KR100444231B1 - A method for forming the insulation layer of printed circuit board - Google Patents
A method for forming the insulation layer of printed circuit board Download PDFInfo
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- KR100444231B1 KR100444231B1 KR10-2002-0029455A KR20020029455A KR100444231B1 KR 100444231 B1 KR100444231 B1 KR 100444231B1 KR 20020029455 A KR20020029455 A KR 20020029455A KR 100444231 B1 KR100444231 B1 KR 100444231B1
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- core
- insulating layer
- dam
- forming
- bump
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
- B65G15/08—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration the load-carrying surface being formed by a concave or tubular belt, e.g. a belt forming a trough
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
- B65G15/60—Arrangements for supporting or guiding belts, e.g. by fluid jets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors
- B65G39/10—Arrangements of rollers
- B65G39/12—Arrangements of rollers mounted on framework
- B65G39/125—Arrangements of rollers mounted on framework for selectively adjusting troughing of the conveying belt
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H25/00—Gearings comprising primarily only cams, cam-followers and screw-and-nut mechanisms
- F16H25/18—Gearings comprising primarily only cams, cam-followers and screw-and-nut mechanisms for conveying or interconverting oscillating or reciprocating motions
- F16H25/20—Screw mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/02—Belt or chain conveyors
- B65G2812/02128—Belt conveyors
- B65G2812/02138—Common features for belt conveyors
- B65G2812/02168—Belts provided with guiding means, e.g. rollers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
본 발명은 인쇄회로기판에 절연층을 형성하는 방법에 관한 것으로, 코아의 상,하부면에 범프를 일정높이 돌출형성하는 단계; 상기 코아의 상,하부면 가장자리를 따라 나란하고, 상기 범프와 동일한 일정높이를 갖는 댐을 돌출형성하는 단계; 및 상기 코아의 전체표면상에 절연물을 도포하고, 상기 코아의 전체표면을 덮는 면적을 갖는 가압수단의 외력으로서 일정시간 가압하는 동안, 상기 가압수단, 댐 및 코아사이에 갖추어지는 밀폐계에 의해서 코아의 전체표면에 일정한 층두께를 갖는 절연층을 형성하는 단계를 포함하여, 상,하부면에 범프가 형성된 코아의 전체표면에 절연물질을 도포하여 절연층을 형성하는 공정시 절연층의 두께편차를 최소화하고, 범프의 변형, 마모를 방지할 수 있다.The present invention relates to a method for forming an insulating layer on a printed circuit board, the step of forming a bump to a predetermined height on the upper and lower surfaces of the core; Projecting dams parallel to the upper and lower surface edges of the core and having a predetermined height equal to that of the bumps; And a core by means of a sealing system provided between the pressurizing means, the dam and the core while applying an insulator on the entire surface of the core and pressurizing for a predetermined time as an external force of the pressing means having an area covering the entire surface of the core. Forming an insulating layer on the entire surface of the core by applying an insulating material to the entire surface of the core having bumps on the upper and lower surfaces thereof to form an insulating layer. Minimize and prevent bump deformation and wear.
Description
본 발명은 인쇄회로기판에 절연층을 형성하는 방법에 관한 것으로, 보다 상세히는 상,하부면에 범프가 형성된 코아의 전체표면에 절연물질을 도포하여 절연층을 형성하는 공정시 절연층의 두께편차를 최소화하고, 범프의 변형, 마모를 방지할수 있는 인쇄회로기판의 절연층 형성방법에 관한 것이다.The present invention relates to a method for forming an insulating layer on a printed circuit board, and more particularly, the thickness difference of the insulating layer during the process of forming an insulating layer by applying an insulating material to the entire surface of the core with bumps formed on the upper and lower surfaces. Minimizing, and preventing the deformation and wear of the bumps relates to a method for forming an insulating layer of a printed circuit board.
최근 전자산업은 전자기기의 소형화, 박형화를 위해 부품 실장시 고밀도화, 고정도화, 고집적화가 가능한 다층인쇄회로기판을 이용한 실장기술을 채용하고 있는데, 특히, 이동통신기기와 디지털가전시장을 중심으로 소형화, 박형화가 급격히 진행되면서 다층인쇄회로기판에 대한 수요가 급증하고 있다.Recently, the electronics industry has adopted a mounting technology using multilayer printed circuit boards that can be made high-density, high-precision, and highly integrated for the miniaturization and thinning of electronic devices. In particular, the miniaturization, As the thinning progresses rapidly, the demand for multilayer printed circuit boards is rapidly increasing.
