KR100429121B1 - Cover foil for protecting the copper foil surface of MLB & manufacturing process method of MLB using the cover foil - Google Patents

Abstract

The present invention provides a cover foil for protecting a copper foil surface of a multilayer printed circuit board (MLB) belonging to the category of a printed circuit board (PCB), and the manufacture of a multilayer printed circuit board (MLB) using the same. The method relates to a metal plate such as an aluminum plate and a copper foil using a TACK ROLLER to remove foreign substances on the surface, and then adhere to each other to form a cover foil, and then to an inner layer substrate. The cover foil is attached to the outer layer of the multilayer printed circuit board (MLB) formed by laminating at least two substrate bodies formed by adhering an insulating layer to the center, and is formed by using a high-temperature and high-pressure press to finish the cover foil. By removing the metal plate, the surface of the multilayer printed circuit board (MLB) can be prevented from being contaminated and scratched, thereby increasing the reliability of the product and reducing the manufacturing time or cost. It is to enhance the expulsion effect.

Description

Cover foil for protecting copper foil surface of multilayer printed circuit board (MLL) and manufacturing method of multilayer printed circuit board (MLL) using the same {Cover foil for protecting the copper foil surface of MLB & manufacturing process method of MLB using the cover foil}

The present invention relates to a cover foil for protecting a copper foil surface of a multilayer printed circuit board (MLB) and a manufacturing method of a multilayer printed circuit board (MLB) using the same, and to a manufacturing process of a multilayer printed circuit board (MLB). Of the multi-layer printed circuit board (MLB), which prevents contamination and damage of the surface of the copper foil due to contamination of the copper foil or handling errors, and shortens the manufacturing process. A cover foil for protecting a copper foil surface and a method for manufacturing a multilayer printed circuit board (MLB) using the same.

As the development of the industry accelerates, electronic parts are becoming thinner and shorter.In response, printed circuit boards (PCBs) housed inside electronic parts are becoming smaller and more compact, and many printed circuits are also becoming smaller. Due to competition from PCB makers, the simplification of the manufacturing process to secure price competitiveness is also inevitable.

Multilayer printed circuit boards (MLBs), which fall within the category of printed circuit boards (PCBs), are increasingly multilayered and thinner, and the connection lines and widths of the circuits formed inside and outside the multilayer printed circuit boards (MLBs). It is also becoming more and more refined.

Therefore, during the manufacturing process of the multi-layer printed circuit board (MLB), the surface of the multi-layer printed circuit board (MLB) is contaminated by foreign matters or handled due to mishandling. Due to the fatal defects, there have been many studies to protect the multilayer printed circuit board (MLB) during the multilayer printed circuit board (MLB) manufacturing process.

As one of these results, the lamination method as shown in Figs. 1 and 2 has been used conventionally.

In this method, the insulating layer (PREPREG) layer 1c, which is an adhesive layer such as resin (resin), is stacked on both sides of the inner layer substrate 1b on which the circuit layer 1a forming the inner layer is formed. By joining one COPPER FOIL 1d to the insulating layer 1c, a multilayer printed circuit board (MLB) 1 is formed, and two multilayer printed circuit boards (MLB) 1 having the same structure (1) (1). Laminating the mirror plate (2) made of aluminum or stainless steel between the '), forming at high temperature and high pressure, removing the mirror plate (2), and then drilling the guide hole, which is a standard for the work, through X-ray, After forming edge trim of edge of multilayer printed circuit board (MLB) in which insulators such as resin (resin) flowed out, and joining support foil to both sides of multilayer printed circuit board (MLB), PTH (PLATED THROUGH HOLE) Manufacture of multi-layer printed circuit board (MLB) by drilling hole (HOLE) and then removing support foil (3) It was of obtaining a chemical, copper, plating the previous stage of the multi-layer printed circuit board (MLB).

However, this conventional method is because all the work is performed in the same clean room (CLEAN ROOM), because the dust is generated by the lamination work inside the clean room where the pollutant must be fundamentally blocked, contaminating the clean room The effect is insufficient, and the surface of the multilayer printed circuit board (MLB) is easily contaminated, and the surface of the copper foil is easily damaged during the process of X-ray drilling and EDGE TRIM of the guide hole, and PTH (PLATED) HOLE ENTRY FOIL needs to be glued to make THROUGH HOLE There is a drawback that SCRATCH is more likely to occur on the surface, and when the PTH (PLATED THROUGH HOLE) is drilled, the entry foil is completely pressed on both sides of the multilayer printed circuit board (MLB). A non-relationship there is a problem such that the quality of PTH (PLATED THROUGH HOLE) decreases.

