CN113453448A - Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board - Google Patents

Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board Download PDF

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Publication number
CN113453448A
CN113453448A CN202110556922.0A CN202110556922A CN113453448A CN 113453448 A CN113453448 A CN 113453448A CN 202110556922 A CN202110556922 A CN 202110556922A CN 113453448 A CN113453448 A CN 113453448A
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CN
China
Prior art keywords
board
layer
manufacturing
adhesive tape
protective adhesive
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Pending
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CN202110556922.0A
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Chinese (zh)
Inventor
陈建军
艾传刚
许明齐
孙怀远
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Guangzhou Meadville Electronics Co ltd
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Guangzhou Meadville Electronics Co ltd
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Priority to CN202110556922.0A priority Critical patent/CN113453448A/en
Publication of CN113453448A publication Critical patent/CN113453448A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a method for manufacturing a local asymmetric multilayer rigid-flexible printed circuit board made of high TG materials, which comprises the following steps: manufacturing the soft board layer by layer until the required number of layers is reached, and performing pressing, drilling and electroplating to generate a soft board layer; processing the protective adhesive tape film into a required size, attaching the protective adhesive tape film to a corresponding position of the flexible board layer, and attaching the resin sheet to the flexible board layer to generate a flexible board layer to be assembled; pressing the hard board and the soft board layer to be assembled together; manufacturing the hard plates layer by layer until the required number of layers is reached, and generating a plurality of hard plate layers; and pressing the multiple hard board layers, drilling, electroplating, patterning and resistance welding, and removing the resin sheets and the protective adhesive tape films which are not needed to expose the asymmetric soft board layers to generate the rigid-flex board. The protective adhesive tape film is matched with the hard board and the soft board, and the resin sheet and the protective adhesive tape film which are not needed are removed at proper positions to form an asymmetric design structure corresponding to the requirement of a manufacturer, so that the problem of inconvenience in subsequent installation is solved.