이러한 다층인쇄회로기판을 제조하는 공정은 기존의 단면, 혹은 양면인쇄회로기판제조공정과 유사한 공정을 거치게 되는데, 즉, 코아(Core)에 동박을 입히거나 도금을 통하여 도전층을 형성시킨 후, 원하지 않는 부분은 에칭(Etching)공정을 이용하여 제거하고 원하는 회로부분인 Cu범프(이하, 범프이라함.)만이 남도록 하여 내층회로패턴을 형성한다.The process of manufacturing the multilayer printed circuit board goes through a process similar to that of a conventional single-sided or double-sided printed circuit board manufacturing process, that is, after forming a conductive layer through copper core or plating core, unwanted The portion is removed using an etching process, and the inner circuit pattern is formed by leaving only Cu bumps (hereinafter referred to as bumps) as desired circuit portions.
그리고, 상기 범프가 돌출형성된 코아상에 감광성, 열경화성 절연수지인 절연물을 도포하여 절연층을 형성한 다음, 그 상측에 또다른 도전성금속을 도포하여 도전층을 형성하고, 상기 도전층의 상측에 감광층을 형성하여 이를 에칭등에 의해서 원하는 부문만 남도록 제거하여 외측 회로패턴을 형성하였다.Then, an insulating material, which is a photosensitive and thermosetting insulating resin, is coated on the bump-protruded cores to form an insulating layer, and then another conductive metal is coated on the bump to form a conductive layer, and the photosensitive layer is exposed on the conductive layer. The outer circuit pattern was formed by forming a layer and removing it so as to leave only a desired section by etching or the like.
도 1은 일반적으로 코아상에 절연층을 형성하는 공정을 도시한 구성도로서, 도시한 바와같이, 먼저 전공정에서 코아(2)의 상,하부면에 범프(3)와 같은 회로패턴을 형성한 상태에서, 상기 코아(2)의 표면상에 절연물을 도포하고, 별도의 가압수단(4)으로부터 제공되는 1.0 kgf/cm2정도의 외력(F)을 상기 코아(2)표면상으로 고르게 일정시간동안 전달하여 코아의 표면상에 일정두께를 갖는 절연층을 형성하였다.FIG. 1 is a configuration diagram generally illustrating a process of forming an insulating layer on a core. As shown in the drawing, a circuit pattern such as a bump 3 is formed on the upper and lower surfaces of the core 2 in a previous step. In one state, an insulator is applied on the surface of the core 2, and an external force F of about 1.0 kgf / cm 2 provided from a separate pressing means 4 is uniformly fixed on the surface of the core 2. Transfer over time to form an insulating layer having a constant thickness on the surface of the core.
그러나, 일정높이를 갖는 범프(3)가 형성된 코아(2)의 표면에 도포되는 절연물을 가압수단(4)에 의해서 가압하여 절연층을 형성하는 과정에서, 상기 범프가 형성되지 않는 코아의 가장자리 부근의 절연물은 외측으로 자유롭게 흘러나오게 되고, 유출된 절연물에 의해서 주변설비 및 부품을 오염시키는 문제점을 유발하였다.However, in the process of forming the insulating layer by pressing the insulator applied to the surface of the core 2 having the bumps 3 having a predetermined height by the pressing means 4 to form an insulation layer, near the edge of the core where the bumps are not formed. The insulator of is free to flow to the outside, causing the problem of polluting the peripheral equipment and components by the leaked insulator.
또한, 상기 코아(2)의 가장자리와 이에 인접하는 범프(3)사이에 형성되는 절연층의 두께가 코아(2)중앙부에 형성되는 절연층의 두께에 비하여 상대적으로 얇게 되고, 이로 인하여 전체 절연층의 두께편차가 커져서 제품신뢰성을 저하시키는 문제점이 있었다.In addition, the thickness of the insulating layer formed between the edge of the core 2 and the bumps 3 adjacent to the core 2 is relatively thinner than the thickness of the insulating layer formed at the center of the core 2. There was a problem of decreasing the reliability of the product due to the large thickness deviation.
또한, 상기 가압수단(4)의 하부면과 상기 범프(3)의 상부단의 접촉시 발생되는 접촉압력에 의해서 상기 범프(3)가 변형, 마모되어 기판제품의 품질을 저하시키고, 제품불량의 원인을 유발하였다.In addition, the bump 3 is deformed and worn by the contact pressure generated when the lower surface of the pressurizing means 4 and the upper end of the bump 3 are deteriorated, resulting in deterioration of the quality of the substrate product. Caused the cause.
