KR100449035B1 - Material transfer setting apparatus of trim form system for semiconductor package to precisely set position of leadframe material transferred and supplied due to operation of belt - Google Patents

Material transfer setting apparatus of trim form system for semiconductor package to precisely set position of leadframe material transferred and supplied due to operation of belt Download PDF

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KR100449035B1
KR100449035B1 KR1019970079581A KR19970079581A KR100449035B1 KR 100449035 B1 KR100449035 B1 KR 100449035B1 KR 1019970079581 A KR1019970079581 A KR 1019970079581A KR 19970079581 A KR19970079581 A KR 19970079581A KR 100449035 B1 KR100449035 B1 KR 100449035B1
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South Korea
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lead frame
guide rail
transfer setting
form system
frame material
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KR1019970079581A
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Korean (ko)
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KR19990059380A (en
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정명국
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앰코 테크놀로지 코리아 주식회사
세미시스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: A material transfer setting apparatus of a trim form system for a semiconductor package is provided to precisely set the position of a leadframe material transferred and supplied due to an operation of a belt by installing a sensor and a vertically moving stopper at the end of a guide rail included in a guide part of a trim form system. CONSTITUTION: A guide part(G) includes a guide rail(R) and a floater(FL) that moves up/down in a trim form system between a supply part(IN) to which a leadframe material(100) is supplied and a singulation part(SG) in which the leadframe is singulated. In a material transfer setting apparatus, a sensor A(20) and vertically moving stopper A(30) are installed at the end of the guide rail of the guide part, and a sensor B(40) and a vertically moving stopper B(50) are installed at a side of the end of the floater.

Description

반도체패키지용 트림폼시스템의 자재이송 셋팅장치Material transfer setting device of trim form system for semiconductor package

본 발명은 반도체패키지용 트림폼시스템의 자재이송 셋팅장치에 관한 것으로서, 특히 트림폼시스템에서 안내부의 안내레일에 공급되어 이송되는 리드프레임자재가 싱귤레이션작업부가 구비된 플로터에 공급될 때 위치셋팅의 정확성을 기하기 위해 센서에 의해 작동하는 스톱퍼를 구비한 반도체패키지용 트림폼시스템의 자재이송 셋팅장치에 관한 것이다.The present invention relates to a material transfer setting apparatus of a trim form system for a semiconductor package, and in particular, when a lead frame material supplied to a guide rail of a guide part in a trim form system is supplied to a plotter equipped with a singulation work part, A material transfer setting apparatus of a trim form system for a semiconductor package having a stopper operated by a sensor for accuracy.

일반적으로 반도체패키지를 제조하는 트림폼시스템은 리드프레임에 반도체칩의 부착과 와이어의 연결과 패키지의 성형이 완료된 리드프레임자재를 싱귤레이션작업과 리드의 컷팅 및 포밍을 하기 위한 것이다.In general, a trim form system for manufacturing a semiconductor package is for singulation work, cutting and forming of a lead frame material in which a semiconductor chip is attached to a lead frame, wires are connected, and a package is formed.

이러한 트림폼시스템은 패키지의 성형이 완료된 리드프레임자재를 매거진에 수납시킨 상태에서 공급부에 셋팅시키면 안내부로 공급되어 이송부에 의해 싱귤레이션작업부가 구비된 플로터에 공급시키고, 싱귤레이션작업부에서는 리드프레임과 리드의 경계면은 절단시켜 분리된 자재를 구한후, 이 자재를 트림폼작업이 시행되는트림폼작업부로 자재를 공급시킨 다음 완성된 반도체패키지의 제품을 외부로 배출시키도록 한 것이다.Such a trim form system is provided with a lead frame material in which the molding of the package is set in the magazine, and when it is set in the supply part, the trim form system is supplied to the guide part and supplied to the plotter equipped with the singulation work part by the conveying part, and in the singulation work part, The interface of the lead is cut to obtain the separated material, and then the material is fed to the trim foam working part where the trim foam work is performed, and then the product of the finished semiconductor package is discharged to the outside.

