JP2019134104A - Mounting method for plate body - Google Patents

Abstract

To enable high-density mounting.SOLUTION: A mounting method for a plate includes preparing a coated transfer body which is a transfer body coated with an adhesive that is cured by a predetermined method in an uncured liquid state (S2a), transferring the adhesive applied to the transfer body to a plate body or a mounted object (S3a), interposing the transferred adhesive between the plate body and the mounted object, and placing the plate body on the mounted object (S4), and curing the adhesive interposed between the plate body and the mounted object (S5).SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for mounting a plate-like body.

  In portable information devices such as smartphones, mobile phones, and tablet computers, there is a demand for miniaturization of portable information devices in order to facilitate the carrying of users. In addition, in order to enable continuous use for a long time without charging, it is desired to increase the size of a rechargeable battery mounted on a portable information device. Furthermore, recently, due to the popularization of IoT (Internet of Things) and the demand for higher functionality and multi-function, devices mounted on portable information devices are greatly increasing.

  Under such circumstances, in devices and mounting boards employed in portable information devices, there is a strong demand for miniaturization of devices and high density mounting on mounting boards.

  In order to meet such a demand, in general, in a chip component, the mounting area has been reduced by miniaturization of a semiconductor integrated circuit. However, miniaturization is approaching its limit, and it is difficult to improve planar mounting density.

  Therefore, CoC (Chip on Chip) in which a plurality of chip components are stacked is adopted in order to improve the mounting density three-dimensionally. In order to increase the number of chip parts laminated with CoC or reduce the thickness of the laminated CoC, each chip part is thinned by mechanical or chemical polishing. However, if the chip component is made thin, there are problems such as cracks due to insufficient mechanical strength and malfunction of the chip component due to residual stress during polishing.

  By the way, generally, in a mounting substrate, a plate-like body such as a chip component may be mounted on an object to be mounted such as a substrate by adhesion.

  For example, Patent Document 1 describes that an adhesive layer is provided on one surface of an EMC (Electro-Magnetic Compatibility) noise shielding cover and this surface is attached to face an electronic component. In this case, the EMC noise shielding cover, which is a plate-like body, is bonded using the electronic component as an object to be mounted.

JP 2000-294975 A

  However, Patent Document 1 does not disclose any technique for reducing the thickness of the adhesive layer. Therefore, it is difficult for the technique described in Patent Document 1 to meet the demand for higher mounting density.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a plate-shaped body mounting method that enables high-density mounting.

In order to achieve the above object, the mounting method of the plate-shaped body according to the present invention is as follows.
Preparing an application transfer body, which is a transfer body in which an adhesive that is cured by a predetermined method is applied in an uncured liquid state;
Transferring the adhesive applied to the transfer body to a plate-like body or an object to be mounted;
Interposing the transferred adhesive between the plate-like body and the mounted object, and arranging the plate-like body on the mounted object;
Curing the adhesive interposed between the plate-like body and the mounted object.

  According to the present invention, high-density mounting is possible.

It is a side view of the chip mounting substrate concerning Embodiment 1 of the present invention. 4 is a flowchart showing a flow of steps included in the chip mounting method according to the first embodiment. 3A is a perspective view showing a wafer prepared in the wafer preparation process according to the first embodiment, and FIG. 3B is a perspective view showing chips individualized from the wafer in the dicing process. is there. 3 is a perspective view of a transfer body according to Embodiment 1. FIG. FIG. 5 is a diagram for explaining a coating process according to the first embodiment. 3 is a front view showing a configuration of a flip chip bonder used in a transfer process and an arrangement process according to Embodiment 1. FIG. FIG. 5 is an enlarged front view of a part of the flip chip bonder for explaining a transfer process according to the first embodiment. FIG. 5 is an enlarged front view of a part of the flip chip bonder for explaining the arrangement process according to the first embodiment. 3 is a front view showing a configuration of a heater used in the curing step according to Embodiment 1. FIG. It is a flowchart which shows the flow of the process included in the chip | tip mounting method which concerns on Embodiment 2 of this invention. It is a front view which shows the structure of the coating device utilized at the application | coating process and primary transfer process which concern on Embodiment 2. FIG. 6 is a front view of a coated transfer body according to Embodiment 2. FIG. 10 is a front view showing a configuration of a flip chip bonder used in a secondary transfer process and an arrangement process according to Embodiment 2. FIG. It is a flowchart which shows the flow of the process included in the chip | tip mounting method which concerns on Embodiment 3 of this invention. FIG. 10 is a front view showing a configuration of a pre-transfer apparatus used in a primary transfer process and a secondary transfer process according to Embodiment 3. FIG. 10 is a front view in which a part of a pre-transfer apparatus is enlarged to explain a primary transfer process and a secondary transfer process according to Embodiment 3. FIG. 10 is a perspective view of a transfer body according to a modification of the third embodiment. It is a flowchart which shows the flow of the process included in the chip | tip mounting method which concerns on Embodiment 4 of this invention. It is a figure which shows the wafer prepared by the wafer preparation process which concerns on Embodiment 4, Comprising: (a) is a perspective view, (b) is a sectional side view. FIG. 6 is a perspective view showing a wafer after a dicing process according to a fourth embodiment. It is a front view which shows the structure of the flip-chip bonder utilized at the transcription | transfer process and arrangement | positioning process which concern on Embodiment 4. FIG. 10 is an enlarged front view of a part of a flip chip bonder for explaining a transfer process according to Embodiment 4;

  Embodiments of the present invention will be described below with reference to the drawings. The same elements are denoted by the same reference symbols throughout the drawings. In the description of the embodiments of the present invention and the drawings, the terms “up”, “down”, “left”, and “right” are used, but these are used to describe directions and are not intended to limit the present invention. Furthermore, in each figure, the ratio of the size of components, such as length and width, is changed for easy understanding.