따라서, 본 발명은 상기와 같은 종래의 문제점을 해소하기 위하여 제안된 것으로서, 그 목적은 범프가 형성된 코아상에서의 절연층 형성시 절연물의 외부유출및 절연층의 두께편차를 최소화하고, 범프의 마모를 방지할수 있는 인쇄회로기판의 절연층 형성방법을 제공하고자 한다.Accordingly, the present invention has been proposed to solve the conventional problems as described above, the object of which is to minimize the outflow of the insulating material and the thickness deviation of the insulating layer when forming the insulating layer on the bump-formed core, and to minimize the wear of the bump The present invention provides a method for forming an insulating layer of a printed circuit board which can be prevented.
도 1은 종래기술에 따른 절연층 형성방법을 도시한 구성도,1 is a block diagram showing a method for forming an insulating layer according to the prior art,
도 2는 본 발명에 따른 절연층 형성방법을 도시한 구성도,2 is a block diagram showing a method for forming an insulating layer according to the present invention,
도 3은 본 발명에 따른 인쇄회로기판 절연층 형성방법을 도시한 작업상태도.3 is a working state diagram showing a method for forming a printed circuit board insulating layer according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
2 ..... 코아 3 ..... 범프2 ..... Core 3 ..... Bump
4 ..... 가압수단 5 ...... 댐4 ..... Pressurization means 5 ...... Dam
상기와 같은 목적을 달성하기 위한 기술적인 구성으로써, 본 발명은,As a technical configuration for achieving the above object, the present invention,
코아의 상,하부면에 범프를 일정높이 돌출형성하는 단계;Forming bumps at a predetermined height on the top and bottom surfaces of the core;
상기 코아의 상,하부면 가장자리를 따라 나란하게 연속하고, 상기 범프와 동일한 일정높이를 갖는 댐을 돌출형성하는 단계; 및Protruding a dam continuous along the upper and lower edges of the core and having the same height as the bump; And
상기 코아의 전체표면상에 절연물질을 도포하고, 상기 코아의 전체표면을 덮는 면적을 갖는 가압수단의 외력으로서 일정시간 가압하는 동안, 상기 가압수단, 댐 및 코아사이에 갖추어지는 밀폐계에 의해서 코아의 전체표면에 일정한 층두께를 갖는 절연층을 형성하는 단계를 포함함을 특징으로 하는 인쇄회로기판 절연층 형성방법을 마련함에 의한다.By applying an insulating material on the entire surface of the core and pressurizing for a predetermined time as an external force of the pressing means having an area covering the entire surface of the core, the core is provided by a sealing system provided between the pressing means, the dam and the core. By forming an insulating layer having a constant layer thickness on the entire surface of the printed circuit board by providing a method for forming an insulating layer.
이하, 본 발명에 대하여 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail.
도 2는 본 발명에 따른 인쇄회로기판 절연층 형성방법을 도시한 구성단면도이고, 도 3은 본 발명에 따른 인쇄회로기판 절연층 형성방법을 도시한 작업상태도이다.2 is a cross-sectional view illustrating a method of forming a printed circuit board insulating layer according to the present invention, and FIG. 3 is a working state diagram illustrating a method of forming a printed circuit board insulating layer according to the present invention.
본 발명의 방법은 도 2와 3에 도시한 바와같이, 코아(2)의 상,하부면에 절연물로서 절연층을 형성할 때 절연물질이 코아(2)외부로 흘러나가는 것을 최소화하여 코아(2)주변의 오염을 방지하고, 두께편차를 줄일수 있도록 절연층을 형성하는 것이다.The method of the present invention, as shown in Figures 2 and 3, when forming an insulating layer as an insulator on the upper and lower surfaces of the core (2) to minimize the flow of the insulating material outside the core (2) core 2 ) Insulation layer is formed to prevent contamination around and reduce thickness deviation.
즉, 코아(2)의 표면상에 절연층을 형성하는 전공정으로서, 상기 코아(2)에 동박을 입히거나 도금을 통하여 도전층을 형성시킨 후, 에칭(Etching)공정을 이용하여 원하는 회로부분인 범프(3)를 일정높이로 형성하도록 원하지 않는 부분을 제거한다.That is, as a pre-process of forming an insulating layer on the surface of the core 2, a conductive layer is formed by coating copper on the core 2 or by plating, and then using an etching process to obtain a desired circuit portion. Remove unwanted portions to form bumps 3 at a constant height.
