KR100453691B1 - Floater apparatus of trim form system for semiconductor package to vertically transfer floater - Google Patents

Floater apparatus of trim form system for semiconductor package to vertically transfer floater Download PDF

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Publication number
KR100453691B1
KR100453691B1 KR1019970079584A KR19970079584A KR100453691B1 KR 100453691 B1 KR100453691 B1 KR 100453691B1 KR 1019970079584 A KR1019970079584 A KR 1019970079584A KR 19970079584 A KR19970079584 A KR 19970079584A KR 100453691 B1 KR100453691 B1 KR 100453691B1
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South Korea
Prior art keywords
floater
plotter
cam
roller
form system
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KR1019970079584A
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Korean (ko)
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KR19990059383A (en
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정명국
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앰코 테크놀로지 코리아 주식회사
세미시스 주식회사
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Priority to KR1019970079584A priority Critical patent/KR100453691B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Abstract

PURPOSE: A floater apparatus of a trim form system for a semiconductor package is provided to vertically transfer a floater by making a roller in contact with the outer circumference of a cam rotating by a driving axis transfer in the vertical direction according to a variation quantity of the cam while vertically transferring the axis of a floater rail by a spring. CONSTITUTION: A cam(12) is installed in a driving axis(11) that is rotated by driving force of a motor and is installed under a table(T). A roller housing(14) comes in contact with the outer circumference of the cam. An axis(15) is elastically installed in the table by a spring(16), and a roller(13) of the roller housing is axially supported under the axis. A floater rail(17) moves up/down a leadframe material, installed over an axis(11) of the roller housing.

Description

반도체패키지용 트림폼시스템의 플로터장치Plotter Device of Trim Form System for Semiconductor Package

본 발명은 반도체패키지용 트림폼시스템의 플로터장치에 관한 것으로서, 특히 트림폼시스템의 안내부에 구비된 플로터레일이 회전하는 캠의 변위량에 의해 업다운될 수 있도록 한 반도체패키지용 트림폼시스템의 플로터장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plotter apparatus for a trim form system for semiconductor packages, and more particularly to a plotter apparatus for a trim package system for semiconductor packages in which the plotter rail provided in the guide portion of the trim form system can be up-down by a displacement amount of a rotating cam. It is about.

일반적으로 반도체패키지를 제조하는 트림폼시스템의 리드프레임에 반도체칩의 부착과 와이어의 연결과 패키지의 성형이 완료된 리드프레임자재를 싱귤레이션 작업과 리드의 컷팅 및 포밍을 위한 것이다.In general, the lead frame material for the semiconductor chip is attached to the lead frame of the trim form system for manufacturing a semiconductor package, the connection of wires and the molding of the package is completed for singulation work, cutting and forming the lead.

이러한 트림폼시스템은 패키지의 성형이 완료된 리드프레임자재를 매거진에 수납시킨 상태에서 공급부에 셋팅시키면 안내부로 공급되어 피딩부에 의해 상하 업다운되는 플로터에 공급되고, 리드프레임자재는 싱귤레이션 작업부에 의해 리드프레임과 리드의 경계면이 분리되는 싱귤레이션작업이 시행되며, 자재는 트림폼작업부로 공급되어 리드의 트림폼이 완료된후 외부로 배출시키도록 한 것이다. The trim form system is supplied to the plotter when the lead frame material, which has been molded of the package, is stored in the magazine and is set to the supply part, and is supplied to the guide part and fed up and down by the feeding part, and the lead frame material is supplied by the singulation work part. A singulation process is performed in which the interface between the lead frame and the lead is separated, and the material is supplied to the trim form work part to be discharged to the outside after the trim form of the lead is completed.

이렇게 싱귤레이션과 트림폼이 시행되는 안내부에 안내레일 선단과 싱귤레이션이 이루어지는 싱귤레이션 작업부에는 플로터가 구비되어 있다.In this way, the guide section where the singulation and trim foam are applied is provided with a plotter at the singulation work section where the guide rail tip and the singulation are made.

상기한 종래의 플로터장치는 트림폼시스템의 테이블에 실린더에 의해 작동하는 플로터레일을 구비하고 이 플로터레일을 통해 리드프레임자재가 이송되어 싱귤레이션작업부로 공급되어 싱귤레이션작업이 이루어지게 한다.The conventional plotter device includes a plotter rail operated by a cylinder on a table of the trim form system, and the lead frame material is transferred to the singulation work part through the plotter rail to perform a singulation work.