(Embodiment 1)
A chip mounting substrate 100 as a plate-shaped object to be mounted according to Embodiment 1 of the present invention is a substrate 102 to which a chip 101 is bonded by an extremely thin adhesive layer 103 as shown in FIG. 1 which is a side view. . As shown in FIG. 1, the chip mounting substrate 100 includes a chip 101, a substrate 102, and an adhesive layer 103.

  The chip 101 is a so-called IC (Integrated Circuit) chip, and is a thin plate-like electronic component in which a number of elements are formed in a semiconductor such as silicon.

  The chip 101 according to the present embodiment is an example of a plate-like body that is a thin plate-like member, and may be packaged by an appropriate method such as being molded with a resin. Further, the plate-like body is not limited to the chip 101. The plate-like body may be, for example, a thin plate-like member made of thin-plate silicon or ceramics, various magnetic bodies, metal, or the like.

  The substrate 102 is a plate having two main surfaces. The chip 101 is mounted on the upper surface that is one of the two main surfaces of the substrate 102. Typically, in addition to the chip 101, various electronic components (not shown) are mounted on the substrate 102, and an appropriate circuit pattern is provided. The material of the substrate 102 is typically PCB (polychlorinated biphenyl), but is not limited thereto and may be changed as appropriate.

  Note that the substrate 102 according to the present embodiment is an example of a mounted object that is a member to which a plate-like body is bonded, and the mounted object is not limited to the substrate 102. The mounted object may be, for example, a chip.

  The adhesive layer 103 is a layer that bonds the chip 101 and the substrate 102 by curing an adhesive 108 described later. The thickness of the adhesive layer 103 according to the present embodiment is, for example, 1 μm (micrometer) to 10 μm. In FIG. 1, the thickness of the adhesive layer 103 is expressed thicker than the thickness of the general chip 101 and the substrate 102 for easy understanding.

  In the chip mounting substrate 100 according to the present embodiment, the thickness of the adhesive layer 103 is extremely thin. Accordingly, the vertical length from the upper surface of the substrate 102 to which the chip 101 is attached to the upper surface of the chip 101 can be reduced, so that the entire volume of the chip mounting substrate 100 can be reduced. Therefore, high-density mounting is possible.

  So far, the configuration of the chip mounting substrate 100 according to the present embodiment has been described. From here, a method for manufacturing the chip mounting substrate 100 according to the present embodiment (a mounting method of the chip 101) will be described.

  Reference is made to FIG. 2 showing a flow of steps included in the mounting method of the chip 101. As shown in FIG. 2, a chip 101 is prepared (chip preparation step; S1a). Specifically, the chip preparation step (S1a) includes a wafer preparation step (S11a) and a dicing step (S12a).

  In the wafer preparation step (S11a), as shown in FIG. 3A, a wafer 104 in which a large number of elements are fabricated is prepared. At this time, the wafer 104 is held on the dicing tape 105 so that the chips 101 are not scattered during the subsequent dicing. Specifically, the wafer 104 is placed on a dicing tape 105 attached to a dicing frame 106 and held by the adhesive force of the dicing tape 105.

  In the dicing step (S12a), as shown in FIG. 3B, the wafer 104 is cut into a predetermined size and shape by a dicing saw while being held on the dicing tape 105. Thereby, a plurality of chips 101 are prepared while being held on the dicing tape 105.

  As shown in FIG. 2, a coating transfer body 107a is prepared (preparation step of coating transfer body; S2a). The coated transfer body 107a (see FIG. 5E) is a transfer body 109a to which an adhesive 108 in an uncured liquid state is applied. In the coating transfer body preparation step (S2a), a transfer body 109a coated with an uncured liquid adhesive 108 with a uniform thickness is prepared as the coating transfer body 107a.

  The adhesive 108 according to the present embodiment is cured by pressing and heating. The adhesive 108 may be any substance that is cured by a predetermined method and adheres different members. For example, the method of curing the adhesive is not limited to pressurization and heating, and may be irradiation with ultraviolet rays.

  The coating transfer body preparation step (S2a) includes, in detail, a transfer body preparation step (S21a) and an application step (S22a).

  In the transfer body preparation step (S21a) according to the present embodiment, as shown in FIG. 4, a transfer body 109a including a recess 110 that forms a recess in a predetermined portion is prepared. The transfer body 109a is, for example, a rectangular flat plate member. A recess 110 is provided on one surface of the transfer body 109a.

  The depth (length in the vertical direction) of the recess formed by the recess 110 according to the present embodiment is, for example, 1 μm to 10 μm. The recess 110 is larger than the chip 101 when viewed from above. The shape of the recess 110 viewed from above is a rectangle in the present embodiment, but may be appropriately changed to a circle or the like. The material of the transfer body 109 is, for example, resin or metal.

  In FIG. 4, for the sake of easy understanding, the depth of the recess formed by the recess 110 is shown larger than the thickness of the general transfer body 109a.

  In the applying step (S22a) according to the present embodiment, a liquid uncured adhesive 108 is applied to the recess 110 of the transfer body 109a.

  First, as shown in FIG. 5A, a liquid uncured adhesive 108 is dropped onto the transfer body 109a. The position where the adhesive 108 is dropped may be on one surface of the transfer body 109 a provided with the recess 110, and is preferably in the vicinity of the recess 110. The adhesive 108 may be dropped in a predetermined amount using, for example, a syringe (not shown) that holds the liquid uncured adhesive 108.

  Next, in the coating step (S22a) according to the present embodiment, as shown in FIGS. 5B to 5D, the liquid uncured adhesive 108 is applied to the recess 110 by the squeegee 111.

  Specifically, as shown in FIG. 5B, a squeegee 111 is arranged. At this time, the squeegee 111 is disposed at a position away from the recess 110 with the dropped adhesive 108 interposed therebetween so that the tip of the squeegee 111 contacts the transfer body 109a.

  As shown in FIG. 5 (c), the squeegee 111 moves in a direction approaching the recess 110 while maintaining the height in the vertical direction. Then, as shown in FIG. 5 (d), the squeegee 111 moves above the recess 110. When the squeegee 111 passes over the concave portion 110, the concave portion 110 is filled with the liquid uncured adhesive 108 as shown in FIG. As a result, the liquid and uncured adhesive 108 is smoothly applied to the recesses 110 to prepare a coated transfer body 107a.