그리고, 상기 범프(3)가 상,하부표면상에 일정한 패턴으로 일정높이 돌출형성된 코아(2)의 상, 하부면에는 상기 코아(2)의 가장자리를 따라 나란하고, 상기 범프(3)의 높이와 동일한 일정높이로 돌출형성되는 댐(5)을 갖추어 구성한다.In addition, the bumps 3 are arranged along the edges of the cores 2 on the upper and lower surfaces of the cores 2 having a predetermined height protruding in a predetermined pattern on the upper and lower surfaces, and the height of the bumps 3. Equipped with a dam (5) is formed to protrude to a certain height equal to.
여기서, 상기 댐(5)은 150 내지 250℃ 의 내열성, 내약품성이 높은 필름을 상기 코아(2)의 표면에 접착하는 방식으로 형성할수도 있지만, 열가소성, 열경화성 수지를 상기 코아(2)의 표면에 스크린(Screen)인쇄법, 오프셋(Offset)인쇄법, 포터리소그라프(Photo lithograph)법과 같은 인쇄방식으로 형성할수 도 있으며, 이에 한정되지 않고 댐(5)을 연속적으로 돌출형성할수 있는 다양한 인쇄법이 선택적으로 다양하게 채용될 수 있다.Here, the dam 5 may be formed by bonding a film having high heat resistance and chemical resistance of 150 to 250 ° C. to the surface of the core 2, but the thermoplastic and thermosetting resin may be formed on the surface of the core 2. It can be formed by printing methods such as screen printing, offset printing, photo lithograph method, and the like, but is not limited to this. This may optionally be employed in various ways.
그리고, 상기 열가소성수지로는 PMMA(polymethyl methacrylate), PET(polyethylen terephthalate), PA(polyamide), PC(polycarbonate), PBT(polybutylen terephthalate), PE, PP 등이 선택적으로 채용되며, 상기 열경화성 수지로는 에폭시가 주로 채용되지만, 이에 한정되지 않고 내열성, 내약품성이 우수한 다양한 수지가 선택적으로 채용될수 있다.In addition, the thermoplastic resin may be selectively selected from PMMA (polymethyl methacrylate), PET (polyethylen terephthalate), PA (polyamide), PC (polycarbonate), PBT (polybutylen terephthalate), PE, PP, and the like, as the thermosetting resin Epoxy is mainly employed, but various resins excellent in heat resistance and chemical resistance may be selectively employed, without being limited thereto.
연속하여, 상기와 같이 코아(2)의 상,하부면에 범프(3)와 댐(5)이 각각 돌출형성된 상태에서, 상기 코아(2)의 전체표면상에 감광성, 열경화성 절연수지인 절연물질을 도포한다.Subsequently, in a state in which bumps 3 and dams 5 protrude from upper and lower surfaces of the core 2 as described above, an insulating material that is a photosensitive and thermosetting insulating resin on the entire surface of the core 2. Apply.
그리고, 상기 댐(5)이 상,하부면 가장자리를 따라 연속하게 돌출형성된 코아(2)의 표면상에 절연물질이 도포된 상태에서, 상기 코아(2)의 직상부 또는 직하부에 배치된 별도의 가압수단(4)을 1.0 kgf/cm2정도의 외력(F)을 상기 코아(2)측으로 일정시간동안 가압한다.In addition, in a state in which an insulating material is applied on the surface of the core 2 which protrudes continuously along the upper and lower edges of the dam 5, the dam 5 is disposed directly above or below the core 2. The pressurizing means 4 of 1.0 kgf / cm 2 of the external force (F) is pressed to the core (2) for a predetermined time.
이러한 경우, 상기 가압수단(4), 댐(5) 및 코아(2)사이에 상기 코아(2)의 전체가장자리가 차단되어 절연물의 외부유출이 곤란하도록 밀폐계가 형성되기 때문에, 일정시간의 가압단계에서 고온의 유동성이 좋은 절연물질이 상기 코아(2)의 외측으로 흘러 외부로 다량 유출되는 것을 방지하면서 상기 코아(2)의 전체표면에 걸쳐 일정한 층두께를 갖는 절연층을 형성할수 있는 것이다.In this case, since the entire edge of the core 2 is blocked between the pressurizing means 4, the dam 5, and the core 2, a hermetic system is formed so that external leakage of the insulation is difficult. In this case, an insulating layer having high fluidity at high temperature can flow out of the core 2 and prevent a large amount of outflowing to the outside, thereby forming an insulating layer having a constant layer thickness over the entire surface of the core 2.