상기한 트림폼시스템의 안내부에는 공급부에서 공급된 리드프레임자재가 공급되면 위치셋팅의 정확성을 기하기 위해 자재이송 셋팅장치가 구비되어 있다.The guide unit of the trim form system is provided with a material transfer setting device to ensure the accuracy of the position setting when the lead frame material supplied from the supply unit is supplied.

이와 같이 된 자재이송 셋팅장치(10)의 종래의구성을 설명하면 도 4에서 보는 바와 같이 상하 업다운되는 안내레일(R)을 구비한다.Referring to the conventional configuration of the material transfer setting device 10 as described above is provided with a guide rail (R) up and down as shown in FIG.

상기 안내레일(R)의 일측에는 리드프레임자재(미도시)를 이송시킬 수 있는푸셔(FS)가 공압실린더에 의해 작동되도록 구비하고, 중앙의 소정위치에는 복수개의 센서A, B(S1)(S2)를 구비한다.One side of the guide rail (R) is provided with a pusher (FS) capable of transferring a lead frame material (not shown) to be operated by a pneumatic cylinder, a plurality of sensors A, B (S1) ( S2).

상기 센서A, B(S1)(S2)가 구비된 안내레일(R)의 하측에는 블록(BL)을 설치하고, 이 블록(BL)의 상부에는 스톱퍼(ST)와 핀(P)을 순차적으로 설치하여 자재이송 셋팅장치를 구비한다.A block BL is provided below the guide rail R provided with the sensors A and B (S1) and S2, and a stopper ST and a pin P are sequentially provided on the block BL. It is installed and equipped with material transfer setting device.

상기 안내레일(R)의 블록(BL)이 위치한 이후에는 리드프레임자재를 이송시키는 별도의 업다운 및 이동되는 이송부(FL)를 구비하고, 안내레일(R)의 소정위치에 싱귤레이션작업부(미도시)를 구비한다.After the block BL of the guide rail R is provided with a separate up-down and moved conveying unit FL for transferring the lead frame material, and a singulation work unit (not shown) at a predetermined position of the guide rail R. C).

이러한 자재이송 셋팅장치(10)는 리드프레임자재가 하강되어 있는 안내레일(R)에 공급되면 푸셔(FS)의 작동에 따라 스톱퍼(ST)까지 이송된다.When the material transfer setting device 10 is supplied to the guide rail R on which the lead frame material is lowered, the material transfer setting device 10 is transferred to the stopper ST according to the operation of the pusher FS.

상기 스톱퍼(ST)에 리드프레임자재가 걸려져 정지되면 센서A(S1)가 리드프레임자재를 감지하여 이 신호에 의해 안내레일(R)을 상승시킨다.When the lead frame material is caught and stopped by the stopper ST, the sensor A (S1) detects the lead frame material and raises the guide rail R by this signal.

안내레일(R)이 상승되면 이송부(FL)의 작동으로 리드프레임자재를 클램핑시킨 상태에서 안내레일(R)을 따라 싱귤레이션작업부(미도시)로 이송시킨다.When the guide rail (R) is raised is transferred to the singulation work unit (not shown) along the guide rail (R) while the lead frame material is clamped by the operation of the conveying unit (FL).

상기 리드프레임자재가 싱귤레이션작업부로 이송될 때 센서B(S2)는 리드프레임자재가 없는 것을 감지하여 리드프레임자재를 연속적으로 공급시킬 수 있게 한다.When the lead frame material is transferred to the singulation work part, the sensor B (S2) detects that there is no lead frame material, thereby enabling to continuously supply the lead frame material.

이러한 공정을 거쳐 싱귤레이션작업부에 공급된 리드프레임자재는 싱귤레이션 작업을 거쳐 이후의 트림폼작업부에서 트림폼작업을 시행한후 완성품의 반도체패키지를 구하도록 한 것이다.Through this process, the lead frame material supplied to the singulation work part is subjected to the trim form work after the singulation work to obtain the semiconductor package of the finished product.

그러나, 상기한 자재이송 셋팅장치(10)는 푸셔(FS)의 가압력으로 안내레일(R)을 따라 공급되는 리드프레임자재가 스톱퍼(ST)에 걸려질 때 일정한 가압력에 의한 이송이 되지 못하여 손상 및 변형이 발생되었다.However, the material transfer setting device 10 is damaged due to a constant pressing force when the lead frame material supplied along the guide rail R is caught by the stopper ST with the pressing force of the pusher FS. Deformation has occurred.