  In FIG. 5, for the sake of clarity, the depth of the recess formed by the recess 110 is shown larger than the thickness of a general transfer body 109. FIGS. 6, 7, 15 and 16 to be referred to later. But the same is true. 5 (c) to 5 (e), the hatched portion represents a portion to which the liquid uncured adhesive 108 is applied, which will be described later with reference to FIGS. The same applies to 15 and 16.

  As shown in FIG. 2, the adhesive 108 of the coating transfer body 107a is transferred to the chip 101 (transfer process; S3a), and the chip 101 to which the adhesive 108 has been transferred is placed on the substrate 102 (placement process; S4). .

  The transfer step (S3a) and the placement step (S4) according to the present embodiment are performed using, for example, a flip chip bonder 112a shown in FIG. 6 which is a front view.

  As shown in FIG. 6, the flip chip bonder 112a according to the present embodiment includes a first installation area 113, a second installation area 114, a third installation area 115, a mount tool 116, and a first moving mechanism 117. With.

  The first installation area 113 is an area where the plurality of chips 101 prepared in the chip preparation step (S1a), that is, the plurality of chips 101 held on the dicing tape 105 are installed.

  Note that, unlike the present embodiment, one chip 101 may be installed in the first installation area 113, or the chip 101 may be installed on an appropriate tray. Good.

  The second installation area 114 is an area in which the coating transfer body 107a prepared in the coating transfer body preparation step (S2a) is installed.

  The third installation area 115 is an area where the substrate 102 is installed. The board | substrate 102 is a board | substrate with which the chip | tip 101 is mounted, The mounting location is predetermined suitably.

  The mount tool 116 is an instrument for transporting the chip 101. The mounting tool 116 according to the present embodiment holds and conveys the chip 101 by suction, and places the chip 101 on the substrate.

  The first moving mechanism 117 is a mechanism for moving the mount tool 116. The first moving mechanism 117 according to the present embodiment moves the mounting tool 116 above the first installation area 113, the second installation area 114, and the third installation area 115.

  In the transfer step (S3a), as shown in FIG. 7A, the mount tool 116 holds one of the plurality of chips 101. Specifically, the mount tool 116 makes the tip contact with one of the plurality of chips 101. The mounting tool 116 moves upward after holding the chip 101 with its tip in contact by suction.

  The mounting tool 116 holding the chip 101 moves to the right and is positioned above the adhesive 108 included in the coating transfer body 107a. Thereafter, as shown in FIG. 7B, the mount tool 116 moves downward until the lower surface of the chip 101 contacts the adhesive 108 applied to the recess 110 of the transfer body 109a.

  When the lower surface of the chip 101 comes into contact with the adhesive 108, the mount tool 116 moves upward as shown in FIG. As a result, a part or most of the liquid uncured adhesive 108 applied to the recess 110 of the transfer body 109 a moves to the lower surface of the chip 101.

  In this way, the adhesive 108 is transferred to the lower surface of the chip 101 by bringing the lower surface of the chip 101 into contact with the liquid uncured adhesive 108 applied to the recess 110 of the transfer body 109a.

  The thickness of the adhesive 108 transferred to the chip 101 can be controlled by adjusting the size of the recess formed by the recess 110, the force pressing the lower surface of the chip 101 against the adhesive 108, and the like. The thickness of the adhesive 108 transferred to the chip 101 is, for example, 1 μm to 10 μm.

  In the placement step (S4), the mounting tool 116 moves while holding the chip 101 to which the adhesive 108 has been transferred, as shown in FIG. 8A, and places the chip 101 on the mounting position of the substrate 102. To do.

  Then, the mount tool 116 stops sucking and moves upward as shown in FIG. Thereby, the chip 101 is disposed on the substrate 102 with the adhesive 108 transferred to the chip 101 interposed between the chip 101 and the substrate 102.

  In this embodiment, the example in which the uncured liquid state adhesive 108 is transferred to the chip 101 has been described. However, the uncured liquid state adhesive 108 is mounted on the substrate in advance. It may be transferred to a location. In this case, for example, the chip 101 may be disposed at the mounting position of the substrate 102 onto which the adhesive 108 has been transferred.

  As shown in FIG. 2, the adhesive 108 interposed between the chip 101 and the substrate 102 is cured (curing step; S5). The curing step (S5) is performed using, for example, the heater 118 shown in FIG. 9 which is a front view. Inside the heater 118, the substrate 102 is placed on the substrate mounting table 119, and the chip 101 is pushed by the pressing member 120 from above with a predetermined force. In this state, the heater 118 heats the chip 101 and the substrate 102 sandwiching the adhesive 108. The heating temperature and time may be appropriately determined according to the properties of the adhesive 108 and the heat resistance of the chip 101 and the substrate 102, respectively.

  Note that the flip chip bonder 112 a may have the function of the heater 118. In the curing step (S5) in this case, for example, the temperature in the flip chip bonder 112a may be raised while the chip 101 is pressed downward by the heated mount tool 116. Also by this, the chip 101 and the substrate 102 sandwiching the adhesive 108 can be heated.

  By performing the curing step (S <b> 5), the adhesive that has been in an uncured liquid state is cured, and the chip 101 is fixed to the substrate 102 by the adhesive layer 103. That is, the chip 101 is mounted on the substrate 102, and the chip mounting substrate 100 shown in FIG. 1 is manufactured.

  According to the present embodiment, the coated transfer body 107a is prepared by applying the adhesive 108 to the transfer body 109a (preparation process of coated transfer body; S2a). Then, the adhesive 108 contained in the coating transfer body 107a is transferred to the chip 101 (transfer process; S3a). As a result, the adhesive 108 in an uncured liquid state can be attached to the chip 101 with a very thin thickness. Thereafter, the chip 101 is placed on the substrate 102 and the adhesive 108 is cured (S4 and S5), whereby the chip mounting substrate 100 with the extremely thin adhesive layer 103 can be manufactured. Therefore, high-density mounting is possible.