The present invention was created in order to solve the above problems, and to produce a cover foil (COVER FOIL) bonded to the metal plate (METAL PLATE) and copper foil (COPPER FOIL) such as aluminum plate (ALUMINUM PLATE) By laminating on an insulating layer bonded to both sides of the inner layer substrate and molding at high temperature and high pressure, the metal sheet of the cover foil serves as a conventional mirror plate and a supporting foil by removing the metal plate of the cover foil. The manufacturing process and manufacturing time can be shortened, so that the economic effect can be increased, and the surface of the multilayer printed circuit board (MLB) can be prevented from being contaminated during the process, so that the reliability of the product can be ensured. An object of the present invention is to provide a cover foil for protecting a copper foil surface of MLB) and a method for manufacturing a multilayer printed circuit board (MLB) using the same.

1 is a cross-sectional view of a laminated structure in a conventional multilayer printed circuit board (MLB) manufacturing process;

2 is a block diagram of a conventional multilayer printed circuit board (MLB) manufacturing process;

3 is a first embodiment of the cover foil of the present invention,

Figure 4 is a second embodiment of the cover foil of the present invention,

5 is a third embodiment of the cover foil of the present invention,

6 is a fourth embodiment of the cover foil of the present invention;

7 is a cross-sectional view of a first embodiment of a laminated structure in a multilayer printed circuit board (MLB) manufacturing process of the present invention;

8 is a cross-sectional view of a second embodiment of a laminated structure in a multilayer printed circuit board (MLB) manufacturing process of the present invention;

9 is a cross-sectional view of a third embodiment of a stacked structure in a multilayer printed circuit board (MLB) fabrication process of the present invention;

10 is a cross-sectional view of a fourth embodiment of a laminated structure in a multilayer printed circuit board (MLB) fabrication process of the present invention;

11 is a cross-sectional view of a fifth embodiment of a laminated structure in a multilayer printed circuit board (MLB) fabrication process of the present invention;

12 is a cross-sectional view of a sixth embodiment of a laminated structure in a multilayer printed circuit board (MLB) fabrication process of the present invention;

13 is a first embodiment block diagram of a multilayer printed circuit board (MLB) manufacturing process;

14 is a block diagram of a second embodiment of a multilayer printed circuit board (MLB) fabrication process.

<Description of the symbols for the main parts of the drawings>

1, 10: multilayer printed circuit board (MLB) 1b, 12: inner layer substrate

1c, 13: insulation layer 1d: copper foil

2, 20: mirror plate 3: support foil

30: cover foil 31: copper foil

32: metal plate 33: hole

34: tape 35: outer cutting line

36: gluing or welding line

Hereinafter, with reference to the accompanying drawings will be described in more detail with respect to the cover foil for protecting the surface of the copper foil of the multilayer printed circuit board (MLB) of the present invention and the manufacturing method of the multilayer printed circuit board (MLB) using the same. .

3 is a first embodiment of the cover foil of the present invention, FIG. 4 is a second embodiment of the cover foil of the present invention, FIG. 5 is a third embodiment of the cover foil of the present invention, and FIG. 6 is a cover foil of the present invention. 4 is a cross-sectional view of a first embodiment of a laminated structure in a multilayer printed circuit board (MLB) manufacturing process of the present invention, and FIG. 8 is a cross-sectional view of a laminated structure in a multilayer printed circuit board (MLB) manufacturing process of the present invention. 9 is a cross-sectional view of the third embodiment of the multilayered printed circuit board (MLB) manufacturing process of the present invention, FIG. 10 is a cross-sectional view of the third embodiment of the multilayer printed circuit board (MLB) manufacturing process of the present invention. 11 is a cross sectional view of the fifth embodiment of the multilayer printed circuit board (MLB) manufacturing process of the present invention. FIG. 12 is a cross sectional view of the fifth embodiment of the multilayer printed circuit board (MLB) manufacturing process of the present invention. 13 is a cross-sectional view of the sixth embodiment, and FIG. 13 shows a first embodiment block of a manufacturing process of a multilayer printed circuit board (MLB). , Figure 14 is a second exemplary block diagram of a multi-layer printed circuit board (MLB) manufacturing process.