또한 일정시간동안 트림폼 작업되는 생산량이 공압실린더를 이용한 푸셔(FS)의 동작이 신속하게 이루어지지 못하여 작업생산성을 저해하는 폐단이 있었다.In addition, the amount of work trimmed for a certain period of time, the operation of the pusher (FS) using the pneumatic cylinder was not made quickly, there was a closing end to the work productivity.

특히 푸셔(FS)의 동작으로 안내레일(R)에서 이송되는 리드프레임자재가 업다운되는 안내레일(R)의 유동에 따라 위치셋팅의 정확성을 기하지 못하여 싱귤레이션 작업부로 공급되는 리드프레임자재의 위치변형에 의한 작업의 불량과 이송공급을 원활하게 시행하지 못하였다.In particular, the position of the lead frame material to be supplied to the singulation work unit due to the movement of the guide rail R, which is transferred from the guide rail R, by the operation of the pusher FS, fails to determine the accuracy of the position setting. Failure of the work due to the deformation and the supply of feed could not be performed smoothly.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 발명한 것으로서, 트림폼시스템의 안내부에 구비된 안내레일의 선단에 센서와 상하업다운되는 스톱퍼를 구비하여 벨트의 작동에 따라 이송공급되는 리드프레임 자재의 위치셋팅을 정확하게 한 것을 목적으로 한다.The present invention has been invented to solve the above conventional problems, the lead frame is provided with a stopper vertically up and down the sensor at the front end of the guide rail provided in the guide portion of the trim form system is fed and supplied according to the operation of the belt The purpose is to accurately position the material.

도 1은 본 발명의 자재이송 셋팅장치가 적용된 트림폼시스템의 전체평면구성도.1 is an overall plan view of a trim form system to which the material transfer setting apparatus of the present invention is applied.

도 2는 본 발명의 자재이송 셋팅장치의 정면구성도.Figure 2 is a front configuration diagram of the material transfer setting apparatus of the present invention.

도 3은 본 발명의 자재이송 셋팅장치의 작용상태도로서,3 is an operational state diagram of the material transfer setting apparatus of the present invention,

(a)는 초기상태도이고,(a) is the initial state diagram,

(b)는 작동상태도이다.(b) is an operational state diagram.

도 4는 종래의 정면구성도.Figure 4 is a front view of a conventional configuration.

(도면의 주요 부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)

10 ; 자재이송셋팅장치 20, 40 ; 센서A, B10; Material feed setting device 20, 40; Sensor A, B

30, 50 ; 스톱퍼A, B 31 ; 회전실린더30, 50; Stopper A, B 31; Rotary cylinder

100 ; 리드프레임자재 G ; 안내부100; Lead frame material G; Guide

R ; 안내레일 FT ; 플로터R; Guide rail FT; Plotter

TS ; 트림폼시스템 IN ; 공급부TS; Trimform System IN; Supply department

SG ; 싱귤레이션작업부SG; Singulation Division

이하 본 발명의 구성을 설명하면 다음과 같다.Hereinafter, the configuration of the present invention will be described.

리드프레임자재(100)가 공급되는 공급부(IN)와 싱귤레이션되는 싱귤레이션작업부(SG) 사이의 트림폼시스템(TS)에 업다운되는 안내레일(R)과 플로터(FT)가 구비된 안내부(G)와 ;Guide portion provided with a guide rail (R) and a plotter (FT) up and down in the trim form system (TS) between the supply unit (IN) to which the lead frame material 100 is supplied and the singulation work unit (SG) being singulated. (G) and;

상기 안내부(G)의 안내레일(R) 선단부에 센서A(20)와 상하 업다운되는 스톱퍼A(30)를 형성하고, 플로터(FT)의 일측선단에 센서B(40)와 상하업다운되는 스톱퍼B(50)를 설치한 자재이송 셋팅장치(10)와 ;The stopper A (30) is formed at the tip of the guide rail (R) of the guide part (G) up and down with the sensor A (20), and the stopper is up and down with the sensor (B 40) at one end of the plotter (FT). A material transfer setting device 10 having B 50 installed thereon;

를 포함하는 것이다.It will include.