  Further, according to the present embodiment, in the coating transfer body preparation step (S2a), the transfer body 109a coated with an uncured liquid adhesive 108 with a uniform thickness is prepared as the coating transfer body 107a. The Accordingly, the adhesive 108 can be transferred to the chip 101 with a uniform thickness in the transfer step (S3a). Thereafter, since the chip 101 is disposed on the substrate 102 and the adhesive 108 is cured (S4 and S5), the chip 101 can be stably and reliably fixed to the substrate 102 by the uniformly distributed adhesive 108. Therefore, stable mounting is possible.

  Further, according to the present embodiment, the coated transfer body 107a in which the adhesive 108 is applied to the concave portion 110 of the transfer body 109a is prepared (preparation process of coated transfer body; S2a). Then, the adhesive 108 contained in the coating transfer body 107a is transferred to the chip 101 (transfer process; S3a).

  As a result, the adhesive 108 in an uncured liquid state can be attached to the chip 101 with a very thin uniform thickness. Thereafter, the chip 101 is placed on the substrate 102 to cure the adhesive 108 (S4 and S5). Therefore, the chip 101 can be stably and reliably fixed to the substrate 102 by the adhesive 108 that is extremely thin and uniformly distributed. As a result, it is possible to stably manufacture the chip mounting substrate 100 in which the adhesive layer 103 is extremely thin. Therefore, stable and high-density mounting is possible.

  Furthermore, according to the present embodiment, the adhesive 108 is transferred to the chip 101 with a thickness of 1 μm to 10 μm in the transfer step (S3a). Therefore, in the subsequent arrangement step (S4) and curing step (S5), the chip 101 to which the uncured liquid state adhesive 108 is attached to the substrate 102 with an extremely thin thickness of 1 μm to 10 μm is disposed on the substrate 102. 108 will be cured. Thereby, it is possible to manufacture a very thin chip mounting substrate 100 in which the adhesive layer 103 has a thickness of about 1 μm to 10 μm. Therefore, high-density mounting is possible.

  The viscosity of the adhesive 108 in an uncured liquid state may be selected as appropriate, and the transfer ratio can be controlled by appropriately selecting the viscosity. For example, the viscosity of the adhesive 108 in an uncured liquid state is preferably 50 Pa · s (Pascal second) or less at 25 degrees Celsius.

  By selecting the adhesive 108 having such a viscosity, it becomes easy to transfer the adhesive 108 to the chip 101 with a very thin thickness of, for example, 1 μm to 10 μm. Thereby, the chip mounting substrate 100 in which the thickness of the adhesive layer 103 is extremely thin can be easily manufactured. Therefore, it becomes possible to facilitate high-density mounting.

  The particle size of the filler contained in the uncured liquid adhesive 108 may be selected as appropriate. For example, the particle size of the filler contained in the adhesive 108 in an uncured liquid state is preferably 1 μm or less.

  By selecting the adhesive 108 containing a filler having a particle size of 1 μm or less, it becomes easy to transfer the adhesive 108 to the chip 101 with a very thin thickness of, for example, 1 μm to 10 μm. Thereby, the chip mounting substrate 100 in which the thickness of the adhesive layer 103 is extremely thin can be easily manufactured. Therefore, it becomes possible to facilitate high-density mounting.

(Embodiment 2)
In the first embodiment, the example in which the chip mounting substrate 100 is manufactured by transferring the adhesive 108 applied to the concave portion 110 of the transfer body 109a to the chip 101 has been described. In the present embodiment, an example in which the chip mounting substrate 100 is manufactured by transferring the adhesive 108 applied to the convex portion of the transfer body onto the chip 101 will be described.

  The chip mounting substrate 100 according to the present embodiment is the same as the chip mounting substrate 100 according to the first embodiment (see FIG. 1). Therefore, a mounting method of the chip 101 that is characteristic of the present embodiment will be described.

  In the mounting method of the chip 101 according to the present embodiment, as shown in FIG. 10, after the chip preparation step (S1a) similar to that of the first embodiment, the coating transfer body preparation step (S2b) and the transfer step (S3b). ) Is performed.

  In the coating transfer body preparation step (S2b), similarly to the coating transfer body preparation step (S2a) according to the first embodiment, the transfer in which the adhesive 108 in an uncured liquid state is applied with a uniform thickness is performed. This is a step of preparing the body 109b as the coating transfer body 107b. The coating transfer body preparation step (S2b) includes, in detail, a transfer body preparation step (S21b) and an application step (S22b).

  In the transfer body preparation step (S21b) according to the present embodiment, as shown in FIG. 11, a transfer body 109b including a convex portion 121 that forms a surface protruding from a predetermined portion is prepared.

  The transfer body 109b according to the present embodiment is a roller that rotates about a rotation axis, and is made of, for example, resin. On the transfer body 109b, protrusions extending in the rotation axis direction are provided as convex portions 121 on the outer peripheral surface. That is, the convex portion 121 forms a surface protruding outward in the radial direction when viewed from the rotation axis direction. In the present embodiment, the two convex portions 121 are provided at symmetrical positions when viewed from the rotation axis direction.

  The coating process (S22b) according to the present embodiment is performed using, for example, a coating apparatus 122 shown in FIG. 11 which is a front view. The coating device 122 includes a first roller 123, a second roller 124, a third roller 125, and a transfer plate setting table 126 in addition to the transfer body 109b.

  Each of the first roller 123, the second roller 124, and the third roller 125 is a roller that rotates around a rotation axis parallel to the rotation axis of the transfer body 109b, and is made of, for example, resin. The first roller 123 and the second roller 124 are provided such that their outer peripheral surfaces are in contact with each other in the rotation axis direction. The second roller 124 and the third roller 125 are provided such that their outer peripheral surfaces are in contact with each other in the rotation axis direction. The third roller 125 and the transfer body 109b are provided such that their outer peripheral surfaces and the protruding surfaces formed by the convex portions 121 are in contact with each other in the rotation axis direction.