그런, 상기 플로터레일은 실린더에 의해 상하업다운되면서 싱귤레이션작업부에 공급되어 있는 리드프레임자재를 싱귤레이션시킴에 따라 신속한 동작이 이루어지지 못하여 반도체패키지의 제조시 고품질이 요구되는 상태로 작업이 용이하게 이루어지지 못하므로서, 대량생산을 저해하는 문제점이 있었다.As such, the plotter rail is not up and down by a cylinder, and the lead frame material supplied to the singulation work part is not regulated quickly, so that the work is easily performed in a state where high quality is required in the manufacture of a semiconductor package. Since it was not made, there was a problem of inhibiting mass production.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 발명한 것으로서, 구동축에 의해 회전하는 캠의 외주연에 접촉된 롤러가 캠의 변위량에 따라 상하 이송되면서 테이블에 스프링으로 축지된 플로터레일의 축이 상하 이동될수 있도록 하므로서 플로터를 상하 이동시킬 수 있게 한 반도체패키지용 트림폼시스템의 플로터장치에 관한 것이다.The present invention has been invented to solve the above conventional problems, the roller contacted to the outer periphery of the cam rotated by the drive shaft is moved up and down according to the displacement amount of the cam shaft of the plotter rail axially spring-loaded on the table The present invention relates to a plotter device of a trim form system for a semiconductor package, which is capable of being moved up and down while being able to move up and down.

이하 본 발명의 구성을 설명하면 다음과 같다.Hereinafter, the configuration of the present invention will be described.

반도체패키지의 리드프레임자재(100)를 싱귤레이션 및 트림폼시키는 트림폼시스템(TS)의 플로터장치(10)에 있어서,In the plotter apparatus 10 of the trim form system TS which singulates and trims the lead frame material 100 of a semiconductor package,

상기 플로터장치(10)는 테이블(T)의 하부에 모터의 구동력에 의해 회전하는 구동축(11)에 설치된 캠(12)과 ;The plotter device 10 includes a cam 12 provided at a lower portion of the table T on a drive shaft 11 that is rotated by a driving force of a motor;

상기 캠(12)의 외주연에 접촉되도록 하고 테이블(T)에 스프링(16)으로 축(15)이 탄력설치되며 축(15)의 하부에 상기 롤러(13)가 축지된 롤러하우징(14)과 ;The roller housing 14 which is in contact with the outer periphery of the cam 12 and the shaft 15 is elastically installed by a spring 16 on the table T, and the roller 13 is stored on the lower part of the shaft 15. And;

상기 롤러하우징(14)의 축(11) 상부에 설치되어 리드프레임자재(100)를 업다운시키는 플로터레일(17)과 ;A plotter rail 17 installed above the shaft 11 of the roller housing 14 to up and down the lead frame material 100;

를 포함하는 것이다.It will include.

이와 같이 된 본 발명의 일 실시예를 첨부도에 의하여 상세히 설명하면 다음과 같다.When described in detail by the accompanying drawings an embodiment of the present invention as follows.

도 1은 본 발명의 플로터장치가 적용된 트림폼시스템의 평면구성도로서, 테이블(T)의 상부면 소정위치에 리드프레임자재(100)를 공급시키는 공급부(IN)가 구비되고, 이 전방에는 좌우 길이방향으로 리드프레임자재(1000)를 안내하는 안내부(IN)를 구비한다.1 is a planar configuration diagram of a trim form system to which the plotter apparatus of the present invention is applied, and a supply unit IN for supplying the lead frame material 100 to a predetermined position on the upper surface of the table T is provided. It is provided with a guide portion (IN) for guiding the lead frame material 1000 in the longitudinal direction.

상기한 공급부(IN)에는 전 단계에서 반도체칩의 부착과 와이어의 연결과 패키지의 성형이 완료된 리드프레임자재(100)가 수납된 매거진(M)이 셋팅되는 셋팅부(ST)와 이 전방에 매거진(M)내의 리드프레임자재(100)를 공급시키는 로테이터이송부(RF)를 구비한다.In the supply part IN, the setting part ST in which the magazine M, in which the lead frame material 100, in which the semiconductor chip is attached, the wires connected, and the molding of the package are completed, is set in the previous step, is set, and the magazine in front of the supply part IN. A rotator transfer part RF for supplying the lead frame material 100 in (M) is provided.

안내부(G)에는 좌우 길이방향으로 안내레일(R)과 도 2와 같이 이 안내레일(R)의 선단에 상하 업다운되는 플로터장치(17)을 구비한다.The guide part G is provided with the guide rail R in the left-right direction, and the plotter apparatus 17 which moves up and down at the front-end | tip of this guide rail R like FIG.