The configuration of the cover foil 30 to protect the surface of the copper foil (COPPER FOIL) during the multilayer printed circuit board (MLB) manufacturing process of the present invention is as shown in Figs.

The inner side of the cover foil 30 shown in FIG. 3 is made of a copper foil 31, and is made by bonding a metal plate 32 such as an aluminum plate to the copper foil 31, and both sides of the metal plate 32 A plurality of holes 33 are drilled in parallel to each other at predetermined intervals, and tape 34 is attached to the holes 33.

In addition, both sides of the copper foil 31 and the metal plate 32 constituting the cover foil 30, the inner side of the predetermined interval in the tape 34 attached to both sides of the metal plate 32 as shown in FIG. The edge cutting line (EDGE TRIM LINE) 35 is formed on the line moving in parallel or passing through the center of the holes 33.

The cover foil 30 shown in FIG. 5 has a metal plate 32 having holes 33 punched along both sides or a square circumferential surface on the copper foil 31, and then put an adhesive in the holes 33. The copper foil 31 is covered and bonded again, or the copper foil 31 is positioned on both sides of the metal plate 32 having the holes 33, and then the copper foil-metal plate-hoho is welded by welding the positions where the holes 33 are perforated. It is to have a form.

At this time, the hole 33 is not formed only on both sides of the metal plate 32, but also formed on the entire surface along the circumference of the square may be referred to as the scope of the present invention.

In the cover foil 30 shown in FIG. 6, the copper foil 31 is laid below and the metal plate 32 having a smaller size than the copper foil 31 is placed thereon, and the metal plate 32 is not covered with the copper foil. An adhesive is attached to the appropriate portion of the margin of the work 31 to cover and join the copper foil 31 of the same size as the copper foil 31, or a larger size copper foil on both sides of the metal plate 32 ( 31) after the copper foils 31 are welded to each other to form a copper foil-metal plate-copper foil. Insulating layer 13 to the multilayer printed circuit board (MLB) (10) The insulating layer 13, the copper foil 31, and the metal plate 30 may be bonded to each other in order to be integrally formed by bonding to the surface of the copper foil 31 of the cover foil 30 without bonding.

In the drawing, reference numeral 36 may be formed on the front surface along the square circumference of the copper foil 31 as in the same drawing as the virtual bonding or welding line, but is not shown in the drawings, but only on both sides of the copper foil 31. It can also be formed.

When the cover foil 30 of FIGS. 3 to 6 is manufactured, the foreign material on the surface is removed by passing through a stick roller before joining the copper foil 31 and the metal plate 32 to each other. Bond through the process.

Unlike the conventional cover foil 30, the insulating layer on both sides of the multilayer printed circuit board (MLB) laminated so as not to contaminate the surface of the copper foil 31 in the previous step of the manufacturing process of the multilayer printed circuit board (MLB) unlike the conventional Laminated on the outside of (13) and the metal plate 32 is removed after the hole (HOLE) processing process for making a plated hole (PTH) to prevent contamination or damage to the surface of the copper foil (31).

Hereinafter, a method of manufacturing a multilayer printed circuit board (MLB) using the cover foil 30 will be described.

First, FIG. 13 is a first embodiment block diagram of an MLB manufacturing process, and the inner layer substrate 12 having the circuit 11 forming the inner layer as shown in FIGS. 7 and 8 when the cover foil 30 is manufactured. The cover foil 30 is attached to both surfaces of the insulating layer 13 of the multilayer printed circuit board (MLB) 10 having the insulating layer 13 such as resin (resin) bonded to both surfaces.

Thereafter, as shown in FIG. 7, the mirror plate 20 is used between the two cover foils 30, and as shown in FIG. 8, the mirror plate 20 is not used. The multilayer printed circuit board (MLB) having a plurality of objects to be laminated, and hot, compression molding to produce a thin lamination (LAMINATE) form to bond the cover foil (30).

After the high temperature and compression molding as described above, X-Ray perforation of the guide hole (GUIDE HOLE) to be a reference hole during the manufacturing process of the multilayer printed circuit board (MLB) 10 in the state that the cover foil 30 is bonded After cutting the edges, the periphery of the multilayer printed circuit board (MLB) 10 through which materials such as resin (resin) forming the insulating layer 13 flows is cut out, and the multilayer printed circuit board (MLB) is cut. After the hole (HOLE) for making PTH (PLATED THROUGH HOLE) in 10 is removed, the metal plate 32 of the cover foil 30 is removed to remove the multilayer printed circuit board (MLB) 10 targeted in the present invention. Get

In this case, by changing the order of the outer cutting process and the last process of drilling the hole (HOLE) for making PTH, the hole (HOLE) for making PTH is drilled first, and the outer cutting is made to manufacture a multilayer printed circuit board (MLB). How to do is also within the scope of the present invention.