  The transfer plate installation table 126 is a table on which the transfer plate 127 is installed. The transfer plate 127 installed on the transfer plate mounting table 126 is a transfer device made of resin or the like, and is installed so that the upper surface thereof is in contact with the protruding surface formed by the convex portion 121 of the transfer body 109b. ing.

  In the coating step (S22b) according to the present embodiment, the liquid and uncured adhesive 108 is applied to the convex portion 121 of the transfer body 109b.

  In the present embodiment, first, the uncured liquid adhesive 108 is applied to the outer peripheral surface of the first roller 123 using, for example, a brush or a syringe. As shown by arrows in FIG. 11, the first roller 123 and the third roller 125 are rotated counterclockwise, and the second roller 124 and the transfer body 109b are rotated clockwise. As a result, the adhesive 108 applied to the first roller 123 is sequentially applied to the second roller 124 and the third roller. By sequentially applying to the plurality of rollers 123 to 125, the thickness of the adhesive 108 applied to the outer peripheral surface is smoothed.

  Then, the adhesive 108 is smoothly applied to the protruding surface formed by the convex portion 121 of the transfer body 109b from the third roller. As a result, as shown in FIG. 12, which is a front view, a coated transfer body 107b, which is a transfer body 109b coated with an uncured adhesive 108, is prepared.

  Referring to FIG. 10, the transfer step (S3b) is a step of transferring the adhesive 108 of the coating transfer body 107b to the chip 101. The transfer process (S3b) according to the present embodiment includes a primary transfer process (S31b) and a secondary transfer process (S32b) in detail.

  The primary transfer step (S31b) is a step of transferring the adhesive 108 in an uncured liquid state onto the transfer plate 127.

  The primary transfer step (S31b) according to the present embodiment is performed using the coating apparatus 122 described above with reference to FIG. As described above, the transfer plate 127 is installed on the transfer plate mounting table 126 of the coating device 122 so that the upper surface of the transfer plate 127 and the protruding surface formed by the convex portion 121 of the transfer body 109b are in contact with each other. Therefore, when the transfer body 109b applied with the uncured liquid state adhesive 108 is rotated, the adhesive 108 applied to the convex portion 121 is transferred to the upper surface of the transfer plate 127 (primary transfer).

  Referring to FIG. 10, the secondary transfer step (S32b) is a step of transferring adhesive 108 in an uncured liquid state from transfer plate 127 to chip 101.

  The secondary transfer step (S32b) according to the present embodiment is performed using a flip chip bonder 112b having the same configuration as the flip chip bonder 112a according to the first embodiment, as shown in FIG. Is called. In the present embodiment, the transfer plate 127 onto which the adhesive 108 in an uncured liquid state is transferred by primary transfer is installed in the second installation region 114 of the flip chip bonder 112b.

  In FIG. 13, the thickness of the transferred adhesive 108 is shown larger than the size of a general transfer plate 127 for easy understanding.

  The flip chip bonder 112b operates in the same manner as in the first embodiment.

  That is, in the secondary transfer step (S32b), the mount tool 116 holds one of the plurality of chips 101 as in the first embodiment.

  Then, the mount tool 116 moves so that the lower surface of the chip 101 held in contact with the adhesive 108 transferred to the transfer plate 127. At this time, the mounting tool 116 may press the lower surface of the chip 101 against the adhesive 108 with a predetermined pressure.

  Thereby, a part or most of the liquid uncured adhesive 108 transferred to the transfer plate 127 moves to the lower surface of the chip 101.

  Thus, the adhesive 108 is transferred to the lower surface of the chip 101 by making the lower surface of the chip 101 contact the liquid uncured adhesive 108 transferred to the transfer plate 127 (secondary transfer).

  The thickness of the adhesive 108 transferred to the chip 101 is the amount of the adhesive 108 applied to the first roller 123, the configuration of the rollers 123 to 125, the hardness of the convex portion 121, and the lower surface of the chip 101 to the adhesive 108. It can be controlled by adjusting the pressing force. The configurations of the rollers 123 to 125 include the number of rollers 123 to 125 that are interposed before transferring to the transfer body 109b, the magnitude of the force applied between the outer peripheral surfaces that are in contact with each other, the hardness of the outer peripheral surfaces of the rollers 123 to 125, and the like. It is. The thickness of the adhesive 108 transferred to the chip 101 is, for example, 1 μm to 10 μm.

  Thereafter, as shown in FIG. 10, the same arrangement step (S4) as that of the first embodiment is performed using the flip chip bonder 112b. That is, the mounting tool 116 moves while holding the chip 101 to which the adhesive 108 has been transferred, and places the chip 101 on the mounting position of the substrate 102. And the chip | tip 101 is mounted in the board | substrate 102 by performing a hardening process (S5), and the chip mounting board | substrate 100 shown in FIG. 1 is manufactured.

  According to the present embodiment, the application transfer body 107b is prepared by applying the adhesive 108 to the transfer body 109b (preparation step of application transfer body; S2b). Then, the adhesive 108 contained in the coating transfer body 107b is transferred to the chip 101 (transfer process; S3b). Therefore, similarly to the first embodiment, the chip mounting substrate 100 in which the adhesive layer 103 is extremely thin can be manufactured. Therefore, high-density mounting is possible.

  Further, according to the present embodiment, in the coated transfer body preparation step (S2b), the transfer body 109b to which the uncured liquid state adhesive 108 is coated with a uniform thickness is prepared as the coated transfer body 107b. The Thus, the adhesive 108 can be transferred to the chip 101 with a uniform thickness in the transfer step (S3b). Therefore, as in the first embodiment, the chip 101 can be stably and reliably fixed to the substrate 102 by the uniformly distributed adhesive 108. Therefore, stable mounting is possible.

  Further, according to the present embodiment, the coated transfer body 107 in which the adhesive 108 is applied to the convex portion 121 of the transfer body 109b is prepared (preparation process of coated transfer body; S2b). Then, the adhesive 108 contained in the coating transfer body 107b is transferred to the chip 101 (transfer process; S3b).

