotated by operating a stepping motor.

The pair of rollers 9 can be formed at a plurality of locations for the convenience of transferring the film 7.

The film 7 coated with a predetermined amount of the adhesive layer 4 or the paste layer 4 by the stopper 12 or the like is shown in FIG.
As shown in FIG. 3, the collet 14 is pressed by an appropriate load after being transferred onto the adherend, for example, the lead frame 3, and the adhesive layer or the paste layer 4 is attached to the lead frame 3.
More precisely, it is transferred to the bed (not shown). The collet 14 has a bottom portion 15 corresponding to the fixed area.

FIG. 14 clarifies a state in which a predetermined area, that is, an area corresponding to the bottom portion 15 is separated from the film 7 in the step of pressing the collet 14.

After this step is completed, the lead frame 3
The predetermined semiconductor element 5 is fixed to the adhesive layer or the paste layer 4 transferred to the bed portion of (3) to finish the mounting process (see FIG. 15).

After completing this series of steps, the film 7
It is possible to carry out the die-bonding step of a predetermined semiconductor element 5 in a mass-production manner by transporting 1 pitch for 1 pitch and repeating the same step for a new film 7 portion.

[0022]

By the method of assembling a semiconductor device according to the present invention, it is possible to secure good wettability according to the semiconductor device with a constant film thickness. Further, by designing the shape of the collet, it becomes possible to deal with any shape such as a divided bed portion installed on a lead frame or a slitted bed portion. That is, the shape of the adhesive layer 4 or the paste layer 4 can be made like a letter or a symbol, and X
It can be confirmed by observing with a line.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a single-point nozzle used in a conventional potting process.

FIG. 2 is a cross-sectional view of a multipoint nozzle used in a conventional potting process.

FIG. 3 is a cross-sectional view showing a state in which an adhesive layer or a paste layer is dropped onto a lead frame from a conventional one-point nozzle.

FIG. 4 is a cross-sectional view showing a state in which an adhesive layer or a paste layer is dropped on a lead frame from a conventional multi-point nozzle.

FIG. 5 is a cross-sectional view after mounting a semiconductor element on an adhesive layer or a paste layer dropped on a lead frame from a single-point nozzle by a conventional process.

FIG. 6 is a cross-sectional view after mounting a semiconductor element on an adhesive layer or a paste layer dropped from a multi-point nozzle on a lead frame by a conventional process.

FIG. 7 is a top view showing a state in which an adhesive layer or a paste layer protrudes around the semiconductor device shown in FIG.

FIG. 8 is a top view showing a state in which an adhesive layer or a paste layer protrudes around the semiconductor element shown in FIG.

FIG. 9 shows a top view of an apparatus used to carry out the method of the invention.

FIG. 10 is a diagram showing a B side surface of FIG. 9;

FIG. 11 is a diagram showing the A side surface of FIG. 9;

FIG. 12 is a schematic perspective view of an apparatus used for carrying out the method of the present invention.

13 is a cross-sectional view showing a pressure bonding step subsequent to the transfer step by the apparatus of FIG.

FIG. 14 is a cross-sectional view of a step of pulling up the collet following the step shown in FIG.

FIG. 15 is a cross-sectional view showing a step of fixing a semiconductor element and a transfer film, which is the final step of the present invention.

[Explanation of symbols]

 1: Single-point nozzle, 2: Multi-point nozzle, 3: Lead frame, 4: Adhesive layer or paste layer, 5: Semiconductor element, 6: Container, 7: Film, 8: Gap, 9: Roller, 10: Room, 11: wall, 12: stopper, 13: micrometer, 14: collet, 15: bottom.

Claims (1)

[Claims] 1. A step of applying an adhesive layer or a paste layer to a film to a constant thickness, and pressing from the side opposite to the coated surface of the film to transfer only the adhesive layer or the paste layer to an adherend. A method of assembling a semiconductor device, comprising the steps of: fixing a semiconductor element to an adhesive layer or a paste layer of a transferred adherend.