상기 플로터장치(10)는 테이블(T)의 하부에 모터의 구동으로 회전하는 구동축(11)과 이 구동축(11)에 캠(12)를 구비한다.The plotter device 10 includes a drive shaft 11 that rotates by driving of a motor under the table T, and a cam 12 on the drive shaft 11.

상기 캠(12)의 상부에는 외주연에 접촉되도록 하는 롤러(13)를 구비하고 이 롤러(13)는 테이블(T)에 스프링(16)으로 탄력설치된 축(15)의 하부에 구비된 롤러하우징(14)에 축지된다.The upper part of the cam 12 is provided with a roller 13 to be in contact with the outer periphery, the roller 13 is a roller housing provided in the lower portion of the shaft 15 elastically installed with a spring 16 on the table (T) It is moistened at 14.

상기 테이블(T)상부에 돌출된 축(15)의 상단에는 플로터레일(17)을 구비한다.The upper end of the shaft 15 protruding above the table T is provided with a plotter rail 17.

또한 롤러하우징(14)의 하부에는 실린더(18)를 설치한다.In addition, a cylinder 18 is installed below the roller housing 14.

이와 같이 된 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention as described above is as follows.

도 3에서 보는 바와 같이 모터의 구동에 의해 구동축(11)이 회전되고, 구동축(11)의 회전에 의해 캠(12)이 회전한다.As shown in FIG. 3, the drive shaft 11 is rotated by the driving of the motor, and the cam 12 is rotated by the rotation of the drive shaft 11.

상기 캠(12)이 회전하면 외주연 변위량에 따라 롤러(13)가 상하 이동한다.When the cam 12 rotates, the roller 13 moves up and down in accordance with the outer peripheral displacement amount.

상기 롤러(13)가 상하이동하면 동시에 롤러하우징(14)과 테이블(T)에 스프링(16)으로 탄력설치된 축(15)이 상하 업다운되고, 동시에 축(15)의 상부에 구비된 플로터레일(17)이 상하 이동되는 것이다.When the roller 13 moves up and down at the same time, the shaft 15 elastically installed by the spring 16 on the roller housing 14 and the table T is moved up and down, and at the same time the plotter rail provided on the upper part of the shaft 15 ( 17) is moved up and down.

이렇게 상하이동되는 플로터레일(17)에는 리드프레임자재(100)가 공급되어 있어 플로터레일(17)의 하강시 싱귤레이션작업부(SG)의 와이어 리드프레임자재(100)가 안치되도록 한 상태에서 펀치의 하강으로 싱귤레이션작업이 이루어지게 한다.The lead frame material 100 is supplied to the floater rail 17 which is moved in such a manner that the punch is carried out in a state in which the wire lead frame material 100 of the singulation work part SG is placed when the plotter rail 17 descends. Sing regulation is performed by the descent of.

이러한 플로터장치(10)는 싱귤레이션되는 리드프레임자재(100)의 상하이동을 캠(12)의 회전에 의해 연계되어 상하 업다운되도록 하여 신속하고 정확한 작업이 이루어지도록 한 것이다.The plotter device 10 is to move up and down by connecting the shangdong of the lead frame material 100 is singulated by the rotation of the cam 12 to make a quick and accurate work.

또한 플로터장치(10)의 롤러하우징(14)에 설치된 실린더(18)는 싱귤레이션작업부(SG)의 금형을 정비하거나 분리시킬 때 실린더(18)의 구동에 의해 롤러하우징(14)과 축(15)과 플로터레일(17)을 상승시킬 수 있게하여 점검을 용이하게 한 것이다.In addition, the cylinder 18 installed in the roller housing 14 of the plotter device 10 is driven by the cylinder 18 when the mold of the singulation work part SG is repaired or removed. 15) and the floater rail 17 can be raised to facilitate the inspection.

이상에서와 같이 본 발명은 구동축에 의해 회전하는 캠의 외주연에 접촉된 롤러가 캠의 변위량에 따라 상하 이송되면서 테이블에 스프링으로 축지된 플로터레일의 축이 상하 이동될수 있도록 하므로서 싱귤레이션작업이 신속하고 정확하게 이루어지게 하므로서 트림폼시스템에서의 싱귤레이션작업성 향상에 따른 생산성을 높일 수 있는 효과가 있다.As described above, the present invention allows the roller contacting the outer circumference of the cam rotated by the drive shaft to be vertically moved according to the cam displacement, so that the shaft of the plotter rail held by the spring on the table can be moved up and down quickly. As a result, it is possible to increase productivity by improving singulation workability in the trim form system.