  As a result, the adhesive 108 in an uncured liquid state can be attached to the chip 101 with a very thin uniform thickness. Therefore, as in the first embodiment, the chip 101 can be stably and reliably fixed to the substrate 102 by the adhesive 108 that is extremely thin and uniformly distributed. As a result, it is possible to stably manufacture the chip mounting substrate 100 in which the adhesive layer 103 is extremely thin. Therefore, stable and high-density mounting is possible.

  Further, according to the present embodiment, the adhesive 108 is transferred to the chip 101 with a thickness of 1 μm to 10 μm in the transfer step (S3b). Therefore, as in the first embodiment, an extremely thin chip mounting substrate 100 in which the adhesive layer 103 has a thickness of about 1 μm to 10 μm can be manufactured. Therefore, high-density mounting is possible.

(Embodiment 3)
In the first embodiment, the example in which the chip mounting substrate 100 is manufactured by directly transferring the adhesive 108 applied to the concave portion 110 of the transfer body 109a to the chip 101 has been described. In this embodiment, the chip mounting substrate 100 is manufactured by transferring the adhesive 108 applied to the concave portion 110 of the transfer body 109a to the chip 101 through the pad and the transfer plate 127 similar to that of the second embodiment. Will be explained.

  The chip mounting substrate 100 according to the present embodiment is the same as the chip mounting substrate 100 according to the first embodiment (see FIG. 1). Therefore, a mounting method of the chip 101 that is characteristic of the present embodiment will be described.

  Referring to FIG. 14, in the mounting method of chip 101 according to the present embodiment, the transfer process (S3c) is performed after the chip preparation process (S1a) and the coating transfer body preparation process (S2a) similar to those in the first embodiment. ) Is performed.

  The transfer step (S3c) is a step of transferring the adhesive 108 of the coated transfer body 107a to the chip 101, similarly to the transfer step (S3a) according to the first embodiment. In detail, the transfer step (S3c) according to the present embodiment includes a primary transfer step (S31c), a secondary transfer step (S32c), and a tertiary transfer step (S33c).

  The primary transfer step (S31c) is a step of transferring the uncured liquid state adhesive 108 to the pad 128.

  The primary transfer process (S31c) according to the present embodiment is performed using, for example, a pre-transfer device 129 shown in FIG. 15 which is a front view. The pre-transfer device 129 includes a fourth installation area 130, a fifth installation area 131, a pad tool 132, and a second moving mechanism 133.

  The fourth installation area 130 is an area in which the coating transfer body 107a prepared in the coating transfer body preparation step (S2a) is installed.

  The fifth installation area 131 is an area where the transfer plate 127 is installed.

  The pad tool 132 is an instrument having a flexible pad 128 below.

  The second moving mechanism 133 is a mechanism for moving the pad tool 132. The second moving mechanism 133 according to the present embodiment moves the pad tool 132 above the fourth installation area 130 and the fifth installation area 131.

  In the primary transfer step (S31c), after the pad tool 132 is positioned above the adhesive 108 of the coating transfer body 107a installed in the fourth installation region 130, as shown in FIG. The lower surface of the plate moves downward until it contacts the adhesive 108. At this time, the pad tool 132 may press the lower surface of the pad 128 against the adhesive 108 with a predetermined pressure.

  When the lower surface of the pad 128 contacts the adhesive 108, the pad tool 132 moves upward as shown in FIG. As a result, a part or most of the liquid uncured adhesive 108 applied to the recess 110 of the transfer body 109 a moves to the lower surface of the pad 128.

  Thus, the adhesive 108 is transferred to the lower surface of the pad 128 by bringing the lower surface of the pad 128 into contact with the liquid uncured adhesive 108 applied to the recess 110 of the transfer body 109a (primary transfer). ).

  In FIG. 16, the thickness of the adhesive 108 is shown larger than that of a general pad 128 for easy understanding.

  Referring to FIG. 14, the secondary transfer step (S32c) is a step of transferring the uncured liquid state adhesive 108 to the transfer plate 127 in the same manner as the primary transfer step (S31b) according to the second embodiment. It is.

  The secondary transfer step (S32c) according to the present embodiment is performed using, for example, the pre-transfer device 129 described above with reference to FIG.

  In the secondary transfer step (S32c), the pad tool 132 having the adhesive 108 transferred to the lower surface of the pad 128 is positioned above the transfer plate 127 installed in the fifth installation region 131. Thereafter, as shown in FIG. 16C, the pad tool 132 moves downward until the lower surface of the pad 128 contacts the upper surface of the transfer plate 127. At this time, the pad tool 132 may press the lower surface of the pad 128 against the transfer plate 127 with a predetermined pressure.

  When the lower surface of the pad 128 contacts the transfer plate 127, the pad tool 132 moves upward as shown in FIG. As a result, part or most of the liquid uncured adhesive 108 transferred to the pad 128 moves to the upper surface of the transfer plate 127.

  Thus, the adhesive 108 is transferred onto the upper surface of the transfer plate 127 by bringing the upper surface of the transfer plate 127 into contact with the liquid uncured adhesive 108 transferred to the pad 128 (secondary transfer).

  Referring to FIG. 14, in the tertiary transfer step (S33c), as in the secondary transfer step (S32b) according to Embodiment 2, the uncured liquid state adhesive 108 is transferred from the transfer plate 127 to the chip 101. This is a transfer process.

  The tertiary transfer step (S33c) according to the present embodiment is performed using the flip chip bonder 112b, similarly to the secondary transfer step (S32b) according to the second embodiment. In the present embodiment, the transfer plate 127 on which the adhesive 108 in an uncured liquid state is transferred by secondary transfer is installed in the second installation region 114 of the flip chip bonder 112b. In this state, the flip chip bonder 112b operates in the same manner as in the secondary transfer step (S32b) according to the second embodiment. As a result, the liquid uncured adhesive 108 transferred to the transfer plate 127 is transferred to the lower surface of the chip 101 (third transfer).