이와 같이 된 본 발명의 일 실시예를 첨부도에 의하여 상세히 설명하면 다음과 같다.When described in detail by the accompanying drawings an embodiment of the present invention as follows.

도 1은 본 발명의 자재이송 셋팅장치(10)가 적용된 트림폼시스템(TS)의 평면구성도로서, 테이블(T)의 상부면 소정위치에 리드프레임자재(100)를 공급시키는 공급부(IN)가 구비되고, 이 전방에 좌우 길이 방향으로 리드프레임자재(100)를 안내하는 안내부(G)를 구비한다.1 is a planar configuration diagram of a trim form system TS to which the material transfer setting apparatus 10 of the present invention is applied, and a supply unit IN for supplying the lead frame material 100 to a predetermined position on the upper surface of the table T. It is provided with a guide portion (G) for guiding the lead frame material 100 in the left and right longitudinal direction.

상기한 공급부(IN)에는 전단계에서 반도체칩의 부착과 와이어의 연결과 패키지의 성형이 완료된 리드프레임자재(100)가 수납된 매거진(M)이 셋팅되는 셋팅부(ST)와 이 전방에 매거진(M)내의 리드프레임자재(100)를 공급시키는 로테이터이송부(RF)를 구비한다.In the supply part IN, the setting part ST in which the magazine M, in which the lead frame material 100 is completed, in which the semiconductor chip is attached, the wires are connected, and the package is formed in the previous step, is set. The rotator conveying part RF which supplies the lead frame material 100 in M) is provided.

안내부(G)에는 좌우길이방향으로 안내레일(R1)과 선단부 하부에 자재이송셋팅장치(10)와 선단 길이 방향으로 상하 업다운되는 플로터(FT)를 설치한다.Guide portion (G) is provided with a guide rail (R1) in the left and right longitudinal direction and the material feed setting device 10 and the plotter (FT) up and down in the longitudinal length direction in the lower end.

플로터(FT)의 중앙부에는 싱귤레이션작업부(SG)를 구비하고, 싱귤레이션작업부(SG)의 전방에는 비젼을 가진 검사부(VS)와 트림폼의 작업이 완료된 반도체패키징 제품을 수납시키는 배출부(OUT)를 구비한다.The central portion of the plotter FT is provided with a singulation work part (SG), and in front of the singulation work part (SG), an inspection part (VS) having a vision and a discharge part for accommodating a semiconductor packaging product having trimmed work completed. (OUT) is provided.

도 2는 본 발명의 자재이송셋팅장치(10)의 정면구성도로서, 상기 안내부(G)의 안내레일(R) 선단부에 센서A(20)를 구비하고, 하측의 내부에는 안내레일(R)의좁은 공간에서 설치가 용이하도록 회전실린더(31)에 의해 업다운되는 스톱퍼A(30)를 구비한 자재이송셋팅장치(10)를 구비한다.2 is a front configuration diagram of the material transfer setting apparatus 10 of the present invention, the sensor A (20) is provided at the tip of the guide rail (R) of the guide part (G), and the guide rail (R) is located inside the lower side. It is provided with a material transfer setting device 10 having a stopper A (30) up and down by the rotary cylinder (31) to facilitate installation in a narrow space.

상기 안내레일(R)에는 구동부(M)와 벨트(V)를 구비한다.The guide rail (R) is provided with a driving unit (M) and a belt (V).

상기한 안내레일(R)의 선단부 길이 방향에는 상하업다운되는 플로터(FT)를 구비하고, 플로터(FT)의 일측선단에는 센서B(40)와 실린더(51)에 의해 상하 업다운되는 스톱퍼B(50)를 구비한다.In the longitudinal direction of the tip end portion of the guide rail (R) is provided with a floater (FT) up and down, stopper B (50) up and down by the sensor B 40 and the cylinder 51 at one end of the plotter (FT). ).

상기 안내레일(R)과 플로터(FT) 사이의 상부에는 상하 업다운 및 좌우 이송하는 이송부(FL)를 구비한 것이다.The upper portion between the guide rail (R) and the plotter (FT) is provided with a conveying part (FL) for up and down and left and right transfer.