Description

Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board
Technical Field
The invention relates to the field of circuit boards, in particular to a manufacturing method of a high-TG material local asymmetric multilayer rigid-flex board.
Background
At present, the birth and development of FPC and PCB have promoted a new product of soft and hard combined board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like. The better the Tg value is, the better the high temperature resistance is when the PCB industry is manufacturing and processing high TG (glass transition temperature) materials. The rigid-flex circuit board has the characteristics of both FPC and PCB, so that the rigid-flex circuit board can be used in products with special requirements, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
However, the existing processing method of the rigid-flex board has the following defects:
1. the rigid-flex boards on the market are generally symmetrically designed, so that a manufacturer cannot adjust workpiece installation according to requirement adaptability, and subsequent installation is inconvenient.
2. The soft and hard combined board has various production processes, high production difficulty, low yield and more input materials and manpower, so the price is high, the production period is long, and the problem of adhesion can occur when the resin bonding sheet is bonded with the soft board.
3. When processing the rigid-flex board on the market, when meeting high TG material, can appear the poor problem of pressfitting effect, original traditional trinity buffer material can't satisfy the pressfitting preparation of this material.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a manufacturing method of a high-TG material local asymmetric multilayer rigid-flexible board, which can solve the problem of inconvenient installation.
One of the purposes of the invention is realized by adopting the following technical scheme:
a manufacturing method of a high-TG material local asymmetric multilayer rigid-flexible board comprises the following steps:
and (3) soft board processing: manufacturing the soft board layer by layer until the required number of layers is reached, and performing pressing, drilling and electroplating to generate a soft board layer;
a bonding step: processing the protective adhesive tape film into a required size, attaching the protective adhesive tape film to a corresponding position of the flexible board layer, and attaching the resin sheet to the flexible board layer to generate a flexible board layer to be assembled;
and (3) soft and hard combination: pressing the hard board and the soft board layer to be assembled together;
processing layer by layer: manufacturing the hard plates layer by layer until the required number of layers is reached, and generating a plurality of hard plate layers;
and (3) hard board processing: and pressing the multiple hard board layers, drilling, electroplating, patterning and resistance welding, and removing the resin sheets and the protective adhesive tape films which are not needed to expose the asymmetric soft board layers to generate the rigid-flex board.
Further, in the soft board processing step, during pressing, aluminum foils are arranged on the upper side and the lower side of the soft board, and double-sided aluminum foils are adopted for pressing for multiple times.
Further, in the soft board processing step, firstly, double-layer soft board manufacturing is carried out, and then four-layer soft board manufacturing is carried out.
Further, in the soft board processing step, a positioning hole is processed on the soft board, a pin hole corresponding to the positioning hole is processed on the protective adhesive tape film, the protective adhesive tape film is processed and attached to the soft board, and a pin is inserted into the pin hole and the positioning hole.
Further, in the soft board processing step, whether the pin hole of each protective adhesive tape film corresponds to the positioning hole in the soft board or not is checked, if yes, a pin is inserted, and if not, the soft board is attached again.
Further, in the hard board processing step, whether the removed protective adhesive tape film is correct or not is checked, if so, the subsequent process is executed, and if not, the protective adhesive tape film is attached again and the protective adhesive tape film at the correct position is removed again.
Further, in the hard sheet processing step, unnecessary hard sheets and protective tape films are cut using a laser.
Further, in the hard board processing step, whether the laser cutting position is correct or not is checked, if so, the protective adhesive tape film is removed, and if not, the hard board is discarded.
Further, the method also comprises the following quality inspection steps: and (5) checking whether the size and the pressing degree of the soft and hard combination plate meet the requirements, and if not, retreating.
Further, in the quality inspection step, if the rigid-flex board meets the requirements, packaging is performed.
Compared with the prior art, the invention has the beneficial effects that:
processing the protective adhesive tape film into a required size, attaching the protective adhesive tape film to a corresponding position of the flexible board layer, and attaching the resin sheet to the flexible board layer to generate a flexible board layer to be assembled; pressing the hard board and the soft board layer to be assembled together; and manufacturing the hard boards layer by layer until the required number of layers is reached, generating a plurality of hard board layers, laminating the plurality of hard board layers, drilling, electroplating, patterning and welding resistance, and removing the resin sheets and the protective adhesive tape films which are not required to expose the asymmetrical soft board layers to generate the rigid-flex board. The protective adhesive tape film is matched with the hard board and the soft board, and the resin sheet and the protective adhesive tape film which are not needed are removed at proper positions to form an asymmetric design structure corresponding to the requirement of a manufacturer, so that the problem of inconvenience in subsequent installation is solved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a preferred embodiment of the method for manufacturing a locally asymmetric multilayer rigid-flex board made of high TG materials according to the present invention;
fig. 2 is a schematic structural diagram of a high-TG material local asymmetric multilayer rigid-flex board.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-2, a method for manufacturing a high TG material local asymmetric multi-layer rigid-flex board includes the following steps:
and (3) soft board processing: manufacturing the soft board layer by layer until the required number of layers is reached, and performing pressing, drilling and electroplating to generate a soft board layer;
a bonding step: processing the protective adhesive tape film into a required size, attaching the protective adhesive tape film to a corresponding position of the flexible board layer, and attaching the resin sheet to the flexible board layer to generate a flexible board layer to be assembled;
and (3) soft and hard combination: pressing the hard board and the soft board layer to be assembled together;
processing layer by layer: manufacturing the hard plates layer by layer until the required number of layers is reached, and generating a plurality of hard plate layers;
and (3) hard board processing: and pressing the multiple hard board layers, drilling, electroplating, patterning and resistance welding, and removing the resin sheets and the protective adhesive tape films which are not needed to expose the asymmetric soft board layers to generate the rigid-flex board. The protective adhesive tape film is matched with the hard board and the soft board, and the resin sheet and the protective adhesive tape film which are not needed are removed at proper positions to form an asymmetric design structure corresponding to the requirement of a manufacturer, so that the problem of inconvenience in subsequent installation is solved.
Preferably, in the soft board processing step, during pressing, the aluminum foil is arranged on the upper side and the lower side of the soft board, and double-sided aluminum foil is adopted for pressing for multiple times. The mode of two-sided aluminium foil pressfitting is applicable to High Tg material pressfitting, has solved the poor problem of original traditional trinity buffer material pressfitting effect. Specifically, in the actual operation, in the soft board processing step, the double-layer soft board is firstly manufactured, and then the four-layer soft board is manufactured.
Preferably, in the soft board processing step, a positioning hole is processed on the soft board, a pin hole corresponding to the positioning hole is processed on the protective adhesive tape film, the protective adhesive tape film is processed and attached to the soft board, and a pin is inserted into the pin hole and the positioning hole. Set up pinhole, locating hole's aim at: because the board is designed to be locally asymmetric, the design of the protective adhesive tape and the resin sheet on the upper surface and the lower surface of the flexible board are different, so that the protective adhesive tape needs to be fool-proof and mistake-proof during manufacturing and inspection. The protective adhesive tape adopts SET makeup design and is attached by a pin jig.
Preferably, in the soft board processing step, whether the pin hole of each protective adhesive tape film corresponds to the positioning hole on the soft board is checked, if so, the pin is inserted, and if not, the soft board is attached again.
Preferably, in the hard board processing step, whether the removed protective adhesive tape film is correct is checked, if so, the subsequent process is executed, and if not, the protective adhesive tape film is attached again and the protective adhesive tape film at the correct position is removed again. Specifically, because the rigid-flex board is of an anylayer structure, the method for obtaining the flexible board layer comprises the following steps: the protective adhesive tape film is attached to the surface of the soft board layer to be exposed and used for isolating the soft board from the resin bonding sheet and preventing the resin bonding sheet from being bonded with the soft board.
Preferably, in the hard sheet processing step, the unnecessary hard sheet and protective tape film are cut using a laser. In the step of processing the hard board, whether the position of laser cutting is correct or not is checked, if so, the protective adhesive tape film is removed, and if not, the hard board is scrapped.
Preferably, the method further comprises the following quality inspection steps: and (5) checking whether the size and the pressing degree of the soft and hard combination plate meet the requirements, and if not, retreating. And in the quality inspection step, if the rigid-flex board meets the requirement, packaging.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims (10)