여기서, 상기 댐(5)은 그 상부단이 가압수단(4)에 의해서 절연물질을 가압하여 절연층을 형성하는 동안 상기 가압수단(4)의 하부면과 접촉하는 반면에 상기 범프(3)의 상부단과는 서로 접촉하지 않도록 상기 범프(3)의 일정높이에 대하여 5%정도 높게 형성한다. 이에 따라, 상기 가압수단을 이용한 가압동안 범프(3)의 변형 및 마모를 방지할수 있는 것이다.Here, the dam 5 is in contact with the lower surface of the pressing means 4 while the upper end thereof presses the insulating material by the pressing means 4 to form an insulating layer. The upper end is formed to be about 5% higher with respect to the predetermined height of the bump 3 so as not to contact each other. Accordingly, it is possible to prevent deformation and wear of the bump 3 during pressurization using the pressurizing means.
또한, 상기 댐(5)은 상기 코아(2) 가장자리부근에 도포된 절연물질중 일부를 외부로 흘러보내 절연층의 내부압을 줄여 상기 댐(5)의 터짐을 방지하면서 균일한 두께편차를 갖도록 상기 범프(3)의 일정높이에 대하여 5%정도 낮게 형성하여도 좋다.In addition, the dam 5 flows some of the insulating material applied near the edge of the core 2 to the outside to reduce the internal pressure of the insulating layer so as to have a uniform thickness deviation while preventing the dam 5 from bursting. The bump 3 may be formed to be about 5% lower than the predetermined height.
상술한 바와같은 본 발명에 의하면, 코아의 표면상에 도포된 절연물질을 가압하는 가압수단과 코아사이의 댐에 의해서 코아의 전체가장자리가 차단되는 밀폐계를 형성함으로써, 고온의 유동성 절연물이 외부로 유출되는 것을 최소화하여 기판주변이 오염되는 것을 방지하고, 절연층의 두께편차를 최소화하는 한편, 범프의 변형 및 마모를 방지하여 기판제품의 신뢰성을 높일수 있는 효과가 얻어진다.According to the present invention as described above, by forming a hermetic system in which the entire edge of the core is blocked by a press between the pressing means and the dam between the core and the insulating material applied on the surface of the core, the high-temperature fluid insulator to the outside By minimizing spillage to prevent contamination around the substrate, minimizing the thickness deviation of the insulating layer, while preventing the deformation and wear of the bumps can be obtained to increase the reliability of the substrate product.
본 발명은 특정한 실시예에 관련하여 도시하고 설명하였지만, 이하의 청구범위에 의해 마련되는 본 발명의 정신이나 분야를 벗어나지 않는 한도내에서 본 발명이 다양하게 개조 및 변화될수 있다는 것을 당업계에서 통상의 지식을 가진자는 용이하게 알수 있음을 밝혀두고자 한다.While the invention has been shown and described with respect to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit or scope of the invention as set forth in the claims below. I would like to clarify that knowledge is easy to know.
Claims (8)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980071397A (en) * | 1997-02-17 | 1998-10-26 | 야스카와 히데아키 | Tape carrier package |
| JPH11307659A (en) * | 1998-04-18 | 1999-11-05 | Tdk Corp | Electronic component and manufacture thereof |
| KR20000002034A (en) * | 1998-06-16 | 2000-01-15 | 장용균 | Tenter for minimizing horizontal thickness deflection of thermoplastic polymer film and manufacturing method for thermoplastic polymer film using tenter |
| JP2002064275A (en) * | 2000-08-17 | 2002-02-28 | Sumitomo Bakelite Co Ltd | Insulating resin film for multilayer printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980071397A (en) * | 1997-02-17 | 1998-10-26 | 야스카와 히데아키 | Tape carrier package |
| JPH11307659A (en) * | 1998-04-18 | 1999-11-05 | Tdk Corp | Electronic component and manufacture thereof |
| KR20000002034A (en) * | 1998-06-16 | 2000-01-15 | 장용균 | Tenter for minimizing horizontal thickness deflection of thermoplastic polymer film and manufacturing method for thermoplastic polymer film using tenter |
| JP2002064275A (en) * | 2000-08-17 | 2002-02-28 | Sumitomo Bakelite Co Ltd | Insulating resin film for multilayer printed wiring board |
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