10 and 11 are cross-sectional views of a fourth embodiment and a fifth embodiment of a stacked structure in a multilayer printed circuit board (MLB) manufacturing process of the present invention, and different from those shown in FIGS. 7 and 8 described above. The cover foil 30 is bonded to the metal plate 32 in a state in which the copper foil 31 and the insulating layer 13 are bonded to each other without bonding the insulating layer 13 such as resin (resin) to both surfaces of the inner layer substrate 10. ) And then the same operation as described in Figures 7 and 8 to produce a multilayer printed circuit board (MLB).

FIG. 14 is a block diagram illustrating a second manufacturing process of the MLB, in which a cover foil 30 in which a manufactured copper foil 31, a metal plate 32, and a copper foil 31 are bonded is manufactured. As shown in FIG. 9, a multilayer printed circuit board (MLB) 10 having an insulating layer 13 such as resin (resin) bonded to both surfaces of an inner layer substrate 12 on which an inner layer circuit 11 is formed. To both sides of the adhesive. In this case, in the case of the outermost layer, the cover foil 30 to which the metal plate 32 and the copper foil 31 used in the process of FIG. 13 are bonded is bonded.

Thereafter, as shown in FIG. 9, a plurality of multilayer printed circuit board (MLB) manufactured objects having the same structure as above are laminated without using the mirror plate 20 between the cover foils 30, and a high temperature and compression molding process is performed. To form a thin lamination (LAMINATE). That is, in this case, the mirror plate 20 is used only at the outermost side.

After the high temperature and compression molding is completed as described above, the support foil is bonded while the metal plate 32 is separated from the cover foil 30 to become a reference hole in the manufacturing process of the multilayer printed circuit board (MLB) 10. After perforating the guide hole (GUIDE HOLE), the edge of the multilayer printed circuit board (MLB) 10 in which materials such as resin (resin) forming the insulating layer 13 by EDGE TRIM flows out. After cutting the periphery and reattaching the separated metal plate 32, the hole (HOLE) for making PTH (PLATED THROUGH HOLE) is drilled in the multilayer printed circuit board (MLB) 10, and then the metal plate of the cover foil 30 32) is removed to prepare a multilayer printed circuit board (MLB) of the chemical, copper, plating step of the intermediate stage of manufacturing the multilayer printed circuit board (MLB) to obtain a multilayer printed circuit board (MLB) target in the present invention.

FIG. 12 is a cross-sectional view of a sixth embodiment of a laminated structure in a multilayer printed circuit board (MLB) manufacturing process of the present invention. Unlike FIG. 9 described above, an insulating layer 13 such as resin (resin) is used. To the metal plate 32 in a state in which the copper foil 31 and the insulating layer 13 are bonded to each other without bonding the inner layer substrate 10 to each other, and then the cover foil 30 is manufactured. The same operation as described above is to produce a multilayer printed circuit board (MLB).

In the method of manufacturing a multilayer printed circuit board (MLB) by the above method, the cover foil 30 is not removed during the manufacturing process of the multilayer printed circuit board (MLB), and a hole (HOLE) for making PTH (PLATED THROUGH HOLE) Since the work proceeds in the attached state until the drilling process, the cover foil 30 is completely adhered to the copper foil 31, thereby providing accuracy and reliability in the drilling of the hole (HOLE) for making PTH (PLATED THROUGH HOLE). In addition, the cause of contamination on the surface of the copper foil 31 can be eliminated, and scratches due to carelessness during the work can be prevented, and because of the thickness of the cover foil 30, it is easy to handle and easy to work. When the plate is not used, the metal plate of the cover foil 30 plays the role of the mirror plate and the role of the support foil at the same time, thus omitting the conventional process of reattaching the support foil after the attachment foil. I can manufacture it by the shortening of the process It is possible to reduce the dragon.

In the method according to FIG. 14, since the cover foil must be removed after molding using the press as compared to FIG. 13, since the metal plate is separated and reattached in the post-molding process, the surface of the foil is less contaminated, but lamination is easy and the initial cost is reduced. You can save more.