1. A manufacturing method of a high-TG material local asymmetric multilayer rigid-flexible board is characterized by comprising the following steps:
and (3) soft board processing: manufacturing the soft board layer by layer until the required number of layers is reached, and performing pressing, drilling and electroplating to generate a soft board layer;
a bonding step: processing the protective adhesive tape film into a required size, attaching the protective adhesive tape film to a corresponding position of the flexible board layer, and attaching the resin sheet to the flexible board layer to generate a flexible board layer to be assembled;
and (3) soft and hard combination: pressing the hard board and the soft board layer to be assembled together;
processing layer by layer: manufacturing the hard plates layer by layer until the required number of layers is reached, and generating a plurality of hard plate layers;
and (3) hard board processing: and pressing the multiple hard board layers, drilling, electroplating, patterning and resistance welding, and removing the resin sheets and the protective adhesive tape films which are not needed to expose the asymmetric soft board layers to generate the rigid-flex board.
2. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 1, wherein: in the soft board processing step, during pressing, aluminum foils are arranged on the upper side and the lower side of the soft board, and double-sided aluminum foils are adopted for pressing for multiple times.
3. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 1, wherein: in the soft board processing step, firstly, double-layer soft board manufacturing is carried out, and then four-layer soft board manufacturing is carried out.
4. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 1, wherein: in the soft board processing step, a positioning hole is processed on the soft board, a pin hole corresponding to the positioning hole is processed on the protective adhesive tape film, the protective adhesive tape film is processed and attached to the soft board, and a pin is inserted into the pin hole and the positioning hole.
5. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 4, wherein: in the soft board processing step, whether the pin hole of each protective adhesive tape film corresponds to the positioning hole on the soft board or not is checked, if yes, a pin is inserted, and if not, the soft board is attached again.
6. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 1, wherein: in the hard board processing step, whether the removed protective adhesive tape film is correct or not is checked, if so, the subsequent process is executed, and if not, the protective adhesive tape film is attached again and the protective adhesive tape film at the correct position is removed again.
7. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 1, wherein: in the hard sheet processing step, unnecessary hard sheets and protective adhesive tape films are cut using a laser.
8. The method for manufacturing a locally asymmetric multilayer rigid-flexible printed circuit board made of high-TG materials according to claim 7, wherein in the rigid board processing step, whether the laser cutting position is correct or not is checked, if so, the protective adhesive tape film is removed, and if not, the processing is abandoned.
9. The method for manufacturing the high-TG material locally asymmetric multilayer rigid-flexible printed circuit board as claimed in claim 1, wherein: further comprises the quality inspection step: and (5) checking whether the size and the pressing degree of the soft and hard combination plate meet the requirements, and if not, retreating.
10. The method for manufacturing a high-TG-material locally asymmetric multilayer rigid-flexible board as claimed in claim 9, wherein: and in the quality inspection step, if the rigid-flex board meets the requirement, packaging.
CN202110556922.0A 2021-05-21 2021-05-21 Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board Pending CN113453448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110556922.0A CN113453448A (en) 2021-05-21 2021-05-21 Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110556922.0A CN113453448A (en) 2021-05-21 2021-05-21 Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board

Publications (1)

Publication Number Publication Date
CN113453448A true CN113453448A (en) 2021-09-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110556922.0A Pending CN113453448A (en) 2021-05-21 2021-05-21 Manufacturing method of high-TG material local asymmetric multilayer rigid-flex board

Country Status (1)

Country Link
CN (1) CN113453448A (en)

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