이와 같이 된 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention as described above is as follows.

도 3(a)에서와 같이 안내부(G)의 안내레일(R)이 상승되고 스톱퍼(30)가 해제된 상태에서 리드프레임자재(100)를 공급시키면 도 3(b)와 같이 실린더의 작동으로 안내레일(R)이 하강된다.When the lead frame material 100 is supplied in the state in which the guide rail R of the guide part G is raised and the stopper 30 is released as shown in FIG. 3 (a), the cylinder is operated as shown in FIG. The guide rail R is lowered.

이때 센서A(20)에 리드프레임자재(100)가 없는 것이 감지되면 회전실린더(31)의 작동으로 스톱퍼A(30)가 상승된다.At this time, if it is detected that the lead frame material 100 is not in the sensor A (20), the stopper A (30) is raised by the operation of the rotary cylinder (31).

이상태에서 트림폼시스템(TS)의 공급부(IN)에 구비된 셋팅부(ST)의 매거진(M)내의 리드프레임자재(100)를 로테이터이송부(RF)의 작동으로 방향성을 정한후 안내레일(R)에 공급시키면 벨트(V)의 이송에 따라 선단부까지 리드프레임자재(100)가 이동된다.In this state, the direction of the lead frame material 100 in the magazine M of the setting part ST provided in the supply part IN of the trim form system TS is determined by the operation of the rotator transfer part RF, and then the guide rail R ), The lead frame material 100 is moved to the front end portion in accordance with the conveyance of the belt (V).

이렇게 이동되는 리드프레임자재(100)는 스톱퍼A(30)에 걸려져 정지되고, 동시에 센서A(20)에 의해 감지된다.The lead frame material 100 thus moved is stopped by being caught by the stopper A 30 and simultaneously sensed by the sensor A 20.

리드프레임자재(100)가 센서A(20)에 감지되면 실리더의 작동으로 안내레일(R)이 상승하여 플로터(FT)가 동일한 위치에 놓이게 된다.When the lead frame material 100 is detected by the sensor A 20, the guide rail R is raised by the operation of the cylinder so that the plotter FT is placed at the same position.

이렇게 안내레일(R)이 상승되면 스톱퍼A(30)에서 해제된 리드프레임자재(100)가 구동부(M)의 구동력으로 플로터(FT)로 공급이송된다.When the guide rail R is raised in this way, the lead frame material 100 released by the stopper A 30 is supplied to the plotter FT by the driving force of the driving unit M.

플로터(FT)에 공급이송되는 리드프레임자재(100)는 일측선단에 구비된 센서B(40)에 의해 감지되어 스톱퍼B(50)를 실린더B(51)의 작동으로 상승시켜 일시정지시킨 상태에서 리드프레임자재(100)의 위치셋팅을 정확하게 이루어지게 한다.The lead frame material 100 supplied and supplied to the plotter FT is sensed by the sensor B 40 provided at one end thereof, and the stopper B 50 is raised by the operation of the cylinder B 51 and paused. Position setting of the lead frame material 100 to be made accurately.

이렇게 리드프레임자재(100)가 플로터(FT)의 일측 선단에 공급되는 스톱퍼B(50)에 걸려지면 센서B(40)의 감지에 의해 상부의 이송부(FL)가 하강하여 리드프레임자재(100)를 클램핑하고, 동시에 스톱퍼B(50)가 해제되고 동시에 플로터(FT)가 하강된다.When the lead frame material 100 is caught by the stopper B 50 supplied to one end of the plotter FT, the transfer part FL of the upper part is lowered by the detection of the sensor B 40 so that the lead frame material 100 is lowered. Is clamped at the same time, stopper B 50 is released and plotter FT is lowered at the same time.