도 1은 본 발명의 플로터장치가 적용된 트림폼시스템의 전체평면 구성도.1 is an overall plan view of a trim form system to which the plotter apparatus of the present invention is applied.

도 2는 본 발명의 플로터장치의 설치상태 정면구성도.Figure 2 is a front configuration diagram of the installation state of the plotter apparatus of the present invention.

도 3은 본 발명의 플로터장치의 작동상태도.Figure 3 is an operating state of the plotter device of the present invention.

(도면의 주요 부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)

10 ; 플로터장치 11 ; 구동축10; Plotter device 11; driving axle

12 ; 캠 13 ; 롤러12; Cam 13; roller

14 ; 롤러하우징 15 ; 축14; Roller housing 15; shaft

16 ; 스프링 17 ; 플로터레일16; Spring 17; Plotter Rail

100 ; 리드프레임자재 TS ; 트림폼시스템100; Lead frame material TS; Trim Foam System

Claims (2)

반도체패키지의 리드프레임자재(100)를 싱귤레이션 및 트림폼시키는 트림폼시스템(TS)의 플로터장치(10)에 있어서,In the plotter apparatus 10 of the trim form system TS which singulates and trims the lead frame material 100 of a semiconductor package, 상기 플로터장치(10)는 테이블(T)의 하부에 모터의 구동력에 의해 회전하는 구동축(11)에 설치된 캠(12);The plotter device 10 includes a cam 12 mounted to a drive shaft 11 that rotates by a driving force of a motor under the table T; 상기 캠(12)의 외주연에 접촉되도록 하고, 테이블(T)에 스프링(16)으로 축(15)이 탄력설치되며 축(15)의 하부에 롤러(13)가 축지된 롤러하우징(14); 및,The roller housing 14 is brought into contact with the outer circumference of the cam 12, and the shaft 15 is elastically installed by the spring 16 on the table T, and the roller 13 is supported on the lower portion of the shaft 15. ; And, 상기 롤러하우징(14)의 축(11) 상부에 설치되어 리드프레임자재(100)를 업다운시키는 플로터레일(17)을 포함하여 이루어진 것을 특징으로 하는 반도체패키지용 트림폼시스템의 플로터장치.Plotter device of the trim form system for a semiconductor package, characterized in that it comprises a plotter rail (17) installed on the shaft (11) of the roller housing 14 to up and down the lead frame material (100). 제1항에 있어서, 상기 롤러하우징(14)의 하부에는, 정비 및 분리시 상기 플로터레일(17)을 상부로 상승시킬 있도록, 실린더(18)가 더 설치된 것을 특징으로 하는 반도체패키지용 트림폼시스템의 플로터장치.The trim form system for a semiconductor package according to claim 1, wherein a cylinder (18) is further provided below the roller housing (14) to raise the floater rail (17) upwards during maintenance and separation. Plotter device.
KR1019970079584A 1997-12-30 1997-12-30 Floater apparatus of trim form system for semiconductor package to vertically transfer floater KR100453691B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970079584A KR100453691B1 (en) 1997-12-30 1997-12-30 Floater apparatus of trim form system for semiconductor package to vertically transfer floater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970079584A KR100453691B1 (en) 1997-12-30 1997-12-30 Floater apparatus of trim form system for semiconductor package to vertically transfer floater

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KR19990059383A KR19990059383A (en) 1999-07-26
KR100453691B1 true KR100453691B1 (en) 2005-02-24

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321274A (en) * 1993-12-06 1995-12-08 Richard H J Fierkens Electric mechanical type press apparatus and operation method
KR960025388U (en) * 1994-12-28 1996-07-22 아남산업 주식회사 Cam plotter for semiconductor manufacturing equipment
KR960035606U (en) * 1995-04-14 1996-11-21 아남산업주식회사 Cam plotter for semiconductor manufacturing equipment
KR970053669A (en) * 1995-12-29 1997-07-31 황인길 Cam structure of trim / forming equipment for semiconductor package manufacturing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321274A (en) * 1993-12-06 1995-12-08 Richard H J Fierkens Electric mechanical type press apparatus and operation method
KR960025388U (en) * 1994-12-28 1996-07-22 아남산업 주식회사 Cam plotter for semiconductor manufacturing equipment
KR960035606U (en) * 1995-04-14 1996-11-21 아남산업주식회사 Cam plotter for semiconductor manufacturing equipment
KR970053669A (en) * 1995-12-29 1997-07-31 황인길 Cam structure of trim / forming equipment for semiconductor package manufacturing

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