  In the present embodiment, the thickness of the adhesive 108 transferred to the chip 101 is the size of the recess formed by the recess 110, the material of the pad 128, the force pressing the lower surface of the pad 128 against the adhesive 108 or the transfer plate 127, etc. It can be controlled by adjusting. The thickness of the adhesive 108 transferred to the chip 101 is, for example, 1 μm to 10 μm.

  Thereafter, as shown in FIG. 14, the steps after the arrangement step (S4) similar to those in the first embodiment are performed. Thereby, the chip 101 is mounted on the substrate 102, and the chip mounting substrate 100 shown in FIG. 1 is manufactured.

  According to the present embodiment, the same effects as those of the first embodiment are obtained.

  Further, according to the present embodiment, the adhesive 108 is transferred to the chip 101 through a plurality of times of transfer in the transfer step (S3c). Thus, the adhesive 108 can be transferred to the chip 101 with a more uniform thickness than in the first embodiment in the transfer step (S3c). Therefore, the chip 101 can be fixed to the substrate 102 more stably and reliably than the first embodiment by the adhesive 108 distributed more uniformly. Therefore, more stable mounting is possible.

  In the third embodiment, instead of the transfer body 109a including the concave portion 110, as shown in FIG. 17, a transfer body 109c including a convex portion P that forms a protruding surface may be employed.

  In this case, in the applying step (S22a), the uncured liquid adhesive 108 may be applied to the protruding surface (upper surface) formed by the convex portion P. In the primary transfer step (S31c), the adhesive 108 is brought into contact with the lower surface of the pad 128 by bringing the lower surface of the pad 128 into contact with the uncured liquid adhesive 108 applied to the upper surface of the convex portion P. It is good to be transferred to.

  Even in such a modification, the same effect as in the third embodiment can be obtained.

(Embodiment 4)
In the present embodiment, an example in which the chip mounting substrate 100 is manufactured using DAF (Die Attach Film), which is an insulating film adhesive, as a coating transfer body will be described.

  The chip mounting substrate 100 according to the present embodiment is the same as the chip mounting substrate 100 according to the first embodiment (see FIG. 1). Therefore, a mounting method of the chip 101 that is characteristic of the present embodiment will be described.

  In the mounting method of the chip 101 according to the present embodiment, as shown in FIG. 18, a coated transfer body 107d is prepared (preparation process of coated transfer body; S2d). The coated transfer body 107d according to the present embodiment is obtained by applying an adhesive 108 to one surface of the transfer body 109d (see FIG. 19).

  The transfer body 109d is a flexible film. The material of the transfer body 109d is, for example, polyethylene terephthalate, polypropylene, polyethylene, or the like. The thickness of the transfer body 109d is preferably 20 μm to 100 μm.

  An adhesive 108 in an uncured liquid state is applied to the transfer body 109d with a uniform thickness. Such a coated transfer body 107d is generally called DAF or the like.

  Note that the coating transfer body preparation step (S2d) may include a transfer body preparation step for preparing the transfer body 109d and an application step for applying the adhesive 108 to the transfer body 109d. In this case, in the coating step, it may be applied uniformly at 1 μm to 20 μm using a gravure coater, a die coater or the like.

  Referring to FIG. 18, chip 101 is prepared (chip preparation step; S1d). Specifically, the chip preparation step (S1d) includes a wafer preparation step (S11d) and a dicing step (S12d).

  In the wafer preparation step (S11d), as shown in FIG. 19, a wafer 104 in which a large number of elements are formed is prepared. FIG. 19A is a perspective view of the wafer 104 prepared in the wafer preparation step (S11d) according to the present embodiment, and FIG. 19B is a side sectional view thereof.

  The wafer 104 is held on the coating transfer body 107d so that the chip 101 does not scatter during subsequent dicing.

  Specifically, the wafer 104 is placed on the adhesive 108 applied to the transfer body 109 d and is held on the application transfer body 107 d by the adhesive force of the adhesive 108.

  Further, the transfer body 109d is sandwiched between the dicing frame 106 and the adhesive 108, for example. At this time, the transfer body 109 d may be fixed to the dicing frame 106 by heating the dicing frame 106 to partially cure the adhesive 108 that contacts the dicing frame 106.

  In FIG. 19, for the sake of clarity, the thickness of the adhesive 108 is shown larger than the thickness of a general dicing frame 106 or wafer 104, and the same applies to FIGS. 21 and 22 to be referred to later. .

  In the dicing step (S12d), as shown in FIG. 20, the wafer 104 is cut into a predetermined size and shape by a dicing saw while being held by the coating transfer body 107d. Thus, the plurality of chips 101 are prepared while being held on the coating transfer body 107d.

  Referring to FIG. 18, the adhesive 108 of the coated transfer body 107d is transferred to the chip 101 (transfer process; S3d).

  The transfer step (S3d) according to the present embodiment is performed, for example, using the flip chip bonder 112d shown in FIG. 21, which is a front view, together with the subsequent arrangement step (S4).

  The flip chip bonder 112d according to the present embodiment does not include the second installation region 114, and is configured in the same manner as the flip chip bonder 112a according to the first embodiment except for this point.

  In the transfer step (S3d), the mount tool 116 moves upward after holding one of the plurality of chips 101 by suction. At this time, the mounting tool 116 may press the lower surface of the chip 101 against the adhesive 108 with a predetermined pressure when holding the chip 101. Thereby, as shown in FIG. 22, the adhesive 108 is separated from the transfer body 109 and transferred to the lower surface of the chip 101.

  The thickness of the adhesive 108 transferred to the chip 101 can be controlled by adjusting the thickness of the adhesive 108 included in the coating transfer body 107d, the force pressing the lower surface of the chip 101 against the adhesive 108, and the like. . The thickness of the adhesive 108 transferred to the chip 101 is, for example, 1 μm to 10 μm.