상기 플로터(FT)가 하강되면 이송부(FL)의 작동으로 플로터(FT)를 따라 싱귤레이션작업부(SG)에 공급되고, 싱귤레이션 펀치의 하강으로 리드프레임(LF)과 리드(LD)의 경계면을 분리시킨 후 리드프레임 폐자재는 플로터(FT)를 따라 폐자재 배출부(DOT)로 배출되며, 분리된 자재는 트림폼작업부(TF)로 공급되어 트림폼 작업을 완료한후 검사부(VS)에서 검사를 시행한 다음 완제품을 수납시키는 배출부(OUT)가 배출시키는 것이다.When the plotter FT is lowered, it is supplied to the singulation work part SG along the plotter FT by the operation of the feeder FL, and the interface between the lead frame LF and the lead LD is lowered by the singulation punch. After separating the lead frame waste material is discharged to the waste material discharge part (DOT) along the plotter (FT), the separated material is supplied to the trim foam working part (TF) to complete the trim foam work and then the inspection unit (VS) ) Is then discharged by the outlet (OUT) that houses the finished product.

이러한 과정을 거쳐 트림폼되는 반도체패키지는 공급부(IN)에서 리드프레임자재(100)를 공급받아 싱귤레이션작업부(SG)로 이송시키기 위한 안내부(G)에 리드프레임자재(100)를 감지하는 센서A, B(20)(40)와 리드프레임자재(100)를 정지시키는 스톱퍼A, B(30)(50)를 구비한 자재이송셋팅장치(10)를 설치함에 따라 리드프레임자재(100)의 이송셋팅 정확성을 기여하고, 위치셋팅 정확성에 따른 이송공급을 용이하게 하여 트림폼 작업을 향상시킬 수 있는 것이다.The semiconductor package trimmed through such a process receives the lead frame material 100 from the supply unit IN and detects the lead frame material 100 in the guide part G for transferring the lead frame material 100 to the singulation work part SG. The lead frame material 100 is installed by installing the material transfer setting device 10 including the sensors A and B 20 and 40 and the stopper A and B 30 and 50 stopping the lead frame material 100. It is possible to improve the trim form work by contributing to the feed setting accuracy of and to facilitate the feed supply according to the positioning setting accuracy.

이상에서와 같이 본 발명은 트림폼시스템의 안내부에 구비된 안내레일의 선단에 센서와 상하업다운되는 스톱퍼를 구비하여 벨트의 작동에 따라 이송공급되는 리드프레임 자재의 위치셋팅을 정확하게 하여 이송공급의 용이하므로 트림폼작업을 향상시킬 수 있는 효과가 있다.As described above, the present invention is provided with a stopper vertically up and down with a sensor at the tip of the guide rail provided in the guide part of the trim form system to accurately position the lead frame material to be fed and supplied according to the operation of the belt. It is easy to improve the trim form work.

Claims (2)

리드프레임자재(100)가 공급되는 공급부(IN)와 싱귤레이션되는 싱귤레이션작업부(SG) 사이의 트림폼시스템(TS)에 업다운되는 안내레일(R)과 플로터(FT)가 구비된 안내부(G)와 ;Guide portion provided with a guide rail (R) and a plotter (FT) up and down in the trim form system (TS) between the supply unit (IN) to which the lead frame material 100 is supplied and the singulation work unit (SG) being singulated. (G) and; 상기 안내부(G)의 안내레일(R) 선단부에 센서A(20)와 상하 업다운되는 스톱퍼A(30)를 형성하고, 플로터(FT)의 일측선단에 센서B(40)와 상하업다운되는 스톱퍼B(50)를 설치한 자재이송 셋팅장치(10)와 ;The stopper A (30) is formed at the tip of the guide rail (R) of the guide part (G) up and down with the sensor A (20), and the stopper is up and down with the sensor (B 40) at one end of the plotter (FT). A material transfer setting device 10 having B 50 installed thereon; 를 포함하는 것을 특징으로 하는 반도체패키지용 트림폼시스템의 자재이송 셋팅장치.Material transfer setting device of a trim form system for a semiconductor package comprising a. 제1항에 있어서, 상기 스톱퍼A(30)는 회전실린더(31)에 의해 회전되어 상하 업다운될수 있도록 한 것을 특징으로 하는 반도체패키지용 트림폼시스템의 자재이송 셋팅장치.The material transfer setting apparatus of claim 1, wherein the stopper (A) is rotated by a rotation cylinder (31) so that it can be moved up and down.
KR1019970079581A 1997-12-30 1997-12-30 Material transfer setting apparatus of trim form system for semiconductor package to precisely set position of leadframe material transferred and supplied due to operation of belt KR100449035B1 (en)

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