The effect obtained by the present invention as described above, the management cost is reduced in terms of management, there is no fear of contamination of the surface of the copper foil (COPPER FOIL) during the manufacturing process, ultra-thin copper foil metal plate As it is handled in the state of cover foil bonded to the surface, it is easy to handle and prevents warping and bending of the surface of copper foil, and it is possible to ensure accuracy in drilling holes for making PTH (PLATED THROUGH HOLE). There are useful effects such as improvement, shortening of manufacturing process and reduction of manufacturing cost. Since the thickness of metal plate is relatively thin compared to mirror plate made of stainless steel, it is possible to increase stacking number and good thermal conductivity, so that the compression cycle time (PRESS CYCLE TIME) can be reduced to increase productivity.

Claims (7)

delete delete delete delete In a method of manufacturing a multilayer printed circuit board (MLB) in which a copper foil (COPPER FOIL) forming an outer layer is bonded to both surfaces of an inner layer substrate on which a circuit is formed, using an insulating layer such as a resin (resin). , A preliminary step of manufacturing a cover foil 30 formed by joining the metal plate 32 in a state where the copper foil 31 and the insulating layer 13 are bonded to each other; When the cover foil 30 is manufactured, a multilayer printed circuit board (MLB) having an insulating layer 13 such as resin (resin) adhered to both surfaces of the inner layer substrate 12 on which the circuit 11 forming the inner layer is formed ( The multi-layer printed circuit board (MLB) having the same structure as described above without adhering the cover foil 30 to both surfaces of the insulating layer 13 of 10) and not using the mirror surface plate 20 between the cover foils 30. (10) a cover foil adhesive step of stacking a plurality of objects to be manufactured and forming a thin sheet by high temperature and compression molding; In the state where the cover foil 30 is bonded, the guide hole (GUIDE HOLE) serving as a reference hole is manufactured by X-RAY in the manufacturing process of the multilayer printed circuit board (MLB) 10, and then insulated by EDGE TRIM. Cut the periphery of the multilayer printed circuit board (MLB) 10 from which materials such as resin (resin) forming the layer 13 flow out, and apply a plated throat hole (PTH) to the multilayer printed circuit board (MLB) 10. Manufacturing a multilayer printed circuit board (MLB) using a cover foil, characterized in that to manufacture a multilayer printed circuit board (MLB) by removing the metal plate 32 of the cover foil 30 after the hole (HOLE) for making. Way. 6. The multilayer printed circuit board (MLB) according to claim 5, wherein the copper foil forming the outer layer is bonded to both surfaces of the inner layer substrate on which the circuit is formed by using an insulating layer, which is an adhesive layer such as resin. In the manufacturing method of), A preliminary step of manufacturing a cover foil 30 to which the copper foil 31-the metal plate 32-the copper foil 31 is bonded; When the cover foil 30 is manufactured, a multilayer printed circuit board (MLB) having an insulating layer 13 such as resin (resin) bonded to both surfaces of the inner layer substrate 12 on which the circuit 11 forming the inner layer is formed ( 10) and the cover foil 30 is adhered to both sides of the cover foil, but in the case of the outermost layer, the cover foil 30, to which the metal plate 32-the copper foil 31 is bonded, is bonded. 30) A cover foil made of a thin laminated sheet by stacking a plurality of multilayer printed circuit board (MLB) manufacturing objects having the same structure using the mirror plate only at the outermost side without using the mirror plate 20, and hot and compression molding. Bonding step; After the metal plate 32 is removed from the cover foil 30, the support foil is bonded to form a guide hole (GUIDE HOLE), which is a reference hole in the manufacturing process of the multilayer printed circuit board (MLB), Cut the outer periphery of the multilayer printed circuit board (MLB) 10 through which materials such as resin (resin), which forms the insulating layer 13 through EDGE TRIM, are cut, and the separated metal plate 32 is reattached. After drilling the hole for making plated hole hole (ML) on the printed circuit board (MLB) and removing the metal plate 32 of the cover foil 30, A method of manufacturing a multilayer printed circuit board (MLB) using a cover foil, characterized in that the manufacturing of the multilayer printed circuit board (MLB) by the copper, pre-plating step. The method according to any one of claims 5 to 6, wherein the copper foil 31 and the insulating layer 13 are bonded to each other in the state of manufacturing the cover foil 30 to be bonded to the metal plate 32 integrally. Method for manufacturing a multilayer printed circuit board (MLB) using a cover foil, characterized in that for producing a cover foil (30).