  Thereafter, as shown in FIG. 18, the same arrangement step (S4) as that of the first embodiment is performed using the flip chip bonder 112d. That is, the mounting tool 116 moves while holding the chip 101 to which the adhesive 108 has been transferred, and places the chip 101 on the mounting position of the substrate 102. And the chip | tip 101 is mounted in the board | substrate 102 by performing a hardening process (S5), and the chip mounting board | substrate 100 shown in FIG. 1 is manufactured.

  According to the present embodiment, the coated transfer body 107d in which the adhesive 108 is applied to the transfer body 109d is prepared (preparation process of coated transfer body; S2d). Then, the adhesive 108 contained in the coating transfer body 107d is transferred to the chip 101 (transfer process; S3d). Therefore, similarly to the first embodiment, the chip mounting substrate 100 in which the adhesive layer 103 is extremely thin can be manufactured. Therefore, high-density mounting is possible.

  Further, according to the present embodiment, in the coating transfer body preparation step (S2d), the transfer body 109d coated with an uncured liquid adhesive 108 with a uniform thickness is prepared as the coating transfer body 107d. The Thus, the adhesive 108 can be transferred to the chip 101 with a uniform thickness in the transfer step (S3d). Therefore, as in the first embodiment, the chip 101 can be stably and reliably fixed to the substrate 102 by the uniformly distributed adhesive 108. Therefore, stable mounting is possible.

  Furthermore, according to the present embodiment, it is possible to manufacture the chip mounting substrate 100 using a general DAF as the coating transfer body 107d. Therefore, the coating transfer body 107d can be easily prepared. Therefore, high-density mounting can be easily realized.

  Further, according to the present embodiment, the adhesive 108 is transferred to the chip 101 with a thickness of 1 μm to 10 μm in the transfer step (S3d). Therefore, as in the first embodiment, an extremely thin chip mounting substrate 100 in which the adhesive layer 103 has a thickness of about 1 μm to 10 μm can be manufactured. Therefore, high-density mounting is possible.

  In the first embodiment, the coating transfer body 107d according to the fourth embodiment may be employed instead of the coating transfer body 107a. According to this, the same effect as in the fourth embodiment can be obtained.

  As mentioned above, although embodiment of this invention, the modification, etc. were demonstrated, this invention is not limited to these. The present invention includes, for example, an aspect obtained by changing the embodiment, an aspect obtained by appropriately combining the embodiment and the modification, an aspect obtained by appropriately changing this aspect, and the like.

  The method for mounting a plate-like body according to the present invention can be used for mounting a thin plate-like member on an object to be mounted such as a substrate or a chip.

100 Chip mounting substrate 101 Chip 102 Substrate 103 Adhesive layer 104 Wafer 105 Dicing tape 106 Dicing frames 107a, 107b, 107d Application transfer body 108 Adhesive 109a, 109b, 109c, 109d Transfer body 110 Recessed part 111 Squeegee 112a, 112b, 112d Flip chip Bonder 113 First installation area 114 Second installation area 115 Third installation area 116 Mount tool 117 First moving mechanism 118 Heater 119 Substrate installation table 120 Pressure member 121 Protruding part 122 Coating device 123 First roller 124 Second roller 125 Third roller 126 Transfer plate setting table 127 Transfer plate 128 Pad 129 Pre-transfer device 130 Fourth setting area 131 Fifth setting area 132 Pad tool 133 Second moving mechanism

Claims (9)

Preparing an application transfer body, which is a transfer body in which an adhesive that is cured by a predetermined method is applied in an uncured liquid state;
Transferring the adhesive applied to the transfer body to a plate-like body or an object to be mounted;
Interposing the transferred adhesive between the plate-like body and the mounted object, and arranging the plate-like body on the mounted object;
Curing the adhesive interposed between the plate-like body and the object to be mounted. A method of mounting a plate-like body, comprising: 2. The preparation of the application transfer body, wherein the transfer body on which the uncured liquid adhesive is applied with a uniform thickness is prepared as the application transfer body. The mounting method of the plate-shaped body of description. Preparing the coating transfer body includes
Preparing the transfer body including a protrusion that forms a protruding surface;
Applying the uncured liquid state adhesive to the projections,
In transferring to the plate-like body or the mounted object, the uncured liquid adhesive applied to the convex portion is transferred to the plate-like body or the mounted object. The mounting method of the plate-shaped body according to claim 1 or 2. Preparing the coating transfer body includes
Preparing the transfer body including a recess that forms a depression;
Applying the uncured liquid adhesive to the recess,
The said adhesive agent apply | coated to the said recessed part is transcribe | transferred to the said plate-shaped object or the said to-be-mounted object by transferring to the said plate-shaped object or the to-be-mounted object. Mounting method for plate. Preparing the coating transfer body includes
Preparing the transfer body including a convex portion forming a protruding surface or a concave portion forming a depression;
Applying the uncured liquid state adhesive to the convex part or the concave part,
Transferring to the plate-like body or the mounted object,
Transferring the adhesive applied to the convex part or the concave part to a pad;
The method for mounting a plate-like body according to claim 1, further comprising: transferring the adhesive transferred to the pad to the plate-like body or the mounted object. In preparing the coating transfer body, a flexible film-like transfer body coated with the uncured liquid adhesive is prepared as the coating transfer body,
In the transfer, the adhesive applied to the transfer body is brought into contact with the adhesive applied to the transfer body by pressing the plate-like body or the mounting object to the plate-like body or the mounting object. The plate-shaped body mounting method according to claim 1, wherein the plate-shaped body is mounted on the plate-like body. By transferring the adhesive applied to the transfer body to a plate-like body or an object to be mounted, the adhesive applied to the transfer body has a thickness of 1 μm to 10 μm to the plate-like body or the object to be mounted. The plate-shaped body mounting method according to claim 1, wherein the plate-like body is transferred. The method for mounting a plate-shaped body according to any one of claims 1 to 7, wherein the uncured liquid adhesive has a viscosity at 25 degrees Celsius of 50 Pa · s or less. The method for mounting a plate-shaped body according to any one of claims 1 to 8, wherein the filler contained in the uncured liquid adhesive has a particle size of 1 µm or less.

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